CN101464126B - Production method of integrated submissive sensor for measuring curve clearance and force - Google Patents
Production method of integrated submissive sensor for measuring curve clearance and force Download PDFInfo
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Abstract
The invention belongs the technical field of sensors and relates to a method for preparing an integrated compliant type sensor used for measuring curved surface gaps and force, and prepares planar electric eddy current sensitive elements and ultrathin compliant conducting polymer sensitive elements respectively by the following steps: coating the periphery of the base of a planar electric eddy current sensitive element which is stuck with an ultrathin compliant conducting polymer sensitive element with thermoset package resin by utilizing package resin location resin; and sticking another planar electric eddy current sensitive element layer on the surface to obtain an integrated compliant type sensor, while sticking, the planar electric eddy current coils the internal down-leads and the openings of the upper layer and the lower layer are opposite respectively. The sensor prepared according to the method has the advantages that the gap and the extrusion force between curved surfaces can be measured at the same time; the sensor can be stuck between surfaces of arbitrary shapes while measuring, is suitable for being mounted in narrow space while measuring, and can be applied in measuring field with high temperature, radicalization and the like; the measuring range is wide; and the measuring accuracy is high.
Description
Technical field
The present invention relates to a kind of preparation method who measures the integrated submissive sensor of curve clearance and power, belong to sensor technical field.
Background technology
The proposition of " submissive sensor " notion can be traced back to the phase at the end of the eighties in last century, and the many special constructions in the aerospace vehicle have brought very big difficulty for the installation of conventional rigid sensor.People wish that sensor has good submissive performance, not limited by the testee shape, can be attached at various rules or irregular curved surface is realized normal sensing function.Enter after the nineties in last century, the scientist of countries such as the U.S., France, Japan, Switzerland and Portugal begins to carry out the research work of submissive sensor, and many novel sensor materials and structure are applied among this research field.
Calendar year 2001, well-known scholar professor Lumelsky of U.S.'s sensor field has proposed bold imagination to the developing direction of submissive sensor.Professor Lumelsky thinks that responsive epidermis will be a kind of large-area submissive sensor array, just as the skin of human body, can cover the surface of whole measuring mechanism.It has the ability of perception external environment, can measure the variation of extruding force, shearing force, approaching distance, light intensity, temperature, humidity and some gas concentration comparatively exactly, thereby (for example: in complex environment, execute the task exactly help some Autonomous Control mechanisms robot).Can predict, submissive sensor technology will bring a new revolution to sensor field, and will drive development of technologies in the fields such as industrial automation, health care, Aero-Space, environmental monitoring, robot.
(1) complaisance type current vortex sensor: in the 16th world's Non-Destructive Testing meeting in 2004, Frenchman C.Gilles-Pascaud has showed a kind of sensor array probe that is applied to blocking-up crack detection in surface in the aviation field of current research.This instrument comprises one group of eddy-current coils array and high-resolution camera of containing 32 sensing units, can realize, complete sum reliable detection real-time to surperficial potential crack, and can well be applied to various alloy materials, the accuracy of detection of crack depth is about 0.2mm.The characteristics of this system's maximum are exactly the real time fusion that has realized two kinds of different detection techniques, thereby have improved the detectability to little surface blocking-up crackle.This shows that the complaisance type current vortex sensor of processing on flexible base material can be advantageously applied to curve clearance and measure and the curved body crack detection.
(2) conducting polymer composite complaisance type force transducer: conductive polymer composite refers to common in recent years conductive rubber, conductive plastics, electrically-conducting paint, electro-conductive adhesive and conductive film etc.Conductive polymer composite is divided into two kinds on filled-type and chemical combination type, and the former is mixed into conductive particle to form conductive channel in the polymeric matrix, is the mixture of two or more materials; And the latter is a homogenous material, and self has electric conductivity.Discovering of field of functional materials, the filled-type conductive polymer composite has piezoresistive effect, so some research institutions utilize it as the sensitive element material, has developed the Compliant Force sensor.
U.S. Tekscan company just carries out the research work of submissive sensor since the nineties in last century always.2003, the said firm released a kind of conductive polymer composite Compliant Force sensor, and this sensor area does not wait to one square metre by tens square centimeters, and thickness is 0.15mm.The sensor sensing unit is made of up and down two-layer electrode and one deck conductive polymer composite, and wire length can reach 700mm.Adopt polyimide film up and down two-layer electrode and one deck conductive polymer composite be packaged into a sensor integral body, guaranteed pliability and reliability, the minimum bending radius that allows reaches 100mm.
