CN101460035A - Heat radiating system, machine cabinet and control method - Google Patents

Heat radiating system, machine cabinet and control method Download PDF

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Publication number
CN101460035A
CN101460035A CNA2007101250536A CN200710125053A CN101460035A CN 101460035 A CN101460035 A CN 101460035A CN A2007101250536 A CNA2007101250536 A CN A2007101250536A CN 200710125053 A CN200710125053 A CN 200710125053A CN 101460035 A CN101460035 A CN 101460035A
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rack
temperature
unit
pcm
ventilating blind
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CNA2007101250536A
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Chinese (zh)
Inventor
黄文雄
姬生钦
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Priority to CNA2007101250536A priority Critical patent/CN101460035A/en
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Abstract

The invention provides a heat dissipating system, which is arranged in a frame. The heat dissipating system comprises a PCM unit, a TEC air-conditioning unit, a fan unit, a ventilating shutter and a control device, wherein the PCM unit is arranged in the frame, the fan unit is arranged in the frame, the blowing or the exhausting position of the fan unit is provided with the ventilating shutter, the TEC air-conditioning unit is installed on the wall surface of the frame, and the control device is installed in the frame, wherein the control device is used for collecting temperature of the PCM unit and the temperature in and out of the frame, and controls the TEC air-conditioning unit, the fan unit and the ventilating shutter according to control strategies and collected temperature. The heat dissipating system can effectively dissipate heat for communication equipment in the frame through the mode.

Description

A kind of cooling system, rack and control method
Technical field
The present invention relates to the heat dissipation technology field, relate in particular to a kind of cooling system that a kind of PCM of utilization, TEC air-conditioning and direct ventilation radiating mode dispel the heat.
Background technology
Phase-change material (PCM-Phase Change Material) is meant and varies with temperature and change form and the material of latent heat can be provided.Phase transition process is meant because of influenced by change of external conditions, phase-change material is in solid, liquid, three kinds of different existences of vapour change mutually or thing changes mutually under same existence process, in the process that different conditions changes mutually or thing changes mutually under same existence, phase-change material can neither endothermic nor exothermic.
Along with development of Communication Technique, the integrated level of communication equipment is more and more higher in the rack, the heat radiation of the electronic device of communication equipment is required more and more higher, and the radiating mode in the existing cabinet cabinet can not satisfy the requirement of communication equipment.
See also Fig. 1, be the schematic diagram that utilizes existing PCM and direct ventilation mode to dispel the heat for the communication equipment electronic device in the rack.Among Fig. 1, described rack 10 internal upper parts have a rack top layer dividing plate 11, and between the roof 12 and this rack top layer dividing plate 11 of this rack 10, offer ventilation hole 15 on the left side wall 13 of rack 10, right side wall 14, and are provided with fan 16 in these ventilation hole 15 places.See also Fig. 2, be the vertical view of Fig. 1, between the top layer dividing plate 11 of the roof 12 of rack 10 and this rack, be equiped with several PCM unit, wherein, be provided with insulation material 17 in the wall of this rack 10 along the A-A direction.
When the mode that adopts PCM unit 18 and direct ventilation is dispelled the heat for the communication equipment in this rack 10, temperature is higher than the temperature of PCM phase-change material in rack 10, and when the temperature of this PCM unit 18 is lower than the temperature of its PCM phase-change material, these PCM unit 18 accumulation of heats; When the temperature of this PCM unit 18 is higher than the phase point temperature of its PCM phase-change material, the cold airflow that provides after utilizing this fan 16 to dry outside this rack 10 dispels the heat for this PCM unit, guarantee that the heat that this PCM unit is put aside can in time be discharged into outside the rack, realize the circulation accumulation of heat of this PCM unit, and keep rack 10 interior temperature in predetermined scope, thereby guarantee that the communication equipment in its rack 10 normally moves, and have long life-span and good reliability.
