CN101434744B - Mixture and encapsulating material - Google Patents

Mixture and encapsulating material Download PDF

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CN101434744B
CN101434744B CN 200710187104 CN200710187104A CN101434744B CN 101434744 B CN101434744 B CN 101434744B CN 200710187104 CN200710187104 CN 200710187104 CN 200710187104 A CN200710187104 A CN 200710187104A CN 101434744 B CN101434744 B CN 101434744B
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parts
mixture
weight
mixed
greater
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CN101434744A (en
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林志祥
庄雅岚
蔡佩容
叶淑铃
吴志郎
康清炬
高信敬
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财团法人工业技术研究院
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Abstract

本发明提供一种混掺物,包括20至80重量份的聚碳酸酯;20至80重量份的聚芳酯;以及20至80重量份的共聚物;且共聚物具有结构式如下:其中R1是环己烷二甲基、乙烯基、2-甲基丙基、及新戊基至少二者的组合物;R2是萘基、苯基、丁基、及己基至少二者的组合物;以及n是1500-3000。 The present invention provides a composition of Mixed, comprising 20 to 80 parts by weight of a polycarbonate; 20 to 80 parts by weight of a polyarylate; and 20 to 80 parts by weight of the copolymer; and copolymers having the following structural formula: wherein R1 is dimethyl cyclohexane, vinyl, 2-methylpropyl, neopentyl and the at least two compositions; R2 is naphthyl, phenyl, butyl, hexyl, and the at least two compositions; and n It is 1500-3000. 由于上述聚合物的高透明度,高耐热温度,高耐UV黄变性及高耐候性,因此适用于发光组件的封装材料。 Due to the high transparency of the above polymers, a high heat resistant temperature, high resistance to UV yellowing and high weather resistance, it is applied to the light emitting module packaging material.

Description

混慘物及封装材料 And encapsulating material mixture was miserable

技术领域 FIELD

[0001] 本发明是涉及一种混掺物,更特别涉及此混掺物于封装材料的应用及其组成。 [0001] The present invention relates to a doping mixture thereof, and more particularly relates to the application of this mixture was mixed with the encapsulating material and its composition.

背景技术 Background technique

[0002] 在发光组件的领域中,封装材料占有相当重要的地位。 [0002] In the field of light emitting module, the encapsulating material plays an important role. 以发光二极管(LED)为例,其封装用高分子材料需具备下列条件:透明度、耐热温度、结晶性、及耐碰撞性等性质。 Light emitting diode (LED) for example, the encapsulating polymer materials must have the following: properties of transparency, heat resistance temperature, crystallinity, and impact resistance, and the like. 聚酯这一公知的高分子已广泛应用于封装材料上,但此材料仍具有一些缺点。 This known polymer polyester has been widely used on the encapsulating material, but the material still has some disadvantages. 举例来说,聚碳酸酯(polycarbonate,以下简称PC)及聚芳酯(polyarylate,以下简称PAR)虽然具有不错的透明度及耐热温度(Tg > 100°C ),但耐UV黄变性及流动性较差。 For example, polycarbonate (Polycarbonate, hereinafter referred to as PC) and polyarylate (a polyarylate, hereinafter referred to as PAR) while having good transparency and heat resistance temperature (Tg> 100 ° C), but the UV yellowing resistance and flowability poor. 而对苯二甲酸乙二醇酯(以下简称PET)具有较佳的耐UV黄变性及流动性,但其耐热温度差(Tg约为70°C ),不符合LED其封装材料所需的高耐热温度(Tg > IOO0C )。 Have preferred UV yellowing resistance and the fluidity of the polyethylene terephthalate (hereinafter referred to as PET), but the difference in the heat resistance temperature (Tg about 70 ° C), does not meet the required LED encapsulating material a high heat resistant temperature (Tg> IOO0C). 为了解决此问题,部份工艺将PET所用的单体对苯二甲酸的苯基被置换成萘基,形成聚2,6_萘甲酸乙二酯(以下简称PENhPEN的结晶度远大于PET,其Tg约为108°C,可有效提升封装材料的耐热温度。不过PEN的结晶性太好,容易结晶而影响透明度,且不利后续高温融熔态的射出封装工艺。为了结合PET易于加工与PEN高耐热性的优点,已有公知技术采用混掺(blend)的方式结合这两种高分子。混掺的PET及PEN规格并不统一,只要PET及/或PEN的聚合度或比例不同即影响混掺物的性质,在实际应用上具有再现性及放大等问题。为了规格化封装材料的性质,目前需要设计新的封装材料以完成上述需求。 To solve this problem, part of the process the monomers used PET terephthalic acid is replaced with a naphthyl group phenyl, naphthyl 2,6_ acid form polyethylene terephthalate (hereinafter referred to as the degree of crystallinity is much larger than PENhPEN PET, which a Tg of about 108 ° C, can effectively enhance the heat resistance temperature of the encapsulating material, but good crystallinity of PEN, affect the transparency and readily crystallized, and adversely emits packaging process subsequent high temperature molten state. for ease of processing in conjunction with PET and PEN the advantages of high heat resistance, well-known prior art use of mixed (Blend) are incorporated in the two polymers. the mixture of PET and PEN doped specifications are not uniform, and as long as PET or proportion of different degrees of polymerization / or PEN i.e. Effect of mixed material properties, reproducibility and amplification problems in practical use. in order to normalize nature of the encapsulant, the current need to design new packaging material to the above requirements.

