CN101549545B - Energy-efficient semiconductor plastic package die - Google Patents
Energy-efficient semiconductor plastic package die Download PDFInfo
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- CN101549545B CN101549545B CN 200910059165 CN200910059165A CN101549545B CN 101549545 B CN101549545 B CN 101549545B CN 200910059165 CN200910059165 CN 200910059165 CN 200910059165 A CN200910059165 A CN 200910059165A CN 101549545 B CN101549545 B CN 101549545B
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- diaphragm capsule
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- patrix
- counterdie
- runner
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Abstract
The invention discloses an energy-efficient semiconductor plastic package die, wherein the upper central casting plate of the upper die box (8) and the lower central casting plate of the lower die box(9) form a closed cavity; the upper die box (8) and the lower die box (9) are provided with gel passages (24) which are hollow pipelines connected with the flow passage (25); the gel passages (24) are connected with an integrated component cavity (26) via the flow passage (25); the casting head (4) is connected with the cavity; the liquid resin of the feeding cylinder (31) is infused via the flowpassage and the flow passage (25) by the casting head. The invention overcomes the disadvantages of long casting process of current technology, bad air tightness of plastic-casting products, and complication of insert and mandril exchange. The invention provides a semiconductor plastic package die with large density, convenient disassembly and little plastic package material waste, saves 15%-30%resin, and improves utilization rate of the raw material, which can be applied in the field of IC package.
Description
Technical field
The present invention relates to the equipment of injection mo(u)lding, be specifically related to the sealed in unit of integrated circuit
Background technology
The semiconductor integrated circuit package mould is that microelectronics Packaging is produced indispensable key processing equipment, and the develop rapidly of microelectronics industry has proposed profound high new demand to the design of semiconductor packaging mold with manufacturing.
The semiconductor packaging mold industry to the requirement of mould is: the one, and the requirement fine machining die, at present constantly integrated, miniaturization of electronic product, the product trend is high-end, size is also more and more less, packaging body is more and more thinner, and this requires more and more higher to encapsulation, require very high to mould and die accuracy.Plastic sealed mould technique is one of extremely important process means during operation is produced behind the semiconductor devices, the general single cylinder encapsulation technology of using, its encapsulated object comprises the series of products such as DI P, SOP, QFP, SOT, SOD, TR class discrete device and chip tantalum electric capacity, inductance, bridge circuit.Multi-gate pole encapsulating mould MGP is the extension of single cylinder Tool and Die Technology, is encapsulating mould main product nowadays.It adopts many barrels, multi-gate pole packing forms, and advantage is can balanced runner, realizes closely filling, and the resin utilization rate is high, and packaging technology is stable, and the goods package quality is good.It is applicable to the micro semiconductor device products encapsulation such as SSOP, many rows such as TSS OP, LQFP, fine pith, high density integrated circuit and SOT, SOD.
On November 14th, 2007 was announced, and notification number is: CN 200974321Y, name is called " the multi-gate pole circuit package mould that is used for the aniseed cake " Chinese patent, discloses a kind of multi-cylinder integrated circuit packaging mould.The deficiencies such as but still there is the waste material in this multi-gate pole circuit package mould for the aniseed cake, and complicated when changing mold insert and push rod, and the time that needs is long, odd-numbered day cylinder injection moulding waste material is more serious simultaneously.
Summary of the invention
The present invention has overcome the deficiencies in the prior art, provides to solve wastage of material and the underproof integrated circuit packaging mould of encapsulation.
For solving above-mentioned technical problem, the present invention by the following technical solutions:
Energy-efficient semiconductor plastic package die, cope match-plate pattern are fixed with patrix diaphragm capsule system, and lower bolster is fixed with the counterdie diaphragm capsule; Rack-and-pinion is connected to drive and turns on plate, and moves back and forth up and down, and turns on the plate fixedly injecting head system; The lower central runner plate UNICOM of injecting head system and counterdie diaphragm capsule; Turn into the moving counterdie push rod power restoring board of strip and move back and forth up and down, the counterdie push rod power rail that the power restoring board passes lower bolster by the lathe release link drives push rod and moves up, and ejects shaped article and running channel; The patrix push rod dynamical system that resets withstands between baffle plate and the patrix diaphragm capsule, and the patrix push rod dynamical system that resets drives the patrix push rod and moves down, and ejects shaped article and running channel; After lower bolster moves up, patrix diaphragm capsule and counterdie diaphragm capsule are fitted, it is characterized in that the lower central runner plate of upper central runner plate in the patrix diaphragm capsule and counterdie diaphragm capsule forms the cavity of sealing, in patrix diaphragm capsule and the counterdie diaphragm capsule Jiao Dao is arranged, Jiao Dao is hollow pipeline, be communicated with runner, Jiao Dao links by runner and integrated component cave; Injecting head and cavity UNICOM; Liquid resin in the casing drum injects liquid resin by Jiao Dao through runner by injecting head; Wherein, embed between upper central runner plate and the lower central runner plate central plate is arranged, the section of described runner is arc, and described patrix diaphragm capsule quick sliding in patrix diaphragm capsule fixed head enters and removes, and the counterdie diaphragm capsule enters and removes by chute device quick sliding in counterdie diaphragm capsule fixed head.