In realizing process of the present invention, the inventor finds that there are the following problems at least in the prior art:
The communication equipment radiating modes external environment condition of rack that places one's entire reliance upon in this rack 10, if the rack ambient temperature is higher than the temperature of PCM unit phase-change material all the time, and when PCM unit phase-change material temperature has been higher than the temperature of its transformation temperature, the heat storage capacity of PCM unit can sharply reduce, nor can reach the performance of fast quick-recovery PCM unit accumulation of heat by the fan in the rack to the external environment condition release heat.Thereby the temperature in this rack is raise.
Summary of the invention
The embodiment of the invention provides a kind of cooling system, can effectively dispel the heat for the electronic equipment in the rack.
For achieving the above object, the embodiment of the invention provides a kind of cooling system, is located in the rack, and described cooling system comprises PCM unit, TEC air-conditioning unit, fan unit, ventilating blind and control device, wherein, described PCM unit is arranged in the described rack; Described fan unit is located in the rack; The position of described fan unit blowing or exhausting is provided with described ventilating blind; Described TEC air-conditioning unit is installed on the wall of described rack, described control device is installed in the described rack, wherein, described control device is used to gather temperature and the outer temperature of described rack in the temperature of described PCM unit, described rack, according to control strategy and the temperature that collects described TEC air-conditioning unit, described fan unit, described ventilating blind is controlled.
The embodiment of the invention provides a kind of rack, comprise electronic equipment and cooling system in the described rack, described cooling system is that described electronic equipment dispels the heat, described cooling system comprises PCM unit, TEC air-conditioning unit, fan unit, ventilating blind and control device, wherein, described PCM unit is arranged in the described rack; Described fan unit is located in the rack; The position of described fan unit blowing or exhausting is provided with ventilating blind; Described TEC air-conditioning unit is installed on the wall of described rack, described control device is installed in the rack, described control device is used to gather temperature and the outer temperature of described rack in the temperature of described PCM unit, described rack, according to control strategy and the temperature that collects described TEC air-conditioning unit, described fan unit, described ventilating blind is controlled.
The embodiment of the invention provides a kind of control method, is applied to cooling system, comprising:
Gather the temperature of PCM unit in the rack, the temperature that temperature in the rack and rack are outer;
According to control strategy and the temperature that collects described TEC air-conditioning unit, described fan unit, described ventilating blind are controlled.
As seen from the above, by cooling system is installed in rack, control device is gathered temperature and the outer temperature of this rack in this PCM unit, this rack, according to control strategy and the temperature that collects this TEC air-conditioning unit, this fan unit, this ventilating blind are controlled, thereby can be dispelled the heat for the rack inner electronic equipment effectively.
Description of drawings
Fig. 1 is for utilizing PCM and the direct ventilation schematic diagram for communication equipment heat radiation in the rack in the prior art;
Fig. 2 is along the vertical view of A-A direction among Fig. 1;
Fig. 3 is the embodiment one of cooling system of the present invention;
Fig. 4 is another embodiment of cooling system of the present invention;
Fig. 5 is the schematic diagram of control device in the embodiment of the invention;
Fig. 6 is the control device signal processing unit schematic diagram of cooling system;
Fig. 7 is the control device workflow diagram of cooling system;
Fig. 8 is the flow chart of the temperature control strategy of cooling system.
Embodiment
For describing architectural feature of the present invention and technical characterictic in detail, the specific embodiment of the present invention is at length set forth below in conjunction with accompanying drawing.
