CN101450983A - Synthetic process of high temperature resistant epoxy vinyl ester resin - Google Patents
Synthetic process of high temperature resistant epoxy vinyl ester resin Download PDFInfo
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- CN101450983A CN101450983A CNA2007101717740A CN200710171774A CN101450983A CN 101450983 A CN101450983 A CN 101450983A CN A2007101717740 A CNA2007101717740 A CN A2007101717740A CN 200710171774 A CN200710171774 A CN 200710171774A CN 101450983 A CN101450983 A CN 101450983A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
- C08F2/40—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation using retarding agents
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Abstract
The invention provides a high-temperature resistant epoxy vinyl ester resin for a glass flake daub high-temperature section of wet flue gas desulfurization. A synthesis process comprises the following steps: polyfunctional-group epoxy resin and organic monadic unsaturated carboxylic acid react at a temperature between 120 and 160 DEG C in the presence of catalyst and inhibitor, and then are diluted by crosslinkable monomers, so as to synthesize the epoxy vinyl ester resin for the glass flake daub high-temperature section of wet flue gas desulfurization. Compared with the prior art, the resin has the following advantages that the resin has high heat distortion temperature and good acid-alkali resistance; as the resin is high in crosslinking density and difficult to be permeated by solvents, the resin of the type is quite good in solvent resistance; the resin is applicable to special corrosion-resistant environment in the presence of solvents, oxidizing media and high-temperature flue gas and the like; and glass fiber reinforced plastic made from the resin has high strength retention at a high temperature.
Description
Technical field
The present invention relates to a kind of synthesis technique of high-temperature-resistance epoxy vinyl ester resin, relate in particular to the synthesis technique of a kind of wet process of FGD glass flake plasticine high temperature section (100 ℃～200 ℃) with epoxy vinyl ester resin.
Background technology
Wet process of FGD glass flake plasticine high temperature section is meant that former flue gas heat exchange device exhaust pass is to the absorption tower gas approach, 100 ℃～200 ℃ of this district's flue-gas temperatures (containing the accident temperature), the heat-drawn wire of common epoxy vinyl ester resin is about 100 ℃, for the corrosive environment more than 100 ℃, not only corrosion resistance is limited, and the intensity of resin material declines to a great extent significant discomfort usefulness.The ordinary resin material can cause the rigidity deficiency because of the high temperature mistake by force, trembles because of structure and causes the inefficacy of lining be full of cracks unsticking, or corroded by the air retaining wall ablation that high-temperature flue gas causes.
Wet flue gas desulfurizer smoke treatment amount is big, desulfurization degree is high, the cycle of operation is long, operation cost is moderate, has become the master of domestic and international flue gas desulphurization.But this corrosion of equipment environment harshness, big, the corrosion of equipment maintenance difficult of anticorrosion engineering amount.
Molecule two ends of epoxy vinyl ester resin contain the vinyl ester group, and middle skeleton is a Resins, epoxy, and they are to carry out the esterification by ring opening reaction by unsaturated organic monocarboxylic acid and Resins, epoxy to obtain.Epoxy vinyl ester resin is owing to have the excellent corrosion resistance and the mechanical property of Resins, epoxy concurrently, have unsaturated polyester resin machine-shaping processing performance easily again, become at present the main body material of corrosion-resistant glass fiber reinforced plastics product, application surface is very wide, spreads all over the protection against corrosion field of national economy all departments such as chemical industry, metallurgy, building.But do not see that as yet epoxy vinyl ester resin is used for the report of wet process of FGD high temperature section with glass flake plasticine.
For solving the protection against corrosion problem of Chinese large-sized flue gas desulfurization device in thermal power plant, develop a kind of at high temperature existing strong corrosion resistant, there is the epoxy vinyl ester resin of excellent mechanical performances that urgency in its application is arranged again.
Summary of the invention
The purpose of this invention is to provide a kind of have heat-drawn wire height, acid-alkali-corrosive-resisting performance good, be suitable for wet process of FGD glass flake plasticine high temperature section epoxy vinyl ester resin.
For achieving the above object, the technical scheme that adopts is: at 120～160 ℃ reaction in the presence of catalyzer and the stopper is arranged by polyfunctional epoxy resin and organic monobasic unsaturated carboxylic acid, again by the synthetic a kind of wet process of FGD glass flake plasticine high temperature section epoxy vinyl ester resin of crosslinkable monomers dilution.Concrete steps are:
(1) batching is standby with mass percent prescription batching:
A, polyfunctional epoxy resin 40%～55%
B, organic monobasic unsaturated carboxylic acid 15%～25%
C, catalyzer 0.05%～0.25%
D, stopper 0.01%～0.05%
E, crosslinkable monomers 30～40%
Wherein polyfunctional epoxy resin is meant linear phenol formaldehyde (PF) Resins, epoxy, ortho-cresol formaldehyde Resins, epoxy, resorcinol formaldehyde Resins, epoxy, four (p-hydroxybenzene) ethane, four tetraglycidel ether epoxy resins, triphenol methylmethane triglycidyl ether Resins, epoxy, Phloroglucinol monomethyl ether triglycidyl ether Resins, epoxy, bisphenol-A phenolic type Resins, epoxy, the naphthalene nucleus phenol aldehyde type epoxy resin, diphenyl ketone type Resins, epoxy, tetraphenyl ethylene four tetraglycidel ether epoxy resins, diaminodiphenylmethane four glycidyl amine Resins, epoxy, diisopropyl fork penylene type four glycidyl amine Resins, epoxy, tetramethyl-isopropylidene penylene type four glycidyl amine Resins, epoxy; Organic monobasic unsaturated carboxylic acid is meant methacrylic acid, vinylformic acid, butenoic acid, 10-undecylenic acid, oleic acid or phenyl propylene-(2)-acid; Catalyzer is benzyldimethylamine, benzyl trimethyl ammonium chloride or benzyltriethylammoinium chloride; Stopper is Pyrogentisinic Acid, methyl Pyrogentisinic Acid, Tert. Butyl Hydroquinone, tert-butyl catechol, para benzoquinone or copper naphthenate solution (concentration is 8%); Crosslinkable monomers is vinylbenzene, Vinylstyrene, Vinyl toluene, methacrylic ester, acrylate, chloro-styrene, tert-butylbenzene ethene, alpha-methyl styrene, dicyclopentadiene acrylate, Phthalic acid, diallyl ester, triallyl cyanurate.
(2) drop into material A, B, C and D in the esterification by ring opening reaction response device, stir under the situation of feeding nitrogen, be warming up to 120～160 ℃ gradually, keep temperature, up to recording acid number less than 30mgKOH/g;
(3) dilution is cooled to and adds material D, E below 110 ℃, fully stirs;
(4) filtration is cooled to room temperature, filters and promptly gets light yellow viscous liquid.
The wet process of FGD glass flake plasticine high temperature section that the present invention makes compared with prior art has the following advantages with epoxy vinyl ester resin:
Epoxy vinyl resin of the present invention is a higher kind of temperature resistant grade, and it has heat-drawn wire height, advantage that acid-proof alkaline is good.Because its cross-linking density height, solvent are difficult to infiltrate, so this resinoid solvent resistance also is pretty good.Be applicable to special erosion resistance environment such as having solvent, Oxidant and high-temperature flue gas, the glass reinforced plastic made from it has high strength retention ratio under hot conditions.
High-temperature-resistance epoxy vinyl ester resin of the present invention be suitable for hand stick with paste, spray, squeeze draw, glass reinforced plastic moulding process such as winding, it has the advantage of unsaturated polyester resin and Resins, epoxy concurrently: good moulding process, the i.e. controllability of Shi Yi viscosity, self-vulcanizing and gel time; Good mechanical performance and to the cohesiveness of fiber.Reach and itself have good chemical-resistant.High-temperature-resistance epoxy vinyl ester resin of the present invention is in the successful Application in high-temperature anticorrosion erosion field, for promoting the nonmetal corrosion-resistant material of China grade that develops skill, save the wet flue gas desulfurizer maintenance cost, in the prolonging overhaul reason cycle, the aspect of raising labour productivity has outstanding contributions.
Embodiment
Followingly the present invention is described in more detail by embodiment.
Embodiment 1:
In reactor, drop into linear phenol formaldehyde (PF) Resins, epoxy 340g, methacrylic acid 150g, benzyldimethylamine 1.2g, Pyrogentisinic Acid 0.15g.Be warming up to 130 ℃ gradually under the situation of feeding nitrogen, keep temperature, up to recording acid number less than 30mgKOH/g.Be cooled to the tert-butyl catechol of adding below 110 ℃ 0.05g, vinylbenzene 260g, fully stir, be cooled to room temperature at last, filter and promptly get light yellow viscous liquid.
