CN101442109A - Organic electroluminescent device and down-lead structure, mask plate, drive chip thereof - Google Patents
Organic electroluminescent device and down-lead structure, mask plate, drive chip thereof Download PDFInfo
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- CN101442109A CN101442109A CNA2008101917741A CN200810191774A CN101442109A CN 101442109 A CN101442109 A CN 101442109A CN A2008101917741 A CNA2008101917741 A CN A2008101917741A CN 200810191774 A CN200810191774 A CN 200810191774A CN 101442109 A CN101442109 A CN 101442109A
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- lead
- contact conductor
- row
- chip
- bang ding
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- 239000004020 conductor Substances 0.000 claims description 64
- 238000005401 electroluminescence Methods 0.000 claims description 24
- 238000005452 bending Methods 0.000 abstract description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 11
- 239000000758 substrate Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses an organic light emitting display (OLED), as well as a lead wire structure, a mask plate and a driving chip thereof. A column lead wire is directly extended to a binding zone from a luminous zone; a row lead wire is led out to be parallel to the column lead wire and then is directly extended to the binding zone; the row lead wire and the column lead wire are led out to the binding zone respectively and then are connected with the driving chip; the pin interval of the driving chip is identical with the interval between the row lead wire and the column lead wire which are led out to the binding zone; or the row lead wire and the column lead wire are led out to the binding zone respectively and then are connected with the driving chip through a connecting piece; and the connecting piece is a printed circuit board preferably, and is a flexible printed circuit board more preferably. The invention has the advantages of reducing the bending in the lead wire structure of the prior OLED, reducing resistance and improving luminance uniformity.
Description
Technical field
The present invention relates to the screen body design of organic electroluminescent device OLED (Organic Light Emitting Display), particularly the laying structure of contact conductor.
Background technology
The mode that at present a lot of display devices mostly adopt single-chip to drive, the area of electrode district are usually much larger than the area of chip for driving.In order to cooperate the pin-pitch of chip for driving, contact conductor must carry out curved design, and as shown in Figure 1: monolateral contact conductor has 6 curved design, and the both sides symmetry is totally 12 curved design.
The overall width of each crooked rank rear lead-in wire and the overall width of line lead all can diminish.Through measuring, line lead becomes original about 1/2nd through 4 crooked back overall widths, and the row lead-in wire also is original about 1/2nd through 2 crooked back overall widths.The contact conductor overall width narrows down, and corresponding resistance will become greatly, and driving voltage will raise, and the power consumption of screen body will become big; If do not raise driving voltage, the brightness of screen body will step-down, does not reach instructions for use.Along with the increase of screen size, the contact conductor number increases, and this phenomenon can be more serious.
And, because angle of bend difference, the change width of each bar lead-in wire is different, changes in resistance is also just different, and especially organic electroluminescent device OLED generally uses chrome substrate or molybdenum substrate at present, and the resistivity of these two kinds of metals itself is just bigger, contact conductor is long again, the caused resistance variations of the variation of contact conductor width will be more obvious, causes the brightness irregularities of each light emitting pixel under identical driving voltage, thereby influence the imaging results of entire display screen.
In addition, repeatedly bending causes contact conductor preparation process complexity, and the contact conductor number of bends is many, and it is complicated that the used mask plate of this lead-in wire of etching becomes, and the expense of making mask plate increases.
The Chinese patent (patent No. is 200520047933.2) of authorizing on January 24th, 2007 discloses a kind of electrode lead layout structure of organic electroluminescence device, proposition acutangulates line lead and horizontal line and changes the right angle into to enlarge the live width of line lead, and select the material of silver alloy for use, thereby reduce resistance as contact conductor.But this scheme can increase the shared area of contact conductor, reduces the shared proportion in viewing area in the whole display device.Do not solve the repeatedly problem of the crooked complex process that causes of contact conductor yet.And, select for use silver alloy can increase manufacturing cost.
Summary of the invention
In order to address the above problem, the present invention at first proposes the bending of a kind of minimizing lead-in wire, reduces resistance, improves the inhomogeneity electrode lead layout structure of light emitting pixel.
Purpose of the present invention can be achieved through the following technical solutions: first contact conductor directly extends to the Bang Ding district by electrode district, and second contact conductor directly extends to the Bang Ding district after leading to the direction parallel with first contact conductor.Described first contact conductor is the row lead-in wire, and second contact conductor is a line lead.The row lead-in wire leads to back, Bang Ding district respectively with line lead and is connected with chip for driving.The pin-pitch of described chip for driving is consistent with spacing after row, column leads to the Bang Ding district.
