CN101466215B - Grounding structure of electronic device - Google Patents
Grounding structure of electronic device Download PDFInfo
- Publication number
- CN101466215B CN101466215B CN2007103005280A CN200710300528A CN101466215B CN 101466215 B CN101466215 B CN 101466215B CN 2007103005280 A CN2007103005280 A CN 2007103005280A CN 200710300528 A CN200710300528 A CN 200710300528A CN 101466215 B CN101466215 B CN 101466215B
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- CN
- China
- Prior art keywords
- circuit board
- base plate
- external diameter
- earthing
- perforation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009434 installation Methods 0.000 claims description 13
- 238000009713 electroplating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The invention discloses an earthing structure for an electronic device, which comprises a shell body, a circuit board and an elastic cushion; wherein, the shell body is provided with a base plate and a frame vertically connected to the baseplate, and the frame is horizontally and protrudingly provided with at least one location portion; the circuit board is provided with an earthing circuit layer and a conductive layer; the earthing circuit layer is allocated on the circuit plate; the conductive layer is allocated at one side of the circuit plate and is electrically connected with the earthing circuit layer. The elastic cushion is arranged on the base plate; when the circuit board is vertically arranged on the base plate, the conductive layer is contacted with the elastic cushion and is electrically connected with the base plate through the elastic cushion, so as to lead the earthing circuit layer to be earthed through the baseplate.
Description
Technical field
The invention relates to a kind of electronic installation (electronic device), and particularly relevant for a kind of ground structure (grounding structure) of electronic installation.
Background technology
In the framework of present server (server), the housing of server (case) can have the back of the body frame (back frame) that vertically is arranged on the base plate (base plate) usually.In addition, (hard disc device, HDD) (motherboard, the switching circuit board (transferring circuit board) between MB) then usually can be through screws on back of the body frames with mainboard in order to be connected in hard disk drive.
Under above-mentioned framework, switching circuit board can have in order to the perforation that wears screw (through hole) usually, and perforation around can dispose earth point (grounding point) usually.When switching circuit board through screws during in the screw hole (screw hole) of back of the body frame, the earth point of switching circuit board can be through screw and with back of the body frame conducting so that switching circuit board can see through back of the body frame ground connection.
Yet, owing to utilize the design of screws when assembly and disassembly, all need pass through the assistance of hand tool (hand tool), so it uses comparatively inconvenient.And through after dismounting repeatedly and the assembling, screw is easy to and can loses, and then causes screw and the screw hole difficulty on locking.Moreover if used the different screw of pitch (thread pitch) to lock accidentally, the integrality of the internal thread of screw hole (female thread) may be destroyed, and then the problem that causes screw to lock.In addition, under reusable situation, hand tool also destroys the groove at screw top easily, and then causes screw can't dismantle the problem that maybe can't assemble.
Therefore, traditional technology has proposed a kind ofly through fastener (locking element) switching circuit board to be fixedly arranged on the design of the back of the body on the frame, to improve the problem that above-mentioned designing institute produces.For instance, hole clipping (locking hole) can be designed with on the switching circuit board, and snib (pin) can be designed with on the back of the body frame.At this moment, switching circuit board can be through being fixedly arranged on hole clipping and cooperating of snib on the back of the body frame.
It should be noted that the design of fastener has the problem of manufacturing tolerance (tolerance) usually.For instance, too small when the internal diameter (internal diameter) of hole clipping, and the external diameter of snib (external diameter) is when excessive, and snib will be not easy to be inserted in the hole clipping.In addition, excessive when the internal diameter of hole clipping, and the external diameter of snib is when too small, and the tightness between hole clipping and the snib is not good.Thus, will be easy to generate the problem of loose contact between the earth point of switching circuit board and the back of the body frame.
Summary of the invention
The present invention provides a kind of ground structure of electronic installation, and its circuit board is not easy to produce the problem of loose contact when seeing through frame ground.
