CN101457003A - High/low temperature resistant polytetrafluroethylene base electromagnetic screen material and preparation method thereof - Google Patents
High/low temperature resistant polytetrafluroethylene base electromagnetic screen material and preparation method thereof Download PDFInfo
- Publication number
- CN101457003A CN101457003A CNA2009100952865A CN200910095286A CN101457003A CN 101457003 A CN101457003 A CN 101457003A CN A2009100952865 A CNA2009100952865 A CN A2009100952865A CN 200910095286 A CN200910095286 A CN 200910095286A CN 101457003 A CN101457003 A CN 101457003A
- Authority
- CN
- China
- Prior art keywords
- electro
- tetrafluoroethylene
- magnetic screen
- screen function
- organosilicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 75
- 229920001343 polytetrafluoroethylene Polymers 0.000 title abstract description 8
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 48
- 238000005245 sintering Methods 0.000 claims abstract description 33
- 238000002156 mixing Methods 0.000 claims abstract description 32
- 239000002994 raw material Substances 0.000 claims abstract description 30
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims description 66
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 53
- 239000000203 mixture Substances 0.000 claims description 37
- 239000000843 powder Substances 0.000 claims description 37
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 29
- 238000000465 moulding Methods 0.000 claims description 29
- 229910000889 permalloy Inorganic materials 0.000 claims description 23
- 206010013786 Dry skin Diseases 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 11
- 238000003756 stirring Methods 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 4
- 238000012986 modification Methods 0.000 abstract description 37
- 230000004048 modification Effects 0.000 abstract description 37
- 239000002131 composite material Substances 0.000 abstract description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 27
- 238000001914 filtration Methods 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Soft Magnetic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a high-and low-temperature resistant polytetrafluoroethylene-base electromagnetic shielding material and a preparation method thereof. The electromagnetic shielding material consists of a polytetrafluoroethylene composite material and electromagnetic shielding composite filler, wherein, the polytetrafluoroethylene composite material consists of a polytetrafluoroethylene raw material and a polytetrafluoroethylene recovered material, and the electromagnetic shielding composite filler refers to electromagnetic shielding filler after an organic silicon modification treatment. The preparation adopts the process of mechanical mixing, pre-press forming and high temperature sintering, with a pre-press forming pressure being 10-30MPa, a pressing time being 2-3min, and a sintering temperature being 320-380 DEG C. The process is simple and feasible, meanwhile, the polytetrafluoroethylene recovered material is partly used in the polytetrafluoroethylene composite material, thus lowering cost and being beneficial for the sustainable utilization of resources. The high-and low-temperature resistant polytetrafluoroethylene-base electromagnetic shielding material and the preparation method of the invention can be beneficial for industrial practical application.
Description
Technical field
The present invention relates to a kind of high/low temperature resistant polytetrafluroethylebase base electromagnetic screen material and preparation method thereof.
Background technology
Along with the development of modern high technology, the harm that hertzian wave causes is serious day by day.Hertzian wave not only causes electronic machine, equipment and disturbs and damage, and pollutes the environment harm humans health; The safety of electromagnetic-wave leakage entail dangers to national information safety and military vital strategic secrets in addition.Therefore the development of electromagnetic shielding material more and more is subject to people's attention with exploitation, and (publication number CN101265386) discloses " composite electromagnetic wave shielded coating and preparation method thereof " as Chinese patent.
Early stage electromangnetic spectrum mainly uses metal and matrix material thereof, though this class material has good shielding properties, its elasticity is low, and density is big, and is perishable, and cost an arm and a leg, and is difficult to regulate effectiveness of shielding, and regenerative power is poor.Polymer materials is used to make electromagnetic shielding material in recent years, and especially the composite electromagnetic shielding polymer materials is developed rapidly.Wherein the homodisperse of electro-magnetic screen function filler in polymeric matrix is a difficult point; Conventional polymer does not possess the performance of high-low temperature resistant simultaneously, and for some occasions that has distinct temperature to require, conventional polymer base composite electric magnetic shielding material can't use.
