CN101448978A - Metal surface treatment agent and use of same - Google Patents
Metal surface treatment agent and use of same Download PDFInfo
- Publication number
- CN101448978A CN101448978A CNA2007800183617A CN200780018361A CN101448978A CN 101448978 A CN101448978 A CN 101448978A CN A2007800183617 A CNA2007800183617 A CN A2007800183617A CN 200780018361 A CN200780018361 A CN 200780018361A CN 101448978 A CN101448978 A CN 101448978A
- Authority
- CN
- China
- Prior art keywords
- phenyl
- imidazoles
- benzoglyoxaline
- naphthyl
- treatment agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012756 surface treatment agent Substances 0.000 title claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 31
- 239000002184 metal Substances 0.000 title claims abstract description 31
- -1 imidazole compound Chemical class 0.000 claims abstract description 49
- 239000000126 substance Substances 0.000 claims abstract description 45
- 229910000679 solder Inorganic materials 0.000 claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 150000004693 imidazolium salts Chemical class 0.000 claims description 23
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 19
- 229950006191 gluconic acid Drugs 0.000 claims description 19
- 238000000034 method Methods 0.000 abstract description 33
- 238000005476 soldering Methods 0.000 abstract description 7
- 150000001875 compounds Chemical class 0.000 abstract description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract description 4
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 59
- 150000002460 imidazoles Chemical class 0.000 description 26
- 125000000217 alkyl group Chemical group 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 125000004432 carbon atom Chemical group C* 0.000 description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 238000003466 welding Methods 0.000 description 12
- 125000005843 halogen group Chemical group 0.000 description 11
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 7
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 7
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 5
- 238000011010 flushing procedure Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- 239000005749 Copper compound Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000003750 conditioning effect Effects 0.000 description 3
- 150000001880 copper compounds Chemical class 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 150000002366 halogen compounds Chemical class 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 description 2
- SDQCONAKTCBAMG-UHFFFAOYSA-N 2-pentadecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCC1=NC=CN1 SDQCONAKTCBAMG-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- JOOXCMJARBKPKM-UHFFFAOYSA-N 4-oxopentanoic acid Chemical compound CC(=O)CCC(O)=O JOOXCMJARBKPKM-UHFFFAOYSA-N 0.000 description 2
- IKJYRWQCYXTMFR-UHFFFAOYSA-N 5-methyl-2-naphthalen-1-yl-4-phenyl-1h-imidazole Chemical compound CC=1NC(C=2C3=CC=CC=C3C=CC=2)=NC=1C1=CC=CC=C1 IKJYRWQCYXTMFR-UHFFFAOYSA-N 0.000 description 2
- LFNLCLNDJHARGR-UHFFFAOYSA-N 5-naphthalen-2-yl-2-phenyl-1h-imidazole Chemical class N=1C(C=2C=C3C=CC=CC3=CC=2)=CNC=1C1=CC=CC=C1 LFNLCLNDJHARGR-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-M D-gluconate Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O RGHNJXZEOKUKBD-SQOUGZDYSA-M 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229940107816 ammonium iodide Drugs 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 230000004087 circulation Effects 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229940050410 gluconate Drugs 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 125000002769 thiazolinyl group Chemical group 0.000 description 2
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- UAYWVJHJZHQCIE-UHFFFAOYSA-L zinc iodide Chemical compound I[Zn]I UAYWVJHJZHQCIE-UHFFFAOYSA-L 0.000 description 2
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 2
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- DJARRRWWLTWZRT-UHFFFAOYSA-N 2-(2-bromophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound BrC1=C(C=CC=C1)C=1NC(=C(N=1)C1=CC=CC=C1)C DJARRRWWLTWZRT-UHFFFAOYSA-N 0.000 description 1
- YOXFKAQGQSOCHH-UHFFFAOYSA-N 2-(2-bromophenyl)-5-phenyl-1H-imidazole Chemical compound BrC1=C(C=CC=C1)C=1NC=C(N=1)C1=CC=CC=C1 YOXFKAQGQSOCHH-UHFFFAOYSA-N 0.000 description 1
- LYOLIGWGWRTHCT-UHFFFAOYSA-N 2-(2-fluorophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound FC1=C(C=CC=C1)C=1NC(=C(N=1)C1=CC=CC=C1)C LYOLIGWGWRTHCT-UHFFFAOYSA-N 0.000 description 1
- LIYVLBOGFIRDDZ-UHFFFAOYSA-N 2-(2-iodophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound IC1=C(C=CC=C1)C=1NC(=C(N=1)C1=CC=CC=C1)C LIYVLBOGFIRDDZ-UHFFFAOYSA-N 0.000 description 1
- QUPGAQPCEFJHAV-UHFFFAOYSA-N 2-(2-iodophenyl)-5-phenyl-1H-imidazole Chemical compound IC1=C(C=CC=C1)C=1NC=C(N=1)C1=CC=CC=C1 QUPGAQPCEFJHAV-UHFFFAOYSA-N 0.000 description 1
- 125000003163 2-(2-naphthyl)ethyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(C([H])=C([H])C2=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- WRFWLJXNVMSJAX-UHFFFAOYSA-N 2-(3-bromo-5-octylphenyl)-5-phenyl-1H-imidazole Chemical compound BrC=1C=C(C=C(C=1)CCCCCCCC)C=1NC=C(N=1)C1=CC=CC=C1 WRFWLJXNVMSJAX-UHFFFAOYSA-N 0.000 description 1
- PREIASNNKJXBJG-UHFFFAOYSA-N 2-(3-bromophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound BrC=1C=C(C=CC=1)C=1NC(=C(N=1)C1=CC=CC=C1)C PREIASNNKJXBJG-UHFFFAOYSA-N 0.000 description 1
- LOLMYQXBJWSZMM-UHFFFAOYSA-N 2-(3-bromophenyl)-5-phenyl-1H-imidazole Chemical compound Brc1cccc(c1)-c1nc(c[nH]1)-c1ccccc1 LOLMYQXBJWSZMM-UHFFFAOYSA-N 0.000 description 1
- NFXOFJVCPMEEHL-UHFFFAOYSA-N 2-(3-fluorophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound FC=1C=C(C=CC=1)C=1NC(=C(N=1)C1=CC=CC=C1)C NFXOFJVCPMEEHL-UHFFFAOYSA-N 0.000 description 1
- OETLFHKNZYBADH-UHFFFAOYSA-N 2-(3-fluorophenyl)-5-phenyl-1h-imidazole Chemical compound FC1=CC=CC(C=2NC(=CN=2)C=2C=CC=CC=2)=C1 OETLFHKNZYBADH-UHFFFAOYSA-N 0.000 description 1
- SVPLJFBBVKBWIB-UHFFFAOYSA-N 2-(3-iodophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound IC=1C=C(C=CC=1)C=1NC(=C(N=1)C1=CC=CC=C1)C SVPLJFBBVKBWIB-UHFFFAOYSA-N 0.000 description 1
- UQVXNXSSFXZVDY-UHFFFAOYSA-N 2-(3-iodophenyl)-5-phenyl-1H-imidazole Chemical compound Ic1cccc(c1)-c1nc(c[nH]1)-c1ccccc1 UQVXNXSSFXZVDY-UHFFFAOYSA-N 0.000 description 1
- KIKYZVSVRQKUDE-UHFFFAOYSA-N 2-(3-octylphenyl)-5-phenyl-1H-imidazole Chemical compound C(CCCCCCC)C=1C=C(C=CC=1)C=1NC=C(N=1)C1=CC=CC=C1 KIKYZVSVRQKUDE-UHFFFAOYSA-N 0.000 description 1
- UFAFFTPZZZSUKP-UHFFFAOYSA-N 2-(4,6-dimethylnaphthalen-1-yl)-6-ethyl-1H-benzimidazole Chemical compound CC1=CC=C(C2=CC=C(C=C12)C)C=1NC2=C(N1)C=CC(=C2)CC UFAFFTPZZZSUKP-UHFFFAOYSA-N 0.000 description 1
- WPWSWQMHRIBBTB-UHFFFAOYSA-N 2-(4-bromophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound BrC1=CC=C(C=C1)C=1NC(=C(N=1)C1=CC=CC=C1)C WPWSWQMHRIBBTB-UHFFFAOYSA-N 0.000 description 1
