CN101533231B - Off-axis alignment system and alignment method - Google Patents
Off-axis alignment system and alignment method Download PDFInfo
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- CN101533231B CN101533231B CN2009100486413A CN200910048641A CN101533231B CN 101533231 B CN101533231 B CN 101533231B CN 2009100486413 A CN2009100486413 A CN 2009100486413A CN 200910048641 A CN200910048641 A CN 200910048641A CN 101533231 B CN101533231 B CN 101533231B
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Abstract
The invention provides an off-axis alignment system, which is used for lithographic equipment to ensure the position relationship of a silicon chip and a worktable. The off-axis alignment system comprises a laser interferometer, a zero position sensor, an off-axis optic system and a worktable; wherein, the laser interferometer is arranged along X direction and Y direction, and the laser interferometer is used for measuring the position of an off-axis optical axis and the worktable; the zero position sensor is arranged at the edge of the maximal motion range of the worktable and used for providing the initialization signal of the laser interferometer; the side of the off-axis optic system is provided with two off-axis reflecting surfaces respectively vertical to the X direction and the Y direction; and the side of the worktable is provided with two reflecting surfaces respectively vertical to the X direction and the Y direction, and the off-axis reflecting surfaces and the worktable reflecting surfaces are used for reflecting the measuring beams sent by the laser interferometer. The laser interferometer is added in the off-axis alignment system, so that the excursion of the off-axis plain shaft in the alignment system can be detected in real time and the alignment precision of the silicon chip can be ensured.
Description
Technical field
The present invention relates to the treating apparatus that a kind of silicon chip is aimed at, and be particularly related to a kind of off-axis alignment system, the alignment methods of this off-axis alignment system also relates in the lump.
Background technology
The purpose of projection scanning formula litho machine be exactly clear figure on the mask, correctly be imaged on the silicon chip that scribbles photoresist, the effect of off-axis alignment system in litho machine is exactly to determine the position of silicon chip when exposure.
Describe in the layout and measuring method of axle system at U.S. Pat 7332732B2, fix a datum plate that has from the axle mark in the work stage lower right.At first by catching from the relative position of axle optical axis in work stage on the scanning work stage datum plate, and then set up the relation of silicon chip and work stage by the mark on axle system scanning silicon chip from the axle mark.Before aiming at, each silicon chip all needing reference mark is scanned definite position from axle system under this structure and layout from the axle optical axis.
This way has prolonged the time of whole aligning, has influenced the productive rate of litho machine.Simultaneously, when silicon chip mark scans, can't determine the error that causes silicon chip to aim at accurately with the main frame vibration from the axle optical axis.
Summary of the invention
The present invention proposes a kind of off-axis alignment system and alignment methods thereof, can address the above problem.
In order to achieve the above object, the invention provides a kind of off-axis alignment system, be used in lithographic equipment, determining that the silicon chip and the position of work stage concern.The off-axis alignment system comprises: along X to Y to the laser interferometer system of placing; Null pick-up is placed on the edge of work stage largest motion scope, is used for when work stage moves to the largest motion scope described laser interferometer being carried out initialization; Off-axis optical system, side have and two vertical respectively off axis reflector faces of X, Y-axis; And the work stage side has and two vertical respectively work stage reflectings surface of X, Y-axis, described off axis reflector face and described work stage reflecting surface are used for reflecting the measuring beam that described laser interferometer system sends, and reflect described position from axle optical axis and described work stage self respectively.
Optionally, also comprise control system, be used for the communication of positional data to compensate that it comprises:
Work stage position measurement digital signal processing (digital signal processing, DSP) plate is used for handling the work stage position measurement;
Measure dsp board from the axle optical axis position, be used for handling from axle optical axis position measurement data;
Synchronous clock control panel, clock signal are connected to work stage position measurement dsp board and measure dsp board from the axle optical axis position, are used to provide unified clock signal and measure dsp board to work stage position measurement dsp board with from the axle optical axis position;
From axle subsystem control system, be electrically connected to described from axle optical axis position measurement dsp board;
Work stage subsystem control system is electrically connected to described work stage position measurement dsp board; And
SUN workstation master control system is electrically connected to described from axle subsystem control system and described work stage subsystem control system.