The present invention proposes a kind of ground structure of electronic installation, comprises a housing, a circuit board and a cushion (gasket).Housing has the framework that a base plate and vertically is connected in base plate, and the framework level is outstanding to be provided with at least one location division, and circuit board also has the location hole of at least one correspondence in the location division.Circuit board has an earthing circuit layer (grounding wire layer) and a conductive layer (conductive layer).Earthing circuit layer is disposed in the circuit board.Conductive layer is disposed at a lateral margin (edge) of circuit board, and is electrically connected at earthing circuit layer.Cushion is disposed on the base plate.When circuit board vertically is arranged on the base plate, conductive layer contact resilient pad, and see through cushion and be electrically connected at base plate, so that earthing circuit layer sees through chassis ground.
In one embodiment of this invention, above-mentioned circuit board also have one be disposed at a surface of this circuit board connection pad (pad), and this conductive layer sees through this connection pad and is electrically connected at this earthing circuit layer.
In one embodiment of this invention, above-mentioned location division comprises a pilot pin (positioning pin).Pilot pin is made up of the cylinder that a spheroid and is connected between framework and the spheroid; Spheroid has one first external diameter; Cylinder has one second external diameter; And location hole is made up of second perforation that one first perforation and is connected in first perforation, and first perforation has one first aperture, and second perforation has one second aperture.First external diameter is greater than second external diameter.First aperture is greater than first external diameter.Second aperture is greater than second external diameter and less than first external diameter.
In one embodiment of this invention, above-mentioned base plate also has at least one limiting section (position-limiting portion).Limiting section is located at the edge of cushion.
In one embodiment of this invention, above-mentioned cushion is conduction bubble continuous (conductive formed plastic).
In the present invention, be disposed at the conductive layer that earthing circuit layer in the circuit board is electrically connected at the lateral margin that is disposed at circuit board.Simultaneously, conductive layer also sees through cushion and is electrically connected at base plate.Therefore, circuit board is fixedly arranged on framework so that its earthing circuit layer when seeing through chassis ground, is not easy to produce the problem of loose contact.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts an embodiment, and conjunction with figs., elaborates as follows.
Description of drawings
Fig. 1 is the sketch map of ground structure of a kind of electronic installation of one embodiment of the invention.
Fig. 2 is the front view of the circuit board among Fig. 1.
Embodiment
Fig. 1 is the sketch map of ground structure of a kind of electronic installation of one embodiment of the invention, and Fig. 2 is the front view of the circuit board among Fig. 1.Below embodiment be being that example is explained chassis ground in order to what be connected in that switching circuit board between hard disk drive and the mainboard sees through the server housing in the server.Wherein, switching circuit board for example is to see through soft arranging wire (soft flat cable) to electrically connect with the mainboard that is disposed in the server.
In addition, in order more clearly to describe characteristic of the present invention, the members lower such as mainboard in the graphic omission server in following examples and hard disk drive with relevance of the present invention.And the part of housing only schematically shows the part of base plate, framework, location division and limiting section, and omits other members.Wherein, switching circuit board has in order to plugging the Port of hard disk drive, and Port is suitable for being arranged in the hollow out zone of framework.Yet the present invention is not limited in use in server.
Please refer to Fig. 1 and Fig. 2, the ground structure 100 of electronic installation comprises that a housing 110, a circuit board 120 and are disposed at the cushion 130 between housing 110 and the circuit board 120.Housing 110 has a base plate 112 and and vertically is arranged at the framework 114 on the base plate 112.Moreover the inside of circuit board 120 is embedded with an earthing circuit layer (or ground plane), and wherein earthing circuit layer is omitted because of being embedded in the circuit board 120 in present embodiment graphic.In addition, a lateral margin 122 of circuit board 120 can cover a conductive layer 124 through the mode of electroplating, and earthing circuit layer is electrically connected at conductive layer 124.In addition, cushion 130 is disposed on the base plate 112, and is adjacent to a side of framework 114, and it for example is that the conduction bubble is continuous.