Polytetrafluoroethylmaterial material has good high and low temperature resistance, can in-100～350 ℃, stablize use for a long time, simultaneously tetrafluoroethylene has difficult oxidation, insoluble molten, excellent dielectric properties and self-lubricating property, makes it become the indispensable important materials of nearly all branch of industry based on industry such as chemistry, machineries.
Conventional electromagnetic shielding material can not be under low temperature or hot conditions long-time works better, and single polytetrafluoroethylmaterial material does not have electro-magnetic screen function, with the tetrafluoroethylene is matrix, add suitable electro-magnetic screen function filler, the matrix material that is processed into will have the dual-use function of electromagnetic shielding and high-low temperature resistant.
Summary of the invention
For solving the problem of above-mentioned existence, the object of the present invention is to provide a kind of high/low temperature resistant polytetrafluroethylebase base electromagnetic screen material and preparation method thereof.
The technical solution used in the present invention is:
1, a kind of high/low temperature resistant polytetrafluroethylebase base electromagnetic screen material:
This electromagnetic shielding material is made up of compound material of tetrafluoroethylene and electro-magnetic screen function compounded mix, being respectively by mass fraction of each raw material:
50～99 parts in the compound material of tetrafluoroethylene;
1～50 part of electro-magnetic screen function compounded mix.
The compound material of described tetrafluoroethylene is made up of tetrafluoroethylene virgin material and tetrafluoroethylene reclaimed materials, and both mass ratioes are 1:1; Described electro-magnetic screen function compounded mix is made up of electro-magnetic screen function filler and organosilicon, and the mass percent that organosilicon accounts for the electro-magnetic screen function filler is 1%～5%.
Described electro-magnetic screen function filler is nickel powder, iron powder or permalloy powder; The particle diameter of powder is 100～200nm.
Described organosilicon is tetramethoxy-silicane, vinyltrimethoxy silane, N-(β-aminoethyl)-γ-An Bingjisanjiayangjiguiwan or γ-(methacryloxypropyl) propyl trimethoxy silicane.
2, a kind of method for preparing high/low temperature resistant polytetrafluroethylebase base electromagnetic screen material:
1) with organosilicon hydrolyzation 3～6h, add the electro-magnetic screen function filler then, wherein to account for the mass percent of electro-magnetic screen function filler be 1%～5% to organosilicon, after the dispersed with stirring, filters, obtains surface modified electro-magnetic screen function compounded mix after the washing, 120 ℃ of dryings;
2) the compound material of tetrafluoroethylene is made up of tetrafluoroethylene virgin material and tetrafluoroethylene reclaimed materials, and both mass ratioes are 1:1;
3) with compound material of tetrafluoroethylene and electro-magnetic screen function compounded mix mechanically mixing, the mass fraction of two kinds of components is respectively: 50～99 parts in the compound material of tetrafluoroethylene, 1～50 part of electro-magnetic screen function filler; After mixing, pre-molding, pressure are 10～30MPa, and the press time is 2～3min;
4) sample after being pressed is heated up sintering, sintering temperature is 320～380 ℃.
The present invention compared with prior art, the useful effect that has is:
With the tetrafluoroethylene is matrix, adds suitable electro-magnetic screen function filler, and the matrix material that is processed into will have the dual-use function of electromagnetic shielding and high-low temperature resistant.Owing to adopt the surface modified electro-magnetic screen function filler of organosilicon, the better electro-magnetic screen function filler that must solve disperses uneven problem in poly tetrafluoro ethylene matrix, improved the dispersing property of electro-magnetic screen function filler, adopting tetrafluoroethylene simultaneously is body material, make matrix material have good high and low temperature resistance, erosion resistance.Wherein the tetrafluoroethylene base-material has used 50% tetrafluoroethylene recovery waste material, can reduce cost, and helps Sustainable utilization of resources.The present invention helps industrial practical application.
