CN101425561A - Organic semiconductor element having multiple protection layers and preparation thereof - Google Patents
Organic semiconductor element having multiple protection layers and preparation thereof Download PDFInfo
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- CN101425561A CN101425561A CNA2008101802235A CN200810180223A CN101425561A CN 101425561 A CN101425561 A CN 101425561A CN A2008101802235 A CNA2008101802235 A CN A2008101802235A CN 200810180223 A CN200810180223 A CN 200810180223A CN 101425561 A CN101425561 A CN 101425561A
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Abstract
The invention relates to an organic semiconductor component with a plurality of protective layers, which comprises an organic thin film transistor, a first protective layer formed on the organic thin film transistor in a gas-phase deposition manner and a second protective layer formed on the first protective layer. The invention also relates to a manufacturing method of the organic semiconductor component with the plurality of protective layers. The manufacturing method comprises the following steps: providing the organic thin film transistor, forming the first protective layer on the organic thin film transistor in a gas phase deposition manner; and forming the second protective layer on the first protective layer. Through forming the second protective layer on the first protective layer manufactured in a gas-phase deposition manner, the multiplex protective layers of the organic thin film transistor are formed, have good uniformity, and can achieve the effect of protecting the organic thin film transistor; and liquid crystal can be matched by utilizing the second protective layer. Therefore, the organic semiconductor component with the protective layers can be widely applied.
Description
The application is dividing an application at original bill application (application number: 200510064320.4, the applying date: on 04 14th, 2005).
Technical field
The present invention relates to a kind of organic semiconductor device and preparation method thereof, organic semiconductor device of particularly a kind of tool multi-protective layer and preparation method thereof.
Background technology
Organic semiconductor device was the heat subject of scientists study always in recent years.With regard to OTFT (OTFT), the trend that commercial applications is more arranged recently, apply to radio-frequency (RF) identification products such as (RFID) and all entered the test manufacture stage, can be widely used in categories such as bendable substrate, display and Electronic Paper future, particularly OTFT have manufacture process simple and easy, make temperature advantage low and with low cost, as long as on component life tangible breakthrough can be arranged, its commercial use has limitless potentiality.
Yet, owing in the making of the organic material protective layer of OTFT,, can be subject to the not good problem of the existing uniformity if the solution application manufacture method is coated with fully, the problem that causes the collocation panel quality of follow-up making to be difficult to improve.
In the prior art, IBM Corporation's proposition is a kind of carries out the method that the vapour deposition mode is made the protective layer of pentacene OTFT (pentacene OTFT) with organic molecule Parylene (parylene), but because the density of parylene film itself is not high, can't reach the effect of protection pentacene OTFT and damaged by liquid crystal, and the Parylene molecule there is no enough side chains and makes to carry out the required grinding orientation (rubbing) of LCD alignment; Therefore, the organic semiconductor device of OTFT as described above, its protective layer has faced many difficulties really on manufacturing technology, and remains to be broken through.
Summary of the invention
Organic semiconductor device that provides a kind of tool multi-protective layer and preparation method thereof is provided technical problem to be solved by this invention; be used in and make multi-protective layer on the OTFT; set up organic semiconductor device more smooth and that have perfect protection effect, thereby solve the existing problem of prior art.
To achieve these goals, the invention provides a kind of organic semiconductor device of tool multi-protective layer, its characteristics are, include: an OTFT; One first protective layer is formed on this OTFT in the vapour deposition mode; And one second protective layer, be formed on this first protective layer.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this OTFT is selected from down contact, goes up group's combination of the OTFT of contact, following grid and last grid.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this OTFT is selected from group's combination of N type metal-oxide half field effect transistor, P type metal-oxide half field effect transistor and CMOS field-effect transistor.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this second protective layer forms with the solution manufacture method.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this solution manufacture method is selected from group's combination of rotary coating, wire mark, ink jet printing and coating without spin.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this second protective layer forms in the vapour deposition mode.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this second protective layer and this first protective layer are different material layer.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this first protective layer is an inorganic material layer.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this first protective layer is an organic material layer.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this organic material is selected from group's combination of Parylene-N, Parylene-C and Parylene-D.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this second protective layer is an inorganic material layer.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that the quantity of this first protective layer and this second protective layer is a plurality of, and this first protective layer and this second protective layer form in the mode of intermeshing.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this vapour deposition mode is selected from chemical vapour deposition (CVD), organic vapor phase deposition, group's combination of evaporation altogether.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this second protective layer is the polyvinyl phenol layer.
The organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this second protective layer is an organic material layer.