Optionally, between wherein said work stage position measurement dsp board and the described work stage subsystem control system, describedly measure dsp board and described between axle subsystem control system from the axle optical axis position, adopt high speed communication optical fiber to communicate with one another, the described Industrial Ethernet that adopts between axle subsystem control system, described work stage subsystem control system and described SUN workstation master control system is carried out data communication.
The present invention also provides a kind of alignment methods of using the described off-axis alignment of claim 1 system, may further comprise the steps:
When driving work stage to the null pick-up position, the numerical value of initialization laser interferometer system, and above-mentioned position is set to from axle optical axis initial position;
In the off-axis alignment process, above-mentioned laser interferometer system is measured in real time from axle optical axis position and work stage position;
Utilize and above-mentionedly compensate above-mentioned work stage position from the axle optical axis position and obtain the work stage aligned position; And
Utilize above-mentioned work stage aligned position to participate in the silicon chip alignment procedures.
Optionally, wherein utilize above-mentionedly to compensate above-mentioned work stage position from the axle optical axis position and obtain this step of work stage aligned position, its formula is L
New=L-(P1-P0), wherein L
NewBe above-mentioned work stage aligned position, L is above-mentioned work stage position, and P1 is above-mentioned from the axle optical axis position, and P0 is above-mentioned from axle optical axis initial position.
Optionally, further comprising the steps of:
Calculate work stage position measurement total delay time T
Stage-total
Calculating is measured total delay time T from the axle optical axis position
OA-total
Above-mentioned work stage position measurement total delay time T
Stage-total, above-mentionedly measure total delay time T from the axle optical axis position
OA-totalCompensate to above-mentioned work stage position measurement dsp board, above-mentioned in axle optical axis position measurement dsp board respectively.
Optionally, wherein calculating this step of work stage position measurement total delay time comprises:
Work stage, is carried out scan exposure with constant speed and is obtained a ranking tagging on the silicon chip to positive dirction along Y;
Travelling workpiece platform slight distance on directions X;
Work stage, is carried out scan exposure with same constant speed and is obtained a ranking tagging on the silicon chip to negative direction along Y;
On the off-line measurement silicon chip mark position Y to deviation, the Y that statistics obtains forward and reverse exposure mark position to mean deviation dy, according to the speed v of exposure, just can count the total delay time of work stage position measurement: T
Stage-total=dy/ (2*v);
Optionally, the step of wherein calculating from axle optical axis position measurement total delay time comprises:
Calculating is from axle optical axis position Survey Software T time delay
OA-soft
Calculate work stage position measurement software delays time T
Stage-soft
Calculate work stage position measurement hardware delay time T
Stage-hard=T
Stage-total-T
Stage-softAnd
Calculating is measured total delay time T from the axle optical axis position
OA-total=T
Stage-hard+ T
OA-soft
The present invention measures real-time change from the axle optical axis position accurately by add laser interferometer in the off-axis alignment system, can detect in real time in the off-axis alignment system from the skew of axle optical axis, has guaranteed the precision that silicon chip is aimed at.In addition, the adding of laser interferometer has also improved alignment procedures, does not need to carry out the mark scannng on the work stage datum plate again.
Description of drawings
Figure 1 shows that the lithographic equipment structural representation that has the off-axis alignment system in the preferred embodiment of the present invention;
Figure 2 shows that the control system calcspar of off-axis alignment system in the preferred embodiment of the present invention;
Figure 3 shows that the position measurement algorithm flow chart in the preferred embodiment of the present invention.
Embodiment
In order more to understand technology contents of the present invention, especially exemplified by specific embodiment and cooperate appended illustrate as follows.
Figure 1 shows that the lithographic equipment structural representation that has the off-axis alignment system in the preferred embodiment of the present invention.
The present invention passes through laser interferometer monitoring in real time and is aiming at relative variation constantly from the axle optical axis, and compensates on the silicon chip mark scanning position, sets up the relation between silicon chip and work stage coordinate, realizes the silicon chip aligning fast.Comprise: the topology layout of off-axis measuring systems, the error correction of measuring system, backoff algorithm and from three parts of axle system alignment algorithm.