Embodiment
Embodiment 1:
1), the electro-magnetic screen function filler is modified with the organosilicon surface modification: electro-magnetic screen function filler and organosilicon quality proportioning according to 99:1.The electro-magnetic screen function filler that present embodiment adopts is a nickel powder; The organosilicon that adopts is γ-(methacryloxypropyl) propyl trimethoxy silicane.With organosilicon hydrolyzation 5h, add nickel powder then earlier, the nickel powder particle diameter is 100～200nm, after the dispersed with stirring, obtains surface modified nickel powder after filtration, washing, 120 ℃ of dryings;
2), the composition of each raw material (umber) is: 99 parts in the compound material of tetrafluoroethylene, 1 part of modification nickel powder;
3), the compound mechanically mixing is even, pre-molding pressure is 24MPa, the press time is 2～3min.380 ℃ of sintering temperatures.
Embodiment 2:
1), identical with embodiment 1;
2), the composition of each raw material (umber) is: 90 parts in the compound material of tetrafluoroethylene, 10 parts of modification nickel powders;
3), 3), the compound mechanically mixing is even, pre-molding pressure is 30MPa, the press time is 2～3min.350 ℃ of sintering temperatures.
Embodiment 3
1), identical with embodiment 1;
2), the composition of each raw material (umber) is: 50 parts in the compound material of tetrafluoroethylene, 50 parts of modification nickel powders
3), the compound mechanically mixing is even, pre-molding pressure is 10MPa, the press time is 2～3min.320 ℃ of sintering temperatures.
Embodiment 4:
1), the electro-magnetic screen function filler is modified with the organosilicon surface modification: electro-magnetic screen function filler and organosilicon quality proportioning according to 97:3.The electro-magnetic screen function filler that present embodiment adopts is a nickel powder; The organosilicon that adopts is γ-(methacryloxypropyl) propyl trimethoxy silicane.With organosilicon hydrolyzation 5h, add nickel powder then earlier, the nickel powder particle diameter is 100～200nm, after the dispersed with stirring, obtains surface modified nickel powder after filtration, washing, 120 ℃ of dryings;
2), the composition of each raw material (umber) is: 99 parts in the compound material of tetrafluoroethylene, 1 part of modification nickel powder;
3), the compound mechanically mixing is even, pre-molding pressure is 24MPa, the press time is 2～3min.380 ℃ of sintering temperatures.
Embodiment 5:
1), identical with embodiment 4;
2), the composition of each raw material (umber) is: 90 parts in the compound material of tetrafluoroethylene, 10 parts of modification nickel powders;
3), 3), the compound mechanically mixing is even, pre-molding pressure is 30MPa, the press time is 2～3min.350 ℃ of sintering temperatures.
Embodiment 6:
1), identical with embodiment 4;
2), the composition of each raw material (umber) is: 50 parts in the compound material of tetrafluoroethylene, 50 parts of modification nickel powders
3), the compound mechanically mixing is even, pre-molding pressure is 10MPa, the press time is 2～3min.320 ℃ of sintering temperatures.
Embodiment 7:
1), the electro-magnetic screen function filler is modified with the organosilicon surface modification: electro-magnetic screen function filler and organosilicon quality proportioning according to 95:5.The electro-magnetic screen function filler that present embodiment adopts is a nickel powder; The organosilicon that adopts is γ-(methacryloxypropyl) propyl trimethoxy silicane.With organosilicon hydrolyzation 5h, add nickel powder then earlier, the nickel powder particle diameter is 100～200nm, after the dispersed with stirring, obtains surface modified nickel powder after filtration, washing, 120 ℃ of dryings;
2), the composition of each raw material (umber) is: 99 parts in the compound material of tetrafluoroethylene, 1 part of modification nickel powder;
3), the compound mechanically mixing is even, pre-molding pressure is 24MPa, the press time is 2～3min.380 ℃ of sintering temperatures.
Embodiment 8:
1), identical with embodiment 7;
2), the composition of each raw material (umber) is: 90 parts in the compound material of tetrafluoroethylene, 10 parts of modification nickel powders;
3), 3), the compound mechanically mixing is even, pre-molding pressure is 30MPa, the press time is 2～3min.350 ℃ of sintering temperatures.