See also Fig. 3, be embodiment one schematic diagram of cooling system of the present invention, this cooling system is located in the rack 200.This rack 200 comprises a plurality of walls, and wherein, this wall comprises left side wall 21, right side wall 23, antetheca, rear wall 25, bottom 27, top.Wherein, this antetheca is made of door 30, and this door 30 is installed on the rack 200 by a sidewall (left side wall 21 or right side wall 23).These rack 200 inside are divided into upper and lower two parts in the first half horizontally set one dividing plate 40 with this rack 200.This cooling system comprises PCM unit 50, TEC air-conditioning unit 60, fan unit 70, ventilating blind 80 and control device 90, wherein, this PCM unit 50 is located between this enclosure top and this dividing plate 40, and near this enclosure top, this fan unit 70 is located at this rack rear wall 25, and near this PCM unit 50, and be provided with ventilating blind 80 in the position of this fan unit 70 fans blowing or exhausting.This TEC air-conditioning unit 60 is installed on the sidewall of this rack 200 (left side wall 21 or right side wall 23).This control device 90 is installed in the rack 200, and is positioned on the wherein sidewall (left side wall 21 or right side wall 23) of rack 200, and the hot junction of this TEC air-conditioning unit 60 is positioned at outside the rack 200, and cold junction is positioned at rack 200.Wherein, this control device 90 is used to gather temperature and the outer temperature of rack in the temperature, this rack of this PCM unit 50, according to control strategy and the temperature that collects this TEC air-conditioning unit 60, this fan unit 70, this ventilating blind 80 is controlled.
See also Fig. 4, be another embodiment schematic diagram of cooling system of the present invention, this cooling system is located in the rack 200.This rack 200 comprises a plurality of walls, and wherein, this wall comprises left side wall 21, right side wall 23, antetheca, rear wall 25, bottom 27, top.Wherein, this antetheca is made of door 30, and this door 30 is installed on the rack 200 by a sidewall (left side wall 21 or right side wall 23).These rack 200 inside are divided into upper and lower two parts in the first half horizontally set one dividing plate 40 with this rack 200.This cooling system comprises PCM unit 50, TEC air-conditioning unit 60, fan unit 70, ventilating blind 80 and control device 90, this PCM unit 50 is located between this enclosure top and this dividing plate 40, and near this enclosure top, this fan unit 70 is located at this rack rear wall 25, and near this PCM unit 50, and in the top of these cabinet door 30 correspondences ventilating blind 80 is installed in the position of this fan unit 70 fans blowing or exhausting.This TEC air-conditioning unit 60 is installed on the inboard of this cabinet door 30, and is positioned at this rack 200 inside.This control device 90 is installed in the rack 200, and on a wherein sidewall of rack 200, the hot junction of this TEC air-conditioning unit 60 is positioned at outside the rack 200, and cold junction is positioned at rack 200.Wherein, this control device 90 is used to gather temperature and the outer temperature of rack in the temperature, this rack of this PCM unit 50, according to control strategy and the temperature that collects this TEC air-conditioning unit 60, this fan unit 70, this ventilating blind 80 is controlled.
In like manner, the fan unit 70 in the embodiment of the invention cooling system can be located at left and right sidewall (21, the 23) position of rack, and the position of corresponding fan unit 70 fans blowing or exhausting is equipped with ventilating blind 80 in the top of these cabinet door 30 correspondences.
Further, PCM unit 50 is arranged at the place that needs in the rack 200 to dispel the heat and gets final product, fan unit 70 is located in the rack 200, the position of these fan unit 70 blowings or exhausting is provided with ventilating blind 80, this TEC air-conditioning unit 60 is installed on the wall of rack, the cold junction of this TEC air-conditioning is positioned at rack, the hot junction is positioned at outside the rack, this control device 90 is installed in the described rack, wherein, this control device 90 is used to gather the temperature of this PCM unit 50, the temperature that temperature in this rack and rack are outer, according to control strategy and the temperature that collects to this TEC air-conditioning unit 60, this fan unit 70, this ventilating blind 80 is controlled.
This fan unit 70 is located in the rack 200, includes but not limited to that this fan unit 70 is located at the wall of rack 200, and this fan unit 70 is located in the rack, and near the wall of rack 200.
Need to prove, the foregoing description is the schematic diagram of cooling system embodiment, in specific implementation process, fan unit 70, ventilating blind 80, TEC air-conditioning unit 60 and control device 90 be accommodation as required, with the needs of realistic application scenarios.
In the above-described embodiments, this PCM unit 50 is mainly used in the heat load that absorbs in the rack, to keep in the rack temperature in the best effort scope of equipment requirements.Wherein, this heat load is made up of to rack internal leak heat two parts equipment self caloric value and external environment in the rack.