Lithographic equipment with off-axis alignment system shown in Figure 1 comprises: projection objective 1, silicon chip 2, work stage 3, off-axis optical system 4, work stage reflecting surface, X, Y are to laser interferometer system, work stage null pick-up 11.Wherein, off-axis optical system also comprises off axis reflector face and beam orifice 6.Only depicted among Fig. 1 Y to off axis reflector face 5, the X of Y in work stage reflecting surface 10 and laser interferometer system to laser interferometer 9.X to laser interferometer 9 send first measuring beam 7 to above-mentioned Y on work stage reflecting surface 10, send second measuring beam 8 to above-mentioned Y on off axis reflector face 5.
The effect of off-axis optical system 4 is to produce the off-axis alignment light source and the off-axis alignment light source is focused on, and it comprises parts such as laser instrument and eyeglass.Beam orifice 6 is used for the off-axis alignment light source that transmission off-axis optical system 4 produces.Off-axis optical system 4 is done as a whole the running in the present embodiment, and its concrete structure does not repeat them here.
Laser interferometer is to be known length with optical maser wavelength, utilizes the general dimensional measuring instrument of Michelson-interference system Displacement Measurement.Present embodiment adds X, Y to laser interferometer in the off-axis alignment system, be used for respectively along X to the position of Y to measuring workpieces platform 3 and off-axis optical system 4 optical axises.Only depicted X among Fig. 1 to laser interferometer 9, had in this area and know that usually the knowledgeable can learn that according to foregoing description and Fig. 1 Y is to the position of laser interferometer and the direction of its measuring beam.
Below be that example describes with X to laser interferometer 9, X sends first measuring beam 7, second measuring beam 8 to laser interferometer 9 and is used for the optical axis of measuring workpieces platform, off-axis optical system 4 respectively promptly from the position of axle optical axis.
Y to the effect of laser interferometer similar with X to laser interferometer, be used for measuring workpieces platform 3 and from the Y of axle optical axis to the position.
Null pick-up 11 is positioned at the edge of work stage largest motion scope, is used for initialization is carried out in position measurement.When work stage 3 moves to null pick-up 11 places according to instruction, position (X, the Y of work stage can mandatoryly be set, Z, Rx, Ry and Rz) and be original state from the horizontal level of axle optical axis, be the zero clearing of laser interferometer measurement numerical value, to reach the initialization of measuring preceding laser interferometer.
Figure 2 shows that the control system calcspar of off-axis alignment system in the preferred embodiment of the present invention.
The control system of off-axis alignment system comprises: synchronous clock control panel 12, work stage position measurement digital signal processing (digital signal processing, DSP) plate 13, from the axle optical axis position measure dsp board 14, from axle subsystem control system 16, work stage subsystem control system 17 and SUN workstation master control system 18.Between work stage position measurement dsp board 13 and the work stage subsystem control system 17, from axle optical axis position measurement dsp board 14 and between axle subsystem control system 16, can adopt high speed communication optical fiber 15 to communicate with one another.Between axle subsystem control system 16, work stage subsystem control system 17 and SUN workstation master control system 18, can adopt Industrial Ethernet 19 to carry out data communication.
The control system of off-axis alignment system is used for the measurement of synchronizes workpiece platform 3 and off-axis optical system optical axis position and the realization of various algorithms, is divided into Three Estate, dsp board, subsystem control system and SUN workstation system that laser interferometer signal is handled,
Synchronous clock control panel 12 provides unified clock signal, coordinates to carry out between different subsystems the synchro measure of a plurality of positions, and it is connected to each dsp board 13,14 and subsystem control system 16,17.
The effect of work stage position measurement dsp board 13 is measured the position freely to worktable 3 six exactly, and measures the communication of compensation of delay and position data.
The effect of measuring dsp board 14 from the axle optical axis position is exactly to measuring to the position from the axle system level, and measures the communication of compensation of delay and position data.
Use real time operating systems from axle subsystem control system 16 and work stage subsystem control system 17, significant feature is exactly to carry out synchroballistic between the communication of position data and subsystem in the present embodiment.Scanning position after the compensation, communication is handled to SUN workstation1 8, realizes the silicon chip alignment algorithm.
Because present embodiment has increased X, Y to laser interferometer system, so on technical scheme, extend following problem: 1. the compensation problem of pair laser interferometer measurement time-delay.2. laser interferometer measurement is from the compensation problem of axle optical axis variation.
Figure 3 shows that the position measurement algorithm flow chart in the preferred embodiment of the present invention.
At the compensation of measuring time-delay, present embodiment provides following scheme.
Using when dsp board carries out position measurement has delay time error, can be divided into two parts: the hardware system time-delay of laser interferometer measurement system and the software delay of processing measuring-signal.Because the identical hardware that adopt the laser interferometer measurement position, so can think that the hardware time-delay is consistent.The software aspect is to measuring object backoff algorithm difference, so the software delay difference between subsystem.Aligning step to the position measurement delay parameter is as follows:
1, work stage, is carried out scan exposure with constant speed and is obtained a ranking tagging on the silicon chip 2 to positive dirction along Y;
2, the distance of 2 mark width of travelling workpiece platform on directions X;
3, work stage, is carried out scan exposure with same constant speed and is obtained a ranking tagging on the silicon chip 2 to negative direction along Y;
4,1-3 step 10 time (step S20) above repeating is to reduce stochastic error;
5, on the off-line measurement silicon chip mark position Y to deviation, the Y that statistics obtains forward and reverse exposure mark position to mean deviation dy (step S21), according to the speed v of exposure, just can count the time delay of work stage laser interferometer signal disposal system measuring position: T
Stage-total=dy/ (2*v) (step S22);
Same position is carried out opposite scan exposure twice, what the position between two marks should be at same position, still, because the time-delay of measuring, the exposure that causes this two mark has caused the deviation dy of position not at same position.So this position deviation dy comprises two parts: the position deviation of forward scan position deviation and negative sense scanning, we can think that the time-delay for position measurement is the same, so, time=distance/speed.As above-mentioned formula, obtain work stage position measurement total delay time T
Stage-total
6, by analyzing DSP instruction time and bar number, can determine the position measurement software delays time T of DSP algorithm computing
Stage-soft(step S23);
7, by 5 and 6 steps, can obtain the hardware delay time of work stage position measurement dsp board: T
Stage-hard=T
Stage-total-T
Stage-soft(step S25);
8, by analysis to measure from axle optical axis level to dsp software algorithm instruction and bar number, can obtain the software delays time T
OA-soft(step S24);
9, because work stage position measurement dsp board is identical with the hardware of measuring dsp board from the axle optical axis position, like this,, analyze the time delay T of measurement from axle optical axis measuring position by 7 and 8 steps
OA-total=T
Stage-hard+ T
OA-soft(step S26);
10, correction is obtained different subsystem position measurement delay times compensate to (step S27) (step S28) in off-axis alignment system, the work stage position measurement dsp board;
Because in alignment procedures, lithographic equipment can produce vibrations, therefore, may cause skew because of vibrations from the axle optical axis.At the position correction and the compensation of scanning silicon chip mark, present embodiment proposes following scheme:
1, be in and survey school pattern following time opening litho machine or litho machine, control work stage 3 moves to work stage null pick-up 11 places, the original horizontal position P0 of recording off-axis optical axis (step S29);
2, the scanning silicon chip mark is carried out on time, in real time measuring workpieces platform horizontal level L and from the horizontal level P1 of axle optical axis, so the work stage aligned position after the compensation is L
New=L-(P1-P0) (step S30);
3, the work stage aligned position after the compensation participates in silicon chip alignment procedures (step S31);
The algorithm of silicon chip alignment procedures (step S31) specifically may further comprise the steps:
1, opening litho machine or litho machine for surveying school pattern following time, work stage 3 is driven to null pick-up 11 positions, the numerical value of initialization this moment laser interferometer 9, and as from axle optical axis initial position;
2, after litho machine is uploaded new silicon chip, carry out off-axis alignment;
3, adopt laser interferometer 9 measuring workpieces platforms 3 and when the position of axle optical axis, when the dsp board measuring position, measure compensation of delay;
4, when scanning silicon chip mark position, in the subsystem control system, carry out the compensation of scanning position algorithm;
5, repeated for 3 and 4 steps, obtain the scanning position of a series of silicon chip marks;
6, utilize least square method, try to achieve the position relation between the coordinate of work stage 3 and silicon chip 2, realize the rapid alignment of silicon chip.