Purpose of the present invention can also be achieved through the following technical solutions: first contact conductor directly extends to the Bang Ding district by electrode district, and second contact conductor directly extends to the Bang Ding district after leading to the direction parallel with first contact conductor.Described first contact conductor is the row lead-in wire, and second contact conductor is a line lead.The row lead-in wire leads to back, Bang Ding district respectively with line lead and is connected with chip for driving by connector.Described connector is printed circuit board (PCB), preferably flexible printed circuit board.
The present invention also provides a kind of used mask plate of described contact conductor for preparing.
Purpose of the present invention can be achieved through the following technical solutions: the openwork part of described mask plate is corresponding with the figure of contact conductor.
Purpose of the present invention can also be achieved through the following technical solutions: the openwork part of described mask plate is corresponding with the figure of contact conductor gap portion.
The present invention also provide a kind of adopt described minimizing lead-in wire crooked, reduce resistance, improve the organic electroluminescence device of the inhomogeneity electrode lead layout structure of light emitting pixel.
Purpose of the present invention can be achieved through the following technical solutions: first contact conductor directly extends to the Bang Ding district by electrode district, and second contact conductor directly extends to the Bang Ding district after leading to the direction parallel with first contact conductor.Described first contact conductor is the row lead-in wire, and second contact conductor is a line lead.Described row lead-in wire leads to back, Bang Ding district respectively with line lead and is connected with chip for driving.The pin-pitch of described chip for driving is consistent with spacing after row, column leads to the Bang Ding district.
Purpose of the present invention can also be achieved through the following technical solutions: first contact conductor directly extends to the Bang Ding district by electrode district, and second contact conductor directly extends to the Bang Ding district after leading to the direction parallel with first contact conductor.Described first contact conductor is the row lead-in wire, and second contact conductor is a line lead.Described row lead-in wire leads to back, Bang Ding district respectively with line lead and is connected with chip for driving by connector.Described connector is printed circuit board (PCB), preferably flexible printed circuit board.
The present invention also provides a kind of chip for driving of organic electroluminescence device, comprises horizontal drive circuit, and column drive circuit, data output pin, horizontal drive circuit, column drive circuit are connected with organic electroluminescence device line lead, row lead-in wire respectively.Purpose of the present invention can be achieved through the following technical solutions: the spacing of the data output pin of described chip for driving is consistent with spacing after the row, column of organic electroluminescence device leads to the Bang Ding district.
Description of drawings
Fig. 1 is the schematic diagram of existing organic electroluminescence device electrode lead layout structure;
Fig. 2 is the fixed schematic diagram of existing organic electroluminescence device display screen and chip for driving nation;
Fig. 3 directly extends to the Bang Ding district for the present invention is listed as lead-in wire, line lead lead to be listed as the parallel direction of lead-in wire after directly extend to the schematic diagram in Bang Ding district;
Fig. 4 is the schematic diagram of contact conductor mask plate of the present invention;
Fig. 5 leads to back, Bang Ding district and the fixed schematic diagram of chip for driving nation respectively for row, column lead-in wire of the present invention;
Fig. 6 leads to the schematic diagram that back, Bang Ding district is connected with connector respectively for row, column lead-in wire of the present invention;
Fig. 7 lays the situation schematic diagram for the circuit of connector of the present invention;
Fig. 8 leads to back, Bang Ding district respectively by the fixed schematic diagram of connector and chip for driving nation for row, column line of the present invention;
Wherein, description of reference numerals is as follows:
The 1-substrate; The 2-electrode district; 3-Bang Ding district; 4-chip for driving A; 5-chip for driving B; The 6-flexible printed circuit board; 11,12-bending 1; 21,22-bending 2; 31,32-bending 3; 41,42-bending 4; 51,52-bending 5; 61,62-bending 6.
Embodiment
Embodiment one provides a kind of electrode lead layout structure of organic electroluminescence device.As shown in Figure 3, first contact conductor is the row lead-in wire, and second contact conductor is a line lead.The row lead-in wire directly extends to Bang Ding district 3 by electrode district 2, and line lead directly extends to the Bang Ding district after leading to the direction parallel with being listed as lead-in wire.Compare with the electrode lead layout structure of existing organic electroluminescence device shown in Figure 1, crooked 3 (31,32), crooked 4 (41,42), crooked 5 (51,52), crooked 6 (61,62) have not just existed.
During this pin configuration of etching, with cleaning agent and deionized water ito substrate 1 is cleaned and drying earlier, resist coating and baking on the conductor planes of ito substrate, mask plate of the present invention is covered on the photoresist, pass through mask plate photolithography glue surface with ultraviolet light (UV), photoresist is carried out the selectivity exposure, through development, post bake, etch pin configuration of the present invention again.
It is fixed with chip for driving B (5) nation that row lead-in wire and line lead lead to back, Bang Ding district respectively.Chip for driving B comprises horizontal drive circuit, and column drive circuit, data output pin, horizontal drive circuit, column drive circuit are connected with organic electroluminescence device line lead, row lead-in wire respectively.The spacing of the data output pin of chip for driving B is consistent with spacing after the row, column of organic electroluminescence device leads to the Bang Ding district.
Embodiment two provides a kind of electrode lead layout structure of organic electroluminescence device equally.As shown in Figure 8, first contact conductor is the row lead-in wire, and second contact conductor is a line lead.The row lead-in wire directly extends to Bang Ding district 3 by electrode district 2, and line lead directly extends to the Bang Ding district after leading to the direction parallel with being listed as lead-in wire.The process of this pin configuration of etching is as described in the embodiment one.It is fixed with chip for driving A (4) nation by flexible printed circuit board 6 that row lead-in wire and line lead lead to back, Bang Ding district respectively.The internal wiring laying structure of flexible printed circuit board as shown in Figure 7.
According to the electrode lead layout structure that embodiment one provides, to compare with the contact conductor structure of existing organic electroluminescence device, crooked number of times significantly reduces, thereby has simplified the etching technics of contact conductor.The overall width of contact conductor broadens, and corresponding resistance decreasing can be saved power consumption under the situation that does not change driving voltage.If contact conductor is through repeatedly crooked, each bar lead-in wire causes resistance variations situation difference because of the difference of angle of bend, and therefore the uniformity of light emitting pixel is affected.The electrode laying structure that adopts embodiment one to provide can greatly improve the uniformity of light emitting pixel, thereby improves the imaging results of entire display screen.
According to the electrode lead layout structure that embodiment two provides, compare with the contact conductor structure of existing organic electroluminescence device, need on substrate, the lead-in wire bending of etching significantly reduce.And contact conductor is connected with chip for driving by flexible printed circuit board, is equivalent to the bending that existing contact conductor is on the substrate is transferred on the flexible printed circuit board.Organic electroluminescence device generally uses chrome substrate or molybdenum substrate at present, and flexible printed circuit board generally adopts copper, the resistivity of copper is much smaller than molybdenum or chromium, even the overall width of crooked influence lead-in wire occurs, to whole piece lead resistance influence also is very little, also is very little for the uniformity influence of power consumption and light emitting pixel.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; anyly be familiar with this technology personage; without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations; therefore, protection scope of the present invention is as the criterion when the claim with application defines.
Claims (17)
1, a kind of electrode lead layout structure, comprise first contact conductor, second contact conductor, it is characterized in that first contact conductor directly extends to the Bang Ding district by electrode district, second contact conductor directly extends to the Bang Ding district after leading to the direction parallel with first contact conductor.
2, electrode lead layout structure according to claim 1 is characterized in that, described first contact conductor is the row lead-in wire, and second contact conductor is a line lead.
3, electrode lead layout structure according to claim 2 is characterized in that, described row lead-in wire leads to back, Bang Ding district respectively with line lead and is connected with chip for driving.
4, electrode lead layout structure according to claim 3 is characterized in that, the pin-pitch of described chip for driving is consistent with spacing after row, column leads to the Bang Ding district.
5, electrode lead layout structure according to claim 2 is characterized in that, the row lead-in wire leads to back, Bang Ding district respectively with line lead and is connected with chip for driving by connector.
6, electrode lead layout structure according to claim 5 is characterized in that, described connector is a printed circuit board (PCB).
7, electrode lead layout structure according to claim 6 is characterized in that, described connector is a flexible printed circuit board.
8, a kind of used mask plate of the described contact conductor of claim 1 for preparing is characterized in that the openwork part of mask plate is corresponding with the figure of contact conductor.
9, a kind of used mask plate of the described contact conductor of claim 1 for preparing is characterized in that the openwork part of mask plate is corresponding with the figure of contact conductor gap portion.
10, a kind of organic electroluminescence device that adopts the described electrode lead layout structure of claim 1, it is characterized in that, first contact conductor directly extends to the Bang Ding district by electrode district, and second contact conductor directly extends to the Bang Ding district after leading to the direction parallel with first contact conductor.
11, organic electroluminescence device according to claim 10 is characterized in that, described first contact conductor is the row lead-in wire, and second contact conductor is a line lead.
12, organic electroluminescence device according to claim 11 is characterized in that, described row lead-in wire leads to back, Bang Ding district respectively with line lead and is connected with chip for driving.
13, organic electroluminescence device according to claim 12 is characterized in that, the pin-pitch of described chip for driving is consistent with spacing after row, column leads to the Bang Ding district.
14, organic electroluminescence device according to claim 11 is characterized in that, described row lead-in wire leads to back, Bang Ding district respectively with line lead and is connected with chip for driving by connector.
15, organic electroluminescence device according to claim 14 is characterized in that, described connector is a printed circuit board (PCB).
16, organic electroluminescence device according to claim 15 is characterized in that, described connector is a flexible printed circuit board.
17, a kind of chip for driving based on claim 1 or 10, comprise horizontal drive circuit, column drive circuit, the data output pin, horizontal drive circuit, column drive circuit are connected with organic electroluminescence device line lead, row lead-in wire respectively, it is characterized in that the described line lead of the spacing of data output pin is consistent with the lead spacing that row lead to behind the Bang Ding district.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101917741A CN101442109B (en) | 2008-08-20 | 2008-12-31 | Organic electroluminescent device and down-lead structure, mask plate, drive chip thereof |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810124652.0 | 2008-08-20 | ||
| CN200810124652 | 2008-08-20 | ||
| CN2008101917741A CN101442109B (en) | 2008-08-20 | 2008-12-31 | Organic electroluminescent device and down-lead structure, mask plate, drive chip thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101442109A true CN101442109A (en) | 2009-05-27 |
| CN101442109B CN101442109B (en) | 2011-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008101917741A Expired - Fee Related CN101442109B (en) | 2008-08-20 | 2008-12-31 | Organic electroluminescent device and down-lead structure, mask plate, drive chip thereof |
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| Country | Link |
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| CN (1) | CN101442109B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894857B (en) * | 2010-02-08 | 2012-11-07 | 昆山维信诺显示技术有限公司 | Organic light emitting device |
| CN103324035A (en) * | 2013-06-20 | 2013-09-25 | 深圳市华星光电技术有限公司 | Mask plate and manufacture method of array base plate |
| CN105203825A (en) * | 2015-08-31 | 2015-12-30 | 国家纳米科学中心 | Manufacturing method of micro measuring electrode, measuring method of thermoelectrical potential and related device |
| CN109698216A (en) * | 2017-10-20 | 2019-04-30 | 昆山维信诺科技有限公司 | Flexible display screen |
-
2008
- 2008-12-31 CN CN2008101917741A patent/CN101442109B/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894857B (en) * | 2010-02-08 | 2012-11-07 | 昆山维信诺显示技术有限公司 | Organic light emitting device |
| CN103324035A (en) * | 2013-06-20 | 2013-09-25 | 深圳市华星光电技术有限公司 | Mask plate and manufacture method of array base plate |
| WO2014201730A1 (en) * | 2013-06-20 | 2014-12-24 | 深圳市华星光电技术有限公司 | Mask plate and manufacturing method of array substrate |
| CN103324035B (en) * | 2013-06-20 | 2015-07-01 | 深圳市华星光电技术有限公司 | Mask plate and manufacture method of array base plate |
| KR20160018708A (en) * | 2013-06-20 | 2016-02-17 | 센젠 차이나 스타 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드 | Mask plate and manufacturing method of array substrate |
| GB2529790A (en) * | 2013-06-20 | 2016-03-02 | Shenzhen China Star Optoelect | Mask plate and manufacturing method of array substrate |
| KR101708158B1 (en) * | 2013-06-20 | 2017-02-17 | 센젠 차이나 스타 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드 | Mask plate and manufacturing method of array substrate |
| RU2619817C1 (en) * | 2013-06-20 | 2017-05-18 | Шэньчжэнь Чайна Стар Оптоэлектроникс Текнолоджи Ко., Лтд. | Method for producing mask plate and matrix substrate |
| GB2529790B (en) * | 2013-06-20 | 2019-12-11 | Shenzhen China Star Optoelect | Manufacturing method of mask plate and array substrate |
| CN105203825A (en) * | 2015-08-31 | 2015-12-30 | 国家纳米科学中心 | Manufacturing method of micro measuring electrode, measuring method of thermoelectrical potential and related device |
| CN105203825B (en) * | 2015-08-31 | 2018-02-13 | 国家纳米科学中心 | The preparation method of micro- measuring electrode and the measuring method of thermoelectrical potential and relevant apparatus |
| CN109698216A (en) * | 2017-10-20 | 2019-04-30 | 昆山维信诺科技有限公司 | Flexible display screen |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101442109B (en) | 2011-08-10 |
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Granted publication date: 20110810 Termination date: 20161231 |