CN101459041A - Updating method for fast heat treatment device - Google Patents
Updating method for fast heat treatment device Download PDFInfo
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- CN101459041A CN101459041A CNA2007100945345A CN200710094534A CN101459041A CN 101459041 A CN101459041 A CN 101459041A CN A2007100945345 A CNA2007100945345 A CN A2007100945345A CN 200710094534 A CN200710094534 A CN 200710094534A CN 101459041 A CN101459041 A CN 101459041A
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- fluorescent tube
- heat treatment
- treatment device
- fast heat
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Abstract
Disclosed is an updating method for a fast heat treating device, the steps comprise dividing a plurality of lamps in the fast heat treating device into a plurality of areas according to different heating temperatures, determining areas of which the rate of lamp consumption is relatively high, and changing all lamps in the areas of which the rate of lamp consumption is relatively high into new lamps when in equipment maintenance. The method avoids shut down problems caused by damaged lamps during machines are in operation, thereby reducing the maintenance time to shut down the machines, improving the utilization rate of the machines, reducing maintenance time of the machines, and increasing the period achieving rate of machine maintenance.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, particularly a kind of update method of fast heat treatment device.
Background technology
Rapid thermal treatment (Rapid thermal processing, RTP) be that wafer is heated rapidly to design temperature, carry out short time quick heat treatment method, heat treatment time is usually less than 1～2 minute, RTP equipment can rise to the temperature (600～1300 ℃) of technological requirement fast, and cooling fast, rising (falling) warm speed usually is 20～250 ℃/second.In the past few years, RTP becomes sophisticated semiconductor gradually and makes a requisite technology, is used for the formation and the rapid heat chemical deposition of oxidation, annealing, metal silicide.
RTP is rapidly heated, the ability of short time fast processing is very important, because the sophisticated semiconductor manufacturing requires shortening heat processing time, restriction diffusion of impurities degree as far as possible.Replace at a slow speed with RTP that Technology for Heating Processing can also shorten growth cycle greatly, therefore the RTP technology is valuable especially for the yield improvement stage.
There are multiple heating arrangement, thermal source and temperature-controlled process in the RTP system.At present, common in the world semiconductor fast heat treatment device is to adopt light radial pattern thermal source, wherein basically, utilizing many row's tungsten halogen lamps that wafer is heated is the most frequently used method, because the thermal source that it provides is easy to control, convenient, effective, firing rate is fast.In the RTP system, thermal source is directly faced wafer surface, rather than as the batch processing high temperature furnace Waffer edge is heated.Therefore, can not influence the uniformity and the warm speed of liter (falling) of PROCESS FOR TREATMENT during RTP system handles major diameter wafer.Usually, the RTP system also has the wafer spinfunction, makes the heat treatment uniformity better.
The description of the structure reference integrated circuit education network of light radiation heating N-type semiconductor N fast heat treatment device (http://www.icedu.net/Article/xinpian/semiequipment/200707/7108. html): constitute by two special-purpose light tube group up and down, general each light tube group all has tens of special-shaped fluorescent tubes (shape and number are different because of the size of producer and processing semiconductor wafer), by these two light tube group the semiconductor crystal wafer between being positioned at is wherein carried out Fast Heating and heat treatment.
Because this device is the area source that linear light source constitutes, and is in order to reach the uniform heating effect, very high to the coherence request of each fluorescent tube; When the brightness of fluorescent tube changed in time to some extent, equipment must be in time, detection by quantitative goes out difference exactly, and compensate immediately, otherwise the product quality of being produced can't guarantee.If the arbitrary fluorescent tube in two thermal source groups does not reach rated value in case power output occurs up and down, and the yet expendable situation of system regulation, alarm in time, shutdown maintenance and change spare part.Therefore, the reliability index of this thermal source relates to the reliability index of fluorescent tube and the total quantity of the interior fluorescent tube of thermal source group.