Embodiment 9:
1), identical with embodiment 1;
2), the composition of each raw material (umber) is: 50 parts in the compound material of tetrafluoroethylene, 50 parts of modification nickel powders
3), the compound mechanically mixing is even, pre-molding pressure is 10MPa, the press time is 2～3min.320 ℃ of sintering temperatures.
Embodiment 10:
1), the electro-magnetic screen function filler is modified with the organosilicon surface modification: electro-magnetic screen function filler and organosilicon quality proportioning according to 99:1.The electro-magnetic screen function filler that present embodiment adopts is an iron powder; The organosilicon that adopts is a vinyltrimethoxy silane, earlier with organosilicon hydrolyzation 6h, adds iron powder then, and the iron powder particle diameter is 100～200nm, after the dispersed with stirring, obtains surface modified iron powder after filtration, washing, 120 ℃ of dryings;
2), the composition of each raw material (umber) is: 99 parts in the compound material of tetrafluoroethylene, 1 part of modification iron powder;
3), the compound mechanically mixing is even, pre-molding pressure is 24MPa, the press time is 2～3min.380 ℃ of sintering temperatures.
Embodiment 11:
1), identical with embodiment 10;
2), the composition of each raw material (umber) is: 80 parts in the compound material of tetrafluoroethylene, 20 parts of modification iron powders;
3), the compound mechanically mixing is even, pre-molding pressure is 20MPa, the press time is 2～3min.350 ℃ of sintering temperatures.
Embodiment 12:
1), identical with embodiment 10;
2), the composition of each raw material (umber) is: 50 parts in the compound material of tetrafluoroethylene, 50 parts of modification iron powders;
3), the compound mechanically mixing is even, pre-molding pressure is 30MPa, the press time is 2～3min.320 ℃ of sintering temperatures.
Embodiment 13:
1), the electro-magnetic screen function filler is modified with the organosilicon surface modification: electro-magnetic screen function filler and organosilicon quality proportioning according to 97:3.The electro-magnetic screen function filler that present embodiment adopts is an iron powder; The organosilicon that adopts is a tetramethoxy-silicane, earlier with organosilicon hydrolyzation 6h, adds iron powder then, and the iron powder particle diameter is 100～200nm, after the dispersed with stirring, obtains surface modified iron powder after filtration, washing, 120 ℃ of dryings;
2), the composition of each raw material (umber) is: 99 parts in the compound material of tetrafluoroethylene, 1 part of modification iron powder;
3), the compound mechanically mixing is even, pre-molding pressure is 16MPa, the press time is 2～3min.380 ℃ of sintering temperatures.
Embodiment 14:
1), identical with embodiment 13;
2), the composition of each raw material (umber) is: 80 parts in the compound material of tetrafluoroethylene, 20 parts of modification iron powders;
3), the compound mechanically mixing is even, pre-molding pressure is 20MPa, the press time is 2～3min.350 ℃ of sintering temperatures.
Embodiment 15:
1), identical with embodiment 13;
2), the composition of each raw material (umber) is: 50 parts in the compound material of tetrafluoroethylene, 50 parts of modification iron powders;
3), the compound mechanically mixing is even, pre-molding pressure is 30MPa, the press time is 2～3min.320 ℃ of sintering temperatures.
Embodiment 16:
1), the electro-magnetic screen function filler is modified with the organosilicon surface modification: electro-magnetic screen function filler and organosilicon quality proportioning according to 95:5.The electro-magnetic screen function filler that present embodiment adopts is an iron powder; The organosilicon that adopts is N-(β-aminoethyl)-γ-An Bingjisanjiayangjiguiwan, with organosilicon hydrolyzation 6h, add iron powder then earlier, the iron powder particle diameter is 100～200nm, after the dispersed with stirring, obtain surface modified iron powder after filtration, washing, 120 ℃ of dryings;
2), the composition of each raw material (umber) is: 99 parts in the compound material of tetrafluoroethylene, 1 part of modification iron powder;
3), the compound mechanically mixing is even, pre-molding pressure is 10MPa, the press time is 2～3min.380 ℃ of sintering temperatures.