TEC air-conditioning unit 60 and fan unit 70 are auxiliary heat dissipation unit of PCM unit 50, in PCM unit 50 is finished rack after the savings of heat, its temperature can raise, until reaching transformation temperature, after this heat storage capacity of PCM unit 50 can significantly descend, need utilize TEC air-conditioning unit 60 or fan unit 70 with the transfer of heat of PCM unit 50 savings to external environment, recover the heat storage capacity of PCM unit 50, keep the interior temperature of whole rack.
Ventilating blind 80 is used to cooperate 70 pairs of PCM unit 50 of fan unit to dispel the heat, and when control device 90 monitors fan unit 70 when starting working, ventilating blind is opened; Otherwise, the ventilating blind closure.
Control device 90 is cores of entire heat dissipation system, it is by monitoring rack ambient temperature, rack interior environment temperature, PCM cell temperature, thereby the operating state of control TEC air-conditioning, fan unit, the unlatching of ventilating blind and closure state etc. are realized the heat radiation of TEC and PCM group and cooling system.
See also Fig. 5, be the schematic diagram of control device in the embodiment of the invention 90, this control device 90 comprises signal gathering unit 91 and signal processing unit 93.
This signal gathering unit 91, the temperature, the temperature in the rack and the outer temperature of rack that are used to gather PCM unit 50;
Reach rack in this PCM unit 50, the rack and be provided with the temperature sensing point outward,, can gather temperature, rack internal temperature and the rack external temperature of these PCM unit 50 for this signal gathering unit 91 according to the temperature that the temperature sensing point detects.Concrete, this temperature sensing point is a temperature sensor, is used to obtain in this PCM unit 50, the rack and the outer temperature of rack.
This signal processing unit 93 is used for according to control strategy and the temperature that collects this TEC air-conditioning unit, this fan unit, this ventilating blind being controlled.
See also Fig. 6, this signal processing unit 93 comprises, receiver module 931, comparison module 932 and control module 933.
This receiver module 931 is used to obtain temperature, the temperature in the rack and the outer temperature of rack of the PCM unit 50 that this signal gathering unit 91 collects;
This comparison module 932 is used for according to control strategy, and the temperature that described receiver module is received compares;
Control module 933 is used for controlling described TEC air-conditioning unit, described fan unit, described ventilating blind according to described comparison module result relatively.
By on can learn, by cooling system is installed in rack 200, after the heat load that PCM unit 50 absorbs in the racks, by TEC air-conditioning unit 60 and fan unit 70 auxiliary heat dissipations, thus the performance of quick-recovery PCM unit 50 accumulation of heats soon.
See also Fig. 7, be the flow chart of control strategy in the control device 90:
During the minimum temperature that in the temperature in this rack 200 is lower than this rack 200, allows, these ventilating blind 80 closures, this fan unit 70 is not worked, and this TEC air-conditioning unit 60 is not worked, these PCM unit 50 accumulation of heats;
During the maximum temperature that allows in the temperature in this rack 200 is higher than this rack 200, this ventilating blind 80 is opened, 70 yuan of work of this fan list, these PCM unit 50 cold-storages, perhaps these TEC air-conditioning unit 60 work, these PCM unit 50 cold-storages.
Further, in order to consider that the temperature in this rack 200 are higher than the minimum temperatures that allow in this rack 200, and when being lower than the maximum temperature that allows in the described rack, the heat radiation of rack inner electronic equipment, can increase corresponding control strategies, this control strategy further comprises:
1, the minimum temperature that in the temperature in this rack 200 is higher than this rack 200, allows and when being lower than the maximum temperature of permission this rack 200 in, this ventilating blind 80 is opened, these fan unit 70 work, these PCM unit 50 cold-storages, perhaps these TEC air-conditioning unit 60 work, these PCM unit 50 cold-storages;
2, the minimum temperature that in the temperature in this rack 200 is higher than this rack 200, allows and when being lower than the maximum temperature of permission this rack 200 in, these ventilating blind 80 closures, this fan unit 70 is not worked, and this TEC air-conditioning unit 60 is not worked, these PCM unit 50 accumulation of heats.
