CN101452915A - Multi-system module having functional carrier plate - Google Patents
Multi-system module having functional carrier plate Download PDFInfo
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- CN101452915A CN101452915A CNA2007101871940A CN200710187194A CN101452915A CN 101452915 A CN101452915 A CN 101452915A CN A2007101871940 A CNA2007101871940 A CN A2007101871940A CN 200710187194 A CN200710187194 A CN 200710187194A CN 101452915 A CN101452915 A CN 101452915A
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- circuit unit
- system module
- support plate
- carrier plate
- control circuit
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Abstract
The invention provides a multisystem module with a functional support plate, which is characterized in that the multisystem module comprises a support plate which comprises at least one control circuit unit inside, as well as a plurality of main circuit units which are arranged on one side of the support plate, wherein the main circuit units are electrically connected with the control circuit unit; and therefore, the control circuit unit is used for managing the operation of the main circuit units. Due to the modular structure, the support plate can further improve multisystem control function.
Description
Technical field
The present invention relates to a kind of multi-system module of tool functional carrier plate, relate in particular to a kind of multi-system module that control circuit unit is integrated in support plate.
Background technology
Along with the manufacture of semiconductor technical capability constantly upwards promotes, in order to be applicable to the characteristic of mobile device body high spatial density, the demand of each module not only will be kept high-effect and stabilized quality; How to dwindle the module space but still possess high-quality characteristic, even promote better data transmission efficiency, just become the important topic of each manufacturer.
Semiconductor packages mainly provides a media, silicon is connected on the printed circuit board (PCB), and protection device avoids making moist.These years, though this function does not change, encapsulation technology is far beyond complicated in the past.Because the performance of chip makes moderate progress, the responsibility that the heat that is produced will be excluded is safely also undertaken in encapsulation, and allows these heats can not become the limiting factor of this parts Electronic Performance.
And the most application module of prior art is still the main support plate that is used as module with the substrate of unlike materials such as printed circuit board (PCB) (PCB), epoxy resin (FR-4) substrate or BT substrate.Parts such as all chips, assembly are attached to the surface of support plate again by surface mount technology piece modes such as (SMT).So just in order to form the usefulness of circuit connection when carrier, structure wherein is also just in order to the hierarchy as circuit cabling layout purely for support plate.
With the radio system module is example, and for towards multi-functional development, often wireless network (WLAN) can be integrated bluetooth (Bluetooth) or satellite navigation systems such as (GPS) simultaneously.But, relatively under chip, the assembly of required use also just become many, and, then will certainly increase the volume size of whole module if each other part of these circuit all is attached on the support plate.Simultaneously, input and output pin number order also can increase along with the increase of number of systems, to among limited support plate area, put into all signal input and output pin positions, just also just increase the degree of difficulty of designer when design greatly, usually all be to delete that input/output interface is to reduce pin number or to use expensive little pitch packages processing procedure, so that the module compatibility is reduced and cost up.
Summary of the invention
Main purpose of the present invention is to provide a kind of multi-system module of tool functional carrier plate, control circuit unit is integrated among the support plate, to reach the purpose of the volume size that effectively dwindles whole module.
In order to realize above-mentioned purpose, the invention provides a kind of multi-system module of tool functional carrier plate, it is characterized in that: a support plate, this support plate inside comprises at least one control circuit unit; And several main circuit unit, it is arranged at a side of this support plate, and wherein this main circuit unit is electrically connected at this control circuit unit; For this reason, this control circuit unit is in order to manage the running of these main circuit unit.
The present invention has following useful effect: the multi-system module of the tool functional carrier plate that the present invention proposes, use the control circuit unit that has the function of control circuit in the support plate, can manage and control for one or more systems in the module, so multi-system module proposed by the invention can the more effective control of carrying out multisystem.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the schematic diagram of the multi-system module of tool functional carrier plate of the present invention;
Fig. 2 A is the schematic diagram of multi-system module first embodiment of tool functional carrier plate of the present invention;
Fig. 2 B is the schematic diagram of multi-system module second embodiment of tool functional carrier plate of the present invention.
