CN101470292A - Control method for bad voltage of LCD - Google Patents
Control method for bad voltage of LCD Download PDFInfo
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- CN101470292A CN101470292A CNA2007101253939A CN200710125393A CN101470292A CN 101470292 A CN101470292 A CN 101470292A CN A2007101253939 A CNA2007101253939 A CN A2007101253939A CN 200710125393 A CN200710125393 A CN 200710125393A CN 101470292 A CN101470292 A CN 101470292A
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Abstract
The invention relates to a control method of defective voltage for a liquid crystal display, which comprises steps of defining certain manufacturing processes of a liquid crystal panel, finding out manufacturing processes corresponding to major factors which affect voltage of the liquid crystal display, performing diversion operation on the processed liquid crystal panel during the manufacturing processes corresponding to the major factors affecting voltage of the liquid crystal display. The invention utilizes an effective process control method, which greatly reduces defective rate of voltage of the liquid crystal display and improves product quality by controlling all factors which can affect voltage fluctuation potentially and by using the diversion operation to gauge.
Description
Technical field
The present invention relates to a kind of STN/CSTN LCD manufacture method, be specifically related to the control method of bad voltage in a kind of STN/CSTN LCD manufacture process.
Background technology
Terminological interpretation:
Vth: i.e. liquid crystal threshold voltage, needed voltage when driving liquid crystal molecule and just having begun to reverse.
V10: promptly when glass is filtered into 10% thoroughly, drives liquid crystal molecule and reverse needed voltage.
V90: promptly when glass is filtered into 90% thoroughly, drives liquid crystal molecule and reverse needed voltage.
Von: during LCD work, the effective voltage of display dot.
Voff: during LCD work, the effective voltage of non-display dot.
Steepness (steepness): i.e. V90/V10 or V10/V90 value are important parameters in the LCD photoelectricity design process, require V10〉VoffV90＜Von, steepness (V90/V10)＜Von/Voff.
Liquid crystal display is the optical anisotropy that utilizes liquid crystal (LC) molecule, applies arrangement that electric field causes liquid crystal molecule by the external world and changes that light transmission realizes.Bad voltage is more a kind of unusual in the STN/CSTN LCD manufacture process, also is that each LCD producer makes great efforts to require one of problem that solves.
At present the type of drive of STN/CSTN mainly contains two kinds of static drive and dynamic driving:
Static drive is meant and then becomes show state when applying voltage signal on the electrode before and after pixel, do not add and then be non-show state when showing, as Fig. 1, the seven segment type LCD contact conductors that are exactly the static drive mode are arranged, when needs showed " 9 ", then go between a, b, c, g, f and com applied voltage signal, and d, e then do not apply voltage signal, when needs show other whens numeral, then to a b c d e f g com apply the relevant voltage signal respectively.
Static display spare mainly is applicable to the fewer situations of pixel such as a segmentation, is extensively quoted at accutron, instrument display screen etc.The static drive method can can't realize because needing extremely many outer leads for the more display device of general pixel
Dynamic driving passive matrix dynamic driving technology is exactly that (COM applies strobe pulse, adds corresponding selection or non-selected driving pulse for simultaneously all row electrodes (SEG), thereby realizes the Presentation Function of certain all pixel of row to column electrode circularly.This scanning is line by line in sequence, but because retarding action and the human eye vision of response time of liquid crystal persist, makes to present stable image on the liquid crystal display.The matrix that m*n pixel arranged capable by m and the n row are formed adopts dynamic driving only to need (m+n) with contact conductor.Drive for exemplary dynamic as Fig. 2, when needs show " Z ", apply strobe pulse for the circulation of COM electrode, when beginning to scan COM0, all seg electrodes all add non-selected driving pulse; When scanning COM1, seg0 adds non-selected driving pulse, and seg1, seg2, seg3, seg4, seg5, seg6 add driving pulse, and other seg electrodes apply non-selection driving pulse; When scanning COM2, seg5 adds driving pulse, and other seg electrodes apply non-selection driving pulse; So analogize, scan the COM electrode successively, apply the respective drive pulse for corresponding seg electrode.Import driving voltage waveform synchronously in a flash both sides, will on this row and each row electrode intersection point pixel, synthesize a drive waveforms, making has the plurality of pixels point by gating on this row, promptly become display dot, all COM electrode scanning one time is then all just formed a figure by the pixel of gating.
Because existing market is more and more higher to the requirement of liquid crystal display, be limited to the limitation of static drive technology, most of in the market product all is to use dynamic driving to make LCD work.