- ASXXGYRRMAYECY-UHFFFAOYSA-N 2-(4-bromophenyl)-5-phenyl-1h-imidazole Chemical compound C1=CC(Br)=CC=C1C1=NC(C=2C=CC=CC=2)=CN1 ASXXGYRRMAYECY-UHFFFAOYSA-N 0.000 description 1
- XHOIMCPVMWYING-UHFFFAOYSA-N 2-(4-chlorobutyl)-1h-imidazole Chemical class ClCCCCC1=NC=CN1 XHOIMCPVMWYING-UHFFFAOYSA-N 0.000 description 1
- IOOZGAIMDGZQFZ-UHFFFAOYSA-N 2-(4-fluorophenyl)-5-methyl-4-phenyl-1h-imidazole Chemical compound CC=1NC(C=2C=CC(F)=CC=2)=NC=1C1=CC=CC=C1 IOOZGAIMDGZQFZ-UHFFFAOYSA-N 0.000 description 1
- CAJDUBMUXJAMBC-UHFFFAOYSA-N 2-(4-fluorophenyl)-5-phenyl-1H-imidazole Chemical compound FC1=CC=C(C=C1)C=1NC=C(N=1)C1=CC=CC=C1 CAJDUBMUXJAMBC-UHFFFAOYSA-N 0.000 description 1
- IDNIZYCLCDDPFL-UHFFFAOYSA-N 2-(4-iodophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound IC1=CC=C(C=C1)C=1NC(=C(N=1)C1=CC=CC=C1)C IDNIZYCLCDDPFL-UHFFFAOYSA-N 0.000 description 1
- FNYDOGQLEQJIIR-UHFFFAOYSA-N 2-(4-iodophenyl)-5-phenyl-1H-imidazole Chemical compound IC1=CC=C(C=C1)C=1NC=C(N=1)C1=CC=CC=C1 FNYDOGQLEQJIIR-UHFFFAOYSA-N 0.000 description 1
- BQHAUJOWLSGKJL-UHFFFAOYSA-N 2-(5-chloro-2-methylnaphthalen-1-yl)-5-(4-hexylphenyl)-1H-imidazole Chemical class CC1=C(C2=CC=CC(=C2C=C1)Cl)C=1NC=C(N1)C1=CC=C(C=C1)CCCCCC BQHAUJOWLSGKJL-UHFFFAOYSA-N 0.000 description 1
- RFPNWEZMQUWPIW-UHFFFAOYSA-N 2-(cyclohexylmethyl)-6-ethyl-1h-benzimidazole Chemical compound N1C2=CC(CC)=CC=C2N=C1CC1CCCCC1 RFPNWEZMQUWPIW-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- HITWHALOZBMLHY-UHFFFAOYSA-N 2-Butyl-1H-benzimidazole Chemical group C1=CC=C2NC(CCCC)=NC2=C1 HITWHALOZBMLHY-UHFFFAOYSA-N 0.000 description 1
- MWYNOZGYGNMTBG-UHFFFAOYSA-N 2-[(4-bromophenyl)methyl]-6-ethyl-1h-benzimidazole Chemical compound N1C2=CC(CC)=CC=C2N=C1CC1=CC=C(Br)C=C1 MWYNOZGYGNMTBG-UHFFFAOYSA-N 0.000 description 1
- SLLDUURXGMDOCY-UHFFFAOYSA-N 2-butyl-1h-imidazole Chemical compound CCCCC1=NC=CN1 SLLDUURXGMDOCY-UHFFFAOYSA-N 0.000 description 1
- ZUKYCLYMFNPDCT-UHFFFAOYSA-N 2-cyclohexyl-1h-benzimidazole Chemical class C1CCCCC1C1=NC2=CC=CC=C2N1 ZUKYCLYMFNPDCT-UHFFFAOYSA-N 0.000 description 1
- LYNVLWLRSACENL-UHFFFAOYSA-N 2-decyl-1h-imidazole Chemical class CCCCCCCCCCC1=NC=CN1 LYNVLWLRSACENL-UHFFFAOYSA-N 0.000 description 1
- ILSVUUXCOJXFIJ-UHFFFAOYSA-N 2-docosyl-1H-imidazole Chemical class C(CCCCCCCCCCCCCCCCCCCCC)C=1NC=CN1 ILSVUUXCOJXFIJ-UHFFFAOYSA-N 0.000 description 1
- QGFGLYOMJKJZIC-UHFFFAOYSA-N 2-dodecyl-1h-benzimidazole Chemical class C1=CC=C2NC(CCCCCCCCCCCC)=NC2=C1 QGFGLYOMJKJZIC-UHFFFAOYSA-N 0.000 description 1
- LEHNQGSPRXHYRT-UHFFFAOYSA-N 2-dodecyl-1h-imidazole Chemical class CCCCCCCCCCCCC1=NC=CN1 LEHNQGSPRXHYRT-UHFFFAOYSA-N 0.000 description 1
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- PUXNRELNVUCAAJ-UHFFFAOYSA-N FC1=C(C=CC=C1)C=1NC=C(N1)C1=CC=CC=C1 Chemical compound FC1=C(C=CC=C1)C=1NC=C(N1)C1=CC=CC=C1 PUXNRELNVUCAAJ-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 1
- BAFDPEURBNZJCX-UHFFFAOYSA-N NCC(C=C1)=CC=C1C(N1)=NC(C(C2=CC=C3)=CC=CC2=C3Cl)=C1Cl Chemical class NCC(C=C1)=CC=C1C(N1)=NC(C(C2=CC=C3)=CC=CC2=C3Cl)=C1Cl BAFDPEURBNZJCX-UHFFFAOYSA-N 0.000 description 1
- VJMFKNXQUMONPK-UHFFFAOYSA-N NCC(C=C1)=CC=C1C(N1)=NC(C2=CC=CC=C2)=C1Cl Chemical class NCC(C=C1)=CC=C1C(N1)=NC(C2=CC=CC=C2)=C1Cl VJMFKNXQUMONPK-UHFFFAOYSA-N 0.000 description 1
- CVMIDNXMLHMLRU-UHFFFAOYSA-N NCC1=C(C=CC=C1)C=1NC=C(N1)C1=CC=CC=C1 Chemical compound NCC1=C(C=CC=C1)C=1NC=C(N1)C1=CC=CC=C1 CVMIDNXMLHMLRU-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- CANRESZKMUPMAE-UHFFFAOYSA-L Zinc lactate Chemical compound [Zn+2].CC(O)C([O-])=O.CC(O)C([O-])=O CANRESZKMUPMAE-UHFFFAOYSA-L 0.000 description 1
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical compound [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- CUBCNYWQJHBXIY-UHFFFAOYSA-N benzoic acid;2-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC=C1.OC(=O)C1=CC=CC=C1O CUBCNYWQJHBXIY-UHFFFAOYSA-N 0.000 description 1
- XKGUZGHMWUIYDR-UHFFFAOYSA-N benzyl n-(3-fluoro-4-morpholin-4-ylphenyl)carbamate Chemical compound C=1C=C(N2CCOCC2)C(F)=CC=1NC(=O)OCC1=CC=CC=C1 XKGUZGHMWUIYDR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 1
- GQDHEYWVLBJKBA-UHFFFAOYSA-H copper(ii) phosphate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GQDHEYWVLBJKBA-UHFFFAOYSA-H 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 229940040102 levulinic acid Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PYLWMHQQBFSUBP-UHFFFAOYSA-N monofluorobenzene Chemical compound FC1=CC=CC=C1 PYLWMHQQBFSUBP-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 1
- 235000007715 potassium iodide Nutrition 0.000 description 1
- 229960004839 potassium iodide Drugs 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 229940107700 pyruvic acid Drugs 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 229940083599 sodium iodide Drugs 0.000 description 1
- MSXHSNHNTORCAW-GGLLEASOSA-M sodium;(2s,3s,4s,5r,6s)-3,4,5,6-tetrahydroxyoxane-2-carboxylate Chemical compound [Na+].O[C@H]1O[C@H](C([O-])=O)[C@@H](O)[C@H](O)[C@H]1O MSXHSNHNTORCAW-GGLLEASOSA-M 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-O triethanolammonium Chemical compound OCC[NH+](CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-O 0.000 description 1
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 1
- WGIWBXUNRXCYRA-UHFFFAOYSA-H trizinc;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O WGIWBXUNRXCYRA-UHFFFAOYSA-H 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011746 zinc citrate Substances 0.000 description 1
- 235000006076 zinc citrate Nutrition 0.000 description 1
- 229940068475 zinc citrate Drugs 0.000 description 1
- SRWMQSFFRFWREA-UHFFFAOYSA-M zinc formate Chemical compound [Zn+2].[O-]C=O SRWMQSFFRFWREA-UHFFFAOYSA-M 0.000 description 1
- 239000011576 zinc lactate Substances 0.000 description 1
- 235000000193 zinc lactate Nutrition 0.000 description 1
- 229940050168 zinc lactate Drugs 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Abstract
The present invention provides a metal surface treatment agent for improving solder wettability to the surface of a metal conductive section constituting a circuit section of a printed wiring board, at the time of soldering an electronic component or the like to the surface of the conductive section. A method for manufacturing a printed wiring board whereupon a chemical film is formed on the surface of a metal conductive section by bringing the surface treatment agent into contact with the surface of the metal conductive section, and a method for manufacturing a printed wiring board to which soldering is performed by using a lead-free solder after forming a chemical film on the surface of a metal conductive section by bringing the surface treatment agent into contact with the surface of the metal conductive section are also provided. The metal surface treatment agent is characterized in containing an imidazole compound and a gluconic compound as effective components.
Description
Technical field
The present invention relates to a kind of surface treatment agent and uses thereof, described surface treatment agent is used for electronic unit etc. is welded to the process on the surface of metallic conduction part, and described metallic conduction partly constitutes the circuit part of printed wiring board.
Background technology
In recent years, has the method that the surface mounting technique that strengthens packaging density has been widely used as installing printed wiring board.These surface mounting techniques are divided into two-sided surface mounting technique and mix field engineering etc., use solder paster connection piece type parts in the described two-sided surface mounting technique, described mixing field engineering is to use the combination of the through hole mount technology of the sheet type parts surface field engineering of solder paster and discrete parts.In all installation methods, printed wiring board will stand above welding step twice, thereby it all will be exposed at every turn and causes violent thermal history under the high temperature.
As a result, by heating the surface of the metallic conduction metal (such as copper, copper alloy or silver) partly that constitutes the printed wiring board circuit part, quickened the formation of oxide film, so the surface of current-carrying part can not keep good weldability.
In order to stop the atmospheric oxidation of printed wiring board metallic conduction part, surface treatment method has been proposed, wherein use rust-preventive agent on the current-carrying part surface, to form chemical films, described rust-preventive agent contains a kind of as activeconstituents of multiple imidazolium compounds.
Usually, the tin-lead alloy eutectic solder has been widely used in electronic unit is attached to printed wiring board etc.Yet people have begun to notice that the lead that is included in the welding flux alloy can produce adverse influence to human body in recent years, and therefore, lead-free solder is used in expectation.So, begin to consider various lead-free solders.For example, proposed lead-free solder, wherein one or more metals have been added in the base metal tin as silver, zinc, bismuth, indium, antimony and copper.
Eutectic solder in the past (eutectic solder) can join metal to securely owing to excellent wetting capacity on the metallic surface, produces high reliability.In contrast, the wettability of lead-free solder afterwards on the metallic surface is inferior to eutectic solder, often shows that therefore as producing the space, therefore there are the weak problem of scolder and intermetallic bond strength in poor weldability and binding deficient.
Therefore, when using lead-free solder, be necessary the flux of selecting to have the welding flux alloy of good weldability and being applicable to lead-free solder.Also require to be used to stop the surface treatment agent of oxidation on metal surface to have the function that improves lead-free solder wettability and weldability.
Patent documentation 1:JP-B-46-17046
Patent documentation 2:JP-A-4-206681
Patent documentation 3:JP-A-5-25407
Patent documentation 4:JP-A-5-186888
Summary of the invention
The problem to be solved in the present invention
Consider that afore-mentioned makes the present invention.An object of the present invention is to provide a kind of metal surface treatment agent, in the process on the surface that electronic unit is welded to metallic conduction part (described metallic conduction partly constitutes the circuit part of printed wiring board), described surface treatment agent is good at scolder aspect the wettability of metallic conduction part surface.
In addition, another object of the present invention provides a kind of printed wiring board, wherein by above-mentioned surface treatment agent being contacted with the metallic conduction part surface and on described metallic conduction part surface, forming chemical films, and provide a kind of method that is used to produce printed wiring board, wherein, use lead-free solder to weld then by above-mentioned surface treatment agent being contacted with the metallic conduction part surface and on described metallic conduction part surface, forming chemical films.
Solve the method for described problem
In order to address the above problem, the present inventor has carried out extensive and deep research.As a result, have been found that by the metal conditioner that comprises imidazolium compounds and glyconic acid compound and can realize above-mentioned purpose, finished the present invention thus.
Second invention is the metal conditioner that is used for first invention, and described surface treatment agent comprises the imidazolium compounds of 0.01～10wt% and the glyconic acid compound of 0.01～50wt%.
The 3rd invention is printed wiring board, and wherein the surface treatment agent in the surface by making the current-carrying part that metal makes and first invention or second invention contacts and form chemical films on the surface of metallic conduction part.
The 4th invention is the method for making printed wiring board, wherein invent with first by the surface that makes metallic conduction part or second invention in surface treatment agent contact and on the surface of the current-carrying part that constitutes by metal, form chemical films, use lead-free solder to weld then.
Advantage of the present invention
Metal conditioner of the present invention can form chemical films by being used in combination imidazolium compounds and glyconic acid compound, in the process on the surface that electronic unit etc. is welded to the metallic conduction part, described metallic conduction partly constitutes the circuit part of printed wiring board, and described chemical films has the good wettability of scolder to the current-carrying part surface.When using according to printed wiring board of the present invention or using, the metallic conduction part can be attached to electronic unit reliably by the welding of using lead-free solder according to printed wiring board fabrication method of the present invention.
Preferred forms of the present invention
To explain the present invention below.
Surface treatment agent of the present invention is the water soluble liq of imidazo-containing compounds and glyconic acid compound.Being used to implement imidazolium compounds of the present invention does not have particular restriction, but the preferred represented imidazolium compounds of general formula (I)～(VIII) that for example uses by following Chemical formula 1～8.In addition, also may be used in combination these two or more imidazolium compoundss.
[Chemical formula 1]
(R in the formula,
1Representing hydrogen atom or carbonatoms is the alkyl or alkenyl of 1～25 straight or branched, and described alkyl or alkenyl can have substituting group; R
2And R
3Representing hydrogen atom, halogen atom or carbonatoms separately is 1～8 straight or branched alkyl.)
[Chemical formula 2]
(R in the formula,
1Representing hydrogen atom or carbonatoms is 1～25 straight or branched alkyl or alkenyl, and described alkyl or alkenyl can have substituting group; R
2And R
3Can be identical or different mutually, and to represent hydrogen atom, halogen atom or carbonatoms separately be 1～8 straight or branched alkyl.)
[chemical formula 3]
(R in the formula,
1Representing hydrogen atom, halogen atom or carbonatoms is 1～17 straight or branched alkyl; R
2, R
3, R
4And R
5Can be identical or different mutually, and to represent hydrogen atom, halogen atom or carbonatoms separately be 1～8 straight or branched alkyl.)
[chemical formula 4]
(R in the formula,
1Representing hydrogen atom, halogen atom or carbonatoms is 1～17 straight or branched alkyl; R
2, R
3, R
4And R
5Can be identical or different mutually, and to represent hydrogen atom, halogen atom or carbonatoms separately be 1～8 straight or branched alkyl.)
[chemical formula 5]
(R in the formula,
1Representing hydrogen atom, halogen atom or carbonatoms is 1～17 straight or branched alkyl; R
2, R
3, R
4And R
5Can be identical or different mutually, and to represent hydrogen atom, halogen atom or carbonatoms separately be 1～8 straight or branched alkyl.)
[chemical formula 6]
(R in the formula,
1, R
2, R
3And R
4Can be identical or different mutually, and to represent hydrogen atom, halogen atom or carbonatoms separately be 1～8 straight or branched alkyl; N represents 0～6 integer.)
[chemical formula 7]
(R in the formula,
1, R
2, R
3And R
4Can be identical or different mutually, and to represent hydrogen atom, halogen atom or carbonatoms separately be 1～8 straight or branched alkyl; N represents 0～6 integer.)
[chemical formula 8]
(R in the formula,
1And R
2Can be identical or different mutually, and to represent hydrogen atom, halogen atom or carbonatoms separately be 1～8 straight or branched alkyl; N represents 0～6 integer.)
Example by the imidazolium compounds of the general formula (I) of Chemical formula 1 expression comprises:
Imidazoles,
The alkyl imidazole compound, such as
Glyoxal ethyline,
The 2-ethyl imidazol(e),
The 2-propyl imidazole,
2 isopropyl imidazole
The 2-butyl imidazole,
The 2-t-butyl imidazole,
2-amyl group imidazoles,
2-hexyl imidazoles,
2-heptyl imidazoles,
2-(1-ethyl pentyl group) imidazoles,
2-octyl group imidazoles,
2-nonyl imidazoles,
2-decyl imidazoles,
The 2-undecyl imidazole,
2-dodecyl imidazoles,
2-tridecyl imidazoles,
2-tetradecyl imidazoles,
2-pentadecyl imidazoles,
2-hexadecyl imidazoles,
2-heptadecyl imidazoles,
2-octadecyl imidazoles,
2-nonadecyl imidazoles,
2-eicosyl imidazoles,
2-heneicosyl imidazoles,
2-docosyl imidazoles,
2-tricosyl imidazoles,
2-tetracosyl imidazoles,
2-pentacosyl imidazoles,
2-(1-methyl amyl) imidazoles,
2-(1-ethyl pentyl group) imidazoles,
2-(1-heptyl decyl) imidazoles,
2-(5-hexenyl) imidazoles,
2-(9-octenyl) imidazoles,
2-(8-17 thiazolinyls) imidazoles,
2-(4-chlorobutyl) imidazoles,
2-(9-hydroxyl nonyl) imidazoles,
2-ethyl-4-methylimidazole,
2-undecyl-4-methylimidazole,
2-heptadecyl-4-methylimidazole,
4-methylimidazole,
The 4-isopropylimdazole,
4-octyl group imidazoles,
2,4, the 5-tri-methylimidazolium,
4,5-dimethyl-2-octyl group imidazoles,
2-undecyl-4-methyl-5-bromo imidazoles and
4,5-two chloro-2-ethyl imidazol(e)s etc.
The example of the imidazolium compounds of Chemical formula 2 formula of (II) representative comprises:
Benzoglyoxaline,
The alkyl benzimidazole compound, such as
The 2-tolimidazole,
The 2-ethyl benzo imidazole,
2-propyl group benzoglyoxaline,
2-sec.-propyl benzo imidazoles,
2-butyl benzoglyoxaline,
2-tertiary butyl benzo imidazoles,
2-amyl group benzoglyoxaline,
2-hexyl benzoglyoxaline,
2-(1-methyl amyl) benzoglyoxaline,
2-heptyl benzoglyoxaline,
2-(1-ethyl pentyl group) benzoglyoxaline,
2-octyl group benzoglyoxaline,
2-(2,4, the 4-tri-methyl-amyl) benzoglyoxaline,
2-nonyl benzoglyoxaline,
2-decyl benzoglyoxaline,
2-undecyl benzoglyoxaline,
2-dodecyl benzo imidazoles,
2-tridecyl benzo imidazoles,
2-tetradecyl benzoglyoxaline,
2-pentadecyl imidazoles,
2-hexadecyl benzoglyoxaline,
2-heptadecyl benzoglyoxaline,
2-(1-heptyl decyl) benzoglyoxaline,
2-octadecyl benzoglyoxaline,
2-nonadecyl benzoglyoxaline,
2-eicosyl benzoglyoxaline,
2-heneicosyl benzoglyoxaline,
2-docosyl benzoglyoxaline,
2-tricosyl benzoglyoxaline,
2-tetracosyl benzoglyoxaline,
2-pentacosyl benzoglyoxaline,
2-(8-octyl group hexadecyl) benzoglyoxaline,
2-(9-octenyl) benzoglyoxaline,
2-(8-17 thiazolinyls) benzoglyoxaline,
2-(4-chlorobutyl) benzoglyoxaline,
2-(9-hydroxyl nonyl) benzoglyoxaline,
2-hexyl-5-tolimidazole,
2-heptyl-5, the 6-dimethylbenzimidazole,
2-octyl group-5-chloro-benzimidazole,
2-ethyl-5-octyl group-6-bromo benzoglyoxaline,
2-amyl group-5,6-dichloro-benzo imidazoles,
4-fluorobenzene and imidazoles and
2-amyl group-5-iodo benzoglyoxaline etc.
The example of the imidazolium compounds of chemical formula 3 formula ofs (III) representative comprises:
2, the 4-diphenyl-imidazole,
2-(2-aminomethyl phenyl)-4-phenylimidazole,
2-(3-octyl phenyl)-4-phenylimidazole,
2-(2, the 4-3,5-dimethylphenyl)-4-phenylimidazole,
2-phenyl-4-(4-hexyl phenyl) imidazoles,
2-phenyl-4-(2-methyl-5-butyl phenyl) imidazoles,
2,4-phenylbenzene-5-Methylimidazole,
2,4-phenylbenzene-5-hexyl imidazoles,
2-(2, the 4-diethyl)-4-(3-propyl group-5-octyl group)-5-isobutyl-imidazoles,
2-(2-chloro-phenyl-)-4-phenylimidazole,
2-(3-chloro-phenyl-)-4-phenylimidazole,
2-(4-chloro-phenyl-)-4-phenylimidazole,
2-(2-bromophenyl)-4-phenylimidazole,
2-(3-bromophenyl)-4-phenylimidazole,
2-(4-bromophenyl)-4-phenylimidazole,
2-(2-iodophenyl)-4-phenylimidazole,
2-(3-iodophenyl)-4-phenylimidazole,
2-(4-iodophenyl)-4-phenylimidazole,
2-(2-fluorophenyl)-4-phenylimidazole,
2-(3-fluorophenyl)-4-phenylimidazole,
2-(4-fluorophenyl)-4-phenylimidazole,
2-(2, the 3-dichlorophenyl)-4-phenylimidazole,
2-(2,4 dichloro benzene base)-4-phenylimidazole,
2-(2, the 5-dichlorophenyl)-4-phenylimidazole,
2-(2, the 6-dichlorophenyl)-4-phenylimidazole,
2-(3, the 4-dichlorophenyl)-4-phenylimidazole,
2-(3, the 5-dichlorophenyl)-4-phenylimidazole,
2-(2, the 4-dibromo phenyl)-4-phenylimidazole,
2-(2-methyl-4-chloro-phenyl-)-4-phenylimidazole,
2-(3-bromo-5-octyl phenyl)-4-phenylimidazole,
2-(2-chloro-phenyl-)-4-phenyl-5-Methylimidazole,
2-(3-chloro-phenyl-)-4-phenyl-5-Methylimidazole,
2-(4-chloro-phenyl-)-4-phenyl-5-Methylimidazole,
2-(2-bromophenyl)-4-phenyl-5-Methylimidazole,
2-(3-bromophenyl)-4-phenyl-5-Methylimidazole,
2-(4-bromophenyl)-4-phenyl-5-Methylimidazole,
2-(2-iodophenyl)-4-phenyl-5-Methylimidazole,
2-(3-iodophenyl)-4-phenyl-5-Methylimidazole,
2-(4-iodophenyl)-4-phenyl-5-Methylimidazole,
2-(2-fluorophenyl)-4-phenyl-5-Methylimidazole,
2-(3-fluorophenyl)-4-phenyl-5-Methylimidazole,
2-(4-fluorophenyl)-4-phenyl-5-Methylimidazole,
2-(2, the 3-dichlorophenyl)-4-phenyl-5-Methylimidazole,
2-(2,4 dichloro benzene base)-4-phenyl-5-Methylimidazole,
2-(2, the 5-dichlorophenyl)-4-phenyl-5-Methylimidazole,
2-(2, the 6-dichlorophenyl)-4-phenyl-5-Methylimidazole,
2-(3, the 4-dichlorophenyl)-4-phenyl-5-Methylimidazole,
2-(3, the 5-dichlorophenyl)-4-phenyl-5-Methylimidazole,
2-(2,4 dichloro benzene base)-4-phenyl-5-ethyl imidazol(e),
2-(2, the 3-dichlorophenyl)-4-phenyl-5-decyl imidazoles,
2-(3, the 4-dichlorophenyl)-4-phenyl-5-heptadecyl imidazoles,
2-(2, the 4-dibromo phenyl)-4-phenyl-5-isopropylimdazole,
2-(2-heptyl-4-chloro-phenyl-)-4-phenyl-5-isobutyl-imidazoles,
2-phenyl-4-(2-chloro-phenyl-) imidazoles,
2-phenyl-4-(3-chloro-phenyl-) imidazoles,
2-phenyl-4-(4-chloro-phenyl-) imidazoles,
2-phenyl-4-(2-bromophenyl) imidazoles,
2-phenyl-4-(3-bromophenyl) imidazoles,
2-phenyl-4-(4-bromophenyl) imidazoles,
2-phenyl-4-(2-iodophenyl) imidazoles,
2-phenyl-4-(3-iodophenyl) imidazoles,
2-phenyl-4-(4-iodophenyl) imidazoles,
2-phenyl-4-(2-fluorophenyl) imidazoles,
2-phenyl-4-(3-fluorophenyl) imidazoles,
2-phenyl-4-(4-fluorophenyl) imidazoles,
2-phenyl-4-(2, the 3-dichlorophenyl) imidazoles,
2-phenyl-4-(2,4 dichloro benzene base) imidazoles,
2-phenyl-4-(2, the 5-dichlorophenyl) imidazoles,
2-phenyl-4-(2, the 6-dichlorophenyl) imidazoles,
2-phenyl-4-(3, the 4-dichlorophenyl) imidazoles,
2-phenyl-4-(3, the 5-dichlorophenyl) imidazoles,
2-phenyl-4-(2, the 3-dibromo phenyl) imidazoles,
2-phenyl-4-(2-propyl group-3-chloro-phenyl-) imidazoles,
2-phenyl-4-(3-bromo-4-heptyl phenyl) imidazoles,
2-phenyl-4-(2-chloro-phenyl-)-5-Methylimidazole,
2-phenyl-4-(3-chloro-phenyl-)-5-Methylimidazole,
2-phenyl-4-(4-chloro-phenyl-)-5-Methylimidazole,
2-phenyl-4-(2-bromophenyl)-5-Methylimidazole,
2-phenyl-4-(3-bromophenyl)-5-Methylimidazole,
2-phenyl-4-(4-bromophenyl)-5-Methylimidazole,
2-phenyl-4-(2-iodophenyl)-5-Methylimidazole,
2-phenyl-4-(3-iodophenyl)-5-Methylimidazole,
2-phenyl-4-(4-iodophenyl)-5-Methylimidazole,
2-phenyl-4-(2-fluorophenyl)-5-Methylimidazole,
2-phenyl-4-(3-fluorophenyl)-5-Methylimidazole,
2-phenyl-4-(4-fluorophenyl)-5-Methylimidazole,
2-phenyl-4-(2, the 3-dichlorophenyl)-5-Methylimidazole,
2-phenyl-4-(2,4 dichloro benzene base)-5-Methylimidazole,
2-phenyl-4-(2, the 5-dichlorophenyl)-5-Methylimidazole,
2-phenyl-4-(2, the 6-dichlorophenyl)-5-Methylimidazole,
2-phenyl-4-(3, the 4-dichlorophenyl)-5-Methylimidazole,
2-phenyl-4-(3, the 5-dichlorophenyl)-5-Methylimidazole,
2-phenyl-4-(2, the 3-dichlorophenyl)-5-propyl imidazole,
2-phenyl-4-(2,4 dichloro benzene base)-5-undecyl imidazole,
2-phenyl-4-(2, the 4-dibromo phenyl)-5-(1-methyl butyl) imidazoles,
2-phenyl-4-(2-hexyl-4-iodophenyl)-5-propyl imidazole,
2, two (4-chloro-phenyl-) imidazoles of 4-,
2-(2,4 dichloro benzene base)-4-(3, the 4-dichlorophenyl)-5-Methylimidazole,
2-(2-bromo-4-octyl phenyl)-4-(2-methyl-4-iodophenyl)-5-octyl group imidazoles,
2,4-phenylbenzene-5-fluoro imidazoles,
2,4-phenylbenzene-5-chloro imidazoles,
2,4-phenylbenzene-5-bromo imidazoles,
2,4-phenylbenzene-5-iodo imidazoles,
2-(4-aminomethyl phenyl)-4-phenyl-5-chloro imidazoles,
2-(4-chloro-phenyl-)-4-phenyl-5-bromo imidazoles,
2-phenyl-4-(2-chloro-phenyl-)-5-iodo imidazoles etc.
The example of the imidazolium compounds of chemical formula 4 formula ofs (IV) representative comprises:
2-phenyl-4-(1-naphthyl) imidazoles,
2-phenyl-4-(2-naphthyl) imidazoles,
2-(4-aminomethyl phenyl)-4-(4-chloro-6-butyl-1-naphthyl) imidazoles,
2-(2-octyl group 4-ethylphenyl)-4-(5-chloro-7-heptyl-1-naphthyl) imidazoles,
2-(2,4 dichloro benzene base)-4-(2-isobutyl--6-bromo-2-naphthyl) imidazoles,
2-phenyl-4-(1-naphthyl)-5-Methylimidazole,
2-(4-iodophenyl)-4-(5,6-dimethyl-1-naphthyl)-5-decyl imidazoles,
2-phenyl-4-(2-naphthyl)-5-Methylimidazole,
2-(2, the 3-difluorophenyl)-4-(7-octyl group-2-naphthyl)-5-heptadecyl imidazoles,
2-phenyl-4-(1-naphthyl)-5-fluoro imidazoles,
2-phenyl-4-(1-naphthyl)-5-chloro imidazoles,
2-phenyl-4-(1-naphthyl)-5-bromo imidazoles,
2-phenyl-4-(1-naphthyl)-5-iodo imidazoles,
2-phenyl-4-(2-naphthyl)-5-fluoro imidazoles,
2-phenyl-4-(2-naphthyl)-5-chloro imidazoles,
2-phenyl-4-(2-naphthyl)-5-bromo imidazoles,
2-phenyl-4-(2-naphthyl)-5-iodo imidazoles,
2-(4-aminomethyl phenyl)-4-(5-chloro-1-naphthyl)-5-chloro imidazoles etc.
The example of the imidazolium compounds of chemical formula 5 formula ofs (V) representative comprises:
2-(1-naphthyl)-4-phenylimidazole,
2-(2-naphthyl)-4-phenylimidazole,
2-(2-methyl-5-chloro-1-naphthyl)-4-(4-hexyl phenyl) imidazoles,
2-(2-isobutyl--5-iodo-2-naphthyl)-4-(2-amyl group-5-fluorophenyl) imidazoles,
2-(1-naphthyl)-4-phenyl-5-Methylimidazole,
2-(3,6-two chloro-2-naphthyls)-4-(2-sec.-propyl-5-fluorophenyl)-5-decyl imidazoles,
2-(6-propyl group-7-iodo-1-naphthyl)-4-(3-hexyl-6-bromophenyl)-5-heptadecyl imidazoles,
2-(1-naphthyl)-4-phenyl-5-fluoro imidazoles,
2-(1-naphthyl)-4-phenyl-5-chloro imidazoles,
2-(1-naphthyl)-4-phenyl-5-bromo imidazoles,
2-(1-naphthyl)-4-phenyl-5-iodo imidazoles,
2-(2-naphthyl)-4-phenyl-5-fluoro imidazoles,
2-(2-naphthyl)-4-phenyl-5-chloro imidazoles,
2-(2-naphthyl)-4-phenyl-5-bromo imidazoles,
2-(2-naphthyl)-4-phenyl-5-iodo imidazoles,
2-(4-chloro-2-naphthyl)-4-(2-hexyl phenyl)-5-chloro imidazoles etc.
The example of the imidazolium compounds of chemical formula 6 formula ofs (VI) representative is as follows:
2-Phenylbenzimidazole,
2-(4-aminomethyl phenyl) benzoglyoxaline,
2-(2,4 dichloro benzene base) benzoglyoxaline,
2-(2-hexyl phenyl)-5-chloro-benzimidazole,
2-(phenyl methyl) benzoglyoxaline,
2-(4-ethylphenyl methyl) benzoglyoxaline,
2-(4-Chlorophenylmethyl) benzoglyoxaline,
2-(2,4 dichloro benzene ylmethyl) benzoglyoxaline,
2-(3, the 4-dichlorophenylmethyl) benzoglyoxaline,
2-(4-bromophenyl methyl)-5-ethyl benzo imidazole,
2-(3-iodophenyl methyl)-4-chloro benzimidazole,
2-(2-phenylethyl) benzoglyoxaline,
2-[2-(3-isopropyl phenyl) ethyl] benzoglyoxaline,
2-[2-(4-chloro-phenyl-) ethyl] benzoglyoxaline,
2-[2-(4-chloro-phenyl-) ethyl]-4, the 5-dimethylbenzimidazole,
2-(3-phenyl propyl) benzoglyoxaline,
2-[3-(4-tert-butyl-phenyl) propyl group] benzoglyoxaline,
2-[3-(2-chloro-phenyl-) propyl group] benzoglyoxaline,
2-[3-(4-bromophenyl) propyl group]-5-butyl benzoglyoxaline,
2-(4-phenyl butyl) benzoglyoxaline,
2-[4-(4-chloro-phenyl-) butyl] benzoglyoxaline,
2-[4-(2,4 dichloro benzene base) butyl]-4,7-dichloro-benzo imidazoles,
2-(5-phenylpentyl) benzoglyoxaline,
2-[5-(2-octyl phenyl) amyl group] benzoglyoxaline,
2-[5-(3, the 4-dichlorophenyl) amyl group]-5-heptyl benzoglyoxaline,
2-(6-phenyl hexyl) benzoglyoxaline,
2-[6-(3-hexyl phenyl) hexyl] benzoglyoxaline,
2-[6-(2-ethyl-3-fluorophenyl) hexyl]-4-butyl-5-octyl group benzoglyoxaline etc.
The example of the imidazolium compounds of chemical formula 7 formula ofs (VII) representative comprises:
2-(1-naphthyl) benzoglyoxaline,
2-(1-naphthyl)-4-tolimidazole,
2-(2-naphthyl) benzoglyoxaline,
2-(1-chloro-2-naphthyl)-5,6-dichloro-benzo imidazoles,
2-(1-naphthyl methyl) benzoglyoxaline,
2-(4,6-dimethyl-1-naphthyl)-5-ethyl benzo imidazole,
2-(7-bromo-1-naphthyl methyl)-5-bromo benzoglyoxaline,
2-(2-naphthyl methyl) benzoglyoxaline,
2-(4-sec.-propyl-2-naphthyl methyl)-5-tertiary butyl benzo imidazoles,
2-[2-(1-naphthyl) ethyl] benzoglyoxaline,
2-[2-(5-amyl group-1-naphthyl) ethyl]-the 5-chloro-benzimidazole,
2-[2-(2-naphthyl) ethyl] benzoglyoxaline,
2-[2-(6-heptyl-2-naphthyl) ethyl]-4-methyl-5-hexyl benzoglyoxaline,
2-[3-(1-naphthyl) propyl group] benzoglyoxaline,
2-[3-(4-iodo-1-naphthyl) propyl group]-5,6-dibromo-benzene and imidazoles,
2-[3-(2-naphthyl) propyl group] benzoglyoxaline,
2-[3-(8-sec.-propyl-2-naphthyl) propyl group]-5-(2-aminomethyl phenyl) benzoglyoxaline,
2-[4-(1-naphthyl) butyl] benzoglyoxaline,
2-[4-(5-fluoro-1-naphthyl) butyl]-4-(2-propyl group butyl) benzoglyoxaline,
2-[4-(2-naphthyl) butyl] benzoglyoxaline,
2-[4-(7-octyl group-2-naphthyl) butyl]-4,6-diethyl benzo imidazoles,
2-[5-(1-naphthyl) amyl group] benzoglyoxaline,
2-[5-(6-amyl group-7-fluoro-1-naphthyl) amyl group]-4,7-dipropyl benzoglyoxaline,
2-[5-(2-naphthyl) amyl group] benzoglyoxaline,
2-[5-(6,7-dimethyl-2-naphthyl) amyl group]-5,6-dichloro-benzo imidazoles,
2-[6-(6,7-diethyl-1-naphthyl) hexyl]-5-octyl group benzoglyoxaline,
2-[6-(2-naphthyl) hexyl] benzoglyoxaline,
2-[6-(7-ethyl-8-bromo-2-naphthyl) hexyl]-4-hexyl-6-fluoro benzoglyoxaline etc.
The example of the imidazolium compounds of chemical formula 8 formula ofs (VIII) representative comprises:
2-cyclohexyl benzo imidazoles,
2-cyclohexyl-5, the 6-dimethylbenzimidazole,
2-cyclohexyl-5-chloro-benzimidazole,
2-cyclohexyl-4-sec.-propyl benzo imidazoles,
2-(cyclohexyl methyl) benzoglyoxaline,
2-(cyclohexyl methyl)-5-ethyl benzo imidazole,
2-(cyclohexyl methyl)-5-bromo benzoglyoxaline,
2-(2-cyclohexyl ethyl) benzoglyoxaline,
2-(2-cyclohexyl ethyl)-5-chloro-6-tolimidazole,
2-(3-cyclohexyl propyl group) benzoglyoxaline,
2-(3-cyclohexyl propyl group)-5-butyl benzoglyoxaline,
2-(3-cyclohexyl propyl group)-4, the 7-dimethylbenzimidazole,
2-(4-cyclohexyl butyl) benzoglyoxaline,
2-(4-cyclohexyl butyl)-5-iodo benzoglyoxaline,
2-(4-cyclohexyl butyl)-4-chloro-5-ethyl benzo imidazole,
2-(4-cyclohexyl butyl)-5-octyl group benzoglyoxaline,
2-(5-cyclohexyl amyl group) benzoglyoxaline,
2-(5-cyclohexyl amyl group)-5-hexyl benzoglyoxaline,
2-(5-cyclohexyl amyl group)-5,6-dibromo-benzene and imidazoles,
2-(6-cyclohexyl hexyl) benzoglyoxaline,
2-(6-cyclohexyl hexyl)-5-heptyl benzoglyoxaline,
2-(6-cyclohexyl hexyl)-4-chloro-5-(2-propyl group butyl) benzoglyoxaline etc.
In the embodiment of this invention, these imidazolium compoundss involved ratio in surface treatment agent is 0.01～10wt%, preferred 0.1～5wt%.When the content of described imidazolium compounds during less than 0.01wt%, the film thickness of the chemical films that forms on the metallic surface is too thin, thereby can not stop the oxidation of metallic surface effectively.On the contrary, when the content of described imidazolium compounds surpasses 10wt%, be difficult to control surface and handle the expectation thickness that obtains to be suitable for welding conditions.
The glyconic acid compound that is used for implementing the present invention is glyconic acid or its ammonium salt or the metal-salt that has by structural formula shown in the following chemical formula 9.As for the ammonium salt of glyconic acid, specifiable amine salt has such as ammonium gluconate, glyconic acid trimethyl ammonium and glyconic acid triethanol ammonium.As for the metal-salt of glyconic acid, specifiable have gluconic acid sodium salt, Zine Gluconate, Gluconate Ferrecex, a glyconic acid aluminium etc.
The ratio of these glyconic acid compounds that comprise in surface treatment agent is 0.01～50wt%, preferred 0.1～30wt%.When the content of described glyconic acid compound during, improve the effect deficiency of solder wettability less than 0.01wt%.On the other hand, when it surpasses 50wt%, can not expect to have the effect of improving that increases solder wettability.
[chemical formula 9]
Known glyconic acid compound has the coordination (sequestering power) to metal.Thereby, on the metallic surface, form complex compound at imidazolium compounds, and assemble and deposit with in the process that forms chemical films by intermolecular combination, think that described glyconic acid compound can bring into play some effects.
In the embodiment of this invention, in that described imidazolium compounds is soluble in water when forming the aqueous solution, generally well-known organic acid, mineral acid or organic solvent can be used as solubilizing agent.
The organic acid representative example that is used for herein comprises: formic acid, acetate, propionic acid, butyric acid, oxoethanoic acid, pyruvic acid, etheric acid, levulinic acid, enanthic acid, sad, capric acid, lauric acid, oxyacetic acid, R-Glyceric acid, lactic acid, vinylformic acid, phenylformic acid, p-nitrobenzoic acid, p-methyl benzenesulfonic acid, methylsulfonic acid, Whitfield's ointment, picric acid, oxalic acid, succsinic acid, toxilic acid, fumaric acid, tartrate and hexanodioic acid; Representative examples of mineral pigments comprises: hydrochloric acid, phosphoric acid, sulfuric acid, nitric acid etc.
In addition, about organic acid, can use carboxylic acid cpd by the general formula representative of Chemical formula 10.
[Chemical formula 1 0]
(R in the formula,
1Representing carbonatoms is 1～4 straight or branched alkyl; R
2Represent hydrogen atom or methyl; M represents 0～3 integer; N represents 1 or 2.)
These sour compounds can be used alone or in combination, and involved ratio is 0.1～50wt% in surface treatment agent, preferred 1～30wt%.When the content of described acid compound during, can not fully dissolve imidazolium compounds less than 0.1wt%.On the contrary, when it surpassed 50wt%, can not expect had solubilizing effect to imidazolium compounds, and has only vainly increased the reagent cost of described acid compound.
In addition,, can enumerate about organic solvent: lower alcohol such as methyl alcohol, ethanol and Virahol, perhaps acetone, N, dinethylformamide, ethylene glycol etc., they and water freedom are miscible.
In order to quicken the formation speed of chemical films on the metallic conduction part surface, can in surface treatment agent of the present invention, add copper compound.In addition, in order further to improve the thermotolerance of gained chemical films, can add zn cpds.
The representative example of above-mentioned copper compound comprises: neutralized verdigris, cuprous chloride, cupric chloride, cuprous bromide, cupric bromide, cupric iodide, copper hydroxide, cupric phosphate, copper sulfate, cupric nitrate etc.; The representative example of above-mentioned zn cpds comprises: zinc oxide, zinc chloride, zinc bromide, zinc iodide, zinc formate, zinc acetate, zinc oxalate, zinc lactate, zinc citrate, zinc sulfate, zinc nitrate, zinc phosphate etc.The content of metal-salt is 0.01～10wt% in the surface treatment agent, preferred 0.02～5wt%.
When using this class copper compound or zn cpds, can in surface treatment agent, add material with shock absorption, for example ammonia or amine such as monoethanolamine, diethanolamine or trolamine, with the pH value of surface of stability treatment agent, this is suitable.
For the further thermotolerance that improves the formation speed of chemical films and improve rete, can in surface treatment agent according to the present invention, add halogen compounds, ratio is 0.001～1wt%, preferred 0.01～0.5wt%.The example of described halogen compounds comprises: Sodium Fluoride, Potassium monofluoride, Neutral ammonium fluoride, sodium-chlor, Repone K, ammonium chloride, Sodium Bromide, Potassium Bromide, brometo de amonio, sodium iodide, potassiumiodide, ammonium iodide etc.
For using surface treatment agent of the present invention to handle the condition of the metallic conduction part surface that constitutes the printed wiring board circuit part, preferably, the fluid temperature of surface treatment agent can be 10～70 ℃, duration of contact can for 1 second to 10min.The example of contact method comprises methods such as dipping, spraying, coating.
In addition, after carrying out surface treatment of the present invention, can be by on chemical films, forming dual structure and further improve thermotolerance with thermoplastic resin.
That is to say, after forming chemical films on the surface of metallic conduction part, the dual structure of described chemical films and thermoplastic resin can be by being dissolved in solvent (such as toluene with thermoplastic resin, ethyl acetate, or Virahol) in, and rely on roller coating machine etc. that described solution is applied described chemical films equably with the thickness of 1～30 μ m and form, described thermoplastic resin has good thermotolerance, can be by rosin derivative (such as rosin or rosin ester), terpine resin (such as terpine resin or terpene phenolic resin), hydrocarbon resin (such as aromatic hydrocarbon resin or aliphatic hydrocarbon resin), or its mixture is formed.
About being suitable for welding process of the present invention, can enumerate wave soldering method and reflow soldering method, described wave soldering method comprises printed wiring board is moved to the top of fused liquid solder in the solder bath with the bonding part between welding electronic unit and the printed wiring board, described reflow soldering method comprises: print the paste scolder according to circuit pattern on printed wiring board in advance, and electronic unit is installed thereon, then, heat whole printed wiring board and finish welding with melting solder.
The scolder example that is applicable to the welding according to the present invention comprises lead-free solder, such as Sn-Ag-Cu parent metal, Sn-Ag-Bi parent metal, Sn-Bi parent metal, Sn-Ag-Bi-In parent metal, Sn-Zn parent metal and Sn-Cu parent metal, also can use normally used tinsel eutectic solder.
Embodiment
Describe the present invention in detail below with reference to embodiment and comparative example, the present invention is limited to this but should not be construed as.By the way, it is as follows to be used for the raw material and the evaluation test method of embodiment and comparative example.About the following raw material of not describing, use the reagent of commercially available acquisition.
[imidazolium compounds]
2,4-phenylbenzene-5-Methylimidazole (synthetic) according to the method described in the JP-A-7-243053
2-(2,4 dichloro benzene base)-4-phenyl-5-Methylimidazole (synthetic) according to the method described in the JP-A-2004-277386
2-phenyl-4-(3, the 4-dichlorophenyl) imidazoles (synthetic) according to the method described in the JP-A-2005-104878
2-(1-naphthyl)-4-phenyl-5-Methylimidazole (synthetic) according to the method described in the JP-A-2006-36683
2-phenyl-4-(2-naphthyl) imidazoles (synthetic) according to the method among the JP-A-2006-36683
2-(4-Chlorophenylmethyl) benzoglyoxaline (according to Science of Synthesis (synthetic science),
12, the method in 529 (2002) is synthetic)
2-(1-naphthyl methyl) benzoglyoxaline (according to Biochemical Pharmacology (biological chemistry pharmacology),
36, 463 (1987)) in method synthetic)
[glyconic acid compound]
Glyconic acid (50% the aqueous solution is by making with light pure chemistry Industrial Co., Ltd (with light Pure Drug industry society))
The evaluation test of scolder up (flow up) rate capability
Use 120mm (length) * 150mm (wide) * 1.6mm (thick) make by glass-epoxy and have internal diameter as the printed wiring board of 300 copper vias of 0.80mm as test sample.This test sample is carried out degreasing, stand microetch, water flushing then., test sample immersed in the surface treatment agent that remain on appointment fluid temperature, and continue the specified time thereafter, the water flushing, dry then on the copper surface, to form the chemical films of about 0.10～0.50 μ m of thickness.
Use infrared reflow stove (trade name: MULTI-PRO-306, make by Wei Teni company limited (ヴ イ ト ロ ニ Network ス society)), make surface-treated test sample stand three reflux circulations, wherein peak temperature is 245 ℃, uses the wave soldering device to weld (conveyor speed: 1.0m/min) subsequently.
The scolder that uses is the lead-free solder with following composition: 96.5% tin, 3.0% silver and 0.5% copper (wt%) (trade name: H705 " ECOSOLDER ", make by Senju Metal Industry Co., Ltd (thousand live metal industry)), and the flux that is used to weld is that JS-E-09 (by the great (Hong Hui of brightness Co., Ltd.) makes).Welding temperature is 245 ℃.
For the test sample of welding, calculating wherein, scolder is filled up to the ratio (%) of the copper vias number (i.e. Han Jie through hole) on its top with respect to total via count (300 holes).
When the lip-deep solder wettability of copper was big, the fused scolder infiltrated through each copper perforated interior, and the fused scolder is filled up to through hole the top of perforation easily thus.That is to say,, will judge that the wettability of scolder on copper is good, and weldability also is judged to be satisfaction when scolder is filled to the ratio of perforation on its top when big.
The evaluation test of scolder spreadability
The printed wiring board of the 50mm that use is made by glass-epoxy (length) * 50mm (wide) * 1.2mm (thick) is as test sample, described printed wiring board has circuit pattern, and wherein to have formed 10 conductor widths and be 0.80mm and length be 20mm, be spaced apart the copper foil circuit part of 1.0mm on width.This test sample is carried out degreasing, stand microetch, water flushing then., test sample immersed remain in the surface treatment agent of specifying fluid temperature also lasting specified time thereafter, the water flushing, dry then on the copper surface, to form the chemical films of about 0.10～0.50 μ m of thickness.
Use infrared reflow stove (trade name: MULTI-PRO-306 is made by Wei Teni company limited (ヴ イ ト ロ ニ Network ス society)), make surface-treated test sample stand a reflux circulation, wherein peak temperature is 245 ℃.Thereafter, using the aperture is that the metal mask of 150 μ m is printed onto the center of copper circuit with solder paster as 1.2mm and thickness, and carries out reflux under these conditions to finish welding.About this point, the solder paster of use is the lead-free solder with following composition: the silver of 96.5% tin 3.0% and 0.5% copper (wt%) (trade name: M705-221BM5-42-11 is made by Senju Metal Industry Co., Ltd).
Measure scolder wetting and length of sprawling on the copper circuit part of gained test sample.
When length is longer, is good with the wettability of judging scolder, and judges that weldability is for satisfied.
[embodiment 1]
Will be as 2 of imidazolium compounds, 4-phenylbenzene-5-Methylimidazole, acetate and glyconic acid as solubilizing agent, neutralized verdigris as metal-salt, and be dissolved in the ion exchanged water as the ammonium iodide of halogen compounds, the feasible composition that has described in table 1 is regulated pH value to 3.6 with ammoniacal liquor, makes surface treatment agent thus.
Then, the test sample of printed wiring board immersed in the water-soluble pre-flux that is controlled at 40 ℃ continue 60 seconds, the water flushing, dry then, thereafter, measure the upstream rate performance of scolder and the spreadability of scolder.These test-results are shown in Table 1.
[embodiment 2～9, comparative example 1～9]
With with embodiment 1 in identical mode prepared have various described in table 1 surface treatment agent of composition and pH value, and make it under the treatment condition described in table 1, experience surface treatment.Carried out evaluation test thereafter.These test-results are as shown in table 1.
Although the present invention is described in detail, to those skilled in the art,, be conspicuous to its variations and modifications that can make in its spirit and scope with reference to its specific embodiments.
The Japanese patent application 2006-140229 that the application submitted to based on May 19th, 2006, its full content is incorporated into herein as a reference.
Industrial applicibility
According to the present invention, can provide a kind of metal surface treatment agent, with electronic unit etc. Be welded in the process on metallic conduction surface partly, described metallic conduction partly consists of printing cloth The circuit part of line plate, described surface conditioning agent is wetting to the metallic conduction part surface of scolder The property aspect is good.
In addition, according to the present invention, can provide a kind of printed wiring board, wherein chemical films is passed through Above-mentioned surface conditioning agent is contacted and in described metallic conduction part with the metallic conduction part surface Form on the surface, and a kind of method for the production of printed wiring board is provided, wherein by making Above-mentioned surface conditioning agent contacts with the metallic conduction part surface and partly shows at described metallic conduction Form chemical films on the face, use then lead-free solder to weld.
Claims (4)
1. metal surface treatment agent, it comprises imidazolium compounds and glyconic acid compound.
2. metal surface treatment agent as claimed in claim 1, it comprises the glyconic acid compound that imidazolium compounds that ratio is 0.01～10wt% and ratio are 0.01～50wt%.
3. a printed wiring board wherein contacts with the surface treatment agent of claim 1～2 by the surface that makes the metallic conduction part, thereby forms chemical films on the surface of described metallic conduction part.
4. a method of making printed wiring board wherein contacts with the surface treatment agent of claim 1～2 by the surface that makes the metallic conduction part, thereby forms chemical films on the surface of described metallic conduction part, uses lead-free solder to weld then.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP140229/2006 | 2006-05-19 | ||
| JP2006140229A JP5036216B2 (en) | 2006-05-19 | 2006-05-19 | Metal surface treatment agent and use thereof |
| PCT/JP2007/060074 WO2007135930A1 (en) | 2006-05-19 | 2007-05-16 | Metal surface treatment agent and use of same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101448978A true CN101448978A (en) | 2009-06-03 |
| CN101448978B CN101448978B (en) | 2012-06-13 |
Family
ID=38723243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800183617A Expired - Fee Related CN101448978B (en) | 2006-05-19 | 2007-05-16 | Metal surface treatment agent and use of same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5036216B2 (en) |
| KR (1) | KR101298386B1 (en) |
| CN (1) | CN101448978B (en) |
| TW (1) | TWI393804B (en) |
| WO (1) | WO2007135930A1 (en) |
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| JPS6192778A (en) * | 1984-10-09 | 1986-05-10 | C Uyemura & Co Ltd | Parts to be soldered |
| JP2558982B2 (en) * | 1991-12-25 | 1996-11-27 | 日鉱金属株式会社 | Sealing method for precious metal plating |
| JPH1046385A (en) * | 1996-08-02 | 1998-02-17 | Daiwa Kasei Kenkyusho:Kk | Electric and electronic circuit parts |
| JP3579550B2 (en) * | 1996-09-30 | 2004-10-20 | 株式会社大和化成研究所 | Electrical and electronic circuit components |
| DE10050862C2 (en) * | 2000-10-06 | 2002-08-01 | Atotech Deutschland Gmbh | Bath and method for electroless deposition of silver on metal surfaces |
| JP2003328182A (en) * | 2002-05-13 | 2003-11-19 | Yutaka Fujiwara | Tin-silver alloy plating bath for rackless plating |
| JP2004176179A (en) * | 2002-11-15 | 2004-06-24 | Chubu Kiresuto Kk | Water soluble treatment agent for improving solder wettability of electronic component terminal, and treatment method therefor |
| ATE474944T1 (en) * | 2003-03-19 | 2010-08-15 | Shikoku Chem | SOLDERING PROCESS USING AN IMIDAZOLE COMPOUND |
| JP2005008975A (en) * | 2003-06-20 | 2005-01-13 | Nippon Paint Co Ltd | Metal surface treatment method, surface-treated aluminum based metal and pretreatment method to hydrophilic treatment |
| JP2005169495A (en) * | 2003-11-18 | 2005-06-30 | Yoshihiro Miyano | Pre-flux, flux, solder paste and fabrication method of structure joined with lead-free solder |
| JP2005179765A (en) * | 2003-12-24 | 2005-07-07 | Nikko Materials Co Ltd | Surface treatment agent for copper and copper alloy |
| US20050217757A1 (en) * | 2004-03-30 | 2005-10-06 | Yoshihiro Miyano | Preflux, flux, solder paste and method of manufacturing lead-free soldered body |
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2006
- 2006-05-19 JP JP2006140229A patent/JP5036216B2/en not_active Expired - Fee Related
-
2007
- 2007-05-16 WO PCT/JP2007/060074 patent/WO2007135930A1/en active Application Filing
- 2007-05-16 CN CN2007800183617A patent/CN101448978B/en not_active Expired - Fee Related
- 2007-05-16 KR KR1020087028096A patent/KR101298386B1/en active IP Right Grant
- 2007-05-18 TW TW096117828A patent/TWI393804B/en not_active IP Right Cessation
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Also Published As
| Publication number | Publication date |
|---|---|
| CN101448978B (en) | 2012-06-13 |
| JP2007308776A (en) | 2007-11-29 |
| TWI393804B (en) | 2013-04-21 |
| JP5036216B2 (en) | 2012-09-26 |
| KR20090009249A (en) | 2009-01-22 |
| WO2007135930A1 (en) | 2007-11-29 |
| TW200804622A (en) | 2008-01-16 |
| KR101298386B1 (en) | 2013-08-20 |
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