In the fast heat treatment device of existing employing fluorescent tube heating; fluorescent tube in the fast heat treatment device is divided into some different zones; in different zones; because the heating power difference of used fluorescent tube; therefore; the heating-up temperature of zones of different fluorescent tube also has nothing in common with each other; find in practice; the fluorescent tube in certain several zone often is damaged; be damaged the probability of bulb apparently higher than other zone; the method of prior art is after finding that fluorescent tube damages; only change the fluorescent tube that damages, still, adopt this replacing method; other fluorescent tube in the higher zone of these several bulb damage probabilities still constantly is damaged, and causes the shutdown of board; frequency of maintenance is very high.
Summary of the invention
In view of this, the technical problem that the present invention solves provides a kind of update method of fast heat treatment device, to reduce the probability that fluorescent tube is damaged in the light radiation heating N-type semiconductor N fast heat treatment device.
A kind of update method of fast heat treatment device comprises:
Some fluorescent tubes in the fast heat treatment device are divided into several regions according to the difference of heating-up temperature;
Determine to take place the higher zone of fluorescent tube loss probability;
When maintenance of equipment, all change the fluorescent tube that the higher zone of fluorescent tube loss probability takes place into new fluorescent tube.
Wherein, the heating-up temperature of described fluorescent tube is 600 to 1100 degrees centigrade.
The fluorescent tube heating-up temperature in the zone that described fluorescent tube loss probability is higher is 950 to 1100 degrees centigrade.
Described fast heat treatment device contains 187 fluorescent tubes, is divided into 12 zones, and the fluorescent tube heating-up temperature in the 7th, 11,12 zones is 950 to 1100 degrees centigrade, and all the other regional fluorescent tube heating-up temperatures are 700 to 950 degrees centigrade.The higher zone of determining of fluorescent tube loss probability is the 7th, 11,12 zones.
Wherein, the cycle of maintenance of equipment preferably, was 6 to 8 months greater than 6 months.
Described maintenance of equipment refers to owing to changing the maintenance of equipment that fluorescent tube carries out.
Compared with prior art, such scheme has the following advantages:
Adopt the update method of fast heat treatment device of the present invention; after determining to take place the higher zone of fluorescent tube loss probability; when maintenance of equipment; all change the fluorescent tube that the higher zone of fluorescent tube loss probability takes place into new fluorescent tube, avoided board to be in operation, reduced the time of board shutdown maintenance owing to fluorescent tube damages the shutdown event that takes place; promote the board utilance; and, reduced the board maintenance frequency, improved the cycle delivery rate of board maintenance.Because the fluorescent tube that the higher zone of described generation fluorescent tube loss probability is changed can also be used in other zone of board, the quantity of having saved fluorescent tube provides cost savings.
Description of drawings
Fig. 1 is the area dividing chart of the described some fluorescent tubes of the embodiment of the invention;
Fig. 2 is the process chart of the update method of embodiment of the invention fast heat treatment device.
Embodiment
The object of the present invention is to provide a kind of update method of fast heat treatment device, some regional fluorescent tube proportion of goods damaged is higher in the reduction prior art fast heat treatment device, causes board maintenance rate height, influences the defective of production efficiency.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
Embodiment
Present embodiment provides a kind of update method of fast heat treatment device, and the process chart shown in 2 with reference to the accompanying drawings comprises:
S1: the some fluorescent tubes in the fast heat treatment device are divided into several regions according to the difference of heating-up temperature;
S2: determine to take place the higher zone of fluorescent tube loss probability;
S3: when maintenance of equipment, all change the fluorescent tube that the higher zone of fluorescent tube loss probability takes place into new fluorescent tube.
The described fast heat treatment device of present embodiment refers to light radiation heating N-type semiconductor N fast heat treatment device, and described semiconductor fast heat treatment device comprises heating chamber, and the heating frame that is used to place fluorescent tube is installed in the described heating chamber, is positioned at the top of heating chamber; Be used to place wafer and guarantee that wafer passes in and out the installing rack of heating chamber, some fluorescent tubes evenly are installed on the heating frame, in the face of wafer heats.
Described fast heat treatment device adopts chlorination tungsten filament fluorescent tube as heated light sources, and described fluorescent tube is strip or circular or oval-shaped fluorescent tube, and in the present embodiment, described fast heat treatment device preferably adopts round lamp tube.Different fast heat treatment devices, the quantity of fluorescent tube is inequality, generally speaking, and the difference of Jia Re wafer size as required, the quantity difference of fluorescent tube does not wait from tens to hundreds of, and the size of wafer is big more, and the quantity of fluorescent tube is many more.Some fluorescent tubes conglobate plane of arranging on the heating frame of fast heat treatment device is faced with the wafer that will heat.
In described light radiation heating N-type semiconductor N fast heat treatment device, usually with described fluorescent tube of arranging artificial be divided into several regions, can divide according to the heating power of fluorescent tube or the heating-up temperature of fluorescent tube, generally, different fast heat treatment devices, the power of fluorescent tube and heating-up temperature have certain difference, and still, the heating-up temperature of common described fluorescent tube is all at 600 to 1100 degrees centigrade.Heating-up temperature according to described fluorescent tube is divided, and lower heating-up temperature is 600 to 950 degrees centigrade (not comprising 950 degrees centigrade), is 700 to 950 degrees centigrade (not comprising 950 degrees centigrade) preferably, normally 950 to 1100 degrees centigrade of higher heating-up temperatures.
In the present embodiment, a kind of fast heat treatment device has 187 fluorescent tubes, described 187 fluorescent tubes are divided into 12 zones according to the difference of heating-up temperature, 1st, the heating-up temperature in 2,3,4,5,6,8,9,10 zones is not 850 to 950 degrees centigrade (comprising 950 degrees centigrade), and the heating-up temperature in the 7th, 11,12 zones is 950 to 1100 degrees centigrade.
When adopting described light radiation heating N-type semiconductor N fast heat treatment device that wafer is carried out rapid thermal treatment, fluorescent tube is after heating a period of time, loss to a certain degree takes place in the capital, in different zones, the probability of fluorescent tube generation loss is different, experience according to practice, the probability that always has the fluorescent tube generation loss in a few zones is higher than other zone, after changing the fluorescent tube that damages, other fluorescent tube in these several zones can be damaged again, because the quantity and the temperature of the rapid temperature rise and drop performance of light radiation heating N-type semiconductor N fast heat treatment device and the fluorescent tube of heating are closely related, therefore, when the fluorescent tube loss takes place, must in time change fluorescent tube, the probability of maintenance of equipment is very high, and in the present embodiment, described maintenance of equipment refers to owing to fluorescent tube is changed the maintenance of equipment that causes.
Find in the practice, the fluorescent tube normally higher zone of heating-up temperature of fluorescent tube, the higher zone of probability that is damaged, generally speaking, the fluorescent tube heating-up temperature is easier to be damaged at 950 to 1100 degrees centigrade fluorescent tube ratio.
In the present embodiment, after putting into practice the higher zone of definite fluorescent tube loss probability, when maintenance of equipment, all change the fluorescent tube that the higher zone of fluorescent tube loss probability takes place into new fluorescent tube.Time-proven, adopt this method, the fluorescent tube loss took place in the fluorescent tube that can reduce greatly in the higher zone of these conventional fluorescent tube loss probabilities once more before maintenance of equipment next time, even can avoid taking place before maintenance of equipment next time the fluorescent tube loss fully.Usually, the interval of described twice maintenance of equipment preferably, was 6 to 8 months greater than 6 months.
Simultaneously, for the bulb in the higher zone of the loss probability of replacing, after wherein the bulb that has damaged abandoned, remaining bulb can be installed in other zones of fast heat treatment device, the lower zone of fluorescent tube loss probability of present embodiment definition just facts have proved, before maintenance of equipment next time, the old fluorescent tube of changing in the zone that the loss probability is higher is installed in the lower zone of loss probability, and the damage of fluorescent tube can't take place.
Below, again in conjunction with a specific embodiment more, the present invention is described.
As shown in Figure 1, a kind of fast heat treatment device for the present embodiment employing, the fluorescent tube that described fast heat treatment device adopts adopts the chlorination tungsten light source, in the reaction chamber of this equipment, the one side that faces toward the semiconductor device of rapid temperature rise and drop, the fluorescent tube one of heating usefulness has 187 on the heating frame, difference according to described fluorescent tube heating-up temperature, described 187 fluorescent tubes are divided into 12 zones, the concrete arrangement mode in described 12 zones is arranged according to the mode that is similar to donut, specifically as shown in Figure 1, in the accompanying drawing 1, be positioned at the fluorescent tube of first area with 1 circle representative, be positioned at the fluorescent tube of second area with 2 circle representative, ..., and the like, represent the fluorescent tube that is positioned at the No.12 District territory with 12 circle.
In these 12 zones, the quantity of the fluorescent tube that each is regional is different, and the first area is positioned at the middle of heating chamber, and one has 1 fluorescent tube, the fluorescent tube of second area be positioned at the first area fluorescent tube around, one has 6, the fluorescent tube in the 3rd zone be positioned at again the second area fluorescent tube around, be 12, go down successively, 18 altogether of four-range fluorescent tubes, 18 altogether of the fluorescent tubes in the 5th zone, 6 altogether of the fluorescent tubes in the 6th zone ... specifically as described in Table 1.
Table 1
| The zone | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |
| The fluorescent tube number | 1 | 6 | 12 | 18 | 18 | 6 | 24 | 12 | 24 | 18 | 24 | 24 |
In different zones, except the first area has only a fluorescent tube, remaining per two fluorescent tube in zone is 1 group, if have only a fluorescent tube to be damaged in one group, then it is generally acknowledged what this group fluorescent tube still can normally use, if two fluorescent tubes in a group all damage, think that then this group fluorescent tube can not continue to use, if two groups of fluorescent tubes be damaged (except the first area) are arranged in the zone, think that then this regional effect arrives the operation of Fast Heating equipment, must keep in repair, change the fluorescent tube that damages.In a single day 1 fluorescent tube of first area is damaged, and then must change.
Wherein, the heating-up temperature in the 1st, 2,3,4,5,6,8,9,10 zones is not 850 to 950 degrees centigrade (comprising 950 degrees centigrade), and the heating-up temperature in the 7th, 11,12 zones is 950 to 1100 degrees centigrade.
Find in the practice that before once keeping in repair, the fluorescent tube that is damaged all concentrates on the 7th, the 11st and the 12nd zone usually, in the prior art, cause a certain zone to work, the fluorescent tube that promptly direct replacing has damaged in case find the fluorescent tube damage.Yet, after the replacing, in the 7th, the 11st and the 12nd zone, still can be before maintenance next time, the situation that frequent generation fluorescent tube damages.Cause the significant wastage of fluorescent tube, and, cause the maintenance rate of equipment to increase, also increased Facilities Engineer's pressure.
In the present embodiment, in maintenance of equipment each time, adopt the described method of present embodiment, the fluorescent tube in the 7th, the 11st and the 12nd zone is all replaced with new fluorescent tube, then before maintenance of equipment next time, 7th, the 11st and the 12nd zone even no longer takes place because the fluorescent tube probability that causes equipment to work that is damaged reduces greatly.In the present embodiment, if carried out once large-scale maintenance of equipment in per 6 months, then the 7th, the 11st and the 12nd zone is because the fluorescent tube probability that causes Fast Heating equipment to work that is damaged is 0.Adopt the described method of present embodiment to replace after the fluorescent tube in the 7th, the 11st and the 12nd zone, the maintenance frequency of fast heat treatment device from reducing to individual month of 6-8 for 1 month 5-6 time once, is greatly reduced frequency of maintenance.Described maintenance refers to owing to fluorescent tube is changed the maintenance of equipment that causes.