The present invention also provides a kind of manufacture method of organic semiconductor device of tool multi-protective layer, and its characteristics are, comprise the steps: to provide an OTFT; In the vapour deposition mode, form one first protective layer on this OTFT; And form one second protective layer on this first protective layer.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this OTFT is selected from down contact, goes up group's combination of the OTFT of contact, following grid and last grid.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this OTFT is selected from group's combination of N type metal-oxide half field effect transistor, P type metal-oxide half field effect transistor and CMOS field-effect transistor.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that the step that forms this second protective layer is to utilize the solution manufacture method.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this solution system manufacture method is selected from group's combination of rotary coating, wire mark, ink jet printing and coating without spin.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that the step that forms this second protective layer is to utilize the vapour deposition mode.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this second protective layer and this first protective layer are different material layer.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this first protective layer is an inorganic material layer.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this first protective layer is an organic material layer.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this organic material is selected from group's combination of Parylene-N, Parylene-C and Parylene-D.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this second protective layer is an inorganic material layer.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer; its characteristics are; after forming the step of this second protective layer, the mode with intermeshing that also comprises forms a plurality of these first protective layers and the step of a plurality of these second protective layers on this second protective layer.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this vapour deposition mode is selected from chemical vapour deposition (CVD), organic vapor phase deposition, group's combination of evaporation altogether.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this second protective layer is the polyvinyl phenol layer.
The manufacture method of the organic semiconductor device of above-mentioned tool multi-protective layer, its characteristics are that this second protective layer is an organic material layer.
Effect of the present invention; be by second protective layer being formed on first protective layer of making in the vapour deposition mode; make the multiple protective layer of OTFT; this multiple protective layer not only has good homogeneous; also can reach the effect that the protection OTFT is not subjected to the liquid crystal infringement; in addition, can utilize second protective layer to carry out the orientation of liquid crystal, the organic semiconductor device with this protective layer can be had more widely use.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the manufacture method flow chart of the organic semiconductor device of tool multi-protective layer of the present invention;
Fig. 2 A to 2C is the making flow process profile of organic semiconductor device of the tool multi-protective layer of the first embodiment of the present invention;
Fig. 3 A to 3C is the I that drips the organic semiconductor device behind the stable twisted nematic liquid crystal on the forward and backward and OTFT channel after finishing making of the making of first embodiment of the invention
D-V
DPerformance diagram;
Fig. 4 A to 4C is respectively the I that drips the organic semiconductor device behind the stable twisted nematic liquid crystal on the forward and backward and OTFT channel after finishing making of the making of first embodiment of the invention
D-V
GPerformance diagram; And
Fig. 5 A to 5D is that the making of second embodiment of the invention is forward and backward and finish to drip on the OTFT channel after the making to go up behind the stable twisted nematic liquid crystal and drip and go up the I that puts the organic semiconductor device after five days behind the liquid crystal under air
D-V
DPerformance diagram.
Wherein, Reference numeral:
10 OTFT
11 base materials
12 grids
13 insulating barriers
14 source electrodes
15 drain electrodes
16 organic semiconductor layers
20 first protective layers
30 second protective layers
40 organic semiconductor devices
Embodiment
Please refer to Fig. 1, the manufacture method for the organic semiconductor device of tool multi-protective layer of the present invention mainly comprises the following step:
Organic semiconductor device of tool multi-protective layer provided by the present invention and preparation method thereof is elaborated and verifies by two embodiment with next; and, be the manufacturing process of the organic semiconductor device of the tool multi-protective layer of the first embodiment of the present invention please successively with reference to Fig. 2 A to 2C.
Shown in Fig. 2 A, at first, step 100, the pentacene OTFT 10 of contact is provided, and this OTFT 10 is made of with the organic semiconductor layer 16 of drain electrode 15, pentacene (pentacene) base material 11 and the grid 12 that forms successively on base material, insulating barrier 13, source electrode 14.
Shown in Fig. 2 B, step 110, earlier Parylene (parylene) powder is placed vapor deposition apparatus inside, heating makes its distillation be gas molecule, cracking at high temperature and form micromolecule obtains first protective layer 20 of Parylene again on the OTFT 10 of verifying electrical characteristic; Parylene is divided into Parylene-N (parylene-N), Parylene-C (parylene-C) and Parylene-D (parylene-D); present embodiment selects for use Parylene-D to make first protective layer 20, and the manufacturing process of making first protective layer 20 is selected polymer deposition (polymer deposition) mode for use.
Shown in Fig. 2 C; step 120; when the electrical characteristic of element can be recovered original level; make polyvinyl phenol (Poly Vinyl Phenol with the solution manufacture method again; PVP) second protective layer 30 is on first protective layer 20; remedy the hole on first protective layer, 20 surfaces and, at last, promptly finish the organic semiconductor device 40 of tool multiple protective layer as second layer protective film.