Embodiment 17:
1), identical with embodiment 16;
2), the composition of each raw material (umber) is: 70 parts in the compound material of tetrafluoroethylene, 30 parts of modification iron powders;
3), the compound mechanically mixing is even, pre-molding pressure is 20MPa, the press time is 2～3min.350 ℃ of sintering temperatures.
Embodiment 18:
1), identical with embodiment 16;
2), the composition of each raw material (umber) is: 50 parts in the compound material of tetrafluoroethylene, 50 parts of modification iron powders;
3), the compound mechanically mixing is even, pre-molding pressure is 30MPa, the press time is 2～3min.320 ℃ of sintering temperatures.
Embodiment 19:
1), the electro-magnetic screen function filler is modified with the organosilicon surface modification: electro-magnetic screen function filler and organosilicon quality proportioning according to 99:1.The electro-magnetic screen function filler that present embodiment adopts is the permalloy powder; The organosilicon that adopts is a vinyltrimethoxy silane, with organosilicon hydrolyzation 6h, add the permalloy powder then earlier, the permalloy powder directly is 100～200nm, after the dispersed with stirring, obtain surface modified permalloy powder after filtration, washing, 120 ℃ of dryings;
2), the composition of each raw material (umber) is: 1 part in the permalloy powder of 99 parts in the compound material of tetrafluoroethylene, modification;
3), the compound mechanically mixing is even, pre-molding pressure is 24MPa, the press time is 2～3min.380 ℃ of sintering temperatures.
Embodiment 20:
1), identical with embodiment 19;
2), the composition of each raw material (umber) is: 20 parts in the permalloy powder of 80 parts in the compound material of tetrafluoroethylene, modification;
3), the compound mechanically mixing is even, pre-molding pressure is 20MPa, the press time is 2～3min.350 ℃ of sintering temperatures.
Embodiment 21:
1), identical with embodiment 19;
2), the composition of each raw material (umber) is: 50 parts in the permalloy powder of 50 parts in the compound material of tetrafluoroethylene, modification;
3), the compound mechanically mixing is even, pre-molding pressure is 30MPa, the press time is 2～3min.320 ℃ of sintering temperatures.
Embodiment 22:
1), the electro-magnetic screen function filler is modified with the organosilicon surface modification: electro-magnetic screen function filler and organosilicon quality proportioning according to 97:3.The electro-magnetic screen function filler that present embodiment adopts is the permalloy powder; The organosilicon that adopts is a tetramethoxy-silicane, earlier with organosilicon hydrolyzation 6h, adds the permalloy powder then, and the permalloy powder is 100～200nm directly, after the dispersed with stirring, obtains surface modified permalloy powder after filtration, washing, 120 ℃ of dryings;
2), the composition of each raw material (umber) is: 1 part in the permalloy powder of 99 parts in the compound material of tetrafluoroethylene, modification;
3), the compound mechanically mixing is even, pre-molding pressure is 16MPa, the press time is 2～3min.380 ℃ of sintering temperatures.
Embodiment 23:
1), identical with embodiment 22;
2), the composition of each raw material (umber) is: 20 parts in the permalloy powder of 80 parts in the compound material of tetrafluoroethylene, modification;
3), the compound mechanically mixing is even, pre-molding pressure is 20MPa, the press time is 2～3min.350 ℃ of sintering temperatures.
Embodiment 24:
1), identical with embodiment 22;
2), the composition of each raw material (umber) is: 50 parts in the permalloy powder of 50 parts in the compound material of tetrafluoroethylene, modification;
3), the compound mechanically mixing is even, pre-molding pressure is 30MPa, the press time is 2～3min.320 ℃ of sintering temperatures.
Embodiment 25:
1), the electro-magnetic screen function filler is modified with the organosilicon surface modification: electro-magnetic screen function filler and organosilicon quality proportioning according to 95:5.The electro-magnetic screen function filler that present embodiment adopts is the permalloy powder; The organosilicon that adopts is N-(β-aminoethyl)-γ-An Bingjisanjiayangjiguiwan, with organosilicon hydrolyzation 6h, add the permalloy powder then earlier, the permalloy powder directly is 100～200nm, after the dispersed with stirring, obtain surface modified permalloy powder after filtration, washing, 120 ℃ of dryings;
2), the composition of each raw material (umber) is: 1 part in the permalloy powder of 99 parts in the compound material of tetrafluoroethylene, modification;
3), the compound mechanically mixing is even, pre-molding pressure is 10MPa, the press time is 2～3min.380 ℃ of sintering temperatures.