In actual applications, can select above-mentioned control strategy 1 or control strategy 2, or control strategy 1 and control strategy 2.
Further, control strategy can also for:
During the maximum temperature that in temperature in the rack 200 is elevated to this rack 200, allows, ventilating blind 80 closures, fan unit 70 is not worked, and TEC air-conditioning unit 60 is not worked, 50 accumulation of heats of PCM unit; Or when temperature in the rack 200 was reduced to the maximum temperature that allows in the rack 200, ventilating blind 80 was opened, fan unit 70 work, PCM unit 50 cold-storages, perhaps TEC air-conditioning unit 60 work, PCM unit 50 cold-storages;
When rack external environment temperature is lower than in the rack 200 minimum temperature that allows, when temperature were higher than the maximum temperature that allows in the rack 200 in the rack 200, ventilating blind 80 was opened, fan unit 70 work, and TEC air-conditioning unit 60 is not worked, PCM unit 50 cold-storages; Or be higher than the minimum temperature that allows in the rack when rack external environment temperature, and the outer temperature of rack is lower than the maximum temperature that allows in the rack, when temperature is higher than the maximum temperature that allows in the rack in the rack, ventilating blind 80 is opened, fan unit 70 work, TEC air-conditioning unit 60 is not worked, PCM unit 50 cold-storages;
When rack external environment temperature is higher than the maximum temperature that allows in the rack, when temperature is higher than the maximum temperature that allows in the rack in the rack, 60 work of TEC air-conditioning unit, ventilating blind 80 closures, fan unit 70 is not worked, PCM unit 50 cold-storages;
When temperature in the rack is reduced to when being lower than the minimum temperature that allows in the rack, ventilating blind 80 closures, fan unit 70 quits work, and TEC air-conditioning unit 60 quits work, 50 accumulation of heats of PCM unit.
Consider the redundancy of interior temperature of rack and the outer temperature of rack in the real work, can set in the rack and the outer redundancy of rack.
Suppose: Ta is the ambient temperature outside this rack 200, Tmax is the maximum temperature that allows in the rack 200, Tmin is the minimum temperature that allows in the rack 200, Tin is the normal temperature in the rack 200, a, b are the fluctuation range (wherein a, b is a positive integer) of temperature in the rack, concrete a is that temperature high temperature redundancy value in the rack 200 (0≤a≤(Tmax-Tmin)/2), b are in-cabinet temperature low temperature redundancy value (0≤b≤(Tmax-Tmin)/2), promptly is expressed as: Tmin+b≤Tin≤Tmax-a.
Detailed control strategy is:
1, when temperature T in is lower than the minimum temperature Tmin+b that allows in the rack in the rack, fan unit 70 and TEC air-conditioning unit 60 are not all worked, ventilating blind 80 closures, 50 accumulation of heats of PCM unit;
2, be higher than the minimum temperature Tmin+b that allows in the rack as temperature T in the rack, and when being lower than the maximum temperature Tmax-a that allows in the rack:
If temperature is in ascent stage in the rack, fan unit 70 and TEC air-conditioning unit 60 are not all worked, ventilating blind 80 closures, 50 accumulation of heats of PCM unit;
If temperature is in the decline stage in the rack, a is lower than the maximum temperature Tmax-a that allows in the rack when rack external environment temperature T, and then ventilating blind 80 is opened, fan unit 70 work, and TEC air-conditioning unit 60 is not worked, PCM unit 50 cold-storages;
If rack external environment temperature T a is higher than the maximum temperature Tmax-a that allows in the rack, then TEC air-conditioning unit 60 work, ventilating blind 80 closures, fan unit 70 is not worked, PCM unit 50 cold-storages;
3, when temperature T in is higher than the maximum temperature Tmax-a that allows in the rack in the rack:
If rack external environment temperature T a is lower than the maximum temperature Tmax-a that allows in the rack, then ventilating blind 80 is opened, fan unit 70 work, and TEC air-conditioning unit 60 is not worked, PCM unit 50 cold-storages;
If rack external environment temperature T a is higher than the maximum temperature Tmax-a that allows in the rack, then TEC air-conditioning unit 60 work, ventilating blind 80 closures, fan unit 70 is not worked, PCM unit 50 cold-storages.