Fig. 3 is a kind of electro-optical response curve of present most widely used STN/CSTN working method, adds suitable voltage and just can realize different transmitances on liquid crystal pixel electrodes.It should be noted that the voltage pulsewidth that is added on the liquid crystal is littler than the liquid crystal response time (several milliseconds to the hundreds of millisecond) usually, the effect that is added in the voltage on the liquid crystal will be represented with effective voltage:
Do not consider to be added in the difference (same model IC operating voltage otherness is very little) of the voltage effective value on the liquid crystal.Because the otherness of LCD itself, same batch products be behind the identical liquid crystal of injection, the Vth that is showed, can there be certain difference (as shown in Figure 4) in V10, V90.When pressing IC, identical product transmitance difference will occur after being assembled into module, thereby show out to show light, show dense, the defective productss such as (crosstalk) of crosstalking.
It is a lot of to influence the voltage of LCD factor, outside cause is arranged, the own reason of product etc., in the LCD manufacture process, the same model that to produce is on the same day tried to irritate together often, determine product voltage and management and control standard then, this batch model is carried out volume production with regard to the standard of trying to irritate affirmation then, does not consider the voltage differences that production environment (humiture) after own reason of product (different hot pressing anchor clamps, different hot pressing condition make etc.) and the cutting, production time (the cutting back product residence time etc.) etc. cause.When all product unifications are accomplished to detect the post, can occur portioned product voltage usually and exceed the management and control standard, fraction defective generally about 5%, has caused scrapping of product.
Existing control method can't reach desirable effect, fraction defective is too high, therefore demand urgently a kind of new bad voltage control method to overcome the problem that occurs in the existing Control of Voltage.
Summary of the invention
The purpose of this invention is to provide a kind of reduction bad voltage of LCD incidence, the control method of the bad voltage of LCD that improves the quality of products.
The technical scheme that realizes described purpose is: a kind of control method of bad voltage of LCD may further comprise the steps: some production process of determining to produce liquid crystal panel; Finding out influences the pairing production process of voltage of LCD fluctuation principal element; In influencing the pairing production process of voltage of LCD fluctuation principal element, the liquid crystal panel of processing is shunted operation.
Specifically, some production process of described production liquid crystal panel comprise cleaning, gluing, exposure, development, etching, demoulding, cleaning, TOP/PI, curing, friction, silk-screen, dust, applying, hot pressing, cutting, filling liquid and leveling.
Preferably, in the TOP/PI production process, the operation of shunting of one of following situation appears in liquid crystal panel:
1) not on the same day or produce for different times;
2) in the TOP/PI production process, occur pausing is not quantity-produced midway, and the time was above 1 hour;
3) in the TOP/PI production process, change the APR version midway;
4) in the TOP/PI production process, use different materials or concentration;
5) after PI precuring or PI master are solidified, reclaim printing PI;
6) TOP/PI master's curing process difference;
7) TOP/PI master's curing oven temperature occurs unusual;
8) the TOP/PI color exception is found in production midway;
9) production finds that midway there is deviation the TOP/PI position, and the limit is near the mark;
10) it is unusual humiture to occur in the production run.
The 7th) TOP/PI master's curing oven temperature occurs being meant unusually that on the low side or the higher or local temperature skewness of whole oven temperature does not reach technological requirement.
Preferably, silk-screen, applying, hot-pressing operation one of following situation occurs and shunt operation:
1) not on the same day or not the homogeneous silk-screen produce;
Change half tone when 2) silk-screen is produced midway;
3) produce continuously but adopt different silk screen printing process;
4) in the silk-screen production run abnormal occurrence appears;
5) technological parameter such as epoxy precuring temperature-time is different;
6) powder injection process difference;
7) hot pressing pressure difference, hot pressing temperature difference;
8) heat baking technology difference;
9) the hot pressing post is checked and is found abnormal quality;
10) the hot pressing oven temperature is unusual;
11) hot pressing pressure is unusual;
12) friction process difference;
13) use different air bag anchor clamps hot-press solidifyings.
Described the 10th hot pressing oven temperature is meant that unusually on the low side or the higher or local temperature skewness of whole oven temperature does not reach technological requirement.
Preferably, in the shunting operation process, the control liquid crystal panel cutting back residence time, the temperature and humidity in liquid room is irritated in control.
Preferably, described control liquid crystal panel cutting heat is dried by the fire the back residence time for being no more than 24 hours, and the humidity that the liquid room is irritated in described control is 50% ± 5%RH.