And the organic semiconductor device 40 of the tool multi-protective layer that the first embodiment of the present invention provided; please refer to shown in Fig. 2 C; it is by OTFT 10; first protective layer 20 and second protective layer 30 constitute; the grid 12 that this OTFT 10 comprises base material 11 and forms successively on base material; insulating barrier 13; the organic semiconductor layer 16 of source electrode 14 and drain electrode 15 and pentacene (pentacene); and first protective layer 20 is to be formed on the OTFT 10 in the vapour deposition mode; 30 of second protective layers are formed on first protective layer 20; to improve the effect and the uniformity of film protection; make OTFT 10 avoid sustain damage, and keep the performance of organic semiconductor device 40.
Please refer to shown in Fig. 3 A to 3C and Fig. 4 A to 4C, the present invention makes testing electrical property for the organic semiconductor device in the present embodiment 40, wherein, Fig. 3 A to 3C be respectively make forward and backward and finish aforementioned making after the channel of OTFT 10 on drip stable twisted nematic liquid crystal (TwistedNematic Liquid Crystal, the ID-VD performance diagram of the organic semiconductor device 40 TNLC), can under the fixed railing pole tension, estimate switch current ratio (ON/OFF ratio, Ion/Ioff).In addition, Fig. 4 A to 4C is respectively and makes the I that drips the organic semiconductor device 40 behind the stable twisted nematic liquid crystal on forward and backward and the OTFT after finishing aforementioned making 10
D-V
GPerformance diagram can be under fixed drain voltage, obtains drain current grid voltage is changed to the coefficient of conductivity (transconductance, gm=I
D(saturation)/V
G), found that these I
D-V
DCharacteristic curve and I
D-V
GCharacteristic difference is little, shows that the electric property of this organic semiconductor device 40 there is no decline, and characteristic is kept level originally, therefore, can make in this way with the pentacene OTFT and drive torsion nematic liquid crystal display panel.
In addition, the OTFT in the present embodiment 10 can be selected from down the OTFT of contact (bottomcontact), last contact (top contact), following grid (bottom gate) or last grid (topgate).The material of first protective layer 20 and second protective layer 30 is optional from organic material or inorganic material, second protective layer 30 is made with the solution manufacture method, the solution manufacture method can comprise rotary coating (spin coating), wire mark (screen printing), ink jet printing (injectprinting) or without spin the coating modes such as (spinless coating), and second protective layer 30 also can be by the vapour deposition mode, but the material mode different with first protective layer 10 forms, and the vapour deposition mode can be chemical vapor deposition (CVD), organic vapor phase deposition (OVPD), be total to the mode of evaporation or other non-solution manufacture method; Perhaps; first protective layer 20 of the present invention and second protective layer 30 can be plural layer; and first protective layer 20 is organic materials; and second protective layer 30 is inorganic material; with its successively intermeshing on OTFT 10; be staggered with inorganic material to constitute organic material, and more even and have more the multi-protective layer of protecting effect.
And OTFT of the present invention can be selected from N type metal-oxide half field effect transistor (NMOS), P type metal-oxide half field effect transistor (PMOS) or CMOS field-effect transistor (CMOS).In the aforementioned embodiment, it adopts pentacene (pentacene) OTFT of p type organic semiconducting materials, below the second embodiment of the present invention will be described, it adopts copper 16 fluoronaphthalene cyanogen (copperhexadecafluorophthalocyanine, the F of n type organic semiconducting materials
16CuPc) OTFT.It is the OTFT (step 100) of 30 μ m that present embodiment is selected channel length for use, carries out electrically preceding value (I earlier
DV
D) measurement, carry out the deposition of first protective layer of Parylene again, film thickness is about 5000
(step 110) then, is that 5% polyvinyl phenol solution is rotated coating with percentage by weight, obtains about 6000
Film (step 120), promptly finish the organic semiconductor device of the tool multi-protective layer of present embodiment.
Afterwards, after measure making electrically, find its electrically value keep original level, stable twisted nematic liquid crystal again drips on channel, organic semiconductor device electrically still normal, under atmosphere, placed organic semiconductor device electrically identical when just dripping liquid crystal, the i.e. I of the organic semiconductor device shown in Fig. 5 A to 5D five days
D-V
DPerformance diagram shows that this multi-protective layer can be used as the F of n type organic semiconducting materials
16The protective layer of CuPc.
In sum; organic semiconductor device provided by the present invention and preparation method thereof; be by second protective layer being formed on first protective layer of making in the vapour deposition mode; make the multiple protective layer of OTFT; this multiple protective layer not only has good homogeneous; also can reach the effect that the protection OTFT is not subjected to the liquid crystal infringement; in addition; can utilize second protective layer to carry out the orientation of liquid crystal, the organic semiconductor device with this protective layer can be had more widely use.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of claim of the present invention.
Claims (26)
1, a kind of organic semiconductor device of tool multi-protective layer is characterized in that, includes:
One OTFT;
One first protective layer is formed on this OTFT in the vapour deposition mode; And
One second protective layer is formed on this first protective layer;
Wherein, this first protective layer is inorganic material layer or organic material layer.
2, the organic semiconductor device of tool multi-protective layer according to claim 1 is characterized in that, this OTFT is selected from down contact, goes up group's combination of the OTFT of contact, following grid and last grid.
3, the organic semiconductor device of tool multi-protective layer according to claim 1 is characterized in that, this OTFT is selected from group's combination of N type metal-oxide half field effect transistor, P type metal-oxide half field effect transistor and CMOS field-effect transistor.
4, the organic semiconductor device of tool multi-protective layer according to claim 1 is characterized in that, this second protective layer forms with the solution manufacture method.
5, the organic semiconductor device of tool multi-protective layer according to claim 4 is characterized in that, this solution manufacture method is selected from group's combination of rotary coating, wire mark, ink jet printing and coating without spin.
6, the organic semiconductor device of tool multi-protective layer according to claim 1 is characterized in that, this second protective layer forms in the vapour deposition mode.
7, the organic semiconductor device of tool multi-protective layer according to claim 6 is characterized in that, this second protective layer and this first protective layer are different material layer.
8, the organic semiconductor device of tool multi-protective layer according to claim 1 is characterized in that, this organic material is selected from group's combination of Parylene-N, Parylene-C and Parylene-D.
9, the organic semiconductor device of tool multi-protective layer according to claim 1 is characterized in that, this second protective layer is an inorganic material layer.
10, the organic semiconductor device of tool multi-protective layer according to claim 9 is characterized in that, the quantity of this first protective layer and this second protective layer is a plurality of, and this first protective layer and this second protective layer form in the mode of intermeshing.
11, the organic semiconductor device of tool multi-protective layer according to claim 1 is characterized in that, this vapour deposition mode is selected from chemical vapour deposition (CVD), organic vapor phase deposition, group's combination of evaporation altogether.
12, the organic semiconductor device of tool multi-protective layer according to claim 1 is characterized in that, this second protective layer is the polyvinyl phenol layer.
13, the organic semiconductor device of tool multi-protective layer according to claim 1 is characterized in that, this second protective layer is an organic material layer.
14, a kind of manufacture method of organic semiconductor device of tool multi-protective layer is characterized in that, comprises the steps:
One OTFT is provided;
In the vapour deposition mode, form one first protective layer on this OTFT; And
Form one second protective layer on this first protective layer;
Wherein, this first protective layer is inorganic material layer or organic material layer.
15, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 14 is characterized in that, this OTFT is selected from down contact, goes up group's combination of the OTFT of contact, following grid and last grid.
16, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 14; it is characterized in that this OTFT is selected from group's combination of N type metal-oxide half field effect transistor, P type metal-oxide half field effect transistor and CMOS field-effect transistor.
17, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 14 is characterized in that, the step that forms this second protective layer is to utilize the solution manufacture method.
18, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 14 is characterized in that, this solution system manufacture method is selected from group's combination of rotary coating, wire mark, ink jet printing and coating without spin.
19, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 14 is characterized in that, the step that forms this second protective layer is to utilize the vapour deposition mode.
20, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 14 is characterized in that, this second protective layer and this first protective layer are different material layer.
21, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 14 is characterized in that, this organic material is selected from group's combination of Parylene-N, Parylene-C and Parylene-D.
22, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 14 is characterized in that, this second protective layer is an inorganic material layer.
23, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 22; it is characterized in that; after forming the step of this second protective layer, the mode with intermeshing that also comprises forms a plurality of these first protective layers and the step of a plurality of these second protective layers on this second protective layer.
24, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 14 is characterized in that, this vapour deposition mode is selected from chemical vapour deposition (CVD), organic vapor phase deposition, group's combination of evaporation altogether.
25, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 14 is characterized in that, this second protective layer is the polyvinyl phenol layer.
26, the manufacture method of the organic semiconductor device of tool multi-protective layer according to claim 14 is characterized in that, this second protective layer is an organic material layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101802235A CN101425561A (en) | 2005-04-14 | 2005-04-14 | Organic semiconductor element having multiple protection layers and preparation thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101802235A CN101425561A (en) | 2005-04-14 | 2005-04-14 | Organic semiconductor element having multiple protection layers and preparation thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100643204A Division CN100524883C (en) | 2005-04-14 | 2005-04-14 | Organic semiconductor elements with multi-protective layer and producing method thereof |
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| Publication Number | Publication Date |
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| CN101425561A true CN101425561A (en) | 2009-05-06 |
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| CNA2008101802235A Pending CN101425561A (en) | 2005-04-14 | 2005-04-14 | Organic semiconductor element having multiple protection layers and preparation thereof |
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2005
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