CN101493207A - Solid light source, projecting system and bundling lighting fixture employing the device - Google Patents

Solid light source, projecting system and bundling lighting fixture employing the device Download PDF

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Publication number
CN101493207A
CN101493207A CNA2008100656477A CN200810065647A CN101493207A CN 101493207 A CN101493207 A CN 101493207A CN A2008100656477 A CNA2008100656477 A CN A2008100656477A CN 200810065647 A CN200810065647 A CN 200810065647A CN 101493207 A CN101493207 A CN 101493207A
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light
prism
optical component
solid state
light source
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CN101493207B (en
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曹嘉灿
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Shenzhen Highmight Technology Co., Ltd.
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曹嘉灿
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Abstract

The invention discloses a solid state light source device, a projection system and a gathering illumination lamp adopting the device. The solid state light source comprises a hollow optical component. Air, vacuum or other light transmission media are included in the cavity of the optical component, a light-emitting window is arranged on the optical component in polyhedron shape; at least a light-entering window is arranged on the optical component, at least a light conducting prism is arranged corresponding to the light-entering window, a solid state luminescence component is arranged corresponding to the bottom side of the light conducting prism, reflection parts are positioned in the optical component or both in and out of the optical component, the light sent out by the solid state luminescence component is refracted or totally reflected by the light conducting prism, reflected by the reflection parts or directly emitted from the light-emitting window of the optical component. By fully utilizing the side wall of the optical component to be equipped with more solid state luminescence components, the device is capable of enlarging the effective light-emitting area of the solid state luminescence components, increasing the light output of light source under the condition of maintaining the same light-emitting window area; and all the light sent out by a plurality of solid state luminescence components is put together and educed toward the direction of the light-emitting window through the reflection part and the light conducting prism, which not only increases the light output but also educes light efficiently.

Description

Solid state light source, the optical projection system that adopts this device and boundling lighting
Technical field
The present invention relates to a kind of light supply apparatus and application thereof, relate in particular to a kind of solid state light source, adopt the optical projection system and the cluster type lighting of this device.
Background technology
Great power LED Sony ericsson mobile comm abs such as (comprising OLED) is as novel high brightness; the long-life light source has obtained significant progress in applications such as illuminations; the long-life that it has; characteristics such as high colour purity existing just based on arc glow projection light source was short of; but Sony ericsson mobile comm abs such as LED to be applied to optical projection system; just necessarily require to constitute light source be a comparatively desirable spot light; but the illuminator of each LED is a semiconductor chip with certain light-emitting area; be a low profile light source in essence; and because single led chip luminosity is limited; in order to reach enough big luminous flux; usually also need a plurality of led chips are arranged in array; or adopt larger sized LED planar luminous body; when forming the luminous flux multiplication; the also corresponding multiplication of its light source luminescent area; when the light source luminescent area big more; the imaging efficient of its respective projection imaging optical system is just low more; promptly attempt to increase LED quantity and increase by traditional approach the light output flow (luminosity) of light source and make great efforts to be difficult to gather effect, this is the major technique obstacle that solid light sources such as great power LED is applied to optical projection system.
Usually, for non-strict spot light, adopt " optical extend " (Etendue) to show E=π Asin is promptly arranged its degree of approximation to spot light 2θ, wherein E is optical extend (Etendue) value, and A is the surface source luminescence area, and θ is the maximum angle of flare of area source emergent ray, and light-emitting area is more little, and the maximum angle of flare of light is more little, and the E value is more little, gets over points of proximity light source, otherwise then requires far away more from spot light.Under the prior art condition, with comparatively typical 40mil (1mm 2) led chip is example, its Etendue value is about 3.14mm 2* sr, and for a kind of design of typical projection optical system, the coupling Etendue value of its display light chip is about 34.36mm 2* sr, designing requirement according to the Etendue value≤display light chip Etendue value of light source, promptly can only adopt 9 led chips to line up 3 * 3 array, luminous efficiency with led chip is 40 lumens/W, the optical projection system optical efficiency is 15% calculating, then can only obtain the projected light output of 54 lumens at last, such level can only be used " pocket " type projector as general individual and use, and does not reach general family expenses or the commercial affairs light output requirement with projection display equipment (projection arrangement of back projection or front projection mode) needed hundreds of lumen and even several kilolumens far away.Sony ericsson mobile comm abs such as LED to be replaced tradition " arc light " formula projection light source, one of its technological difficulties to be solved, be to make it under the condition that satisfies the desired Etendue value of optical projection system, increase substantially " the product light quantity " of light source, in other words under the prerequisite that does not increase light source output Etendue value, roll up the led chip quantity that to hold in the light source or the light-emitting area of LED planar luminous body, and the light that led chip sent can be derived with sufficiently high efficient.For reaching its purpose, as shown in Figure 1, publication number is to have disclosed a kind of light supply apparatus in the Chinese patent " light supply apparatus and projecting display " of CN1682070A, according to this technical scheme, at first to construct a bar-shaped optical component, an end face of bar-shaped optical component is an exiting surface, the light output Etendue value of this light source is determined by this face area, other surface of bar-shaped optical component is reflecting surface, led chip vertically is arranged on its lateral reflection face along bar-shaped optical component, the led chip issued light is exported from its light output end behind interreflection between the reflecting surface of bar-shaped optical component inside, thereby can unrestrictedly increase the led chip quantity that is arranged at bar-shaped optical component inside by the length of unrestrictedly extending bar-shaped optical component and unrestrictedly improve the light output quantity that obtains from light output end, attempting to reach significantly increases the target that light source produces light quantity under the condition that does not increase light source Etendue value.Yet, in the disclosed technical scheme of this patent, there is serious defective: be arranged at the led chip in the bar-shaped optical component, both provided the source of this light source light output, it is again the light that will be sent obstacle from the inner guiding of bar-shaped optical component light output end, because in the process that the light that led chip sent is derived by the reflecting surface interreflection of rod member inside, in case these light are mapped on the led chip, will be absorbed by led chip, in chip internal interreflection decay, become the heat of chip and lose.Therefore, more led chip is set in rod member inside in order to obtain the output of more light, but the derivation for light is provided with more obstacle simultaneously, the derivation efficient of light is reduced, do not have to realize that the quantity by at the inner LED of increasing of rod member significantly increases the purpose that light source produces light quantity.In addition, as shown in Figure 2, the characteristics of luminescence of led chip satisfies " Lambertian distribution ", because the led chip luminous energy is relevant with its angle of departure, the light that the angle of departure is more little, its emitted energy is big more, the light that the angle of departure is big more, and its emitted energy is more little, in the disclosed technical scheme of above-mentioned patent, the light that the angle of departure is more little, many more on the contrary at the inner order of reflection that will experience of rod member, it is absorbed by led chip and the probability that loses is just big more.Last result is, when in a large number led chip being set in rod member inside in order to seek the output of high light, only have the light of the very little big angle of departure of part of energy more efficiently to be derived from light output end, it is very low that photoconduction goes out efficient, also is difficult to reach and significantly improves the purpose of producing light quantity.
Summary of the invention
The solid state light source that the purpose of this invention is to provide a kind of high yield light quantity, high efficiency derivation.
The present invention realizes above-mentioned purpose by the following technical solutions: a kind of solid state light source, comprise the hollow optical component, in the cavity of optical component is air, vacuum or other light transmission medium, optical component is provided with light-emitting window, optical component is polyhedral, which is provided with at least one light inlet, corresponding at least one leaded light prism that is provided with light inlet, leaded light prism bottom surface is provided with the solid luminescent assembly, all be provided with reflecting element outward with optical component in the optical component or in the optical component, the light that the solid luminescent assembly sends is through leaded light refraction by prism or total reflection, reflecting element reflects or directly penetrates from the optical component light-emitting window.
Be provided with reflecting element, at least one leaded light prism in the described optical component, leaded light prism bottom surface is corresponding with light inlet, the outer corresponding solid luminescent assembly that is provided with of optical component, the light that the solid luminescent assembly sends with light inlet through leaded light refraction by prism or total reflection, reflecting element reflects or directly penetrate from light-emitting window.
Described optical component is a hexahedron shape optical component, and its antetheca is provided with a light-emitting window, and sidewall is provided with at least one light inlet, and the internal face of the optical component except that light-emitting window, light inlet is provided with reflecting element, leaded light prism bottom surface size and light inlet coupling.
The solid luminescent assembly comprises luminous plaque, luminous plaque by heat sink, be encapsulated in and heat sinkly densely arranged luminescence chip and constitute, the luminous plaque size is consistent with the light inlet coupling, the light-emitting area of luminous plaque and leaded light prism bottom surface coupling are installed, leave air-gap between the coupling face, perhaps between the coupling face, be provided with refractive index matched agent.
The heat sink semiconductor cooler that is provided with of luminous plaque is provided with heat transfer device behind the refrigerator, the wherein chill surface of refrigerator and heat sink radiating surface applying, and the heating face of refrigerator is fitted with heat transfer device, is provided with thermal conducting agent between the described binding face.
Described reflecting element is a specular layer.
Rear surface is provided with the pyramid-shaped specular layer in the optical component relative with light-emitting window.
The leaded light prism is the strip prism wedge, and the leaded light prism array sheet is formed in the parallel no gap of the leaded light prism more than two, leaded light prism array sheet and light inlet size coupling.
The leaded light prism is asymmetric prism, with the side of the bigger leaded light prism of bottom surface angle towards light-emitting window.
The size of light-emitting window and projection optical system coupling.
Four sidewalls of optical component all are provided with light inlet respectively in the position near rear wall, and the optical component internal face except that light-emitting window, light inlet is provided with reflecting element.
Described light inlet width in the horizontal direction is less than the housing width of light inlet vertical direction.
Each light inlet is provided with different single primary colours luminous plaques, and corresponding leaded light prism bottom surface is provided with the media film that only sees through these primary lights.
The optical component light inlet outside is provided with the refractive power right-angle prism, mate with the leaded light prism of light inlet, the light-emitting area of luminous plaque respectively orthogonal two sides of refractive power right-angle prism, its inclined side is provided with the reflecting layer, is provided with air-gap or refractive index matched agent between the coupling face.
The optical component light inlet outside is provided with the light-combining prism group, the light-combining prism group is formed by stacking in proper order by a triangular prism and two parallelogram prisms, a vertical side of triangular prism is an exiting surface, leaded light prism coupling in itself and the optical component light inlet, another vertical side of triangular prism and with the bottom surface of the parallelogram prism of its homonymy be incidence surface, three's correspondence respectively is provided with the solid luminescent assembly, and light-combining prism group all lateral surfaces except that incidence surface, exiting surface all are provided with the reflecting layer.
Binding face between triangular prism, the parallelogram prism is provided with respectively a kind of single primary lights is produced the dichroic coating that reflection sees through all the other primary lights, all be provided with luminous plaque with its coupling at the incidence surface of three prisms, described each luminous plaque all sends the reflectible primary lights of dichroic coating with the prism of its coupling, is provided with air-gap or refractive index matched agent between the coupling face.
The interlaced setting of the light inlet of optical component adjacent side, corresponding leaded light prism, the also interlaced setting of solid luminescent assembly.
Described solid luminescent assembly is a LED solid luminescent assembly.
Two light inlets are crisscross arranged respectively on two adjacent sides.
A kind of optical integration rod type projecting illumination system, the light source of described optical integration rod type projecting illumination system has adopted the solid state light source of the invention described above.
A kind of boundling lighting, the light source of described boundling lighting has adopted the solid state light source of the invention described above.
The light that solid luminescent assembly of the present invention sends enters polyhedron optical component inner space through the leaded light prism or the leaded light prism array sheet at light inlet place, by refraction or the total reflection that in the leaded light prism, produces, and reflecting element reflection by being provided with on the polyhedron optical component madial wall, making light propagate harmless lost territory derives in the light-emitting window direction set, can make full use of polyhedron optical component side so more solid luminescent assembly is set, increase effective solid luminescent assembly light-emitting area, under the constant situation of light-emitting window area, increase the product light quantity of light source, and the light that a plurality of solid luminescent assemblies send all derived in the light-emitting window direction set in this way, both improved the product light quantity, derived expeditiously again.
Hexahedron structure is stable structure, and its light-emitting window geometry is convenient to and the optical projection system coupling, and in addition, hexahedron is a kind of structure of most convenient processing, assembling in the polyhedral structure.
Because the luminescence chip of a large amount of high-density installation, the high power solid state luminescence component can produce high temperature when work, be controlled at for PN junction temperature in the temperature range of efficiency operation for a long time luminescence chip, will carry out efficiently radiates heat to the solid luminescent assembly, therefore luminescence chip is mounted on good heat sink of heat conduction and is made into luminous plaque, and by semiconductor cooler luminous plaque is cooled off, by heat-transfer device the heat that is produced is derived again.
Be provided with the pyramid-shaped reflecting layer at polyhedron optical component and light-emitting window opposed bottom surface, this pyramid-shaped reflecting layer can be reflected be mapped to this surperficial light after leaded light refraction by prism or total reflection again, and with less angle of departure directive light-emitting window, reduce to derive the angle of departure of light from light-emitting window, and reduce light reflected back light inlet mouth and the light losing that causes has improved optical efficiency again.
The leaded light prism adopts strip, asymmetric wedge shape leaded light prism, the refraction of different directions or reflection are different, has asymmetric light energy distribution characteristic, can utilize this characteristic, the main energy outbound course that makes light is towards the light-emitting window direction, light can be in polyhedron low-loss ground guiding light-emitting window, thereby obtain high photoconduction and go out efficient, and under the restriction of limited light source Etendue value, significantly increase the light-emitting area of luminous plaque, thereby obtain high product light quantity.
The luminous plaque set in the side of polyhedron optical component sends primary lights different in the red, green, blue three primary colours respectively, and be synthetic in the polyhedron optical component, and at light-emitting window output synthesize white light.Bottom surface at pairing leaded light prism of the luminous plaque of each primary colours or leaded light prism array sheet, the media film that can see through this kind primary lights and reflect other primary lights is set respectively, because the media film of set luminous plaque of ipsilateral and correspondence is not different, then in polyhedron optical component space, transmit and reflect or when reflecting the leaded light prism array sheet of other side when light that luminous plaque sent, just can be reflected by the different base colors media film of this leaded light prism array sheet bottom surface and be reclaimed, thereby reduce the escape loss of light, improve photoconduction and go out efficient.
Between the coupling face of luminous plaque and leaded light prism array sheet, can leave air-gap, so that the part light in the hexahedron optical component produces total reflection in leaded light prism bottom surface, reduce light escape loss, perhaps between the coupling face, be aided with refractive index matched agent, can prevent that the light that luminous plaque sends from producing total reflection at the coupling face, improves the importing efficient of light.
Be provided with the triangle refractive prism at the light inlet place, reflecting surface reflection by the triangle refractive prism makes the installation direction of solid luminescent assembly parallel with light-emitting window, thereby can make the solid luminescent assembly be in same plane (or same direction), reduce the shared locus of solid luminescent assembly.
The refractive prism expansion is formed the light-combining prism group, the light-combining prism group is formed by stacking in proper order by a triangular prism and two parallelogram prisms, a vertical side of triangular prism is as the prism exiting surface, mate with the leaded light prism, two inclination binding faces of light-combining prism group inside are provided with respectively and can produce reflection to certain primary lights, all the other primary lights are produced the different dichroic coatings of transmission; The bottom surface of three prisms of light-combining prism group is as the incidence surface of prism group, be matched with the bottom surface of three prisms respectively according to different base colors light, its lap can be set to reflecting surface or plane of refraction, three primary colours light synthesizes at the light-combining prism exiting surface, output to the white light that is in the polyhedron optical component, the luminous plaque enlarged areas that this structure will be used for light source is original 3 times, has improved the product light quantity.
The light inlet of two adjacent side is crisscross arranged along the light-emitting window vertical direction, also being about to luminous plaque and leaded light prism is crisscross arranged, interfere the geometric position of having avoided the leaded light prism of two adjacent side settings to cause in hexahedron optical component inside like this, thereby can strengthen prism dimensions in the prism array, reduce the prism number in the prism array, thereby return luminous plaque after can effectively avoiding part light by the different refraction by prisms in the prism array and cause light escape loss, improve light and import efficient, and can reduce device manufacturing and installation accuracy requirement.
In four sides of hexahedron optical component, have only two adjacent sides that light inlet is set, be provided with luminous plaque and leaded light prism at the light inlet place, eliminated when on relative side, light inlet being set, the light that luminous plaque sends is absorbed loss by the light that leaded light refraction by prism is caused to the leaded light prism on opposite, can obviously improve the leaded light efficient of device, and because the opposite flank is not provided with the leaded light prism, can increase the size of this leaded light prism, compare with the situation that four sides all are provided with light inlet, when the leaded light number of prisms is identical, the size of leaded light prism can increase and is twice, and correspondingly with the area of the luminous plaque of leaded light prism coupling also doubles, therefore, increase the product light quantity, increased the leaded light efficient of device.
Description of drawings
Fig. 1 is the prior art constructions schematic diagram;
Fig. 2 is the Lambertian distribution map of led chip;
Fig. 3 is the structural representation of embodiment 1;
Fig. 4 a is the structural representation of embodiment 2;
Fig. 4 b is the structural representation of embodiment 2 another kind of embodiments;
Fig. 5 a is the structural representation of embodiment 3;
Fig. 5 b is the structural representation of embodiment 3 another kind of embodiments;
Fig. 6 a is the structural representation of embodiment 4;
Fig. 6 b is the structural representation of embodiment 4 another kind of embodiments;
Fig. 7 a is the structural representation of embodiment 5;
Fig. 7 b is the structural representation after embodiment 5 light-combining prisms split;
Fig. 7 c is the structural representation of embodiment 5 another kind of embodiments;
Fig. 8 a is the structural representation of embodiment 6;
Fig. 8 b is the three-dimensional appearance schematic diagram of embodiment 6;
Fig. 8 c is the structural representation of embodiment 6 another kind of embodiments;
Fig. 9 a is the structural representation of embodiment 7;
Fig. 9 b is the structural representation of embodiment 7 another kind of embodiments;
Figure 10 is the structural representation of embodiment 8;
Figure 11 a is embodiment 9 one chip DLP type projection imaging system schematic diagrames;
Figure 11 b is the projection imaging system schematic diagram after embodiment 9 solid-state devices light sources replace traditional arc light type projection light source;
Figure 12 is the structural representation of embodiment 10.
The specific embodiment
Embodiment 1, as shown in Figure 3, a kind of solid state light source comprises the hexahedron optical component 1 of hollow, its antetheca is provided with light-emitting window 3, the size of light-emitting window 3 and projection optical system coupling, a side inner walls at hexahedron optical component 1 is provided with light inlet 5, remove light-emitting window 3, light inlet 5 outer optical component 1 internal faces are provided with specular layer 2, light inlet 5 can be provided with a leaded light prism 4, as long as leaded light prism 4 bottom surface summations and light inlet 5 couplings, the leaded light prism array sheet of the parallel no gap of the leaded light prism composition of a plurality of different sizes also can be set, leaded light prism 4 is the strip prism wedge of symmetry, optical component 1 outer with the light inlet 5 corresponding solid luminescent assemblies 6 that are provided with, the solid luminescent assembly comprises luminous plaque 6-1, luminous plaque 6-1 is by heat sink 6-1-2, the luminescence chip or the densely arranged luminescence chip array 6-1-1 that are encapsulated on the heat sink 6-1-2 constitute, the size that luminescence chip or densely arranged luminescence chip array 6-1-1 form light-emitting area is consistent with light inlet 5 couplings, the light-emitting area of luminous plaque 6-1 and leaded light prism 4 bottom surfaces coupling are installed, leave air-gap between the two coupling face, can also between the coupling face, be provided with refractive index matched agent, the heat sink 6-1-2 of luminous plaque 6-1 is provided with semiconductor cooler 6-2, be provided with heat transfer device 6-3 behind the refrigerator 6-2, wherein the radiating surface of the chill surface of refrigerator 6-2 and heat sink 6-1-2 is fitted, the heating face of refrigerator 6-2 is fitted with heat transfer device 6-3, be provided with thermal conducting agent between the described binding face, be filled with light-transmissive resin material or glass in the optical component 1.