Generally speaking, conductive polymer composite Compliant Force sensor has that submissive performance is good, dynamometry range and useful area are big, advantage such as processing technology is fairly simple, processing charges is lower.
In sum, complaisance type current vortex sensor and complaisance type force transducer can be distinguished and measure extruding force between curve clearance and curved surface well.But along with the development of science and technology and production, the shape of some substantial equipment key components and parts becomes increasingly complex, and its processing and assembling and positioning accuracy requirement are more and more higher, and is also just high more to measuring requirement.The part of thin-walled surface of revolution one class shape face is widely used in national defence and the various daily life product, and the processing of these parts, measurement, monitoring have often increased difficulty because of the restriction that is subjected to some specific conditions such as space structure size and measured material medium.When in same curved surface measurements gap and extruding force, two kinds of sensors need to be installed, installation site and lead-in wire mode are subjected to the restriction of space structure and can't realize through regular meeting.
Summary of the invention
The objective of the invention is to propose a kind of integrated submissive sensor of measuring curve clearance and power, overcome the deficiency of prior art, make that sensor has that structure is slim, compliance good, range is big, precision is high, resolution is high, the characteristics of measurement clearance and extruding force simultaneously, to be suitable for the online detection of commercial production and medical-therapeutic treatment of human body rehabilitation course mean camber gap and extruding force.
The preparation method of the measurement curve clearance that the present invention proposes and the integrated submissive sensor of power may further comprise the steps:
(1) preparation plane current vortex sensitive element:
(1-1) press the row and column perforate in the Kapton substrate, the thickness of Kapton is 100 μ m-200 μ m, and the aperture of perforate is 250-350 μ m;
(1-2) lining Copper Foil respectively on the surface of positive and negative two surfaces of Kapton substrate and above-mentioned perforate, the thickness of Copper Foil is 15 μ m-20 μ m;
(1-3) above-mentioned reverse side Copper Foil is carried out photoetching, be formed centrally eddy-current coils in above-mentioned perforate being, form internal lead, above-mentioned front Copper Foil is carried out photoetching, between above-mentioned perforate, form outer lead in a side of each eddy-current coils;
(2) preparation ultra-thin complaisant conductive macromolecule sensitive element:
(2-1) particle diameter is mixed in concentration is acetone organic solvent more than 95% less than 1 micron conductive black powder, silica dispersions powder that particle diameter is the 10-50 nanometer and liquid one-component silicon rubber, the concentration of volume percent of each composition is during mixing: one-component silicon rubber: the conductive black powder: the silica dispersions powder: acetone organic solvent=100: 10-15: 1-3: 300-500;
(2-2) carry out mechanical raking under sonic oscillation, stirring environment temperature is 40-60 ℃, and mixing time is 2-4 hour, obtains the gel state mixture;
(2-3) the butadiene rubber particle that will account for the 3-5% of above-mentioned mixture cumulative volume amount joins in this mixture, continues mechanical raking 20-30 minute, makes the acetone volatilization;
(2-4) mixture after the above-mentioned acetone volatilization is splashed into rotation platform, the spin coating moulding obtains the conducting polymer film that thickness is the 70-100 micron;
(2-5) dibutyltin dilaurate catalyst that will account for the tetraethoxysilance crosslinking chemical of above-mentioned conducting polymer film cumulative volume 1% and account for above-mentioned conducting polymer film cumulative volume 2% is mixed into solution, this mixed solution is coated in the surface of above-mentioned conducting polymer film, make the conducting polymer film sulfuration, cure time is more than 24 hours, obtains the ultra-thin complaisant conductive macromolecule sensitive element;
(3) encapsulation of integrated submissive sensor:
(3-1) between the every adjacent two row eddy-current coils of above-mentioned plane current vortex sensitive element, apply one deck location glue;
(3-2) the ultra-thin complaisant conductive macromolecule sensitive element with above-mentioned preparation is cut into strip, will be cut into the ultra-thin complaisant conductive macromolecule sensitive component affixing of strip on the glue of above-mentioned location;
(3-3) has heat cured packaging plastic in above-mentioned substrate periphery coating of having pasted the plane current vortex sensitive element of ultra-thin complaisant conductive macromolecule sensitive element, utilize packaging plastic that another layer plane current vortex sensitive element is sticked to the surface, obtain integrated submissive sensor, during adhesion, make upper and lower two layer plane eddy-current coils, internal lead and perforate relative respectively.