Embodiment 26:
1), identical with embodiment 25;
2), the composition of each raw material (umber) is: 30 parts in the permalloy powder of 70 parts in the compound material of tetrafluoroethylene, modification;
3), the compound mechanically mixing is even, pre-molding pressure is 20MPa, the press time is 2～3min.350 ℃ of sintering temperatures.
Embodiment 27:
1), identical with embodiment 25;
2), the composition of each raw material (umber) is: 50 parts in the permalloy powder of 50 parts in the compound material of tetrafluoroethylene, modification;
3), the compound mechanically mixing is even, pre-molding pressure is 30MPa, the press time is 2～3min.320 ℃ of sintering temperatures.
Claims (5)
1, a kind of high/low temperature resistant polytetrafluroethylebase base electromagnetic screen material is characterized in that this electromagnetic shielding material is made up of compound material of tetrafluoroethylene and electro-magnetic screen function compounded mix, being respectively by mass fraction of each raw material:
50～99 parts in the compound material of tetrafluoroethylene;
1～50 part of electro-magnetic screen function compounded mix.
2, a kind of high/low temperature resistant polytetrafluroethylebase base electromagnetic screen material according to claim 1 is characterized in that: the compound material of described tetrafluoroethylene is made up of tetrafluoroethylene virgin material and tetrafluoroethylene reclaimed materials, and both mass ratioes are 1:1; Described electro-magnetic screen function compounded mix is made up of electro-magnetic screen function filler and organosilicon, and the mass percent that organosilicon accounts for the electro-magnetic screen function filler is 1%～5%.
3, a kind of high/low temperature resistant polytetrafluroethylebase base electromagnetic screen material according to claim 1 is characterized in that: described electro-magnetic screen function filler is nickel powder, iron powder or permalloy powder; The particle diameter of powder is 100～200nm.
4, a kind of high/low temperature resistant polytetrafluroethylebase base electromagnetic screen material according to claim 1 is characterized in that: described organosilicon is tetramethoxy-silicane, vinyltrimethoxy silane, N-(β-aminoethyl)-γ-An Bingjisanjiayangjiguiwan or γ-(methacryloxypropyl) propyl trimethoxy silicane.
5, a kind of method for preparing the described a kind of high/low temperature resistant polytetrafluroethylebase base electromagnetic screen material of claim 1 is characterized in that:
1) with organosilicon hydrolyzation 3～6h, add the electro-magnetic screen function filler then, wherein to account for the mass percent of electro-magnetic screen function filler be 1%～5% to organosilicon, after the dispersed with stirring, filters, obtains surface modified electro-magnetic screen function compounded mix after the washing, 120 ℃ of dryings;
2) the compound material of tetrafluoroethylene is made up of tetrafluoroethylene virgin material and tetrafluoroethylene reclaimed materials, and both mass ratioes are 1:1;
3) with compound material of tetrafluoroethylene and electro-magnetic screen function compounded mix mechanically mixing, the mass fraction of two kinds of components is respectively: 50～99 parts in the compound material of tetrafluoroethylene, 1～50 part of electro-magnetic screen function filler; After mixing, pre-molding, pressure are 10～30MPa, and the press time is 2～3min;
4) sample after being pressed is heated up sintering, sintering temperature is 320～380 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100952865A CN101457003A (en) | 2009-01-08 | 2009-01-08 | High/low temperature resistant polytetrafluroethylene base electromagnetic screen material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100952865A CN101457003A (en) | 2009-01-08 | 2009-01-08 | High/low temperature resistant polytetrafluroethylene base electromagnetic screen material and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101457003A true CN101457003A (en) | 2009-06-17 |
Family