Moreover; Base plate 112 can have at least one limiting section 116 that protrudes from base plate 112 upper surfaces (this embodiment graphic in schematically show two); And cushion 130 for example is the edge of being located at circuit board 120, and between framework 114 and these limiting sections 116.Wherein, but the distance between framework 114 and these limiting sections 116 for example is proper containment circuit board 120.
In addition, framework 114 can have at least one location division 118 that flatly protrudes in a side of framework 114 (this embodiment graphic in schematically show two).Wherein, location division 118 for example is connected in the pilot pin that the cylinder 118b between framework 114 and the spheroid 118a is formed by a spheroid 118a and.Spheroid 118a has one first external diameter, and cylinder 118b has one second external diameter, and first external diameter of spheroid 118a is greater than second external diameter of cylinder 118b.
In addition, circuit board 120 also can have at least one position corresponding to the location hole 126 of these location divisions 118 (this embodiment graphic in schematically show two).Wherein, location hole 126 for example by one first the perforation 126a and be connected in first the perforation 126a second the perforation 126b form.The first perforation 126a has one first aperture, and the second perforation 126b has one second aperture.And first aperture of the first perforation 126a is slightly larger than first external diameter of spheroid 118a, and second aperture of the second perforation 126b then is slightly larger than second external diameter of cylinder 118b and less than first external diameter of spheroid 118a.
In this embodiment, when the user will be assembled to framework 114 with circuit board 120, can earlier conductive layer 124 be disposed between framework 114 and the limiting section 116, and make these spheroids 118a pass these first perforation 126a.At this moment, cushion 130 can be electrically connected between conductive layer 124 and the base plate 112, and can receive circuit board 120 and produce strain with the extruding of base plate 112.And these cylinders 118b can be disposed among these first perforation 126a.Then, make circuit board 120 be parallel to framework 114 and move a distance,, can circuit board 120 be fixedly arranged on framework 114 so that these cylinders 118b is moved among the second perforation 126b by these first perforation 126a.
It should be noted that circuit board 120 among this embodiment is to see through location division 118 to be fixedly arranged on framework 114 with cooperating of location hole 126 with the mode that no screw designs, therefore, the problem that it can avoid utilizing in the traditional technology design of screws to produce.In addition, because cushion 130 can produce strains, more be connected mutually closely so that can see through cushion 130 between base plate 112 and the conductive layer 124, therefore, earthing circuit layer is not easy to produce the problem of loose contact during through base plate 112 ground connection.In addition, conductive layer 124 is the lateral margin 122 of covering board 120 fully, so that can have bigger contact area between conductive layer 124 and the cushion 130, and further to avoid the problem of loose contact.
Yet execution mode of the present invention is not limited in the foregoing description.In the embodiment that other do not illustrate; The surface of circuit board 120 also can have a connection pad (not illustrating); And the mode that earthing circuit layer can see through guide hole (blind via) or via (via) is connected to connection pad, is electrically connected to conductive layer 124 and connection pad can see through lead (not illustrating) again.At this moment, earthing circuit layer also can see through base plate 112 ground connection.In addition, location division 118 can also be a trip (hook), and location hole 126 can also be the hole clipping (locking hole) corresponding to trip, and circuit board 120 can be fixedly arranged on framework 114 through trip with cooperating of hole clipping.Yet the foregoing description is not in order to limit the fixed form between circuit board 120 and the framework 114.
In sum, in the present invention, the connected mode of circuit board and framework is no screw design, the problem that can produce when it can avoid utilizing screws in the traditional technology.Moreover, can see through the strain of cushion between base plate and the conductive layer and be connected mutually more closely, so earthing circuit layer is not easy to produce the problem of loose contact through chassis ground the time.In addition, conductive layer is the lateral margin of covering board fully, so that can have bigger contact area between conductive layer and the cushion.
Though the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Has common knowledge the knowledgeable in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is when being as the criterion with what claim defined.