Embodiment 2, shown in Fig. 4 a, a kind of solid state light source comprises the hexahedron optical component 1 of hollow, its antetheca is provided with light-emitting window 3, the size of light-emitting window 3 and projection optical system coupling, be respectively equipped with four light inlets 5 in 1 four side inner walls of hexahedron optical component, remove light-emitting window 3, light inlet 5 outer optical component 1 internal faces are provided with specular layer 2, six parallel no gaps of leaded light prism are formed leaded light prism array sheet 4 and are arranged on light inlet 5, leaded light prism array sheet 4 can also be made up of the leaded light prism of other varying numbers, the quantity of leaded light prism and its size, it is relevant that adjacent side leaded light prism array sheet is provided with situation, the leaded light prism is the strip prism wedge of symmetry, leaded light prism array sheet 4 bottom surfaces and light inlet coupling, optical component 1 outer with the light inlet 5 corresponding solid luminescent assemblies 6 that are provided with, solid luminescent assembly 6 structures are with embodiment 1, do not repeat them here, the heat sink semiconductor cooler 6-2 that is provided with of luminous plaque 6-1, be provided with heat transfer device 6-3 behind the refrigerator 6-2, the wherein chill surface of refrigerator 6-2 and heat sink radiating surface applying, the heating face of refrigerator 6-2 is fitted with heat transfer device 6-3, be provided with thermal conducting agent between the described binding face, be filled with light-transmissive resin material or glass in the optical component.The length-width ratio of light-emitting window 3 is corresponding with optical projection system display image the ratio of width to height (16: 9 or 4: 3), the desired Etendue value coupling of the area of light-emitting window 3 and projection optical system; Corresponding to adopting the outside radiator structure of air-cooled light source, heat transfer device 6-3 can make for the material with good heat conductive performance, corresponding to the radiator structure that adopts liquid-cooled light source outside, heat transfer device 6-3 can be for having the hollow material of good heat conductive performance, and charge into the thermal conductivity fluid in the portion space within it and make.
Four side surface area that present embodiment makes full use of hexahedron optical component space are provided with luminous plaque 6-1, to increase effective luminous plaque 6-1 light-emitting area, are under the definite condition of hexahedron optical component 1 cross section at light-emitting window 3 areas, increase light source and produce light quantity; After the light that luminous plaque 6-1 is sent enters hexahedron optical component 1 space by light inlet 5, by leaded light prism or 4 pairs of ray refraction of leaded light prism array sheet or total reflection, light is taken place to helping the direction turnover that the harmless lost territory of light is penetrated from light-emitting window 3, the width of luminous plaque 6-1 is consistent with light inlet 5 cooperations, reduces the light escape that takes place by light inlet 5 as far as possible; The high temperature that produces during the high-power light-emitting plate 6-1 work that constituted for the luminescence chip array that makes a large amount of high-density installation carries out efficiently radiates heat, to guarantee that it carries out the needed junction temperature of efficiency operation, luminous plaque 6-1 is mounted on the good substrate of heat conduction (heat sink), and can introduce semiconductor cooler 6-2 luminous plaque 6-1 is cooled off, by heat-transfer device the heat that is produced is derived again, between the coupling face of luminous plaque 6-1 and prism array sheet 4, can leave air-gap, so that the part light in hexahedron optical component 1 space produces total reflection in leaded light prism 4 bottom surfaces, reduce light escape loss, also can between the coupling face, be aided with index-matching fluid, to prevent that luminous plaque 6-1 institute isolychn from producing total reflection at the coupling face, improves the importing efficient of light.
Shown in Fig. 4 b, another kind of embodiment is that rear surface is provided with pyramid-shaped specular layer 2 in the optical component 1 relative with light-emitting window 3, leaded light prism 4 is asymmetrical strip prism wedge, all the other structures are same as the previously described embodiments, do not repeat them here, pyramid-shaped specular layer 2 can with through be mapped to after leaded light prism 4 refraction or the total reflection this surperficial light after this surface reflection with less angle of departure directive light-emitting window 3, reduce to derive the angle of departure of light from light-emitting window 3, and reduce the light escape that light causes via light inlet 5, improve optical efficiency.
Assembling process: the hexahedron optical component is made by glass, metal or other material, and it is surperficial within it coated with specular layer, at the light inlet of leaving near bottom surface one end, during assembling, earlier prism array sheet is packed into from light inlet, again luminescence component (being made of luminous plaque, semiconductor cooler, heat transfer device applying assembling) is assembled to the position corresponding with light inlet.
Embodiment 3, shown in Fig. 5 a, a kind of solid state light source comprises the hexahedron optical component 1 of hollow, its antetheca is provided with light-emitting window 3, the size of light-emitting window 3 and projection optical system coupling, be respectively equipped with four light inlets 5 in 1 four side inner walls of hexahedron optical component, remove light-emitting window 3, light inlet 5 outer optical component 1 internal faces are provided with specular layer 2, six parallel no gaps of leaded light prism are formed leaded light prism array sheet 4 and are arranged on light inlet 5, leaded light prism array sheet 4 can also be made up of the leaded light prism of other varying numbers, the quantity of leaded light prism and its size, it is relevant that adjacent side leaded light prism array sheet is provided with situation, the leaded light prism is the strip prism wedge of symmetry, leaded light prism array sheet 4 bottom surfaces and light inlet 5 couplings, optical component 1 outer with the light inlet 5 corresponding solid luminescent assemblies 6 that are provided with, the solid luminescent modular construction is with embodiment 1, do not repeat them here, the light-emitting area of luminous plaque 6-1 and leaded light prism 4 bottom surfaces coupling are installed, leave air-gap between the two coupling face, can also between the coupling face, be provided with refractive index matched agent, each light inlet 5 is provided with different single primary colours luminous plaque 6-1, corresponding leaded light prism 4 bottom surfaces are provided with the media film 9 that only sees through these primary lights, the luminous plaque 6-1 and the media film 9 of two adjacent side in the preferred hexahedron optical component 1 of present embodiment in four sides are set to green, the luminous plaque 6-1 and the media film 9 of two adjacent side are set to redness and blueness respectively in addition, the light-emitting area of each luminous plaque 6-1 and leaded light prism array sheet 4 bottom surfaces coupling, the heat sink semiconductor cooler 6-2 that is provided with of luminous plaque 6-1, be provided with heat transfer device 6-3 behind the refrigerator 6-2, the wherein chill surface of refrigerator 6-2 and heat sink radiating surface applying, the heating face of refrigerator 6-2 is fitted with heat transfer device 6-3, be provided with thermal conducting agent between the described binding face, be filled with light-transmissive resin material or glass in the optical component.The length-width ratio of light-emitting window 3 is corresponding with optical projection system display image the ratio of width to height (16: 9 or 4: 3), the desired Etendue value coupling of the area of light-emitting window 3 and projection optical system.
Shown in Fig. 5 b, another kind of embodiment is that rear surface is provided with pyramid-shaped specular layer 2 in the optical component 1 relative with light-emitting window 3, and the leaded light prism is asymmetrical strip prism wedge, and all the other structures are same as the previously described embodiments, do not repeat them here.
The set luminous plaque 6-1 in four sides of hexahedron optical component 1 sends the light of different base colors in the red, green, blue three primary colours respectively, and is synthetic in hexahedron optical component 1, and at light-emitting window output synthesize white light.And, bottom surface at the pairing leaded light prism plate of the luminous plaque 6-1 of each primary colours array board 4, be provided with respectively and can see through this kind primary lights, reflect the media film 9 of other primary lights, because the media film 9 of set luminous plaque 6-1 of ipsilateral and correspondence is not different, then the light that is sent as luminous plaque 6-1 is when the 1 space internal reflection of hexahedron optical component advances to be arranged at the leaded light prism array sheet 4 of other side, just can be reflected by the different base colors media film 9 of these prism array sheet 4 bottom surfaces and be reclaimed, thereby reduce the escape loss of light, improve photoconduction and go out efficient.
Embodiment 4, shown in Fig. 6 a, a kind of solid state light source comprises the hexahedron optical component 1 of hollow, its antetheca is provided with light-emitting window 3, the size of light-emitting window 3 and projection optical system coupling, be respectively equipped with four light inlets 5 in 1 four side inner walls of hexahedron optical component, remove light-emitting window 3, light inlet 5 outer optical component 1 internal faces are provided with specular layer 2, six parallel no gaps of leaded light prism are formed leaded light prism array sheet 4 and are arranged on light inlet 5, leaded light prism array sheet 4 can also be made up of the leaded light prism of other varying numbers, the quantity of leaded light prism and its size, it is relevant that adjacent side leaded light prism array sheet 4 is provided with situation, the leaded light prism is the strip prism wedge of symmetry, leaded light prism array sheet 4 bottom surfaces and light inlet 5 couplings, optical component 1 outer with the light inlet 5 corresponding solid luminescent assemblies 6 that are provided with, solid luminescent assembly 6 structures are with embodiment 1, do not repeat them here, the light-emitting area of luminous plaque 6-1 and leaded light prism 4 bottom surfaces coupling are installed, leave air-gap between the two coupling face, can also between the coupling face, be provided with refractive index matched agent, optical component 1 light inlet 5 outsides are provided with refractive power right-angle prism 10, refractive power right-angle prism 10 orthogonal two side 10-1,10-2 respectively with the leaded light prism array sheet 4 of light inlet 5, solid luminescent assembly 6 couplings are fitted, its the 3rd 10-3 is provided with the reflecting layer, be provided with air-gap or refractive index matched agent between the coupling face, wherein solid luminescent assembly 6 structures are identical with embodiment 1, do not repeat them here, the heat sink semiconductor cooler 6-2 that is provided with of luminous plaque 6-1, be provided with heat transfer device 6-3 behind the refrigerator 6-2, the wherein chill surface of refrigerator 6-2 and heat sink radiating surface applying, the heating face of refrigerator 6-2 is fitted with heat transfer device 6-3, be provided with thermal conducting agent between the described binding face, be filled with light-transmissive resin material or glass in the optical component.Present embodiment is owing to be provided with triangle refractive prism 10 between light inlet 5 and solid luminescent assembly 6, reflecting surface 10-3 reflection by triangle refractive prism 10 makes that the installation direction of solid luminescent assembly 6 is parallel with light-emitting window 3, thereby can make the solid luminescent assembly 6 corresponding be in same plane (or same direction) with each light inlet 5, therefore luminous plaque 6-1 can adopt the method that luminescence chip is installed in same heat sink zones of different accordingly to constitute, promptly realize corresponding to the luminous plaque 6-1 of each light inlet 5 public be one, semiconductor cooler 6-2 and heat transfer device 6-3 also can be correspondingly public one, reduced solid luminescent assembly 6 shared locus and structure and assembly technology.The length-width ratio of light-emitting window 3 is corresponding with optical projection system display image the ratio of width to height (16: 9 or 4: 3), the desired Etendue value coupling of the area of light-emitting window 3 and projection optical system; Corresponding to adopting the outside radiator structure of air-cooled light source, heat transfer device 6-3 can make for the material with good heat conductive performance, corresponding to the radiator structure that adopts liquid-cooled light source outside, heat transfer device 6-3 can be for having the hollow material of good heat conductive performance, and charge into the thermal conductivity fluid in the portion space within it and make.
Shown in Fig. 6 b, another kind of embodiment is that rear surface is provided with pyramid-shaped specular layer 2 in the optical component 1 relative with light-emitting window 3, and the leaded light prism is asymmetrical strip prism wedge, and all the other structures are same as the previously described embodiments, do not repeat them here.
Embodiment 5, as Fig. 7 a, shown in the 7b, a kind of solid state light source comprises the hexahedron optical component 1 of hollow, its antetheca is provided with light-emitting window 3, the size of light-emitting window 3 and projection optical system coupling, be respectively equipped with four light inlets 5 in 1 four side inner walls of hexahedron optical component, remove light-emitting window 3, light inlet 5 outer optical component 1 internal faces are provided with specular layer 2, six parallel no gaps of leaded light prism are formed leaded light prism array sheet 4 and are arranged on light inlet 5, leaded light prism array sheet 4 can also be made up of the leaded light prism of other varying numbers, the quantity of leaded light prism and its size, it is relevant that adjacent side leaded light prism array sheet 4 is provided with situation, the leaded light prism is the strip prism wedge of symmetry, leaded light prism array sheet 4 bottom surfaces and light inlet 5 couplings, optical component light inlet 5 outsides are provided with light-combining prism group 11, light-combining prism group 11 is by a triangular prism 11-1 and two parallelogram prism 11-2,11-3 is formed by stacking in proper order, the vertical side D1 of triangular prism 11-1 is an exiting surface, leaded light prism array sheet 4 couplings in itself and the optical component light inlet 5, another vertical side B1 of triangular prism 11-1 reaches two parallelogram prism 11-2 with its homonymy, the bottom surface B2 of 11-3, B3 is an incidence surface, the three is respectively equipped with solid luminescent assembly 6, solid luminescent assembly 6 structures are with embodiment 1, do not repeat them here, luminous plaque 6-1 size is consistent with light inlet 5 couplings, the light-emitting area of luminous plaque 6-1 and leaded light prism array sheet 4 bottom surfaces coupling, light-combining prism group 11 is removed incidence surface, all lateral surface C1 beyond the exiting surface, C2, C3 is provided with specular layer 13, triangular prism 11-1, parallelogram prism 11-2, the first binding face 12-1 between the 11-3, the second binding face 12-2 is provided with respectively a kind of single primary lights is produced the dichroic coating that reflection sees through all the other primary lights, incidence surface B1 at three prisms, B2, B3 is provided with the luminous plaque 6-1 with its coupling, described each luminous plaque 6-1 all sends the reflectible primary lights of dichroic coating with the prism of its coupling, be provided with air-gap or refractive index matched agent between the coupling face, preferred binding face 12-1 is set to the dichroic coating of " counter be popular in bluish-green ", binding face 12-2 is set to " anti-indigo plant reveals the green " dichroic coating, incidence surface B1 coupling has the luminous plaque 6-1 of burn red, import above-mentioned hexahedron optical component 1 via first binding face 12-1 reflection back from exiting surface D1 by this luminous plaque 6-1 glow, incidence surface B2 coupling has the luminous plaque 6-1 of the coloured light that turns blue, by this luminous plaque 6-1 institute blue light-emitting via second binding face 12-2 reflection and after the first binding face 12-1 transmission, import above-mentioned hexahedron optical component 1 from exiting surface D1, incidence surface B3 coupling has the luminous plaque 6-1 of glow green, by this luminous plaque 6-1 institute green light via reflecting surface C3 reflection and through the second binding face 12-2, import above-mentioned hexahedron optical component 1 from exiting surface D 1 after the first binding face 12-1 transmission, realize the light compositing of three primary colours light with this, and the gross area of luminous plaque 6-1 expanded as three times of exiting surface at light-combining prism group 11 exiting surfaces.The heat sink semiconductor cooler 6-2 that is provided with of luminous plaque 6-1, be provided with heat transfer device 6-3 behind the refrigerator 6-2, the wherein chill surface of refrigerator 6-2 and heat sink radiating surface applying, the heating face of refrigerator 6-2 is fitted with heat transfer device 6-3, be provided with thermal conducting agent between the described binding face, be filled with light-transmissive resin material or glass in the optical component.Present embodiment is also owing to be provided with described light-combining prism group 11 between light inlet 5 and solid luminescent assembly 6, by sloping reflector C3 in the light-combining prism group 11 or dichroic coating 12-1, the reflection of 12-2 makes that the installation direction of solid luminescent assembly 6 is parallel with light-emitting window 3, thereby can make the solid luminescent assembly 6 corresponding be in same plane (or same direction) with each light inlet 5, therefore luminous plaque 6-1 can adopt the method that luminescence chip is installed in same heat sink zones of different accordingly to constitute, promptly realize corresponding to the luminous plaque of each light inlet 5 public be one, semiconductor cooler 6-2 and heat transfer device 6-3 also can be correspondingly public one, reduced solid luminescent assembly 6 shared locus and structure and assembly technology.
Assembling process: prism group assembling: each prism is carried out according to the order of sequence bonding, form complete light-combining prism group integral body.
Light source assembling: earlier each prism array sheet and light-combining prism group are installed to each corresponding light inlet on the polyhedron respectively according to the order of sequence, form optical module.The luminous plaque applying is packaged in heat sink precalculated position, constitute luminous plaque, the radiating surface of luminous plaque and the chill surface of semiconductor cooler are fitted, the heating face of semiconductor cooler is fitted with heat transfer device, between each binding face, re-use thermal conducting agent, form luminescence component.At last, optical module and luminescence component assembling are fit together, finish assembling.
Shown in Fig. 7 c, another kind of embodiment is that rear surface is provided with pyramid-shaped specular layer 2 in the optical component relative with light-emitting window, and the leaded light prism is asymmetrical strip prism wedge, and all the other structures are identical with embodiment, do not repeat them here.
Embodiment 6, shown in Fig. 8 a, a kind of solid state light source comprises the hexahedron optical component 1 of hollow, its antetheca is provided with light-emitting window 3, the size of light-emitting window 3 and projection optical system coupling, be respectively equipped with four light inlets 5 four side inner walls, two parallel no gaps of leaded light prism are arranged on light inlet 5, form leaded light prism array sheet 4, the light inlet 5 interlaced settings of optical component 1 adjacent side, corresponding leaded light prism array sheet 4, the also interlaced setting of solid luminescent assembly 6, remove light-emitting window 3, light inlet 5 outer optical component 1 internal faces are provided with specular layer 2, leaded light prism array sheet 4 can also be made up of the leaded light prism of other varying numbers, because light inlet 5 is crisscross arranged, it is few that leaded light prism array sheet 4 can be provided with quantity, bigger leaded light prism, the quantity of leaded light prism and size, to interfere with the leaded light prism geometric position of opposite face be restrictive condition not cause, the leaded light prism is the strip prism wedge of symmetry, leaded light prism array sheet 4 bottom surface summations cooperate with light inlet, optical component 1 outer with the light inlet 5 corresponding solid luminescent assemblies 6 that are provided with, solid luminescent assembly 6 comprises luminous plaque 6-1, the structure of luminous plaque 6-1 is identical with embodiment 1, do not repeat them here, luminous plaque 6-1 size is consistent with the light inlet coupling, the light-emitting area of luminous plaque 6-1 and leaded light prism array sheet 4 bottom surfaces coupling are installed, leave air-gap between the coupling face, can also between the coupling face, be provided with refractive index matched agent, the heat sink semiconductor cooler 6-2 that is provided with of luminous plaque 6-1, be provided with heat transfer device 6-3 behind the refrigerator 6-2, the wherein chill surface of refrigerator 6-2 and heat sink radiating surface applying, the heating face of refrigerator 6-2 is fitted with heat transfer device 6-3, be provided with thermal conducting agent between the described binding face, be filled with light-transmissive resin material or glass in the optical component.The length-width ratio of light-emitting window 3 is corresponding with optical projection system display image the ratio of width to height (16: 9 or 4: 3), the desired Etendue value coupling of the area of light-emitting window 3 and projection optical system; Corresponding to adopting the outside radiator structure of air-cooled light source, heat transfer device 6-3 can make for the material with good heat conductive performance, corresponding to the radiator structure that adopts liquid-cooled light source outside, heat transfer device 6-3 can be for having the hollow material of good heat conductive performance, and charge into the thermal conductivity fluid in the portion space within it and make.
Because the luminous plaque 6-1 and the leaded light prism array 4 of two adjacent side light inlets 5 are crisscross arranged along hexahedron optical component 1 light-emitting window 3 vertical direction, interfere the geometric position of having avoided the leaded light prism array sheet 4 of two adjacent side light inlets 5 to cause in hexahedron optical component 1 inside, thereby can strengthen prism dimensions in the prism array 4, reduce the prism number in the prism array 4, thereby returning luminous plaque after can effectively avoiding part light by the different refraction by prisms in the prism array 4 causes light to escape, improve light and import efficient, and can reduce device manufacturing and installation accuracy requirement.
Shown in Fig. 8 b, another kind of embodiment is that the optical component 1 interior rear surface relative with light-emitting window is provided with pyramid-shaped specular layer 2, and the leaded light prism is asymmetrical strip prism wedge, and all the other structures are same as the previously described embodiments, do not repeat them here.
Embodiment 7, as Fig. 9 a, shown in the 9b, a kind of solid state light source comprises the hexahedron optical component 1 of hollow, its antetheca is provided with light-emitting window 3, the size of light-emitting window 3 and projection optical system coupling, in 1 four sides of hexahedron optical component, respectively be provided with a light inlet 5 respectively on two only adjacent sidewalls, two light inlet 5 interlaced settings, each light inlet 5 place is provided with two leaded light prisms and forms leaded light prism array sheet 4, corresponding leaded light prism array sheet 4, the also interlaced setting of solid luminescent assembly 6, remove light-emitting window 3, light inlet 5 outer optical component 1 internal faces are provided with specular layer 2, because the opposite does not have light inlet 5, adjacent light inlet 5 also is crisscross arranged, it is restrictive condition that the quantity of leaded light prism and size do not cause geometrical interference with the sidewall of hexahedron optical component 1 with the leaded light prism, the bottom surface of leaded light prism or leaded light prism array sheet 4 cooperates consistent with light inlet, the leaded light prism is the strip prism wedge of symmetry, optical component 1 outer with the light inlet 5 corresponding solid luminescent assemblies 6 that are provided with, solid luminescent assembly 6 comprises luminous plaque 6-1, the structure of luminous plaque 6-1 is with embodiment 1, do not repeat them here, luminous plaque 6-1 size is consistent with light inlet 5 couplings, the light-emitting area of luminous plaque 6-1 and leaded light prism array sheet 4 bottom surfaces coupling are installed, leave air-gap between the coupling face, can also between the coupling face, be provided with refractive index matched agent, the heat sink semiconductor cooler 6-2 that is provided with of luminous plaque 6-1, be provided with heat transfer device 6-3 behind the refrigerator 6-2, the wherein chill surface of refrigerator 6-2 and heat sink radiating surface applying, the heating face of refrigerator 6-2 is fitted with heat transfer device 6-3, be provided with thermal conducting agent between the described binding face, be filled with light-transmissive resin material or glass in the optical component.The length-width ratio of light-emitting window 3 is corresponding with optical projection system display image the ratio of width to height (16: 9 or 4: 3), the desired Etendue value coupling of the area of light-emitting window 3 and projection optical system.
Shown in Fig. 9 c, another kind of embodiment is that the optical component 1 interior rear surface relative with light-emitting window is provided with pyramid-shaped specular layer 2, and the leaded light prism is asymmetrical strip prism wedge, and all the other structures are same as the previously described embodiments, do not repeat them here.
In four sides of hexahedron optical component, have only two adjacent sides that light inlet is set, be provided with luminous plaque and leaded light prism array sheet at the light inlet place, eliminated when on relative side, light inlet being set, the light that luminous plaque sends is absorbed loss by the light that leaded light refraction by prism is caused to the leaded light prism on opposite, the leaded light efficient of device can be obviously improved, and, the size of this leaded light prism can be increased because the opposite flank is not provided with the leaded light prism.Compare with the situation that four sides all are provided with light inlet, though the solid luminescent assembly that holds is reduced to two by four, but when the leaded light number of prisms is identical, the size of two side leaded light prisms can increase and is twice, correspondingly with the area of the luminous plaque of leaded light prism coupling also double, therefore, (luminescence chip) light-emitting area of solid luminescent assembly is constant, but has increased the leaded light efficient of device.
Embodiment 8, as shown in figure 10, a kind of solid state light source comprises the hexahedron optical component 1 of hollow, its antetheca is provided with light-emitting window 3, the size of light-emitting window 3 and projection optical system coupling, a side inner walls at hexahedron optical component 1 is provided with light inlet 5, remove light-emitting window 3, light inlet 5 outer optical component 1 internal faces are provided with specular layer 2, be outside equipped with reflective tube 13 with light inlet 5 corresponding optical components 1, reflective tube 13 shapes cooperate consistent with light inlet 1, present embodiment is the cubic cylindrical shell, reflective tube 13 internal faces are provided with the reflecting layer, reflective tube 13 1 ends cooperate with light inlet 5, the other end 18 is provided with solid luminescent assembly 6, a leaded light prism 4 is set in the reflective tube 13, leaded light prism 4 is the strip prism wedge of symmetry, solid luminescent assembly 6 comprises luminous plaque 6-1, luminous plaque 6-1 is by heat sink 6-1-2, the luminescence chip or the densely arranged luminescence chip array 6-1-1 that are encapsulated on the heat sink 6-1-2 constitute, the size that luminescence chip or densely arranged luminescence chip array 6-1-1 form light-emitting area is consistent with reflective tube end 18 couplings, the light-emitting area of luminous plaque 6-1 and leaded light prism 4 bottom surfaces coupling are installed, leave air-gap between the two coupling face, can also between the coupling face, be provided with refractive index matched agent, the heat sink 6-1-2 of luminous plaque 6-1 is provided with semiconductor cooler 6-2, be provided with heat transfer device 6-3 behind the refrigerator 6-2, wherein the radiating surface of the chill surface of refrigerator 6-2 and heat sink 6-1-2 is fitted, the heating face of refrigerator 6-2 is fitted with heat transfer device 6-3, be provided with thermal conducting agent between the described binding face, be filled with light-transmissive resin material or glass in the optical component 1.
Different with the foregoing description, be light inlet 5 outsides that leaded light prism 4 are arranged on optical component 1, by solid luminescent assembly 6 send and via the light after leaded light prism 4 refraction or the total reflection again via importing optical components 1 from light inlet 5 behind the interreflection of reflective tube 13 inner surfaces, for different madial walls the solid luminescent assembly is set all at optical component, the situation of leaded light prism and light inlet, adopt the design can avoid in the foregoing description leaded light prism problem corresponding to adjacent medial surface, the problem includes: the problem of constructive interference, thereby can adopt and increase the leaded light prism dimensions, the method that reduces leaded light prism number improves the importing efficient of the light that sends from the solid luminescent assembly.
Embodiment 9, shown in Figure 11 a, are one chip DLP type projection imaging system schematic diagram, and its imaging operation principle is a prior art, does not repeat them here.
Shown in Figure 11 b, for adopting solid-state devices light sources such as LED of the present invention directly to replace the schematic diagram of traditional arc light type projection light source, be that light-emitting window 3 with solid state light emitter 15 of the present invention is designed and sized to the light inlet bore coupling with the optical integration rod 14 of described existing one chip DLP type projection imaging system, so that the light that light source of the present invention is exported directly is coupled into described optical integration rod 14, avoid producing extra light loss, any one solid state light emitter 15 among the embodiment 1~7 all can be used for the optical projection system of present embodiment, wherein the solid state light emitter 15 in the preferred embodiment 3~7.Wherein most preferred embodiment 3, because the output of the white light of LED solid state light emitter 15 can be synthetic for single primary lights that red, green, blue three primary colours planar luminous body is sent, the three primary colours planar luminous body can be controlled driving respectively, adopt the pulse current time-division to drive to the three primary colours planar luminous body and can realize the time color separation function that the employing colour wheel is realized in the conventional one-piece formula DLP type projection imaging system, thereby the color separation colour wheel that adopts LED solid state light emitter 15 can cancel simultaneously in the projection imaging system, make projection imaging system more simple.
Another optimal way is that the hexahedron optical component of solid state light emitter 15 of the present invention is extended to the length suitable with described optical integration rod 14 along light direction, make the photoconduction of solid state light emitter 15 of the present invention go out the even light processing capacity that part has optical integration rod 14 simultaneously, thereby can cancel the optical integration rod 14 in the described existing one chip DLP type projection imaging system, further simplify system.
Solid state light emitter 15 of the present invention can also be used for monolithic or non-one chip DLP, LCD or the LCOS optical engine system of other employing optical integration rod type illuminator.
Embodiment 10, as shown in figure 12, be cluster type lighting source schematic diagram, form by solid state light emitter 15 and light boundling reflector 16, solid state light emitter 15 is arranged on the bottom of reflector 16, the light direct beam that solid state light emitter 15 is sent or reflect by reflector, produce the cluster type output light source, solid state light emitter 15 preferred embodiment 1~embodiment 7 described solid state light emitters that adopt, if white light source need be provided, then can mix to be provided with and constitute " synthesize white light " output, can also excite its complementary color fluorescent material and produce " fluorescence white light " output with a kind of primary lights by the luminescence chip that contains two or more primary colours.Described smooth boundling reflector 16 preferred parabolic shapes, present embodiment can provide high stable, long-life high brightness cluster type lighting source, directly replace traditional heated filament type or arc light type bulb, be applied to boundling illuminators such as high brightness shot-light or communications and transportation illumination.

Claims (21)

1, a kind of solid state light source, comprise the hollow optical component, in the cavity of optical component is air, vacuum or other light transmission medium, optical component is provided with light-emitting window, it is characterized in that, optical component is polyhedral, which is provided with at least one light inlet, corresponding at least one leaded light prism that is provided with light inlet, the corresponding solid luminescent assembly that is provided with leaded light prism bottom surface, all be provided with reflecting element outward with optical component in the optical component or in the optical component, the light that the solid luminescent assembly sends is through leaded light refraction by prism or total reflection, reflecting element reflects or directly penetrates from the optical component light-emitting window.
2, solid state light source as claimed in claim 1, it is characterized in that, be provided with reflecting element, at least one leaded light prism in the optical component, leaded light prism bottom surface is corresponding with light inlet, the outer corresponding solid luminescent assembly that is provided with of optical component, the light that the solid luminescent assembly sends with light inlet through leaded light refraction by prism or total reflection, reflecting element reflects or directly penetrate from light-emitting window.
3, solid state light source as claimed in claim 2, it is characterized in that, described optical component is a hexahedron shape optical component, its antetheca is provided with a light-emitting window, sidewall is provided with at least one light inlet, the internal face of the optical component except that light-emitting window, light inlet is provided with reflecting element, the bottom surface size of leaded light prism and light inlet coupling.
4, solid state light source as claimed in claim 3, it is characterized in that, the solid luminescent assembly comprises luminous plaque, luminous plaque by heat sink, be encapsulated in and heat sinkly densely arranged luminescence chip and constitute, the luminous plaque size is consistent with the light inlet coupling, the light-emitting area of luminous plaque and leaded light prism bottom surface coupling are installed, and leave air-gap between the coupling face of the two, perhaps are provided with refractive index matched agent between the coupling face.
5, solid state light source as claimed in claim 4, it is characterized in that, the heat sink semiconductor cooler that is provided with of luminous plaque, be provided with heat transfer device behind the refrigerator, the wherein chill surface of refrigerator and heat sink radiating surface applying, the heating face of refrigerator is fitted with heat transfer device, is provided with thermal conducting agent between the described binding face.
6, solid state light source as claimed in claim 5 is characterized in that, described reflecting element is a specular layer.
7, solid state light source as claimed in claim 6 is characterized in that, rear surface is provided with the pyramid-shaped specular layer in the optical component relative with light-emitting window.
8, solid state light source as claimed in claim 7 is characterized in that, the leaded light prism is the strip prism wedge, and the leaded light prism array sheet is formed in the parallel no gap of the leaded light prism more than two, leaded light prism array sheet and light inlet size coupling.
9, solid state light source as claimed in claim 8 is characterized in that, the leaded light prism is asymmetric prism, with the side of the bigger leaded light prism of bottom surface angle towards light-emitting window.
10, solid state light source as claimed in claim 9 is characterized in that, the size of light-emitting window and projection optical system coupling.
As any described solid state light source of claim 3~10, it is characterized in that 11, four sidewalls of optical component all are provided with light inlet respectively in the position near rear wall, the optical component internal face except that light-emitting window, light inlet is provided with reflecting element.
12, solid state light source as claimed in claim 11 is characterized in that, described light inlet width in the horizontal direction is less than the housing width of light inlet vertical direction.
As any described solid state light source of claim 1~10, it is characterized in that 13, each light inlet is provided with different single primary colours luminous plaques, corresponding leaded light prism bottom surface is provided with the media film that only sees through these primary lights.
14, as any described solid state light source of claim 1~10, it is characterized in that, the optical component light inlet outside is provided with the refractive power right-angle prism, mate with the leaded light prism of light inlet, the light-emitting area of luminous plaque respectively orthogonal two sides of refractive power right-angle prism, its inclined side is provided with the reflecting layer, is provided with air-gap or refractive index matched agent between the coupling face.
15, as any described solid state light source of claim 1~10, it is characterized in that, the optical component light inlet outside is provided with the light-combining prism group, the light-combining prism group is formed by stacking in proper order by a triangular prism and two parallelogram prisms, a vertical side of triangular prism is an exiting surface, leaded light prism coupling in itself and the optical component light inlet, another vertical side of triangular prism and with the bottom surface of the parallelogram prism of its homonymy be incidence surface, three's correspondence respectively is provided with the solid luminescent assembly, and the light-combining prism group is removed incidence surface, all lateral surfaces beyond the exiting surface all are provided with the reflecting layer.
16, solid state light source as claimed in claim 15, it is characterized in that, binding face between triangular prism, the parallelogram prism is provided with respectively a kind of single primary lights is produced the dichroic coating that reflection sees through all the other primary lights, all be provided with luminous plaque with its coupling at the incidence surface of three prisms, described each luminous plaque all sends the reflectible primary lights of dichroic coating with the prism of its coupling, is provided with air-gap or refractive index matched agent between the coupling face.
17, as any described solid state light source of claim 1~10, it is characterized in that the interlaced setting of the light inlet of optical component adjacent side, corresponding leaded light prism, the also interlaced setting of solid luminescent assembly.
18, solid state light source as claimed in claim 17 is characterized in that, two light inlets are crisscross arranged respectively on two adjacent sides.
As any described solid state light source of claim 1~10, it is characterized in that 19, described solid luminescent assembly is a LED solid luminescent assembly.
20, a kind of optical integration rod type optical projection system is characterized in that, the light source of described optical integration rod type optical projection system has adopted the solid state light source described in the claim 1.
21, a kind of boundling lighting is characterized in that, the light source of described boundling lighting has adopted the solid state light source described in the claim 1.
CN2008100656477A 2008-01-23 2008-01-23 Solid light source, projecting system and bundling lighting fixture employing the device Expired - Fee Related CN101493207B (en)

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CN101539271B (en) * 2008-03-21 2010-12-08 曹嘉灿 Solid state light source device
CN103941532A (en) * 2013-01-17 2014-07-23 台达电子工业股份有限公司 Optical system
US9176368B2 (en) 2013-01-17 2015-11-03 Delta Electronics, Inc. Optical system
CN108368977A (en) * 2015-09-21 2018-08-03 通用电气照明解决方案有限责任公司 Solid state lamp for remodeling
CN109931532A (en) * 2019-04-12 2019-06-25 杭州友邦演艺设备有限公司 It is a kind of to can be used for underwater stage lighting

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MXPA06000015A (en) * 2003-07-03 2006-03-21 Thomson Licensing Lighting system enabling combination of several light beams.
TW200602585A (en) * 2004-03-16 2006-01-16 Koninkl Philips Electronics Nv High brightness illumination device with incoherent solid state light source

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101539271B (en) * 2008-03-21 2010-12-08 曹嘉灿 Solid state light source device
CN103941532A (en) * 2013-01-17 2014-07-23 台达电子工业股份有限公司 Optical system
US9176368B2 (en) 2013-01-17 2015-11-03 Delta Electronics, Inc. Optical system
CN103941532B (en) * 2013-01-17 2015-11-25 台达电子工业股份有限公司 Optical system
CN108368977A (en) * 2015-09-21 2018-08-03 通用电气照明解决方案有限责任公司 Solid state lamp for remodeling
US10788163B2 (en) 2015-09-21 2020-09-29 Current Lighting Solutions, Llc Solid state lamp for retrofit
US11112065B2 (en) 2015-09-21 2021-09-07 Current Lighting Solutions, Llc Solid state lamp for retrofit
CN109931532A (en) * 2019-04-12 2019-06-25 杭州友邦演艺设备有限公司 It is a kind of to can be used for underwater stage lighting

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