The preparation method of the measurement curve clearance that the present invention proposes and the integrated submissive sensor of power, its advantage is:
1, the integrated sensitive element of the integrated submissive sensor of the present invention's preparation is integrated in ultra-thin plane eddy-current coils and conducting polymer force sensitive element on the same flexible base material, can measure curve clearance and extruding force simultaneously.
2, the conducting polymer force sensitive element in the integrated submissive sensor of the present invention's preparation has adopted novel material design and processing technology, has big range, and quick precision of high power and resolution.
3, ultra-thin plane eddy-current coils and the outgoing cable thereof in the integrated submissive sensor of the present invention's preparation has good compliance.Therefore, sensor can be attached between the surface of arbitrary shape and measure.And traditional current vortex sensor can't be installed on the curved surface and measures.
4, the present invention preparation integrated flexible sensor can carry out quick measurement in the large tracts of land scope.Owing to adopted printed circuit board technology, integrated transducer array can be distributed in the very big areal extent (400mm * 700mm even bigger), thereby realized the measurement of large tracts of land scope.And other technology as fine processes such as MEMS, just can't be made the flexible sensor array of large tracts of land scope, therefore also is difficult to the measurement that realizes that the large tracts of land scope is interior.If utilize single-sensor to carry out the measurement of large tracts of land scope, then need to utilize mechanical hook-up control sensor or measured target to move by rule, this must influence the speed and the precision of measurement.And in the present invention, utilize multi-channel gating switch, sensor array is realized quick scan round.Scan a passage and only need 20 milliseconds.
5, the integrated submissive sensor of the present invention's preparation has ultra-thin characteristic.The I of the thickness of integrated transducer array and outgoing cable thereof is accomplished 0.3mm, is fit to be installed in the narrow space and measures.
6, the integrated submissive sensor of the present invention's preparation can form the solid matter cable.The lead-in wire of sensor array pools together, and forms the long cable of solid matter, makes structure compact more.Owing to adopt the measuring method of scan round, any time, having only in the cable has the signal transmission in one group of line, and therefore, cable institute transmission signals does not disturb mutually.
7, the traditional relatively clearance measurement and the force measuring sensors of integrated submissive sensor of the present invention preparation can be applicable to a lot of measurement occasions, as measure fast in measurement of curved surface, the large tracts of land scope, measurement in the small space etc.Base material is as adopting the polymeric material polyimide, and then this sensor array can also be applied in high temperature (300-400 ℃), radiation etc. and measure occasion.
8, the present invention preparation integrated flexible sensor, thickness only is 0.3mm; Submissive performance is good, and minimum bending radius can reach 200mm; The sensor array area can be had made to order, and scope is 400～700mm
2The range of dynamometry: 0～2MPa; The precision of dynamometry: 1%FS; The resolution of dynamometry: 0.2%FS; The resolution of measurement clearance: 1 μ m; The sensitivity of measurement clearance: 100Hz/ μ m; The precision of measurement clearance: ± 1%FS; The range of measurement clearance: 0～5mm.
Description of drawings
Fig. 1 is that the present invention prepares the forward planimetric map before the sensor package in the integrated submissive sensor process.
Fig. 2 is the reverse planimetric map of encapsulation front sensor shown in Figure 1.
Fig. 3 is the A-A cut-open view of encapsulation back sensor shown in Figure 1.
Fig. 4 is the B-B cut-open view of encapsulation back sensor shown in Figure 1.
Among Fig. 1-Fig. 3, the 1st, substrate, the 2nd, outer lead, the 3rd, internal lead, the 4th, perforate, the 5th, ultra-thin conducting polymer composite sensitive element, the 6th, location glue, the 7th, eddy-current coils, the 8th, fluid sealant.