Wherein, Reference numeral
1 support plate
2 control circuit unit
201 electric power management circuits
2010 external control signals
2011 input power supplys
202 interface conversion circuits
2020 external interface controlling signal
2021 input/output interfaces
203 memory storage circuit
204 frenquency signal circuit
3 main circuit unit
301 wireless network circuit unit
The input power supply of 3010 wireless network circuit unit
3011 SDIO interfaces
3012 I2C interfaces
3013 UART interfaces
302 satellite navigation circuit units
The input power supply of 3020 satellite navigation circuit units
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
Please refer to Fig. 1, be the schematic perspective view of the multi-system module of tool functional carrier plate of the present invention.As shown in the figure, the invention provides a kind of multi-system module of tool functional carrier plate, it comprises: a support plate 1, at least one control circuit unit 2 and several main circuit unit 3.Wherein, this support plate 1 can be a silicon; And this control circuit unit 2 is to be integrated in silicon support plate 1 inside by semiconductor processing procedure mode, these main circuit unit 3 then are the surfaces that for example is attached to silicon support plate 1 with surface mount technology (SMT) mode piece, and electrically connect the control circuit unit 2 that has been integrated in the silicon support plate 1, to carry out signal transmission each other, by the running of the one or more main circuit unit 3 of these control circuit unit 2 management.
And above-mentioned control circuit unit 2 is except can be as electric power management circuit 201, interface conversion circuit 202, memory storage circuit 203 and the frequency signal circuit 204 of being given an example among Fig. 1, more impedance matching circuit, filter-capacitor circuit, voltage conversion circuit and antenna phase change-over circuit etc. can for example be arranged, but not exceed with above-mentioned.
Be connected and the running relation with the actual of these main circuit unit 3 in order to further specify control circuit unit 2.Please refer to Fig. 2 A, these main circuit unit 3 can be a wireless network circuit unit 301 and a satellite navigation circuit unit 302.As shown in the figure, when the electric power management circuit 201 in the control circuit unit 2 desires to provide power supply in this wireless network circuit unit 301 and satellite navigation circuit unit 302, present embodiment is that the input power supply 3020 in input power supply in the wireless network circuit unit 301 3010 and the satellite navigation circuit unit 302 is connected to electric power management circuit 201, control the input electric source modes that offers wireless network circuit unit 301 and satellite navigation circuit unit 302 by external control signal 2010, as normal mode, battery saving mode, " shut " mode" etc., to reach the highest power utilization efficient, and, therefore can reduce pin count because the single input power supply 2011 of 201 need of electric power management circuit can provide a plurality of main circuit unit 3 required power supply.That is this electric power management circuit 201 can be in order to control an external signal (for example above-mentioned input power supply), and with the demand of this external signal according to different main circuit unit 3, the signal of output different mode is to control these main circuit unit 3 respectively.
What please refer to Fig. 2 B and be interface conversion circuit 202 and wireless network circuit unit 301 is connected the framework calcspar.As shown in the figure, present embodiment is that the SDIO interface 3011 in the wireless network circuit unit 301, I2C interface 3012 are connected to interface conversion circuit 202 with UART interface 3013, select to be connected to outside input/output interface 2021 by external interface control signal 2020, to reduce output input pin figure place.That is when these main circuit unit 3 output several interface signals (for example above-mentioned SDIO interface signal or I2C interface signal etc.), these interface signals can be by these control circuit unit 2 output single face signals, with the number of effective minimizing splicing ear.
And be Module Design in response to the different application field, the kind of control circuit is not limited to above-mentioned circuit, and can select one kind of or more than one different circuit to do Application Design.In addition, the kind difference of control circuit is not to be used for limiting application range of the present invention yet.
And owing to the present invention has been integrated in control circuit unit 2 in the silicon support plate 1 in the mode of manufacture of semiconductor earlier, therefore aspect the wiring that carries out between main circuit unit 3 and the control circuit unit 2, can for example pass through circuit rerouting technology (Redistribution Layer, RDL) carry out the wiring design, will be attached to the main circuit unit 3 and the mode that is integrated in the input and output position of control circuit unit 2 by adjusting assembly in the silicon support plate 1 on the silicon support plate 1, be connected with circuit between the control circuit unit 2 to finish main circuit unit 3, and signal quality between the lifting subassembly and stability.