In the present embodiment, the fluorescent tube in the 7th, the 11st and the 12nd zone that replaces, remove the fluorescent tube that has wherein broken down, remaining fluorescent tube can be installed in other zones except that the 7th, the 11st and the 12nd zone, before large-scale next time maintenance of equipment, also can fluorescent tube not being damaged causes Fast Heating equipment to work.Certainly, the fluorescent tube in the 7th, the 11st and the 12nd zone that replaces also can be as other purposes.
Adopt the described method of present embodiment, reduced the probability that fluorescent tube is damaged, improved the utilization ratio of equipment, reduced idle time of equipment, also reduced plant maintenance personnel's working strength.And, because the old fluorescent tube of changing in the 7th, the 11st and the 12nd zone can also be used in other zones of equipment, the whole conversion, the annual fluorescent tube sum that consumes of all fast heat treatment devices is less than the process of directly replacing the fluorescent tube that damages in the existing technology, for enterprise provides cost savings.
Though the present invention discloses as above with preferred embodiment, the present invention is defined in this.Any those skilled in the art without departing from the spirit and scope of the present invention, all can do various changes and modification, so protection scope of the present invention should be as the criterion with claim institute restricted portion.
Claims (8)
1. the update method of a fast heat treatment device is characterized in that, comprising: the some fluorescent tubes in the fast heat treatment device are divided into several regions according to the difference of heating-up temperature; Determine to take place the higher zone of fluorescent tube loss probability; When maintenance of equipment, change the fluorescent tube that the higher zone of fluorescent tube loss probability takes place into new fluorescent tube.
2. according to the update method of the described fast heat treatment device of claim 1, it is characterized in that the fluorescent tube heating-up temperature in the zone that fluorescent tube loss probability is higher is 950 to 1100 degrees centigrade.
3. according to the update method of the described fast heat treatment device of claim 1, it is characterized in that the heating-up temperature of described fluorescent tube is 600 to 1100 degrees centigrade.
4. according to the update method of the described fast heat treatment device of claim 1, it is characterized in that, described fluorescent tube is 187, be divided into 12 zones, 7th, the fluorescent tube heating-up temperature in 11,12 zones is 950 to 1100 degrees centigrade, and the fluorescent tube heating-up temperature in the 1st, 2,3,4,5,6,8,9,10 zones is 700 to 950 degrees centigrade.
5. according to the update method of the described fast heat treatment device of claim 4, it is characterized in that the higher zone of described generation fluorescent tube loss probability is the 7th, 11,12 zones.
6. according to the update method of the described fast heat treatment device of claim 1, it is characterized in that the cycle of described maintenance of equipment was greater than 6 months.
7. according to the update method of the described fast heat treatment device of claim 1, it is characterized in that the cycle of described maintenance of equipment is 6 months to 8 months.
8. according to the update method of the described fast heat treatment device of claim 1, it is characterized in that described maintenance of equipment refers to owing to changing the maintenance of equipment that fluorescent tube carries out.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100945345A CN101459041A (en) | 2007-12-13 | 2007-12-13 | Updating method for fast heat treatment device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100945345A CN101459041A (en) | 2007-12-13 | 2007-12-13 | Updating method for fast heat treatment device |
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| CN101459041A true CN101459041A (en) | 2009-06-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102484896A (en) * | 2009-08-21 | 2012-05-30 | Ap系统股份有限公司 | Heater block for a rapid thermal processing apparatus |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102484896A (en) * | 2009-08-21 | 2012-05-30 | Ap系统股份有限公司 | Heater block for a rapid thermal processing apparatus |
| CN102484896B (en) * | 2009-08-21 | 2014-06-25 | Ap系统股份有限公司 | Heater block for a rapid thermal processing apparatus |
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Open date: 20090617 |