ID=40768138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009100952865A Pending CN101457003A (en) | 2009-01-08 | 2009-01-08 | High/low temperature resistant polytetrafluroethylene base electromagnetic screen material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101457003A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106716545A (en) * | 2014-08-01 | 2017-05-24 | 玛丽安娜·尤哈斯内·莫尔纳 | Shielding device to reduce the impact of electromagnetic radiation |
| CN109849477A (en) * | 2019-02-22 | 2019-06-07 | 昆山华阳新材料股份有限公司 | Composite material with electro-magnetic screen function |
| CN114713817A (en) * | 2022-02-17 | 2022-07-08 | 苏州创浩新材料科技有限公司 | Electromagnetic shielding iron-based composite material and preparation method thereof |
-
2009
- 2009-01-08 CN CNA2009100952865A patent/CN101457003A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106716545A (en) * | 2014-08-01 | 2017-05-24 | 玛丽安娜·尤哈斯内·莫尔纳 | Shielding device to reduce the impact of electromagnetic radiation |
| CN106716545B (en) * | 2014-08-01 | 2019-07-02 | 玛丽安娜·尤哈斯内·莫尔纳 | Reduce the screening arrangement of electromagnetic radiation |
| CN109849477A (en) * | 2019-02-22 | 2019-06-07 | 昆山华阳新材料股份有限公司 | Composite material with electro-magnetic screen function |
| CN114713817A (en) * | 2022-02-17 | 2022-07-08 | 苏州创浩新材料科技有限公司 | Electromagnetic shielding iron-based composite material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103602072A (en) | Conductive silicone rubber with electromagnetic shielding performance and manufacturing method | |
| CN102329560A (en) | Novel electromagnetic shielding paint for surface of silicone rubber | |
| CN106448988A (en) | Ferrite-neodymium iron boron composite injection molding granular material and preparation method thereof | |
| CN105177745A (en) | Novel electromagnetic shielding nanocarbon conductive fibrous material and preparation method thereof | |
| CN105219346A (en) | Bio-based carried by nano carbon fiber vectolite absorbing material and preparation method thereof | |
| CN105385100A (en) | Graphene-modified phenolic molding material and preparation method thereof | |
| CN101974283A (en) | Epoxy resin coating with electromagnetic shielding performance and preparation method thereof | |
| CN101085842A (en) | Method for preparing electromagnetic shielding plastic master batch and composite plastic | |
| CN102653622A (en) | Preparation method of high-dielectric-constant ceramics/polymer-based composite dielectric materials | |
| CN106930100A (en) | A kind of preparation method of polyimides/graphene oxide complex fiber material | |
| CN104098290A (en) | Preparation technology for microwave composite dielectric substrate by adopting ball-shaped ceramic powder as filling materials | |
| CN101457003A (en) | High/low temperature resistant polytetrafluroethylene base electromagnetic screen material and preparation method thereof | |
| CN102745994B (en) | Silicon carbide-carbon composite material and preparation method thereof | |
| CN108962425A (en) | A kind of preparation method of graphene conductive slurry | |
| CN103788551A (en) | Polytetrafluoroethylene composite material and preparation method thereof | |
| CN101265386A (en) | Composite type electromagnetic wave shielding paint and method for preparing same | |
| CN110105761A (en) | Graphene/polyphenylene sulfide electromagnetic shielding composite material and preparation method thereof | |
| CN109971123A (en) | A kind of preparation method of epoxy-boron nitride composite | |
| CN105154770A (en) | Phenolic resin reinforcement iron-based composite material and preparation method thereof | |
| CN104558777B (en) | Preparation method of natural graphite/polymer electromagnetic shielding composite | |
| CN100516136C (en) | Nanomter conducting composite polyester/graphite material and its preparation | |
| CN106832522B (en) | A kind of electromagnetic shielding composite material and preparation method thereof with orientation isolation structure | |
| CN110218409B (en) | Preparation method of polyacrylonitrile electromagnetic shielding film | |
| CN111002674B (en) | Composite electromagnetic shielding material and preparation method thereof | |
| CN102181250A (en) | Carbon black conductive adhesive and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090617 |