Claims (5)
1. the ground structure of an electronic installation comprises:
One housing has the framework that a base plate and vertically is connected in this base plate, and this framework level is given prominence to and is provided with at least one location division;
One circuit board; Have location hole, an earthing circuit layer and the conductive layer of at least one correspondence in this location division; Wherein this earthing circuit layer is disposed in this circuit board, and this conductive layer is disposed at a lateral margin of this circuit board, and is electrically connected at this earthing circuit layer; And
One cushion is disposed on this base plate, and wherein when this circuit board vertically was arranged on this base plate, this conductive layer contacted this cushion, and was electrically connected at this base plate through this cushion, so that this earthing circuit layer sees through this chassis ground.
2. the ground structure of electronic installation as claimed in claim 1 is characterized in that, this circuit board also have one be disposed at a surface of this circuit board connection pad, and this conductive layer sees through this connection pad and is electrically connected at this earthing circuit layer.
3. the ground structure of electronic installation as claimed in claim 1 is characterized in that, this location division comprises a pilot pin; This pilot pin is made up of the cylinder that a spheroid and is connected between this framework and this spheroid, and this spheroid has one first external diameter, and this cylinder has one second external diameter; And this location hole is made up of second perforation that one first perforation and is connected in this first perforation; This first perforation has one first aperture, and this second perforation has one second aperture, and this first external diameter is greater than this second external diameter; And this first aperture is greater than this first external diameter, and this second aperture is greater than this second external diameter and less than this first external diameter.
4. the ground structure of electronic installation as claimed in claim 1 is characterized in that, this base plate also has at least one limiting section, and this limiting section is located at the edge of this cushion.
5. the ground structure of electronic installation as claimed in claim 1 is characterized in that, this cushion is continuous for the conduction bubble.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007103005280A CN101466215B (en) | 2007-12-20 | 2007-12-20 | Grounding structure of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007103005280A CN101466215B (en) | 2007-12-20 | 2007-12-20 | Grounding structure of electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101466215A CN101466215A (en) | 2009-06-24 |
| CN101466215B true CN101466215B (en) | 2012-05-23 |
Family
ID=40806498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007103005280A Expired - Fee Related CN101466215B (en) | 2007-12-20 | 2007-12-20 | Grounding structure of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101466215B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1035600A (en) * | 1987-11-17 | 1989-09-13 | 国际商用机器公司 | The insertable component that is used for printed circuit board (PCB) |
| CN1266296A (en) * | 1998-07-17 | 2000-09-13 | 莫列斯公司 | Card edge connector with improved reference terminal |
| KR20030028664A (en) * | 2001-09-25 | 2003-04-10 | 주식회사 머큐리 | A shelf for telecomunication equipment and a grounding structure for PCB unit |
-
2007
- 2007-12-20 CN CN2007103005280A patent/CN101466215B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1035600A (en) * | 1987-11-17 | 1989-09-13 | 国际商用机器公司 | The insertable component that is used for printed circuit board (PCB) |
| CN1266296A (en) * | 1998-07-17 | 2000-09-13 | 莫列斯公司 | Card edge connector with improved reference terminal |
| CN1139149C (en) * | 1998-07-22 | 2004-02-18 | 莫列斯公司 | Card edge connector with improved reference terminal |
| KR20030028664A (en) * | 2001-09-25 | 2003-04-10 | 주식회사 머큐리 | A shelf for telecomunication equipment and a grounding structure for PCB unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101466215A (en) | 2009-06-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhang Fengli Inventor before: Chen Weishi |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20170321 Address after: Tianjin city Wuqing District High Xiang Feng Hong Kong Road West Nga Court No. 122 rue -1-2402 Patentee after: Zhang Fengli Address before: Taipei City, Taiwan Chinese Shilin District Hougang Street No. 66 Patentee before: Inventec Corporation |
|
| TR01 | Transfer of patent right | ||
| CP02 | Change in the address of a patent holder |
Address after: No. 19, 541500 Central Road, whole state county, Guilin, the Guangxi Zhuang Autonomous Region Patentee after: Zhang Fengli Address before: 301700 Tianjin city Wuqing District High Xiang Feng Hong Kong Road West Nga Court No. 122 rue -1-2402 Patentee before: Zhang Fengli |
|
| CP02 | Change in the address of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120523 Termination date: 20171220 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |