CN101435061B - Process for improving hardness of copper alloy - Google Patents
Process for improving hardness of copper alloy Download PDFInfo
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- CN101435061B CN101435061B CN2008101364601A CN200810136460A CN101435061B CN 101435061 B CN101435061 B CN 101435061B CN 2008101364601 A CN2008101364601 A CN 2008101364601A CN 200810136460 A CN200810136460 A CN 200810136460A CN 101435061 B CN101435061 B CN 101435061B
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- copper alloy
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- compressive stress
- stress state
- mould
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Abstract
The invention relates to a technique for improving the hardness of copper alloy. After carrying out annealing heat treatment or solid solution treatment, the copper alloy is placed into a mold, pressure is applied to the copper alloy material, and cold deformation is carried out in a three-dimensional compressive stress state so as to improve the hardness of the copper alloy. The invention can lead the copper alloy to obtain high hardness, with all parts of the material having uniform hardness and the hardness value being stable, thus being capable of being widely used for manufacturing large-power or superpower conductive switching elements and obviously improving the service life and reliability of the conductive switching elements.
Description
Affiliated technical field
The invention belongs to a kind of metal material processing method, particularly relate to a kind of technology that improves hardness of copper alloy.
Background technology
At present, it is as follows to improve Cu alloy material hardness value method: by the cold deformation of one-way compressive stress state, improve material hardness value (different trade mark materials, the hardness value difference), its technical process is: blanking---heating---thermal distortion base---polishing---annealing thermal treatment or solution treatment---cold deformation---moulding, and cold deformation is to finish at the one-way compressive stress state, and its deformation extent is generally 40%～80%.In this process, the cold deformation degree is big more, and hardness value is high more, but the limitation that hardness value improves is very big.Its main drawback is: material hardness raising amount is little, unstable, inhomogeneous, and inner hardness value is starkly lower than the surface hardness value, and process cycle is long, and complicated operation has increased tooling cost.
Summary of the invention
In order to improve Cu alloy material hardness, guarantee the stability and the homogeneity of material hardness value, a kind of technology that improves hardness of copper alloy is provided, with the cold deformation under the one-way compressive stress state, change into the cold deformation under the three-dimensional compressive stress state.
For achieving the above object, the present invention finishes by the following technical programs, a kind of technology that improves hardness of copper alloy,---heating---thermal distortion base---polishing---annealing thermal treatment or solution treatment------cold deformation of three-dimensional compressive stress state---moulding of putting into mould that its technical process is: blanking, after annealed thermal treatment of copper alloy or the solution treatment, put into mould, the copper alloy blank is exerted pressure, make the generation plasticity cold deformation of copper alloy blank and be full of mold cavity, reach copper alloy and under the three-dimensional compressive stress state, produce the cold deformation effect; The minimum wall thickness (MINI W.) of described mould is 1～1.5 times of the diameter of equivalent circle of the horizontal maximum cross-section of die cavity, and the hardness of mould is HRC35～50; Described moulding stock is a metallic substance; The volumetrical ratio of the volume of described copper alloy blank and mold cavity is 1.05～1.15; It is characterized in that: the stress value of described three-dimensional compressive stress state is 1.5～3 times of material yield intensity level.
The present invention can make copper alloy obtain high hardness value, and the hardness at each position of material is even, and hardness value is stable, can be widely used in to make high-power or superpower conduction switchover element, can significantly improve conduction switchover element work-ing life and reliability.
Embodiment
Below the present invention is done into-goes on foot explanation: a kind of technology that improves hardness of copper alloy,---heating---thermal distortion base---polishing---annealing thermal treatment or solution treatment------cold deformation of three-dimensional compressive stress state---moulding of putting into mould that its technical process is: blanking, after annealed thermal treatment of copper alloy or the solution treatment, put into mould, the copper alloy blank is exerted pressure, make the generation plasticity cold deformation of copper alloy blank and be full of mold cavity, reach copper alloy and under the three-dimensional compressive stress state, produce the cold deformation effect; The minimum wall thickness (MINI W.) of described mould is 1～1.5 times of the diameter of equivalent circle of the horizontal maximum cross-section of die cavity, and the hardness of mould is HRC35～50; Described moulding stock is a metallic substance; The volumetrical ratio of the volume of described copper alloy blank and mold cavity is 1.05～1.15; It is characterized in that: the stress value of described three-dimensional compressive stress state is 1.5～3 times of material yield intensity level.
Embodiment 1: by the physical dimension requirement designing mould of product, the structural strength of mould can be born the surging force of 5.5 times of Cu alloy material yield strength values, the volumetrical of pressing mold cavity calculates QBe2 copper alloy stock volume for 1.10 times, and make the shape of the shape approximation die cavity of QBe2 copper alloy, the Heating temperature of solution treatment is 780 ± 10 ℃, soaking time is by every millimeter calculating in 2 minutes, water-cooled cooling, to put into mould through solution treatment QBe2 copper alloy blank again, cold-forming in mould, cold plastic deformation degree 12%, the stress value of three-dimensional compressive stress state are 2.5 times of material yield intensity level, and the material Brinell hardness can reach HB=255.
Embodiment 2: by the physical dimension requirement designing mould of product, the structural strength of mould can be born the surging force of 5 times of Cu alloy material yield strength values, the volumetrical of pressing mold cavity calculates QCd1 copper alloy stock volume for 1.05 times, and make the shape of the shape approximation die cavity of QCd1 copper alloy blank, again QCd1 copper alloy blank is put into mould, cold-forming in mould, cold plastic deformation degree 15%, the stress value of three-dimensional compressive stress state is 2 times of material yield intensity level, and the material Brinell hardness can reach HB=150.
Claims (1)
1. technology that improves hardness of copper alloy,---heating---thermal distortion base---polishing---annealing thermal treatment or solution treatment------cold deformation of three-dimensional compressive stress state---moulding of putting into mould that its technical process is: blanking, after annealed thermal treatment of copper alloy or the solution treatment, put into mould, the copper alloy blank is exerted pressure, make the generation plasticity cold deformation of copper alloy blank and be full of mold cavity, reach copper alloy and produce the cold deformation effect under the three-dimensional compressive stress state, it is characterized in that: the stress value of described three-dimensional compressive stress state is 1.5～3 times of material yield intensity level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101364601A CN101435061B (en) | 2008-12-15 | 2008-12-15 | Process for improving hardness of copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101364601A CN101435061B (en) | 2008-12-15 | 2008-12-15 | Process for improving hardness of copper alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101435061A CN101435061A (en) | 2009-05-20 |
| CN101435061B true CN101435061B (en) | 2011-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101364601A Active CN101435061B (en) | 2008-12-15 | 2008-12-15 | Process for improving hardness of copper alloy |
Country Status (1)
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| CN (1) | CN101435061B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102002656B (en) * | 2010-11-10 | 2012-04-25 | 中南大学 | Method for refining separated or dispersion-strengthening type block copper alloy crystal particles |
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- 2008-12-15 CN CN2008101364601A patent/CN101435061B/en active Active
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| CN101435061A (en) | 2009-05-20 |
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Application publication date: 20090520 Assignee: JIANGSU HONGDU INTERNATIONAL ELECTROMECHANICAL CO., LTD. Assignor: Hongdu Aviation Industry Group Co., td., Jiangxi Prov. Contract record no.: 2014360000071 Denomination of invention: Process for improving hardness of copper alloy Granted publication date: 20110126 License type: Exclusive License Record date: 20140422 |
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