发明内容 SUMMARY

[0003] 本发明的目的在于提供一种既易于加工又具有高耐热性且在实际应用上易于规格化的新型材料,这种材料可以满足发光二极管等的封装材料的所需性质。 [0003] The object of the present invention is to provide an easily processed and has both high heat resistance and easily normalized In practice the new material, this material can meet the desired properties of the light-emitting diode encapsulating material.

[0004] 为了实现本发明的目的,`本发明提供一种混掺物,包括20至80重量份的聚碳酸酯;20至80重量份的聚芳酯;以及20至80重量份的共聚物,且共聚物具有如下式I的结构: [0004] To achieve the object of the present invention, the present invention provides a mix 'was mixed, comprising 20 to 80 parts by weight of a polycarbonate; 20 to 80 parts by weight of a polyarylate; and 20 to 80 parts by weight of the copolymer and copolymers having the structure of formula I:

O O O O

[。 [. . . 5] (式” 5] (Formula "

\ O O R? I \ O O R? I

n ; n;

[0006] 其中R1是环己烷二甲基、乙烯基、2-甲基丙基、及新戊基至少二者的组合物;R2是萘基、苯基、丁基、及己基至少二者的组合物;以及η是1500-3000。 [0006] wherein R1 is a dimethyl cyclohexane, vinyl, 2-methylpropyl, neopentyl and the at least two compositions; R2 is naphthyl, both phenyl, butyl, hexyl, and at least of the composition; and η is 1500-3000.

[0007] 本发明也提供一种封装材料,包括上述的混掺物。 [0007] The present invention also provides a packaging material comprising the above-described mixture was mixed.

[0008] 本发明提供的聚合物的混掺物具有耐热性好和易于加工的特点,在用于封装材料时,尤其是射出封装工艺时周期短,可有效减少时间成本;此外,该混掺物射出成型后的透明度大于85%,耐热温度大于100°C,耐候/耐UV黄变性均大于1500小时,有利于应用于发光组件的封装材料。 [0008] The present invention provides a composition of Mixed polymers having good heat resistance and ease of processing characteristics, when used in packaging materials, particularly packaging process emits short cycle time, can effectively reduce the time cost; In addition, the mixed after injection molding was doped transparency of greater than 85%, the heat resistance temperature of greater than 100 ° C, weathering / UV yellowing resistance greater than 1500 hours, the light emitting component is applied to facilitate the packaging material. 具体实施方式 Detailed ways

[0009] 为了提高封装材料的耐热性,本发明提供一种混掺物,包括20至80重量份的聚碳 [0009] In order to improve the heat resistance of the packaging material, the present invention provides a composition of Mixed, comprising 20 to 80 parts by weight of polycarbodiimide

酸酯;20至80重量份的聚芳酯;以及20至80重量份的共聚物且共聚物具有结构式如下: Acetate; 20 to 80 parts by weight of a polyarylate; and 20 to 80 parts by weight of the copolymer and the copolymer having the following structural formula:

Figure CN101434744BD00041

[0011] 其中R1是环己烷二甲基、乙烯基、2-甲基丙基、及新戊基至少二者的组合物;R2是萘基、苯基、丁基、及己基至少二者的组合物;以及η是1500-3000。 [0011] wherein R1 is a dimethyl cyclohexane, vinyl, 2-methylpropyl, neopentyl and the at least two compositions; R2 is naphthyl, both phenyl, butyl, hexyl, and at least of the composition; and η is 1500-3000. 在本发明部份实施例中,当R为环己烷二甲基与乙烯基的组合时,环己烷二甲基与乙烯基的摩尔比约为1: 99至99: 1,较佳环己烷二甲基与该乙烯基的摩尔比约为25: 75至35: 65。 In the present invention, part of the embodiment, when R is methyl and vinyl cyclohexane dicarboxylic composition, the molar ratio of vinyl cyclohexane and dimethyl about 1: 99 to 99: 1, preferably ring dimethyl hexane and the molar ratio of vinyl groups of about 25: 75-35: 65.

[0012] 上述混掺物的形成方式是利用物理混合(compounding)的方式,将不同比例的PAR、PC、及具有式I的共聚物混掺形成混掺物。 Is formed so [0012] The mixture was mixed using a physical mixture (Compounding) manner, different proportions of the PAR, PC, and copolymers of Formula I having a mixture of Mixed formed was doped. 以射出加工为例,螺杆的直径为45mm,进料口的温度约介于230-250 °C,射出段的温度约为介于250-270 °C,射出压力约介于100-200kg/cm2,射出后的成品的干燥温度及时间约为120°C *3小时。 Processing by injection, for example, a screw diameter of 45mm, inlet temperature of between about 230-250 ° C, a temperature of about emitting section between 250-270 ° C, an injection pressure of between about 100-200kg / cm2 drying temperature and time after finished emitted about 120 ° C * 3 hours. 以封装LED为例,射出周期(cycle time)约介于30至60秒,可有效减少时间成本。 To encapsulate the LED, for example, with the emission cycle (cycle time) between about 30 to 60 seconds, can effectively reduce the time cost. 由于混掺物射出成型后的透明度大于85%,耐热温度大于100°C,且耐UV黄变性及耐候性大于1500小时,本案的混掺物可应用于发光组件如OLED的封装材料。 Due to the transparency of Mixed injection molding was greater than 85%, the heat resistance temperature of greater than 100 ° C, and resistance to UV yellowing and weather resistance of more than 1500 hours in the case of Mixed composition may be applied to the light emitting component such as an OLED encapsulation material.

[0013] 为使本领域技术人员更清楚本发明的特征,特举例于下述实施例。 [0013] to enable those skilled in the art to more clearly features of the present invention, the following examples Laid example.

[0014] 实施例1 [0014] Example 1

[0015] 取3摩尔份的1,4_环己烷二甲醇(CHDM)、7摩尔份的乙二醇、以及10摩尔份的苯二甲酸置于圆底瓶后,加热至240-290°C后抽真空,进行酯化缩合反应形成PETG。 After [0015] 3 molar parts 1,4_ taken cyclohexanedimethanol (CHDM), 7 parts by mole of ethylene glycol, and 10 parts by mole of terephthalic acid into a round bottom flask and heated to 240-290 ° after evacuation C, an esterification reaction to form a condensation PETG. 取不同重量份的PETG、PC(旭美PC-175D)、PAR (Uni tikaU-po lymer ® )、及PEN(新光合纤)混掺后, Take different parts by weight of PETG, PC (Asahi US PC-175D), PAR (Uni tikaU-po lymer ®), and PEN (Sunbeam synthetic fiber) doped after mixing,

测量混掺物的粘度、Tg、透明度、以及耐UV黄变性等性质。 Properties of Mixed were measured viscosity, a Tg of, transparency, and resistance to UV yellowing. 上述混掺物组成的重量比与物理性质如表I所示。 The weight ratio of the above-described physical properties of Mixed composed as shown in Table I.

[0016]表 I [0016] TABLE I

[0017] [0017]

Figure CN101434744BD00042
Figure CN101434744BD00051

[0018] 聚合物的混掺物的透明度均能维持在85%以上,且耐候/耐UV黄变性均大于1500小时。 [0018] The transparency of the polymer mixture was mixed can be maintained above 85%, and the weather / UV yellowing resistance greater than 1500 hours. ` `

[0019] 虽然本发明已以数个较佳实施例揭露如上,然其并非用以限定本发明,任何所属技术领域中具有通常知识者,在不脱离本发明的精神和范围内,当可作任意的更动与润饰,因此本发明的保护范围当视后附的权利要求书所界定者为准。 [0019] Although the present invention has been described in several preferred embodiments, they are not intended to limit the present invention, any skilled in the art having ordinary knowledge in the present invention without departing from the spirit and scope, it is to be any alterations and modifications, and their equivalents therefore intended scope of the invention claimed in the appended claims as view.

Claims (5)

1.一种混掺物,包括: 20至80重量份的聚碳酸酯; 20至80重量份的聚芳酯;以及20至80重量份的共聚物,且该共聚物是取3摩尔份的1,4-环己烷二甲醇、7摩尔份的乙二醇、以及10摩尔份的苯二甲酸加热至240-290°C后抽真空进行酯化缩合反应而形成。 A mixture was mixed, comprising: 20 to 80 parts by weight of a polycarbonate; 20 to 80 parts by weight of a polyarylate; and 20 to 80 parts by weight of the copolymer, and the copolymer was taken 3 molar parts after 1,4-cyclohexanedimethanol, 7 mole parts of ethylene glycol, and 10 parts by mole of terephthalic acid was heated to 240-290 ° C vacuum esterification condensation reaction to form.
2.根据权利要求1所述的混掺物,其透明度大于85%。 The mixture was mixed according to claim 1, which is greater than 85% transparency.
3.根据权利要求1所述的混掺物,其耐热温度大于100°C。 The mixture was mixed according to claim 1, which is greater than the heat resistance temperature of 100 ° C.
4.根据权利要求1所述的混掺物,其耐UV黄变性及耐候性大于1500小时。 The mixture was mixed with claim 1, which is resistant to UV yellowing and weather resistance of greater than 1500 hours claims.
5.—种封装材料,包括权利要求1所述的混掺物。 5.- encapsulation material, comprising the composition as claimed in claim 1 doped mixture.
CN 200710187104 2007-11-14 2007-11-14 Mixture and encapsulating material CN101434744B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1037352A (en) 1988-03-04 1989-11-22 阿托化学公司 Compositions for making two incompatible thermoplastic polymers into compatible, use in producing thermoplastic blend plastics thereof and thermoplastic blended plastics obtained
WO2007001571A1 (en) 2005-06-17 2007-01-04 Eastman Chemical Company Thermoplastic articles comprising cyclobutanediol having a decorative material embedded therein

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1037352A (en) 1988-03-04 1989-11-22 阿托化学公司 Compositions for making two incompatible thermoplastic polymers into compatible, use in producing thermoplastic blend plastics thereof and thermoplastic blended plastics obtained
WO2007001571A1 (en) 2005-06-17 2007-01-04 Eastman Chemical Company Thermoplastic articles comprising cyclobutanediol having a decorative material embedded therein

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