The present invention adopts described technical scheme, its beneficial technical effects is: the control method of bad voltage of LCD of the present invention, the principal element that influences the voltage of LCD fluctuation is found out in contrast by experiment, determines the production process of the production liquid crystal panel of this principal element correspondence; In this production process, the liquid crystal panel of processing is shunted operation, the present invention adopts effective process control method, may influence the various factors of voltage fluctuation by control, by shunting operation standard in addition, make the bad voltage rate of LCD reduce greatly, product quality is promoted.
Description of drawings
Below by embodiment also in conjunction with the accompanying drawings, the present invention is described in further detail:
Fig. 1 is seven segment type LCD contact conductor layout viewings of traditional liquid crystal panel static drive mode.
Fig. 2 is traditional liquid crystal panel dynamic driving mode synoptic diagram.
Fig. 3 is the electro-optical response curve of present most widely used STN/CSTN working method.
Fig. 4 is the electro-optical response curve of the different voltages of same model LCD.
Fig. 5 is the liquid crystal panel production process figure of the control method of bad voltage of LCD of the present invention.
Embodiment
Please refer to Fig. 5, the present invention relates to a kind of control method of bad voltage of LCD.
The technical scheme that realizes described purpose is: a kind of control method of bad voltage of LCD may further comprise the steps:
(1) definite some production process of producing liquid crystal panel;
Specifically, some production process of described production liquid crystal panel comprise cleaning, gluing, exposure, development, etching, demoulding, cleaning, TOP/PI, curing, friction, silk-screen, dust, applying, hot pressing, cutting, filling liquid and leveling.
(2) find out and influence the pairing production process of voltage of LCD fluctuation principal element;
Finding out by test influences voltage of LCD fluctuation principal element:
List the factor that influences voltage according to experiment, and do corresponding experimental establishment according to influence factor:
Table 1 analysis of Influential Factors
| Factor | Influence factor |
| The people | 1, LC allocate unusual 2, artificially detect unusual 3, batch mixing or irritate wrong liquid crystal |
| Equipment | 1, unusual 5, the electrical measurement machine of unusual 4, the capper of unusual 3, the dosing electronic scale of unusual 2, the crystal-pouring machine of aging machine is unusual 6, the hot pressing anchor clamps are unusual etc. |
| Raw material | 1, unusual 3, the ito glass supplied materials of unusual 2, the volume production liquid crystal of surplus liquid crystal is unusual 4, FPC is unusual |
| Method | 1, LCD designs that unusual 2, liquid crystal deaeration is improper 3, box is thick and PI is unstable 4, liquid crystal proportioning mistake 5, leveling condition are improper etc. |
| Environment | 1, humiture is unusual 2, lamp illumination is unusual |
Table 2 experimental establishment
| The improvement project | Improve content |
| The thick relation with voltage of box | Verify relation between thick and its voltage of the box of product by data statistics |
| The relation of PI thickness and voltage | Verify the PI thickness of product and the relation between its voltage by experiment |
| The residence time is to the influence of voltage | Confirm that product irritates behind the liquid different residence time when sealing to the influence of voltage |
| Surplus LC contrast experiment | Carry out voltage-contrast by the surplus LC experiment of using different time once more |
| Humiture is to the influence of voltage | The humiture of irritating liquid chamber is monitored, and confirmed its influence voltage by adjusting |
| The gauging instrument calibration | To the electrical measurement machine, join the electronic scale of LC and calibrate and provide calibration cycle once more |
| The backlight standard | Backlight model and standard that the electrical measurement operation is used are unified |
| The sealing strip piece optimization | Sealing process condition to coloured prod is optimized, and makes the thick uniformity coefficient of box reach better |
| The shading measure | But to implementation plan from the shading executive measure that cuts to the warehouse coloured prod |
| The affirmation again of defective products | By to experimental summary or experiment before again, determine the change of a certain type product voltage standard |
| The timely affirmation of model is changed | In the electrical measurement production run, in time used model is confirmed, and to duplicating selecting of model |
By experiment, confirm the degree of influencing of each factor to the product voltage fluctuation.Experimental result is as follows:
Table 3 test findings
Reach a conclusion by experiment for: the factor the most serious to voltage influence is: different hot pressing anchor clamps differences, cutting heat baking back overstand (above 24 hours), workshop humidity is too high and because artificial generation glass batch mixing; Box thick inconsistent, the PI thickness is inconsistent.
(3) in influencing the pairing production process of voltage of LCD fluctuation principal element, the liquid crystal panel of processing is shunted operation.
Before the extensive cutting of product, must irritate through examination, the test liquid crystal can operation after middle inspection voltage is qualified.
Must try to irritate detection voltage again according to supplied materials different batches or shunting product.Preceding processing procedure has must shunting of following state:
In the TOP/PI production process, the operation of shunting of one of following situation appears in liquid crystal panel:
1) not on the same day or produce for different times;
2) in the TOP/PI production process, occur pausing is not quantity-produced midway, and the time was above 1 hour;
3) in the TOP/PI production process, change the APR version midway;
4) in the TOP/PI production process, use different materials or concentration;
5) after PI precuring or PI master are solidified, reclaim printing PI;
6) TOP/PI master's curing process difference;
7) TOP/PI master's curing oven temperature occurs unusually, on the low side or the higher or local temperature skewness of the whole oven temperature of finger occurs unusually and does not reach technological requirement;
8) the TOP/PI color exception is found in production midway;
9) production finds that midway there is deviation the TOP/PI position, and the limit is near the mark;
10) it is unusual humiture to occur in the production run.
Again for example: silk-screen, applying, hot-pressing operation one of following situation occurs and shunt operation:
1) not on the same day or not the homogeneous silk-screen produce;
Change half tone when 2) silk-screen is produced midway;
3) produce continuously but adopt different silk screen printing process (adjusting rack height, silk-screen scraper pressure, scraper angle etc.);
4) in the silk-screen production run abnormal occurrence appears;
5) technological parameter different (comprising precuring hot plate fault or temperature anomaly etc.) such as epoxy precuring temperature-time;
6) powder injection process difference (comprising differences such as plastic cement gauge ball lattice, the density of dusting);
7) hot pressing pressure difference, hot pressing temperature difference;
8) heat baking technology difference;
9) the hot pressing post is checked and is found abnormal quality;
10) the hot pressing oven temperature is unusual, and described temperature anomaly is meant that on the low side or the higher or local temperature skewness of whole oven temperature does not reach technological requirement;
11) hot pressing pressure is unusual;
12) friction process difference (differentiated friction cloth or the differentiated friction amount of being pressed into etc.);
13) use different air bag anchor clamps hot-press solidifyings, the numbering that must carry out corresponding air bag anchor clamps indicates the back shunting.
In the shunting operation process, the strict control cutting back product residence time, irritate liquid room humiture, and on flow process is single remarks.
Simultaneously, specification is similar, the mark of close model, and strengthening the people is management and control, avoids occurring artificial batch mixing.
In the present embodiment, with 674A, input 500 is elaborated for row to (Cut).
Product cleans in the past and begins to drop into, and as for the TOP/PI post, according to streaming request, it is several unusual to occurring that the 500 pairs of products have in this post according to the normal flow operation, and this severally just need be shunted product so.Be exemplified as 50 pairs of main curing process condition differences, this 50 couple just should separate with other 450 pairs of products and flow to next post so.All products are still according to the normal flow operation, and being exemplified as 450 centerings has 50 pairs of hot pressing pressures to need shunting unusually, also have the shunting of 50 pairs of heat baking technology different needs.50 couple of the different shuntings of wherein main curing process condition is again because the difference of powder injection process wherein has 30 pairs of needs shuntings again.Because hot pressing air bag anchor clamps difference needs shunting (being assumed to be 7 anchor clamps) again, then this moment, Product Status was simultaneously:
Table 4 minute stream mode
Just with the different labels product separately, notice was irritated liquid post examination filling personnel's supplied materials quantity and supplied materials label when the cutting post received product, and the examination filling personnel try respectively to irritate according to different labels, behind the examination filling OK, can separate batch successively volume production.
The temperature and humidity in strict control filling liquid room in the volume production process, if having unusually, then also needs shunting examination filling operation again at the residence time after the baking of control product incision heat.
By enforcement of the present invention, bad voltage is obtained more stable improvement, and bad ratio is reduced to below 0.5%.Table 5 data are contrasts before and after our company improves:
Table 5 improves contrast
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (8)
1. the control method of a bad voltage of LCD is characterized in that: may further comprise the steps:
Determine to produce some production process of liquid crystal panel;
Finding out influences the pairing production process of voltage of LCD fluctuation principal element;
In influencing the pairing production process of voltage of LCD fluctuation principal element, the liquid crystal panel of processing is shunted operation.
2. the control method of bad voltage of LCD according to claim 1 is characterized in that: some production process of described production liquid crystal panel comprise cleaning, gluing, exposure, development, etching, demoulding, cleaning, TOP/PI, curing, friction, silk-screen, dust, applying, hot pressing, cutting, filling liquid and leveling.