Further technical scheme is that the front of the central plate that embeds between described upper central runner plate and the lower central runner plate has air discharge duct, and there is air discharge duct in the front of moulding bar.
Further technical scheme is 0.8 millimeter of described exhaust groove width, dark 0.015 millimeter air discharge duct.
Further technical scheme is that described injecting head is one or more.
Further technical scheme is that the interior diameter of described casing drum is 45 millimeters, and overall diameter is 55 millimeters.
Further technical scheme is that described single cylinder injection moulding central plate width is 70 millimeters.Compared with prior art, the invention has the beneficial effects as follows that injection cylinder density is large, mounting or dismounting are convenient, and the plastic packaging material waste is few, saves resin 15% to 30%, has improved raw material availability, occur crackle, pore, pinprick, the discontented problem of envelope when having reduced encapsulation.The running channel volume has been accomplished little and reasonable under the prerequisite that guarantees product quality, because the production of semiconductor products amount is large, waste material has the not characteristics of recuperability, has not only reduced the semiconductor production cost, has brought simultaneously good social enviroment protection benefit.
The present invention is perfect frame not only, used simultaneously advanced HGNX design software sunykatuib analysis technology, solve single cylinder and the existing main running channel long flow path of multi-cylinder injection moulding, the plastic packaging product poor air-tightness, in bubble, pinprick arranged, lack the deficiencies such as envelope, not only improved product quality, simultaneously the plastic packaging material materials are reduced to the most rational degree, energy efficient is remarkable.Reduce the production cost, improve competitive power of product.
Description of drawings
Fig. 1 is structural representation of the present invention.
Fig. 2 is the running channel schematic diagram of multi-cylinder injection moulding of the present invention.
Fig. 3 is the running channel schematic diagram of single cylinder injection moulding of the present invention.
Fig. 4 is the generalized section of running channel of the present invention.
The specific embodiment
The present invention is further elaborated below in conjunction with accompanying drawing.
Embodiment 1
Multi-cylinder injection moulding energy-efficient semiconductor plastic package die as shown in Figure 1, cope match-plate pattern 6 is fixed with patrix diaphragm capsule system 8, and lower bolster 7 is fixed with counterdie diaphragm capsule 9; Rack-and-pinion 2 is connected to drive and turns on plate 3, and moves back and forth up and down, and turns on the plate 3 fixedly injecting head system; The lower central runner plate UNICOM of injecting head system and counterdie diaphragm capsule 9; Turn and drive counterdie push rod power restoring boards 10 into plate 3 and move back and forth up and down, the counterdie push rod power rail 11 that power restoring board 10 passes lower bolster 7 by the lathe release link drives push rods and moves up, and ejects shaped article and running channel; The patrix push rod dynamical system 12 that resets withstands between baffle plate 13 and the patrix diaphragm capsule 8, and the patrix push rod dynamical system 12 that resets drives the patrix push rods and moves down, and ejects shaped article and running channel; After lower bolster 7 moves up, patrix diaphragm capsule 8 is fitted with counterdie diaphragm capsule 9, it is characterized in that the lower central runner plate of upper central runner plate in the patrix diaphragm capsule 8 and counterdie diaphragm capsule 9 forms the cavity of sealing, in patrix diaphragm capsule 8 and the counterdie diaphragm capsule 9 glue road 24 is arranged, glue road 24 is hollow pipelines, be communicated with runner 25, glue road 24 links by runner 25 and integrated component cave 26; Injecting head and cavity UNICOM; Liquid resin in the casing drum 31 injects liquid resin by glue road 24 through runner 25 by injecting head.Glue road 24 is hollow pipelines as shown in Figure 2, and runner 25 connections, and glue road 24 links by runner 25 and integrated component cave 26.Injecting head and cavity UNICOM.The interior diameter of casing drum 31 is 45 millimeters, and overall diameter is 55 millimeters.Liquid resin in the casing drum 31 injects liquid resin by glue road 24 through runner 25 by 1 injecting head.Injection moulding barrel in the central plate is hollow pipe, directly is communicated with runner 25.As shown in Figure 4, the section of runner 25 is arc.Patrix diaphragm capsule 8 16 quick slidings in patrix diaphragm capsule fixed head enter and remove, and counterdie diaphragm capsule 9 enters and removes by chute device 15 quick slidings in counterdie diaphragm capsule fixed head.There is air discharge duct in the central plate width front that embeds between upper central runner plate and the lower central runner plate, and there is air discharge duct in the front of moulding bar.0.8 millimeter of exhaust groove width, dark 0.015 millimeter air discharge duct.
Patrix diaphragm capsule 8 and counterdie diaphragm capsule 9 are fixed with regard to the structure of drawer-like formula mode, are convenient to the maintenance of large mold, change moulding mold insert and push rod and only need a few minutes, can resume production, and have greatly reduced the maintenance stand-by time, and production efficiency promotes at double.
In actual the use, the present invention uses the HGNX design software, and carry out the cae analysis technology, can analyse in depth and improve Design of Dies as early as possible, realize the emulation of Shooting Technique process simulation, the reasonability of the inject time in the mould product production process, running channel runner and glue-feeder, product weld mark, filling plastic degree etc. are carried out sunykatuib analysis, thereby with minimum plastic packaging materials.Also integrated by shape of product optimization, fitted position analysis optimization, design and processing, and motion simulation, structural strength analysis, analysis of fatigue, plastic flow, hot analysis, TOLERANCE ANALYSIS and optimization, NC emulation and optimization, dynamic simulation etc., use the how better optimizing design scheme of software automatic analysis assessment.
Multi-cylinder injection moulding energy-efficient semiconductor plastic package die as shown in Figure 1, cope match-plate pattern 6 is fixed with patrix diaphragm capsule system 8, and lower bolster 7 is fixed with counterdie diaphragm capsule 9; Rack-and-pinion 2 is connected to drive and turns on plate 3, and moves back and forth up and down, and turns on the plate 3 fixedly injecting head system; The lower central runner plate UNICOM of injecting head system and counterdie diaphragm capsule 9; Turn and drive counterdie push rod power restoring boards 10 into plate 3 and move back and forth up and down, the counterdie push rod power rail 11 that power restoring board 10 passes lower bolster 7 by the lathe release link drives push rods and moves up, and ejects shaped article and running channel; The patrix push rod dynamical system 12 that resets withstands between baffle plate 13 and the patrix diaphragm capsule 8, and the patrix push rod dynamical system 12 that resets drives the patrix push rods and moves down, and ejects shaped article and running channel; After lower bolster 7 moves up, patrix diaphragm capsule 8 is fitted with counterdie diaphragm capsule 9, it is characterized in that the lower central runner plate of upper central runner plate in the patrix diaphragm capsule 8 and counterdie diaphragm capsule 9 forms the cavity of sealing, in patrix diaphragm capsule 8 and the counterdie diaphragm capsule 9 glue road 24 is arranged, glue road 24 is hollow pipelines, be communicated with runner 25, glue road 24 links by runner 25 and integrated component cave 26; Injecting head and cavity UNICOM; Liquid resin in the casing drum 31 injects liquid resin by glue road 24 through runner 25 by injecting head.Glue road 24 is hollow pipelines as shown in Figure 3, and runner 25 connections, and glue road 24 links by runner 25 and integrated component cave 26.Injecting head and cavity UNICOM.The interior diameter of casing drum 31 is 45 millimeters, and overall diameter is 55 millimeters.Liquid resin in the casing drum 31 injects liquid resin by glue road 24 through runner 25 by 1 injecting head.Injection moulding barrel in the central plate is hollow pipe, directly is communicated with runner 25.As shown in Figure 4, the section of runner 25 is arc.Patrix diaphragm capsule 8 16 quick slidings in patrix diaphragm capsule fixed head enter and remove, and counterdie diaphragm capsule 9 enters and removes by chute device 15 quick slidings in counterdie diaphragm capsule fixed head.The central plate width that embeds between upper central runner plate and the lower central runner plate is 70 millimeters, and there is air discharge duct in its front, and there is air discharge duct in the front of moulding bar.0.8 millimeter of exhaust groove width, dark 0.015 millimeter air discharge duct.
Claims (6)
1. energy-efficient semiconductor plastic package die, cope match-plate pattern (6) is fixed with patrix diaphragm capsule system (8), and lower bolster (7) is fixed with counterdie diaphragm capsule (9); Rack-and-pinion (2) is connected to drive and turns on plate (3), and moves back and forth up and down, and turns into the upper fixedly injecting head system (4) of plate (3); The lower central runner plate UNICOM of injecting head system and counterdie diaphragm capsule (9); Turn into plate (3) drive counterdie push rod power restoring board (10) and move back and forth up and down, counterdie push rod power rail (11) the drive push rod that power restoring board (10) passes lower bolster (7) by the lathe release link moves up, and ejects shaped article and running channel; The patrix push rod dynamical system (12) that resets withstands between baffle plate (13) and the patrix diaphragm capsule (8), and the patrix push rod dynamical system (12) that resets drives the patrix push rod and moves down, and ejects shaped article and running channel; After lower bolster (7) moves up, patrix diaphragm capsule (8) is fitted with counterdie diaphragm capsule (9), it is characterized in that the lower central runner plate of upper central runner plate in the patrix diaphragm capsule (8) and counterdie diaphragm capsule (9) forms the cavity of sealing, in patrix diaphragm capsule (8) and the counterdie diaphragm capsule (9) Jiao Dao (24) is arranged, Jiao Dao (24) is hollow pipeline, and runner (25) connection, Jiao Dao (24) links by runner (25) and integrated component cave (26); Injecting head (4) and cavity UNICOM; Liquid resin in the casing drum (31) injects liquid resin by Jiao Dao (24) through runner (25) by injecting head; Wherein, embed between upper central runner plate and the lower central runner plate central plate is arranged, the section of described runner (25) is arc, described patrix diaphragm capsule (8) (16) quick sliding in patrix diaphragm capsule fixed head enters and removes, and counterdie diaphragm capsule (9) enters and removes by chute device (15) quick sliding in counterdie diaphragm capsule fixed head.
2. energy-efficient semiconductor encapsulating mould according to claim 1 is characterized in that, there is air discharge duct in the front of the central plate that embeds between described upper central runner plate and the lower central runner plate, and there is air discharge duct in the front of moulding bar.
3. energy-efficient semiconductor encapsulating mould according to claim 2 is characterized in that 0.8 millimeter of described exhaust groove width, dark 0.015 millimeter air discharge duct.
4. energy-efficient semiconductor encapsulating mould according to claim 3 is characterized in that described injecting head is one or more.
5. energy-efficient semiconductor encapsulating mould according to claim 4, the interior diameter that it is characterized in that described casing drum (31) is 45 millimeters, overall diameter is 55 millimeters.
6. energy-efficient semiconductor encapsulating mould according to claim 4 is characterized in that described single cylinder injection moulding central plate width is 70 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910059165 CN101549545B (en) | 2009-04-30 | 2009-04-30 | Energy-efficient semiconductor plastic package die |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910059165 CN101549545B (en) | 2009-04-30 | 2009-04-30 | Energy-efficient semiconductor plastic package die |
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| CN101549545A CN101549545A (en) | 2009-10-07 |
| CN101549545B true CN101549545B (en) | 2013-01-30 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101777437A (en) * | 2010-03-04 | 2010-07-14 | 成都尚明工业有限公司 | Tantalum capacitor encapsulating mould |
| CN101913214B (en) * | 2010-08-18 | 2013-02-13 | 肇庆理士电源技术有限公司 | Die |
| CN102357997A (en) * | 2011-08-25 | 2012-02-22 | 铜陵三佳山田科技有限公司 | Runner for forming high-frequency preheating-free resin |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1158499A (en) * | 1995-12-30 | 1997-09-03 | Lg半导体株式会社 | Transfer molding apparatus having laminated chase block |
| CN200974321Y (en) * | 2006-06-17 | 2007-11-14 | 铜陵三佳科技股份有限公司 | Multi-head injection circuit packaging mould for big material cakes |
| CN201405485Y (en) * | 2009-04-30 | 2010-02-17 | 成都尚明工业有限公司 | Highly-effective energy-saving semiconductor plastic-encapsulated mold |
-
2009
- 2009-04-30 CN CN 200910059165 patent/CN101549545B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1158499A (en) * | 1995-12-30 | 1997-09-03 | Lg半导体株式会社 | Transfer molding apparatus having laminated chase block |
| CN200974321Y (en) * | 2006-06-17 | 2007-11-14 | 铜陵三佳科技股份有限公司 | Multi-head injection circuit packaging mould for big material cakes |
| CN201405485Y (en) * | 2009-04-30 | 2010-02-17 | 成都尚明工业有限公司 | Highly-effective energy-saving semiconductor plastic-encapsulated mold |
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| CN101549545A (en) | 2009-10-07 |
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