Subsidiary one carry be, above-mentioned mentioned manufacture of semiconductor mode, can for example be to begin to repeat through a succession of fabrication steps, comprise that steps such as optics developments, quick high-temp processing procedure, chemical vapour deposition (CVD), ion implantation and etching come storehouse to form the functional silicon support plate 1 with circuit used herein by silicon wafer.
In sum, the present invention has following all advantages:
1, the circuit characteristic of hoisting module: quite close by the invention enables control circuit unit to be able in design with main circuit unit, therefore can prevent long signal attenuation during apart from cabling, and the circuit characteristic of hoisting module significantly.
2, reduce the module temperature: because the silicon support plate has good thermal conduction characteristic, the therefore temperature that can effectively reduce whole module and produced as carrier by the silicon support plate.
3, reduce cost: owing to part or whole control circuit unit are integrated among the silicon support plate, and the silicon support plate is to have bigger areal extent comparatively speaking, therefore need not use the process technique of higher-order, and all control circuit unit use identical lower-order processing procedure (as: 0.5 micron system) all to realize in the silicon support plate, so can save cost significantly.
4, reduce output input pin bits number: but because functional carrier plate integrated interface change-over circuit and electric power management circuit, a plurality of interfaces can be integrated into an external interface, and only need single power supply input, can reduce the pin number order of module and not sacrifice interface compatibility, and can use the encapsulation technology of lower cost.
5, promote power-efficient: but because functional carrier plate integrating power supply management circuit can provide the power supply unification of a plurality of systems and manage, can reduce the loss of static working current (Quiescent current).
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (9)
1, a kind of multi-system module of tool functional carrier plate is characterized in that, comprising:
One support plate, this support plate inside comprises at least one control circuit unit; And
Several main circuit unit, it is arranged at a side of this support plate, and wherein this main circuit unit electrically connects this control circuit unit;
For this reason, this control circuit unit is in order to manage the running of these main circuit unit.
2, the multi-system module of tool functional carrier plate according to claim 1 is characterized in that, this support plate is a silicon support plate.
3, the multi-system module of tool functional carrier plate according to claim 1, it is characterized in that this control circuit unit is one of them or a more than one circuit of electric power management circuit, interface conversion circuit, memory storage circuit, memory storage circuit, frequency signal circuit, impedance matching circuit, filter-capacitor circuit and antenna phase change-over circuit.
4, the multi-system module of tool functional carrier plate according to claim 1 is characterized in that, these main circuit unit are connected with a circuit rerouting processing procedure with this control circuit unit.
5, the multi-system module of tool functional carrier plate according to claim 1 is characterized in that, these main circuit unit are arranged at this side of this support plate with surface mount technology.
6, the multi-system module of tool functional carrier plate according to claim 1 is characterized in that, this control circuit unit takes shape in this support plate inside with manufacture of semiconductor.
7, the multi-system module of tool functional carrier plate according to claim 1, it is characterized in that, when an external signal is imported the multi-system module of this tool functional carrier plate, this external signal by the signal of this control circuit unit output different mode to control these main circuit unit.
8, the multi-system module of tool functional carrier plate according to claim 7 is characterized in that, this external signal is an input power supply, and the power supply signal of this control circuit unit output different mode is to control these main circuit unit.
9, the multi-system module of tool functional carrier plate according to claim 1 is characterized in that, when these main circuit unit are exported several interface signals, these interface signals are by this control circuit unit output single face signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101871940A CN101452915B (en) | 2007-11-28 | 2007-11-28 | Multi-system module having functional carrier plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101871940A CN101452915B (en) | 2007-11-28 | 2007-11-28 | Multi-system module having functional carrier plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101452915A true CN101452915A (en) | 2009-06-10 |
| CN101452915B CN101452915B (en) | 2011-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101871940A Active CN101452915B (en) | 2007-11-28 | 2007-11-28 | Multi-system module having functional carrier plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569230A (en) * | 2012-02-28 | 2012-07-11 | 华为技术有限公司 | Semiconductor device and electronic device |
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2007
- 2007-11-28 CN CN2007101871940A patent/CN101452915B/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569230A (en) * | 2012-02-28 | 2012-07-11 | 华为技术有限公司 | Semiconductor device and electronic device |
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| Publication number | Publication date |
|---|---|
| CN101452915B (en) | 2011-03-16 |
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