Embodiment 2:
Four (p-hydroxybenzene) ethane, four tetraglycidel ether epoxy resin 340g, vinylformic acid 115g, benzyl trimethyl ammonium chloride 0.95g, methyl Pyrogentisinic Acid 0.10g are dropped in the device shown in the example 1, be warming up to 120 ℃ gradually under the situation of feeding nitrogen, keep temperature, up to recording acid number less than 30mgKOH/g.Be cooled to the Tert. Butyl Hydroquinone of adding below 110 ℃ 0.05g, copper naphthenate solution 0.08g, vinylbenzene 210g, Vinylstyrene 40g, fully stir, be cooled to room temperature at last, filter and promptly get light yellow viscous liquid.
Embodiment 3:
Phloroglucinol monomethyl ether triglycidyl ether Resins, epoxy 340g, butenoic acid 170g, benzyltriethylammoinium chloride 1.4g, Tert. Butyl Hydroquinone 0.18g are dropped in the device shown in the example 1, be warming up to 160 ℃ gradually under the situation of feeding nitrogen, keep temperature, up to recording acid number less than 30mgKOH/g.Be cooled to the copper naphthenate of adding below 110 ℃ solution 0.05g, vinylbenzene 250g, Phthalic acid, diallyl ester 20g, fully stir, be cooled to room temperature at last, filter and promptly get light yellow viscous liquid.
Embodiment 4:
In the device shown in naphthalene nucleus phenol aldehyde type epoxy resin 340g, phenyl propylene-(2)-sour 180g, benzyldimethylamine 1.0g, tert-butyl catechol 0.10g, the input example 1, be warming up to 140 ℃ gradually under the situation of feeding nitrogen, below operate by operation steps similarly to Example 3.
Embodiment 5:
Tetraphenyl ethylene four tetraglycidel ether epoxy resin 340g, vinylformic acid 125g, benzyltriethylammoinium chloride 0.95g, para benzoquinone 0.15g are dropped in the device shown in the example 1, be warming up to 150 ℃ gradually under the situation of feeding nitrogen, keep temperature, up to recording acid number less than 30mgKOH/g.Be cooled to the tert-butyl catechol of adding below 110 ℃ 0.05g, copper naphthenate solution 0.08g, vinylbenzene 160g, dicyclopentadiene acrylate 90g, fully stir, be cooled to room temperature at last, filter and promptly get light yellow viscous liquid.
Embodiment 6:
Triphenol methylmethane triglycidyl ether Resins, epoxy 340g, 10-undecylenic acid 200g, benzyltriethylammoinium chloride 1.4g, Tert. Butyl Hydroquinone 0.10g are dropped in the device shown in the example 1, be warming up to 120 ℃ gradually under the situation of feeding nitrogen.Keep temperature, up to recording acid number less than 30mgKOH/g.Be cooled to the tert-butyl catechol of adding below 110 ℃ 0.05g, copper naphthenate solution 0.08g, vinylbenzene 200g, Vinyl toluene 90g, fully stir, be cooled to room temperature at last, filter and promptly get light yellow viscous liquid.
Embodiment 7:
Diisopropyl is pitched in the device shown in penylene type four glycidyl amine Resins, epoxy 340g, vinylformic acid 170g, benzyl trimethyl ammonium chloride 0.95g, the methyl Pyrogentisinic Acid 0.10g input example 1, be warming up to 160 ℃ gradually under the situation of feeding nitrogen, keep temperature, until recording acid number less than 30mgKOH/g.Be cooled to the copper naphthenate of adding below 110 ℃ solution 0.10g, vinylbenzene 200g, Phthalic acid, diallyl ester 30g, triallyl cyanurate 50g, fully stir, be cooled to room temperature at last, filter and promptly get light yellow viscous liquid.
Embodiment 8:
Tetramethyl-isopropylidene penylene type four glycidyl amine Resins, epoxy 340g, butenoic acid 145g, benzyldimethylamine 1.8g, Tert. Butyl Hydroquinone 0.20g are dropped in the device shown in the example 1, be warming up to 140 ℃ gradually under the situation of feeding nitrogen.Below operate by operation steps similarly to Example 7.
More than among each embodiment the typical quality index of gained resin as follows:
The typical mechanical performance index of this casting resin is as follows:
| Project | Data | Testing method |
| Tensile strength, MPa | 65～78 | GB/T2568-1995 |
| Tensile modulus, GPa | 3.5～3.8 | GB/T2568-1995 |
| Elongation at break, % | 3～5 | GB/T2568-1995 |
| Flexural strength, MPa | 120～140 | GB/T2570-1995 |
| Modulus in flexure, GPa | 3.2～3.6 | GB/T2570-1995 |
| Compressive strength, MPa | 120～160 | GB/T2569-1995 |
| Modulus of compression, GPa | 3.2～3.4 | GB/T2569-1995 |
| Heat-drawn wire, ℃ (1.8MPa) | 150～170 | GB/T1634-1989 |
From last table as seen, the casting matrix heat-drawn wire height of high-temperature-resistance epoxy vinyl ester resin of the present invention has high strength retention ratio, far above prior art under hot conditions.Synthesis technique of the present invention is simple, and environmental protection does not have " three wastes " and produces, and product stability is good.
Claims (6)
- The synthesis technique of 1 high-temperature-resistance epoxy vinyl ester resin comprises the following steps:(1) batching is standby with mass percent prescription batching:A, polyfunctional epoxy resin 40%～55%B, organic monobasic unsaturated carboxylic acid 15%～25%C, catalyzer 0.05%～0.25%D, stopper 0.01%～0.05%E, crosslinkable monomers 30～40%(2) drop into A, B, C and D in the esterification by ring opening reaction response device, feed under the situation of nitrogen and stir, be warming up to 120～160 ℃ gradually, reaction system becomes all even and keeps temperature 1～2h again after transparent, up to recording acid number less than 30mgKOH/g;(3) dilution is cooled to and adds D, E below 110 ℃, fully stirs;(4) filtration is cooled to room temperature, filters and promptly gets light yellow viscous liquid.
- 2. by the synthesis technique of the described high-temperature-resistance epoxy vinyl ester resin of claim 1, it is characterized in that polyfunctional epoxy resin is meant linear phenol formaldehyde (PF) Resins, epoxy, ortho-cresol formaldehyde Resins, epoxy, resorcinol formaldehyde Resins, epoxy, four (p-hydroxybenzene) ethane, four tetraglycidel ether epoxy resins, triphenol methylmethane triglycidyl ether Resins, epoxy, Phloroglucinol monomethyl ether triglycidyl ether Resins, epoxy, bisphenol-A phenolic type Resins, epoxy, the naphthalene nucleus phenol aldehyde type epoxy resin, diphenyl ketone type Resins, epoxy, tetraphenyl ethylene four tetraglycidel ether epoxy resins, diaminodiphenylmethane four glycidyl amine Resins, epoxy, diisopropyl fork penylene type four glycidyl amine Resins, epoxy, tetramethyl-isopropylidene penylene type four glycidyl amine Resins, epoxy.
- 3 synthesis techniques by the described high-temperature-resistance epoxy vinyl ester resin of claim 1 is characterized in that organic monobasic unsaturated carboxylic acid is meant methacrylic acid, vinylformic acid, butenoic acid, 10-undecylenic acid, oleic acid or phenyl propylene-(2)-acid.
- 4. by the synthesis technique of the described high-temperature-resistance epoxy vinyl ester resin of claim 1, it is characterized in that catalyzer is a kind of in benzyldimethylamine, benzyl trimethyl ammonium chloride or the benzyltriethylammoinium chloride.
- 5. by the synthesis technique of the described high-temperature-resistance epoxy vinyl ester resin of claim 1, it is characterized in that stopper is several in Pyrogentisinic Acid, methyl Pyrogentisinic Acid, Tert. Butyl Hydroquinone, tert-butyl catechol, para benzoquinone or the copper naphthenate solution (concentration is 8%).
- 6. by the synthesis technique of the described high-temperature-resistance epoxy vinyl ester resin of claim 1, it is characterized in that crosslinkable monomers is vinylbenzene, Vinylstyrene, Vinyl toluene, methacrylic ester, acrylate, chloro-styrene, tert-butylbenzene ethene, alpha-methyl styrene, dicyclopentadiene acrylate, Phthalic acid, diallyl ester, triallyl cyanurate.
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007101717740A CN101450983A (en) | 2007-12-05 | 2007-12-05 | Synthetic process of high temperature resistant epoxy vinyl ester resin |
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|---|---|---|---|
| CNA2007101717740A CN101450983A (en) | 2007-12-05 | 2007-12-05 | Synthetic process of high temperature resistant epoxy vinyl ester resin |
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