Embodiment
The preparation method of the measurement curve clearance that the present invention proposes and the integrated submissive sensor of power, the forward planimetric map in the preparation process before the sensor package may further comprise the steps as shown in Figure 1:
(1) preparation plane current vortex sensitive element:
(1-1) press row and column perforate 4 in Kapton substrate 1, the thickness of Kapton is 100 μ m-200 μ m, and the aperture of perforate is 250-350 μ m;
(1-2) lining Copper Foil respectively on the surface of positive and negative two surfaces of Kapton substrate and above-mentioned perforate, the thickness of Copper Foil is 15 μ m-20 μ m;
(1-3) above-mentioned reverse side Copper Foil is carried out photoetching, be formed centrally eddy-current coils 7 in above-mentioned perforate 4 being, form internal lead 3, above-mentioned front Copper Foil is carried out photoetching, between above-mentioned perforate 4, form outer lead 2, as shown in Figure 2 in a side of each eddy-current coils 7;
(2) preparation ultra-thin complaisant conductive macromolecule sensitive element:
(2-1) particle diameter is mixed in concentration is acetone organic solvent more than 95% less than 1 micron conductive black powder, silica dispersions powder that particle diameter is the 10-50 nanometer and liquid one-component silicon rubber, the concentration of volume percent of each composition is during mixing: one-component silicon rubber: the conductive black powder: the silica dispersions powder: acetone organic solvent=100: 10-15: 1-3: 300-500;
(2-2) carry out mechanical raking under sonic oscillation, stirring environment temperature is 40-60 ℃, and mixing time is 2-4 hour, obtains the gel state mixture;
(2-3) the butadiene rubber particle that will account for the 3-5% of above-mentioned mixture cumulative volume amount joins in this mixture, continues mechanical raking 20-30 minute, makes the acetone volatilization;
(2-4) mixture after the above-mentioned acetone volatilization is splashed into rotation platform, the spin coating moulding obtains the conducting polymer film that thickness is the 70-100 micron;
(2-5) dibutyltin dilaurate catalyst that will account for the tetraethoxysilance crosslinking chemical of above-mentioned conducting polymer film cumulative volume 1% and account for above-mentioned conducting polymer film cumulative volume 2% is mixed into solution, this mixed solution is coated in the surface of above-mentioned conducting polymer film, make the conducting polymer film sulfuration, cure time is more than 24 hours, obtains the ultra-thin complaisant conductive macromolecule sensitive element;
(3) encapsulation of integrated submissive sensor:
(3-1) between the every adjacent two row eddy-current coils of above-mentioned plane current vortex sensitive element, apply one deck location glue 6;
(3-2) the ultra-thin complaisant conductive macromolecule sensitive element with above-mentioned preparation is cut into strip, will be cut into the ultra-thin complaisant conductive macromolecule sensitive component affixing of strip on the glue of above-mentioned location;
(3-3) has heat cured packaging plastic in above-mentioned substrate periphery coating of having pasted the plane current vortex sensitive element of ultra-thin complaisant conductive macromolecule sensitive element, utilize packaging plastic that another layer plane current vortex sensitive element is sticked to the surface, obtain integrated submissive sensor, during adhesion, make upper and lower two layer plane eddy-current coils, internal lead and perforate relative respectively.
In the said method, two Example formulations of preparation ultra-thin complaisant conductive macromolecule sensitive element are:
The concentration of volume percent of each composition is during mixing: one-component silicon rubber: the conductive black powder: the silica dispersions powder: acetone organic solvent=100: 12: 2: 350;
The concentration of volume percent of each composition is when perhaps mixing: one-component silicon rubber: the conductive black powder: the silica dispersions powder: acetone organic solvent=100: 14: 2.5: 400.
The integrated submissive sensor of the present invention's preparation is made of the conducting polymer force sensitive element array that encapsulates all-in-one-piece upper/lower electrode layer and be pressed on therebetween, as shown in Figure 3 and Figure 4.
The integrated submissive sensor of the present invention's preparation adopts the conducting polymer composite with piezoresistive effect as the sensitive element of measuring stress, this material with the conductive black powder as conductive phase, with silicon rubber as the insulation phase, mix by optimized proportion, adopted sonic oscillation, organic solvent dissolution, heated and stirred, nano-dispersed and hybrid technology such as elastomer blended.
The conducting polymer force sensitive element electrode layer that uses in the integrated submissive sensor of the present invention's preparation is to utilize flexible printed circuit board technology to be made on film substrate, and wherein upper and lower electrode has adopted ultra-thin plane eddy-current coils to substitute traditional plate electrode.Upper and lower electrode can be distinguished and adopts ultra-thin plane eddy-current coils separately, also can adopt ultra-thin plane eddy-current coils simultaneously.Thus, upper and lower electrode forms individual layer or double-layer electric vortex flow detection architecture.Ultra-thin plane eddy-current coils and conducting polymer force sensitive element integrate, and formed an integrated sensitive element of measurement clearance and extruding force simultaneously jointly.
Each plane eddy-current coils of sensor array in the integrated submissive sensor of the present invention's preparation respectively has two signal line, the lead-in wire of upper and lower electrode forms the signal wire of conducting polymer force sensitive element naturally, the signal wire of each integrated sensitive element pools together in the array, the solid matter cable is drawn in formation, and the other end of this cable is provided with the plug that links to each other with multi-channel gating switch.
Conducting polymer force sensitive element in the integrated submissive sensor of the present invention's preparation can be made into individual layer or bilayer even multilayer, and plane eddy-current coils shape can be circular, square or other shape.
The preparation process of the integrated submissive sensor of the present invention's preparation has adopted the photoetching lead-in wire, has applied the technological process of locating glue, attaching force sensitive element, coating packaging plastic and packaging by hot pressing.Carry out selection and design according to measuring condition and requirement, said film substrate can adopt the flexible material that is fit to printed circuit board technology, as Kapton, and mylar etc.
Below introduce the integrated flexible sensor principle of sensing element of the present invention's preparation:
Integrated sensitive element of the present invention is made up of plane current vortex sensitive element and conducting polymer force sensitive element, and the signal lead of plane current vortex sensitive element uses as the signal lead of conducting polymer force sensitive element simultaneously.
The principle of work of a, current vortex sensitive element measurement clearance:
The principle of work that general current vortex detects is: detect the reciprocation between drive coil magnetic field and the measured conductor inductive loop magnetic field.When sensor coil feeds alternating current, will produce alternating magnetic field around the coil, if move into the metallic conductor target in this alternating magnetic field this moment, target material surface will induce current vortex, and this current vortex can produce a magnetic field, the direction in this magnetic field is just in time opposite with the direction in primary winding magnetic field, thereby has weakened former magnetic field, causes changes of magnetic field.The situation of change in magnetic field is that the impedance variation by sensor coil reflects the function that the equiva lent impedance Z of coil generally can be expressed as:
Z＝F(σ，μ，f，x，r)
Wherein, σ, μ are respectively the conductivity and the magnetic permeabilities of tested metallic conductor, and f is the frequency of pumping signal, and x is the distance between coil and the metallic conductor, and r is the size factor of coil, and is relevant with structure, shape and the size of coil.As seen, the variation of coil impedance is complete and reflected the eddy current effect of tested metallic conductor uniquely.During actual detected, unwanted influence factor is controlled, just can be realized detection certain correlative in the following formula.As the proximity sensor, coil is directly related with the impedance of coil to the distance between the metal targets, and when detecting the defective on metal surface or nearly surface, the existence of defective will cause the variation of measured conductor conductivity and magnetic permeability, and then the impedance parameter of coil is changed.Can obtain the Spherical Clearance measurement data of point position by current vortex sensor.
B, conductive macromolecule sensitive element are measured the principle of work of extruding force:
From the angle analysis of conductive microstructure mechanism as can be known, the reason that carbon black filled silicon rubber composite material produces piezoresistive effect can be summed up as the variation that carbon black pellet distributes in the silicon rubber matrix, more precisely, be the variation of conductive black grain spacing.Ambient pressure can compressed composite material volume because the compressibility of conductive black particle is much smaller than the silicon rubber matrix, so the spacing of conductive particle reduces, and improved contact conduction and tunnel effect odds.Along with pressure increases, the spacing of conductive black particle reduces gradually, because the effect of contact conduction and tunnel effect mechanism has formed conductive channel in the inside of material.And the generation of contact conduction and tunnel effect mechanism is subjected to the particle diameter of conductive particle and the influence of shape again, so the piezoresistive effect of material shows the substantial connection with the pattern parameter.The pattern parameter value of material is big more, and the probability that contact conduction and tunnel effect produce is just high more, and the piezoresistive effect of material is also just obvious more.
From the angle analysis of conduction seepage flow phenomenon, the resistivity of material is fairly obvious with the variation of conductive filler volumetric concentration in the conduction vadose region.This is because when ambient pressure had reduced the volume of polymeric matrix, the corresponding increase of the volumetric concentration of conductive particle caused the significant change of resistivity of material.Material deformation has caused that conduction seepage flow changes, along with material deformation, and the soot body volume concentrations, the resistivity of material reduces thereupon.When the soot body volume concentrations more near the seepage flow threshold value, the piezoresistive effect of material is just obvious more.In effective medium generalized equation, the pattern parameter of the volumetric concentration of carbon black, seepage flow threshold value and material has characterized conduction seepage flow phenomenon together, and the piezoresistive effect that carbon black filled silicon rubber composite material also is described is a concrete manifestation of its conduction seepage flow phenomenon.In addition, distortion of materials not only causes the variation of resistivity, has also changed its resistance geometrical factor (promptly along the length of material on the direction of current and the ratio of cross-sectional area).In sum, the stress deformation of carbon black filled silicon rubber composite material is its immediate cause that produces piezoresistive effect.