The present invention measures real-time change from the axle optical axis position accurately by add laser interferometer in the off-axis alignment system, can detect in real time in the off-axis alignment system from the skew of axle optical axis, has guaranteed the precision that silicon chip is aimed at.In addition, the adding of laser interferometer has also improved alignment procedures, does not need to carry out the mark scannng on the work stage datum plate again.
Though the present invention discloses as above with preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (8)
1. an off-axis alignment system is used for the position relation that lithographic equipment is determined silicon chip and work stage, it is characterized in that the off-axis alignment system comprises:
Laser interferometer system, respectively the measuring workpieces platform and from X, the Y of axle optical axis to the position;
Null pick-up is placed on the edge of work stage largest motion scope, and described laser interferometer initializing signal is provided;
Off-axis optical system, side have and two vertical respectively off axis reflector faces of X, Y-axis; And
Be positioned at work stage side and two vertical respectively work stage reflectings surface of X, Y-axis, described off axis reflector face and described work stage reflecting surface are used for reflecting the measuring beam that described laser interferometer system sends, to determine described position from axle optical axis and described work stage;
Wherein, when driving work stage to the null pick-up position, the numerical value of initialization laser interferometer system, and above-mentioned position is set to from axle optical axis initial position; Then, carry out off-axis alignment, above-mentioned laser interferometer system is measured in real time from axle optical axis position and work stage position; Then, utilize measure in real time above-mentioned to compensate above-mentioned work stage position and obtain the work stage aligned position from the axle optical axis position; And utilize above-mentioned work stage aligned position to participate in the silicon chip alignment procedures.
2. off-axis alignment according to claim 1 system is characterized in that, also comprises control system, is used for the communication of positional data to compensate, and it comprises:
Work stage position measurement digital signal panel is used for handling the work stage position measurement;
Measure digital signal panel from the axle optical axis position, be used for handling from axle optical axis position measurement data;
The synchronous clock control panel, clock signal is connected to work stage position measurement digital signal panel and measures digital signal panel from the axle optical axis position, is used to provide unified clock signal and measures digital signal panel to work stage position measurement digital signal panel with from the axle optical axis position;
From axle subsystem control system, be electrically connected to described from axle optical axis position measurement digital signal panel;
Work stage subsystem control system is electrically connected to described work stage position measurement digital signal panel; And
SUN workstation master control system is electrically connected to described from axle subsystem control system and described work stage subsystem control system.
3. off-axis alignment according to claim 2 system, it is characterized in that, between wherein said work stage position measurement digital signal panel and the described work stage subsystem control system, describedly measure digital signal panel and described between axle subsystem control system from the axle optical axis position, adopt high speed communication optical fiber to communicate with one another, the described Industrial Ethernet that adopts between axle subsystem control system, described work stage subsystem control system and described SUN workstation master control system is carried out data communication.
4. an alignment methods of using the described off-axis alignment of claim 1 system is characterized in that, may further comprise the steps:
When driving work stage to the null pick-up position, the numerical value of initialization laser interferometer system, and above-mentioned position is set to from axle optical axis initial position;
Carry out off-axis alignment, above-mentioned laser interferometer system is measured in real time from axle optical axis position and work stage position;
Utilize measure in real time above-mentioned to compensate above-mentioned work stage position and obtain the work stage aligned position from the axle optical axis position; And
Utilize above-mentioned work stage aligned position to participate in the silicon chip alignment procedures.
5. alignment methods according to claim 4 is characterized in that, wherein utilizes above-mentionedly to compensate above-mentioned work stage position from the axle optical axis position and obtain this step of work stage aligned position, and its formula is L
New=L-(P1-P0), wherein L
NewBe above-mentioned work stage aligned position, L is above-mentioned work stage position, and P1 is above-mentioned from the axle optical axis position, and P0 is above-mentioned from axle optical axis initial position.
6. alignment methods according to claim 4, the off-axis alignment system that uses this alignment methods also comprises:
Work stage position measurement digital signal panel is used for handling the work stage position measurement;
Measure digital signal panel from the axle optical axis position, be used for handling from axle optical axis position measurement data;
The synchronous clock control panel, clock signal is connected to work stage position measurement digital signal panel and measures digital signal panel from the axle optical axis position, is used to provide unified clock signal and measures digital signal panel to work stage position measurement digital signal panel with from the axle optical axis position;
From axle subsystem control system, be electrically connected to described from axle optical axis position measurement digital signal panel;
Work stage subsystem control system is electrically connected to described work stage position measurement digital signal panel; And
SUN workstation master control system is electrically connected to described from axle subsystem control system and described work stage subsystem control system;
It is characterized in that, further comprising the steps of:
Calculate work stage position measurement total delay time T
Stage-total
Calculating is measured total delay time T from the axle optical axis position
OA-total
Above-mentioned work stage position measurement total delay time T
Stage-total, above-mentionedly measure total delay time T from the axle optical axis position
OA-totalCompensate to above-mentioned work stage position measurement digital signal panel, above-mentioned in axle optical axis position measurement digital signal panel respectively.
7. alignment methods according to claim 6 is characterized in that, wherein calculates this step of work stage position measurement total delay time and comprises:
Work stage, is carried out scan exposure with constant speed and is obtained a ranking tagging on the silicon chip to positive dirction along Y;
The certain distance of travelling workpiece platform on directions X;
Work stage, is carried out scan exposure with same constant speed and is obtained a ranking tagging on the silicon chip to negative direction along Y;
On the off-line measurement silicon chip mark position Y to deviation, the Y that statistics obtains forward and reverse exposure mark position to mean deviation dy, according to the speed v of exposure, just can count the total delay time of work stage position measurement: T
Stage-total=dy/ (2*v).
8. alignment methods according to claim 6 is characterized in that, wherein calculates from this step of axle optical axis position measurement total delay time to comprise:
Calculating is from axle optical axis position Survey Software T time delay
OA-soft
Calculate work stage position measurement software delays time T
Stage-soft
Calculate work stage position measurement hardware delay time T
Stage-hard=T
Stage-total-T
Stage-softAnd
Calculating is measured total delay time T from the axle optical axis position
OA-total=T
Stage-hard+ T
OA-soft
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| CN102044460B (en) * | 2009-10-15 | 2013-01-16 | 中芯国际集成电路制造(上海)有限公司 | Standard mechanical interface for manufacturing semiconductor and laser assembling support thereof |
| CN106907991B (en) * | 2017-02-24 | 2019-06-07 | 湖北航天技术研究院总体设计所 | A kind of off-axis aspheric mirror zero testing alignment methods based on compensator |
| CN110421860B (en) * | 2019-08-21 | 2021-08-24 | 业成科技（成都）有限公司 | Laminating equipment and laminating method of lens |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5548195A (en) * | 1994-12-22 | 1996-08-20 | International Business Machines Corporation | Compensated servo control stage positioning apparatus |
| US7336369B2 (en) * | 2005-09-30 | 2008-02-26 | Applied Materials, Inc. | Multi-axis interferometer system using independent, single axis interferometers |
| CN101261451A (en) * | 2008-04-17 | 2008-09-10 | 上海微电子装备有限公司 | Photo-etching machine image-forming quality and workpiece station positioning accuracy measuring systems and measurement method |
-
2009
- 2009-03-31 CN CN2009100486413A patent/CN101533231B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5548195A (en) * | 1994-12-22 | 1996-08-20 | International Business Machines Corporation | Compensated servo control stage positioning apparatus |
| US7336369B2 (en) * | 2005-09-30 | 2008-02-26 | Applied Materials, Inc. | Multi-axis interferometer system using independent, single axis interferometers |
| CN101261451A (en) * | 2008-04-17 | 2008-09-10 | 上海微电子装备有限公司 | Photo-etching machine image-forming quality and workpiece station positioning accuracy measuring systems and measurement method |
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Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |