CN101510532A - Radiating structure, light source module of light-emitting diode and light-emitting diode lamp - Google Patents

Radiating structure, light source module of light-emitting diode and light-emitting diode lamp Download PDF

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Publication number
CN101510532A
CN101510532A CNA2009100473108A CN200910047310A CN101510532A CN 101510532 A CN101510532 A CN 101510532A CN A2009100473108 A CNA2009100473108 A CN A2009100473108A CN 200910047310 A CN200910047310 A CN 200910047310A CN 101510532 A CN101510532 A CN 101510532A
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CN
China
Prior art keywords
light
heat dissipating
led
dissipating housing
emitting diode
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2009100473108A
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Chinese (zh)
Inventor
俞志龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AIDI TECHNOLOGY (SUZHOU) Co Ltd
Original Assignee
AIDI TECHNOLOGY (SUZHOU) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by AIDI TECHNOLOGY (SUZHOU) Co Ltd filed Critical AIDI TECHNOLOGY (SUZHOU) Co Ltd
Priority to CNA2009100473108A priority Critical patent/CN101510532A/en
Publication of CN101510532A publication Critical patent/CN101510532A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention discloses a heat elimination structure, a light source module of a light emitting diode (LED) containing the heat elimination structure and an LED lamp, wherein the heat elimination structure comprises a base plate used for arranging heating elements and a radiator connected with the base plate and used for eliminating heat for the heating elements. The radiator comprises a side wall, an upper wall connected with the side wall and a heat elimination cover of a cover orifice opposite to the upper wall, and heat elimination glue which is filled in a closed inner cavity of the heat elimination cover surrounded by the side wall, the upper wall and the base plate; the base plate is arranged in the cover orifice, and after the assembly of the heat elimination structure, the heat elimination glue fills up the residual space of the inner cavity of the heat elimination cover. At least one channel passing through the heat elimination glue is formed between the base plate and the upper wall and/or on the side wall, and both ends of the channel are communicated with the external of the heat elimination structure; and the LED is arranged on the base plate. The elimination structure and the LED lamp have light weight, low manufacturing cost and good heat elimination effects.

Description

The light source module of radiator structure, light-emitting diode and LED light lamp
Technical field
The present invention relates to a kind of radiator structure, have the light source module and the LED light lamp of the light-emitting diode of this radiator structure.
Background technology
In existing LED light lamp, the member or the circuit board that will have light-emitting diode usually (can be a kind of commercial goods by the very thin thermal paste of one deck, it has good thermal conductivity and non-conductive) be adhered on the radiator of metal formation, the heat that light-emitting diode produces is dispelled the heat.For this class heat radiation form, in order to increase radiating effect, just need to increase the volume of metal heat sink, thereby cause the overall weight of LED light lamp and manufacturing cost to rise.LED light lamp according to this class heat radiation form, when LED light lamp uses the light-emitting diode of vertical stratification to constitute, just must cut the residue pin after circuit board (adopting printed circuit board (PCB) usually) is gone up of being welded on of light-emitting diode, heat radiation to light-emitting diode can only be undertaken by the wiring on the circuit board, thermal paste and metal heat sink, causes increasing technology like this and makes the not good problem of radiating effect again.
Summary of the invention
The present invention is in order to address the above problem, and its purpose is to provide a kind of radiator structure of perfect heat-dissipating of in light weight, low cost of manufacture.The present invention also provide a kind of comprise this radiator structure, in light weight, low cost of manufacture and technology is simple and the light source module of the better light-emitting diode of radiating effect and LED light lamp.
Radiator structure of the present invention, comprise the substrate that is used to be provided with heater element, with join with substrate, to the radiator of heater element heat transmission, this radiator comprises: the heat dissipating housing of roof that include sidewall, joins with sidewall and the cover mouth relative with roof, substrate are arranged on described cover mouthful; With the thermal paste that is filled in by the heat dissipating housing inner chamber of the sealing that sidewall, roof and substrate surrounded of heat dissipating housing; Wherein, after the radiator structure assembling is finished, thermal paste is filled up the remaining space of heat dissipating housing internal cavity, and then is being formed with at least one passage that passes thermal paste between substrate and the roof and/or on the sidewall, and the two ends of at least one passage are communicated with the external world of radiator structure.
The light source module of light-emitting diode of the present invention comprises: radiator structure of the present invention; With the light-emitting diode on the substrate that is arranged on described radiator structure.
LED light lamp of the present invention comprises: radiator structure of the present invention; Accept the lamp holder of power supply usefulness; The lamp holder Connection Block that one end is connected with lamp holder, the other end is connected with the roof of heat dissipating housing outside heat dissipating housing, this lamp holder Connection Block is formed with inner chamber; With the drive circuit that is installed in the described inner chamber; Wherein heater element is on light-emitting diode and the substrate that is installed in radiator structure, and drive circuit utilization power supply makes led lighting, and light-emitting diode is outside heat dissipating housing.
As above the light source module of the radiator structure of Gou Chenging, light-emitting diode and led lamp have the advantage of in light weight, low cost of manufacture, perfect heat-dissipating.
Description of drawings
Fig. 1 is the cutaway view of the structural principle of the radiator structure of the demonstration embodiment of the invention, and wherein, Fig. 1 (a) is presented at the structure chart that forms passage m between substrate 2 and the roof 42, and Fig. 1 (b) is presented at the structure chart that forms passage n on the sidewall 41.
Fig. 2 is the partial sectional view of the structure of the LED light lamp of demonstration one embodiment of the invention.
Embodiment
Fig. 1 is the cutaway view of the structural principle of the radiator structure of the demonstration embodiment of the invention.Referring to Fig. 1 (comprising Fig. 1 (a) and Fig. 1 (b)), radiator structure of the present invention comprises: be used to that the substrate 2 of heater element 1 is set and join with substrate 2, to the radiator 3 of heater element 1 heat transmission.Radiator 3 comprises: the heat dissipating housing 4 of roof 42 that include sidewall 41, joins with sidewall 41 and the cover mouth 43 relative with roof 42; Thermal paste 5 in the heat dissipating housing inner chamber 55 of the sealing of being surrounded with the sidewall 41, roof 42 and the substrate 2 that are filled in by heat dissipating housing 4.
After the radiator structure assembling was finished, thermal paste 5 was filled up the remaining space of heat dissipating housing internal cavity 55.Referring to Fig. 1 (a), between substrate 2 and roof 42, form one or more passage m that pass thermal paste 5, the two ends a of these passages m, b is communicated with the external world of radiator structure, is convenient to extraneous air access way m.Referring to Fig. 1 (b), also can on sidewall 41, form one or more passage n that pass thermal paste 5, the two ends c of these passages n, d also are communicated with the external world of radiator structure.As changing example, also can form above-mentioned such passage (not shown) between substrate 2 and the roof 42 and on the sidewall 41, part or all passage in these passages also mutually structure lead to (not shown).
When being work, heater element 1 can produce the components and parts of a large amount of heat energy.As the example of heater element, for example can be light-emitting diode, high-power electronic component etc.It is one that heater element 1 is not limited to, and also can be a plurality of.When heater element 1 when being a plurality of, they can be distributed in substrate 2 discretely.The effect of substrate 2 is thermal paste 5 to be encapsulated in heat dissipating housing 4 heat interior and that heater element 1 is produced be sent to thermal paste 5, it can be independent metallic heat-conducting plate, its shape is suitable with the profile of the radiator portion of the heater element that will dispel the heat, it also can be the part that constitutes heater element bottom (heat generating part), or be used to install the circuit board of heater element 1, printed circuit board (PCB) etc. for example.Substrate 2 is arranged on cover mouth 43.Particularly, substrate 2 envelopes are located at the end (see figure 1) of cover mouth 43 in one embodiment, and in another embodiment, substrate 2 can be arranged on the stage portion 431 of covering in the mouth 43 (Fig. 2).No matter substrate 2 be arranged on cover mouthfuls 43 specifically where, do not flow out heat dissipating housing outward as long as can contact and block thermal paste 5 with thermal paste 5.Heat dissipating housing 4 is used to hold thermal paste 5, constitutes radiator 3 with thermal paste 5.Heat dissipating housing 4 roughly is peviform, but its profile does not have specific restriction, determines according to installation or requirement attractive in appearance mostly.
Thermal paste 5 is formed on the interior remaining space of heat dissipating housing after filling up the radiator structure assembling.So-called remaining space is meant that substrate 2 is arranged on space that heat dissipating housing that cover mouthful 43 backs (the pure substrate that does not promptly comprise the member that is arranged in substrate 2) are surrounded by sidewall 41, roof 42 and the substrate 2 of heat dissipating housing 4 itself forms and deducts the space that channel space and other member are occupied in this space.Other member comprises the member that is arranged in this space on the substrate 2 and need be arranged in the member in this space for other consideration.For example, in this embodiment, when substrate 2 was installed (promptly opposite with installation shown in Figure 1) with heater element 1 in heat dissipating housing, heater element 1 had constituted other member.Among the embodiment of LED light lamp below, it is exactly the example that need be arranged in the member in this space for other consideration that drive circuit 8 provides the lead aa of electric power to light-emitting diode 1, and the pin 11 of the light-emitting diode 1 in this space is exactly the example of the member on the substrate (circuit board).
Heat dissipating housing 4 roughly is peviform, and effect is in order to hold more thermal paste 5, and with weight and the manufacturing cost that alleviates radiator 3, therefore, heat dissipating housing 4 also can be tubbiness etc., and other is container-like.Heat dissipating housing 4 available metal plates, for example the aluminium sheet material is stamped to form.For weight and the manufacturing cost that more effectively alleviates radiator 3, the volume of preferred thermal paste 5 is more than or equal to the sidewall 41 of heat dissipating housing 4, the volume sum of roof 42, or the weight of preferred thermal paste 5 is more than or equal to the weight of heat dissipating housing 4.
As changing example, the sidewall 41 of heat dissipating housing 4 and roof 42 be provided with one of at least fin (not shown).
Available above-mentioned radiator structure constitutes the light source module of light-emitting diode, and this light source module comprises: above-mentioned radiator structure; With the light-emitting diode on the substrate 2 that is arranged on above-mentioned radiator structure as heater element 1.Light-emitting diode can be the mesa light-emitting diode, also can be LED with vertical structure.When light-emitting diode is LED with vertical structure, described light-emitting diode is a plurality of LED with vertical structure, substrate 2 is circuit boards, passage in the radiator structure is a plurality of passage m that pass the roof of circuit board, thermal paste and heat dissipating housing, and these a plurality of passage m are distributed in a plurality of LED with vertical structure in the interval between at least some LED with vertical structure (referring to Fig. 2).
Fig. 2 shows the structure of the LED light lamp of the embodiment of the invention.Referring to Fig. 2, LED light lamp comprises: radiator structure as described above shown in Figure 1 is arranged on the light-emitting diode as heater element 1 on the substrate 2 of radiator structure; Accept the lamp holder 6 of power supply usefulness; The lamp holder Connection Block 7 that one end is connected with lamp holder 6, lamp holder Connection Block 7 is formed with inner chamber 71; Make light-emitting diode 1 illuminating drive circuit 8 with utilizing to power.Wherein, drive circuit 8 is installed in the inner chamber 71 of lamp holder Connection Block 7, and substrate 2 is installed in the cover mouth 43 of heat dissipating housing 4 and light-emitting diode 1 outside heat dissipating housing, and the other end of lamp holder Connection Block 7 is connected with the roof 42 of heat dissipating housing 4 outside heat dissipating housing.Lamp holder 6 is electrically connected with drive circuit 8 by lead bb, the power supply that drive circuit 8 is accepted from lamp holder 6.
When light-emitting diode 1 was mesa, light-emitting diode 1 can be single, and substrate 2 can be the bottom surface portions of this mesa light-emitting diode, also can be the metallic plate that the bottom surface with the mesa light-emitting diode joins.When light-emitting diode 1 was LED with vertical structure, light-emitting diode 1 can be a plurality of, and substrate 2 as circuit board, for example can adopt printed circuit board (PCB) for being electrically connected the circuit board of a plurality of light-emitting diodes.The two pins 11 of each LED with vertical structure is installed on redundance behind the circuit board 2 and all extends in thermal paste 5 and contact with thermal paste 5, this arrangement, can not only omit the technology that cuts off unnecessary pin, and increase the radiating effect of 3 pairs of light-emitting diodes 1 of radiator.In a preferred embodiment, passage in the radiator structure is a plurality of passage m that pass the roof 42 of circuit board 2, thermal paste 5 and heat dissipating housing 4, for example figure 2 illustrates 8 such passages, these a plurality of passage m are distributed in a plurality of LED with vertical structure 1 in the interval between at least some LED with vertical structure 1 (as shown in Figure 2).
The sidewall of lamp holder Connection Block 7 is provided with at least one louvre 9 of the part heat transmission that the roof 42 of heat dissipating housing 4 is surrounded by the other end of lamp holder Connection Block 7.The shape of lamp holder Connection Block 7 does not have specific qualification, determines according to aesthetic or installation requirement usually.Preferred lamp holder Connection Block 7 is an axis structure axisymmetricly with the line of centres of an end and the other end, and this moment, louvre 9 was the even number louvre more than 2, and is radially configuration in pairs on the sidewall of lamp holder Connection Block 7.
LED light lamp further comprises and prevents that object from entering the drive circuit lid 10 that touches drive circuit 8 usefulness from louvre 9.Drive circuit 8 can be positioned at lamp holder Connection Block 7 Anywhere.But for the louvre usefulness of louvre 9 double as drive circuits 8, the other end of more close lamp holder Connection Block 7 is compared in the position of drive circuit 8 in lamp holder Connection Block 7 with an end of lamp holder Connection Block 7.
LED light lamp further comprises the cover mouth 43 that is used to seal heat dissipating housing 4 and the transmission saturating lid 12 (not shown) from the light of light-emitting diode, and this saturating lid also has ventilating structure.
In this embodiment, the cover mouth 43 place parts of the sidewall 41 of heat dissipating housing 4 are formed with a stage portion 431, when being used to install circuit board or printed circuit board (PCB) 2 are located better, and in this structure, circuit board or printed circuit board (PCB) 2 are positioned at cover mouth 43.
Below in conjunction with the accompanying drawings the present invention is had been described in detail, those skilled in the art are according to design of the present invention that specification disclosed, also can make other various variation examples except that the variation exception of describing in the specification, therefore described embodiment of this specification and variation example thereof should not constitute limitation of the invention, and should be limited the present invention with the appended claims that embodies the present invention's design.

Claims (12)

1. radiator structure, comprise be used to be provided with the substrate of heater element and join with substrate, to the radiator of heater element heat transmission, it is characterized in that radiator comprises:
The heat dissipating housing of roof that includes sidewall, joins with sidewall and the cover mouth relative with roof, described substrate are arranged on described cover mouthful; With
Be filled in thermal paste by the heat dissipating housing internal cavity of the sealing that sidewall, roof and substrate surrounded of heat dissipating housing;
Wherein, after described radiator structure assembling is finished, described thermal paste is filled up the remaining space of heat dissipating housing internal cavity, and then being formed with at least one passage that passes described thermal paste between described substrate and the described roof and/or on the described sidewall, the two ends of at least one passage are communicated with the external world of radiator structure.
2. radiator structure as claimed in claim 1 is characterized in that, the volume of described thermal paste is more than or equal to the sidewall of heat dissipating housing, the volume sum of roof, or the weight of described thermal paste is more than or equal to the weight of heat dissipating housing.
3. radiator structure as claimed in claim 1 or 2 is characterized in that, is provided with one of at least fin at the sidewall of described heat dissipating housing and roof.
4. the light source module of a light-emitting diode is characterized in that, comprises:
As the described radiator structure of the arbitrary claim of claim 1-3; With
Be arranged on the light-emitting diode on the substrate of described radiator structure.
5. light source module as claimed in claim 4, it is characterized in that, described light-emitting diode is a plurality of LED with vertical structure, described substrate is a circuit board, passage in the radiator structure is a plurality of passages that pass the roof of circuit board, thermal paste and heat dissipating housing, and these a plurality of passages are distributed in a plurality of LED with vertical structure in the interval between at least some LED with vertical structure.
6. a LED light lamp is characterized in that, comprises:
As the described radiator structure of the arbitrary claim of claim 1-3;
Accept the lamp holder of power supply usefulness;
The lamp holder Connection Block that one end is connected with lamp holder, the other end is connected with the roof of heat dissipating housing outside heat dissipating housing, this lamp holder Connection Block is formed with inner chamber; With
Be installed in the drive circuit in the described inner chamber; Wherein
Described heater element is on light-emitting diode and the substrate that is installed in radiator structure, and described drive circuit utilizes described power supply to make led lighting, and light-emitting diode is outside heat dissipating housing.
7. LED light lamp as claimed in claim 6, it is characterized in that, described light-emitting diode is a plurality of LED with vertical structure, described substrate is a circuit board, passage in the radiator structure is a plurality of passages that pass the roof of circuit board, thermal paste and heat dissipating housing, and these a plurality of passages are distributed in a plurality of LED with vertical structure in the interval between at least some LED with vertical structure.
8. LED light lamp as claimed in claim 7 is characterized in that, the two pins of each LED with vertical structure is installed on redundance behind the circuit board and all extends in described thermal paste and contact with thermal paste.
9. LED light lamp as claimed in claim 6 is characterized in that the sidewall of described lamp holder Connection Block is provided with louvre.
10. LED light lamp as claimed in claim 9 is characterized in that, further comprises to prevent that object from entering from louvre and touch the drive circuit lid that described drive circuit uses.
11. LED light lamp as claimed in claim 10 is characterized in that, described drive circuit is positioned at the lamp holder Connection Block is compared more close lamp holder Connection Block with a described end of lamp holder Connection Block the described other end.
12. LED light lamp as claimed in claim 11, it is characterized in that, described lamp holder Connection Block is an axis structure axisymmetricly with the line of centres of a described end and the described other end, described louvre is the even number louvre more than 2, and is radially configuration in pairs on the sidewall of lamp holder Connection Block.
CNA2009100473108A 2009-03-10 2009-03-10 Radiating structure, light source module of light-emitting diode and light-emitting diode lamp Pending CN101510532A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2009100473108A CN101510532A (en) 2009-03-10 2009-03-10 Radiating structure, light source module of light-emitting diode and light-emitting diode lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2009100473108A CN101510532A (en) 2009-03-10 2009-03-10 Radiating structure, light source module of light-emitting diode and light-emitting diode lamp

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CN101510532A true CN101510532A (en) 2009-08-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105674097A (en) * 2016-02-29 2016-06-15 柳州格瑞斯光电科技有限公司 Led lamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105674097A (en) * 2016-02-29 2016-06-15 柳州格瑞斯光电科技有限公司 Led lamp

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Application publication date: 20090819