On macroscopical presentation, because the effect of pressure, the conducting polymer composite that constitutes sensitive element has produced resistance variations, and this variation presents the linear ratio relation with pressure within the specific limits.
Below introduce the integrated submissive sensor working of array of the present invention's preparation:
During real work, sensor is attached between curved surface.By the impedance variation of each eddy-current coils of oscillatory circuit survey sensor,,, obtain corresponding gap width and extruding force value according to calibration curve by every pair of interelectrode resistance variations of resistance sampling circuit measuring sensor.By sample of signal and array scanning circuit and multi-channel gating switch, sensitive element is carried out quick scan round, can measure the measured value of each sensitive element.Because the distribution mode of these sensitive elements is known, therefore, measurement result is carried out data processing, just can obtain the distribution of curve clearance and extruding force.
Claims (1)
1. preparation method who measures the integrated submissive sensor of curve clearance and power is characterized in that this method may further comprise the steps:
(1) preparation plane current vortex sensitive element:
(1-1) press the row and column perforate in the Kapton substrate, the thickness of Kapton is 100 μ m-200 μ m, and the aperture of perforate is 250-350 μ m;
(1-2) plating Copper Foil respectively on the surface of positive and negative two surfaces of Kapton substrate and above-mentioned perforate, the thickness of Copper Foil is 15 μ m-20 μ m;
(1-3) the reverse side Copper Foil is carried out photoetching, be formed centrally eddy-current coils in above-mentioned perforate being, form internal lead, the front Copper Foil is carried out photoetching, between above-mentioned perforate, form outer lead in a side of each eddy-current coils;
(2) preparation ultra-thin complaisant conductive macromolecule sensitive element:
(2-1) particle diameter is mixed in concentration is acetone organic solvent more than 95% less than 1 micron conductive black powder, silica dispersions powder that particle diameter is the 10-50 nanometer and liquid one-component silicon rubber, the concentration of volume percent of each composition is during mixing: one-component silicon rubber: the conductive black powder: the silica dispersions powder: acetone organic solvent=100: 10-15: 1-3: 300-500;
(2-2) carry out mechanical raking under sonic oscillation, stirring environment temperature is 40-60 ℃, and mixing time is 2-4 hour, obtains the gel state mixture;
(2-3) the butadiene rubber particle that will account for the 3-5% of above-mentioned mixture cumulative volume amount joins in this mixture, continues mechanical raking 20-30 minute, makes the acetone volatilization;
(2-4) mixture after the above-mentioned acetone volatilization is splashed into rotation platform, the spin coating moulding obtains the conducting polymer film that thickness is the 70-100 micron;
(2-5) dibutyltin dilaurate catalyst that will account for the tetraethoxysilance crosslinking chemical of above-mentioned conducting polymer film cumulative volume 1% and account for above-mentioned conducting polymer film cumulative volume 2% is mixed into solution, mixed solution is coated in the surface of above-mentioned conducting polymer film, make the conducting polymer film sulfuration, cure time is more than 24 hours, obtains the ultra-thin complaisant conductive macromolecule sensitive element;
(3) encapsulation of integrated submissive sensor:
(3-1) between the every adjacent two row eddy-current coils of above-mentioned plane current vortex sensitive element, apply one deck location glue;
The above-mentioned ultra-thin complaisant conductive macromolecule sensitive element that (3-2) will prepare is cut into strip, will be cut into the ultra-thin complaisant conductive macromolecule sensitive component affixing of strip on the glue of above-mentioned location;
(3-3) apply at the substrate periphery of the plane current vortex sensitive element of pasting above-mentioned ultra-thin complaisant conductive macromolecule sensitive element and have heat cured packaging plastic, utilize packaging plastic that another layer plane current vortex sensitive element is sticked to the surface, obtain integrated submissive sensor, during adhesion, make upper and lower two-layer eddy-current coils, internal lead and perforate relative respectively.
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