See also Fig. 8, be the flow chart of control strategy in the control device 90.
When temperature control system was started working, the minimum temperature Tmin that allows at first that rack is outer ambient temperature Ta and the rack compared:
One, as Ta〉during Tmin, the maximum temperature Tmax that allows in ambient temperature Ta that rack is outer and the rack compares:
A, when Ta<Tmax, normal temperature Tin in the rack and Tmax-a are compared:
As Tin〉during Tmax-a, ventilating blind is opened, fan work, the TEC air-conditioning is not worked; PCM cold-storage (PCM controls voluntarily), otherwise, the ventilating blind closure, fan and TEC air-conditioning are not worked, PCM accumulation of heat (PCM controls voluntarily);
B, as Ta during Tmax, normal temperature Tin in the rack and Tmax-a are compared:
As Tin〉during Tmax-a, the TEC air-conditioning work, at this moment, and the ventilating blind closure, fan is not worked, PCM cold-storage (PCM controls voluntarily), otherwise, the ventilating blind closure, fan and TEC air-conditioning are not worked, PCM accumulation of heat (PCM controls voluntarily);
Two, when Ta<Tmin, the maximum temperature Tmax that allows in normal temperature Tin in the rack and the rack is compared:
A ', as Tin during Tmax, ventilating blind is opened, fan work, the TEC air-conditioning is not worked, PCM cold-storage (PCM controls voluntarily);
B ', when Tin<Tmax, the ventilating blind closure, fan and TEC air-conditioning are not worked, PCM accumulation of heat (PCM controls voluntarily).
Three, when Tin<Tmin+b, the ventilating blind closure, fan and TEC air-conditioning are not worked, by PCM accumulation of heat voluntarily;
Four, as Tin〉during Tmin+b, then temperature control system circulates again, starts working.
Control strategy in the embodiment of the invention compares by the temperature that the temperature of PCM unit, temperature in the rack and rack is outer, selecting corresponding control strategies, is that electronic equipment in the rack dispels the heat by control device control TEC air-conditioning unit, fan unit, ventilating blind.
A kind of control method is applied to cooling system, comprising:
Gather the temperature of PCM unit in the rack, the temperature that temperature in the rack and rack are outer;
According to control strategy and the temperature that collects TEC air-conditioning unit, fan unit, ventilating blind are controlled.
Further, TEC air-conditioning unit, fan unit, ventilating blind are controlled, being comprised according to control strategy and the temperature that collects:
According to control strategy, to the temperature of the PCM unit that collects, the outer temperature of temperature in the rack and rack compares;
According to the result of described comparison, control described TEC air-conditioning unit, described fan unit, described ventilating blind.
As seen from the above, by cooling system is installed in rack, control device is gathered temperature and the outer temperature of this rack in this PCM unit, this rack, according to control strategy and the temperature that collects this TEC air-conditioning unit, this fan unit, this ventilating blind are controlled, thereby can be dispelled the heat for the rack inner electronic equipment effectively.
Should be noted that at last: above specific embodiment is only in order to illustrate that technical scheme of the present invention is not intended to limit, although with reference to embodiment the present invention is had been described in detail, those of ordinary skill in the field are to be understood that: still can make amendment or the part technical characterictic is equal to replacement the specific embodiment of the present invention; And not breaking away from the spirit of technical solution of the present invention, it all should be encompassed in the middle of the scope that the present invention asks for protection.

Claims (14)

1, a kind of cooling system is characterized in that, described cooling system is located in the rack, and described cooling system comprises PCM unit, TEC air-conditioning unit, fan unit, ventilating blind and control device, and wherein, described PCM unit is arranged in the described rack; Described fan unit is located in the described rack; The position of described fan unit blowing or exhausting is provided with described ventilating blind; Described TEC air-conditioning unit is installed on the wall of described rack, described control device is installed in the described rack, wherein, described control device is used to gather temperature and the outer temperature of described rack in the temperature of described PCM unit, the described rack, according to control strategy and the temperature that collects described TEC air-conditioning unit, described fan unit, described ventilating blind is controlled.
2, cooling system according to claim 1 is characterized in that, described control device comprises signal gathering unit and signal processing unit;
Described signal gathering unit is used to gather temperature and the outer temperature of described rack in the temperature of described PCM unit, the described rack;
Described signal processing unit is used for according to control strategy and the temperature that collects described TEC air-conditioning unit, described fan unit, described ventilating blind being controlled.
3, cooling system according to claim 2 is characterized in that, described signal processing unit comprises receiver module, comparison module and control module;
Described receiver module is used to obtain temperature, the temperature in the rack and the outer temperature of rack of the PCM unit that described signal gathering unit collects;
Described comparison module is used for according to control strategy, and the temperature that described receiver module is received compares;
Described control module is used for controlling described TEC air-conditioning unit, described fan unit, described ventilating blind according to described comparison module result relatively.
4, cooling system according to claim 1 is characterized in that, described control strategy comprises:
During the minimum temperature that in the temperature in the described rack is lower than described rack, allows, described ventilating blind closure, described fan unit is not worked, and described TEC air-conditioning unit is not worked, described PCM unit accumulation of heat;
During the maximum temperature that allows in the temperature in the described rack is higher than described rack, described ventilating blind is opened, described fan unit work, described PCM unit cold-storage, perhaps described TEC air-conditioning unit work, described PCM unit cold-storage.
5, cooling system according to claim 4 is characterized in that, described control strategy also comprises:
The minimum temperature that in the temperature in the described rack is higher than described rack, allows and when being lower than the maximum temperature that allows in the described rack, described ventilating blind is opened, described fan unit work, described PCM unit cold-storage, perhaps described TEC air-conditioning unit work, described PCM unit cold-storage;
Or the minimum temperature that in the temperature in the described rack is higher than described rack, allows and when being lower than the maximum temperature of permission rack in, described ventilating blind closure, described fan unit is not worked, and described TEC air-conditioning unit is not worked, described PCM unit accumulation of heat.
6, a kind of rack, it is characterized in that, comprise electronic equipment and cooling system in the described rack, described cooling system is that described electronic equipment dispels the heat, described cooling system comprises PCM unit, TEC air-conditioning unit, fan unit, ventilating blind and control device, wherein, described PCM unit is arranged in the described rack; Described fan unit is located in the described rack; The position of described fan unit blowing or exhausting is provided with ventilating blind; Described TEC air-conditioning unit is installed on the wall of described rack, described control device is installed in the rack, described control device is used to gather temperature and the outer temperature of described rack in the temperature of described PCM unit, described rack, according to control strategy and the temperature that collects described TEC air-conditioning unit, described fan unit, described ventilating blind is controlled.
7, rack according to claim 6 is characterized in that, described control device comprises signal gathering unit and signal processing unit;
Described signal gathering unit is used to gather temperature and the outer temperature of described rack in the temperature of described PCM unit, the described rack;
Described signal processing unit is used for according to control strategy and the temperature that collects described TEC air-conditioning unit, described fan unit, described ventilating blind being controlled.
8, rack according to claim 7 is characterized in that, described signal processing unit comprises receiver module, comparison module and control module;
Described receiver module is used to obtain temperature, the temperature in the rack and the outer temperature of rack of the PCM unit that described signal gathering unit collects;
Described comparison module is used for according to control strategy, and the temperature that described receiver module is received compares;
Described control module is used for controlling described TEC air-conditioning unit, described fan unit, described ventilating blind according to described comparison module result relatively.
9, rack according to claim 6 is characterized in that, described control strategy comprises:
During the minimum temperature that in the temperature in the described rack is lower than described rack, allows, described ventilating blind closure, described fan unit is not worked, and described TEC air-conditioning unit is not worked, described PCM unit accumulation of heat;
During the maximum temperature that allows in the temperature in the described rack is higher than described rack, described ventilating blind is opened, described fan unit work, described PCM unit cold-storage, perhaps described TEC air-conditioning unit work, described PCM unit cold-storage.
10, rack according to claim 9 is characterized in that, described control strategy also comprises:
The minimum temperature that in the temperature in the described rack is higher than described rack, allows and when being lower than the maximum temperature that allows in the described rack, described ventilating blind is opened, described fan unit work, described PCM unit cold-storage, perhaps described TEC air-conditioning unit work, described PCM unit cold-storage;
Or the minimum temperature that in the temperature in the described rack is higher than described rack, allows and when being lower than the maximum temperature of permission rack in, described ventilating blind closure, described fan unit is not worked, and described TEC air-conditioning unit is not worked, described PCM unit accumulation of heat.
11, a kind of control method is applied to cooling system, it is characterized in that, described control method comprises:
Gather the temperature of PCM unit in the rack, the temperature that temperature in the rack and rack are outer;
According to control strategy and the temperature that collects TEC air-conditioning unit, fan unit, ventilating blind are controlled.
12, control method according to claim 11 is characterized in that, described TEC air-conditioning unit, fan unit, ventilating blind controls according to control strategy and the temperature that collects comprises:
According to control strategy, to the temperature of the PCM unit that collects, the outer temperature of temperature in the rack and rack compares;
According to the result of described comparison, control described TEC air-conditioning unit, described fan unit, described ventilating blind.
13, control method according to claim 11 is characterized in that, described control strategy comprises:
During the minimum temperature that in the temperature in the described rack is lower than described rack, allows, described ventilating blind closure, described fan unit is not worked, and described TEC air-conditioning unit is not worked, described PCM unit accumulation of heat;
During the maximum temperature that allows in the temperature in the described rack is higher than described rack, described ventilating blind is opened, described fan unit work, described PCM unit cold-storage; Perhaps described TEC air-conditioning unit work, described PCM unit cold-storage.
14, control method according to claim 12 is characterized in that, described control strategy also comprises:
The minimum temperature that in the temperature in the described rack is higher than described rack, allows and when being lower than the maximum temperature that allows in the described rack, described ventilating blind is opened, described fan unit work, described PCM unit cold-storage, perhaps described TEC air-conditioning unit work, described PCM unit cold-storage;
Or the minimum temperature that in the temperature in the described rack is higher than described rack, allows and when being lower than the maximum temperature of permission described rack in, described ventilating blind closure, described fan unit is not worked, and described TEC air-conditioning unit is not worked, described PCM unit accumulation of heat.
CNA2007101250536A 2007-12-14 2007-12-14 Heat radiating system, machine cabinet and control method Pending CN101460035A (en)

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CN102480897A (en) * 2010-11-25 2012-05-30 鸿富锦精密工业(深圳)有限公司 Server cabinet
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CN104181950A (en) * 2014-09-18 2014-12-03 国家电网公司 Electric power outdoor cabinet temperature control system and method
CN104675738A (en) * 2015-02-06 2015-06-03 烽火通信科技股份有限公司 Intelligent fan speed regulating system and method based on unified cabinet management
CN105388930A (en) * 2015-12-14 2016-03-09 广东电网有限责任公司惠州供电局 Substation back-to-back relay protection cabinet temperature control system
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CN107635377B (en) * 2016-07-18 2019-07-16 维谛技术有限公司 A kind of base station heat management system and thermal management algorithm
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WO2021248366A1 (en) * 2020-06-10 2021-12-16 华为数字能源技术有限公司 Heat dissipation system, battery module, and power supply and distribution system

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