3. the control method of bad voltage of LCD according to claim 2, it is characterized in that: in the TOP/PI production process, the operation of shunting of one of following situation appears in liquid crystal panel:
1) not on the same day or produce for different times;
2) in the TOP/PI production process, occur pausing is not quantity-produced midway, and the time was above 1 hour;
3) in the TOP/PI production process, change the APR version midway;
4) in the TOP/PI production process, use different materials or concentration;
5) after PI precuring or PI master are solidified, reclaim printing PI;
6) TOP/PI master's curing process difference;
7) TOP/PI master's curing oven temperature occurs unusual;
8) the TOP/PI color exception is found in production midway;
9) production finds that midway there is deviation the TOP/PI position, and the limit is near the mark;
10) it is unusual humiture to occur in the production run.
4. the control method of bad voltage of LCD according to claim 3 is characterized in that: the 7th) TOP/PI master's curing oven temperature occurs being meant unusually that on the low side or the higher or local temperature skewness of whole oven temperature does not reach technological requirement.
5. the control method of bad voltage of LCD according to claim 2, it is characterized in that: silk-screen, applying, hot-pressing operation one of following situation occurs and shunt operation:
1) not on the same day or not the homogeneous silk-screen produce;
Change half tone when 2) silk-screen is produced midway;
3) produce continuously but adopt different silk screen printing process;
4) in the silk-screen production run abnormal occurrence appears;
5) technological parameter such as epoxy precuring temperature-time is different;
6) powder injection process difference;
7) hot pressing pressure difference, hot pressing temperature difference;
8) heat baking technology difference;
9) the hot pressing post is checked and is found abnormal quality;
10) the hot pressing oven temperature is unusual;
11) hot pressing pressure is unusual;
12) friction process difference;
13) use different air bag anchor clamps hot-press solidifyings.
6. the control method of bad voltage of LCD according to claim 5 is characterized in that: described the 10th hot pressing oven temperature is meant that unusually on the low side or the higher or local temperature skewness of whole oven temperature does not reach technological requirement.
7. according to the control method of any described bad voltage of LCD of claim 1-6, it is characterized in that: in the shunting operation process, the control liquid crystal panel cutting heat baking back residence time, the temperature and humidity in liquid room is irritated in control.
8. the control method of bad voltage of LCD according to claim 7 is characterized in that: the described control liquid crystal panel cutting heat baking back residence time, the humidity in described control filling liquid room was 50% ± 5%RH in order to be no more than 24 hours.
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| CN2007101253939A CN101470292B (en) | 2007-12-25 | 2007-12-25 | Control method for bad voltage of LCD |
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| CN2007101253939A CN101470292B (en) | 2007-12-25 | 2007-12-25 | Control method for bad voltage of LCD |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101806973A (en) * | 2010-03-17 | 2010-08-18 | 宜宾盈泰光电有限公司 | Manufacturing method of segment liquid crystal display (LCD) with high contrast |
| CN102478729A (en) * | 2010-11-26 | 2012-05-30 | 比亚迪股份有限公司 | Method for manufacturing liquid crystal boxes |
| CN105425434A (en) * | 2015-11-30 | 2016-03-23 | 莆田市嘉辉光电有限公司 | LCD display module manufacturing process |
| CN106292019A (en) * | 2015-05-20 | 2017-01-04 | 刘品刚 | A kind of method that in the LCD of preventing production process, PI weighs wounded |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2837878Y (en) * | 2005-11-21 | 2006-11-15 | 比亚迪股份有限公司 | LCD panel detector |
-
2007
- 2007-12-25 CN CN2007101253939A patent/CN101470292B/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101806973A (en) * | 2010-03-17 | 2010-08-18 | 宜宾盈泰光电有限公司 | Manufacturing method of segment liquid crystal display (LCD) with high contrast |
| CN102478729A (en) * | 2010-11-26 | 2012-05-30 | 比亚迪股份有限公司 | Method for manufacturing liquid crystal boxes |
| CN102478729B (en) * | 2010-11-26 | 2016-03-09 | 深圳市比亚迪电子部品件有限公司 | The manufacture method of liquid crystal cell |
| CN106292019A (en) * | 2015-05-20 | 2017-01-04 | 刘品刚 | A kind of method that in the LCD of preventing production process, PI weighs wounded |
| CN105425434A (en) * | 2015-11-30 | 2016-03-23 | 莆田市嘉辉光电有限公司 | LCD display module manufacturing process |
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| CN101470292B (en) | 2010-11-17 |
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