CN101417546A - Heating resistor element, manufacturing method for the same, thermal head, and printer - Google Patents
Heating resistor element, manufacturing method for the same, thermal head, and printer Download PDFInfo
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- CN101417546A CN101417546A CN 200810175033 CN200810175033A CN101417546A CN 101417546 A CN101417546 A CN 101417546A CN 200810175033 CN200810175033 CN 200810175033 CN 200810175033 A CN200810175033 A CN 200810175033A CN 101417546 A CN101417546 A CN 101417546A
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Abstract
Provided is a heating resistor element (1), including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces (9a) between the insulating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the hollow portion (17) includes an inner surface on a side of the insulating substrate (9), the inner surface being processed to have surface roughness (Ra) of 0.2 mum or more. Accordingly, heat accumulation in a gas of the hollow portion (17) can be suppressed to improve printing quality.
Description
Technical field
The present invention relates to heating resistance element and manufacture method thereof, thermal head and printer.
Background technology
Usually, in the heating resistor in being arranged at the printer thermal head, for the efficiency of heating surface that improves heating resistor and reduce power consumption, in the zone relative, form hollow space with heating resistor, and make this hollow space as thermal insulation layer with low-thermal conductivity, control the heat (for example referring to JP 2007-83532A) that flows to the isolation liner bottom side from heating resistor thus.
As the method that forms hollow space, adopted following mode: make silicon substrate stand etching or Laser Processing, and form recess (having) more than or equal to 1 μ m and smaller or equal to the degree of depth of 100 μ m, with by will be thereon in conjunction with (anodicbonding) as sheet glass (having the thickness of the 10 μ m) combination of heat build-up layer to 100 μ m at 700 ℃ or the anode that more carries out under the low temperature.In this case, be difficult to make or operate sheet glass with 100 μ m or littler thickness, therefore, the sheet glass that will have the thickness of relative easy operating is attached on the surface of silicon, remove the surface of the opposite side of (chipped) institute mating surface then by etching or polishing, to obtain the gauge of expectation.。
In this case, the most of heat that is produced by heating resistor is controlled by as the hollow space of thermal insulation layer flowing to the isolation liner bottom side, and effectively with the heat that acts on printing.On the other hand, a part of heat that is not used to print is delivered to the gas that is included in the hollow space from heating resistor via the heat build-up layer that contacts with this heating resistor, and further from being included in gas transfer in the hollow space at the bottom of the isolation liner.
Yet, in the heating resistor of routine, hollow space forms by etching or Laser Processing, therefore, the hollow space inner surface forms extremely smoothly on the surface of isolation liner bottom side, and the heat that exists hollow space thus is difficult to be delivered to the unfavorable of isolation liner bottom side.That is to say that heat is to carry out under the situation at the bottom of gaseous molecular collides isolation liner at the bottom of the isolation liner from being included in gas transfer in the hollow space, but when the smooth surface at the bottom of the isolation liner, gaseous molecular collides the decreased number at the bottom of the isolation liner in the unit interval.For this reason, the heat that passes to gas is difficult to be discharged into the isolation liner bottom side and accumulates in the gas.Therefore, if print for a long time, then hollow space becomes thermal source, and this can produce the problem that print quality descends, and the conditions of streaking that printable character connects together along paper feed direction for example takes place.
Summary of the invention
In view of the foregoing proposed the present invention, so its purpose is to provide heating resistance element and manufacture method, thermal head and printer, wherein, this heating resistance element can suppress to be included in the heat build-up in the gas in the hollow space and improve print quality.
In order to achieve the above object, the invention provides following mode.
The invention provides heating resistance element, comprising: at the bottom of the isolation liner; Be attached to the heat build-up layer on the isolation liner basal surface; And be arranged on heating resistor on the heat build-up layer, wherein: at the bottom of the isolation liner and at least on one of them of the mating surface between the heat build-up layer, at the bottom of the isolation liner with the heat build-up layer one of them is provided with recess in the zone relative with heating resistor at least, to form hollow space; And this hollow space comprises the inner surface that is positioned on the isolation liner bottom side, and this inner surface is processed into has 0.2 μ m or bigger surface roughness Ra.
Based on the present invention, at the bottom of the isolation liner and the heat build-up layer (wherein recess be formed at the bottom of the isolation liner and at least one mating surface of heat build-up layer on) mutually combine, and be formed at the bottom of the isolation liner and the heat build-up layer between this hollow space be formed in the zone relative with heating resistor.Correspondingly, controlled by this hollow space by the transmission at the bottom of the isolation liner of heat that heating resistor produced, therefore, heat can more effectively be used.
In this case, the inner surface of hollow space on the isolation liner bottom side is processed into has 0.2 μ m or bigger surface roughness Ra, therefore, its surface area is enlarged with comparing by etching or the formed recess inner surface of similar approach, and can increase the chance of colliding at the bottom of the isolation liner for the gaseous molecular in being sealed in hollow space.As a result, the heat that passes to gas can promptly pass at the bottom of the isolation liner to scatter and disappear, and therefore, can prevent the unfavorable of in hollow space heat build-up.
In foregoing invention, the degree of depth of hollow space can be set at more than or equal to 1 μ m and smaller or equal to 100 μ m.
Therefore, the thickness of the gas in being included in hollow space guarantees to be 1 μ m or when bigger fully, can obtain fabulous effect of heat insulation, and the power consumption of heating resistance element can be suppressed lower.In addition, be set at 100 μ m or more hour, the thickness of heating resistance element can be made lessly when the degree of depth of hollow part.
In addition, in foregoing invention, at the bottom of the isolation liner and the heat build-up layer can form by alkali-free glass.
As a result, even basic ion can be by wash-out yet after long-time the use.Therefore, can prevent basic ion to heating resistor and near the electrode at the bottom of being positioned at heat build-up layer and isolation liner, or the driver IC that is provided with in its vicinity has a negative impact.
In addition, alkali-free glass is more cheap than Pyrex (registration mark) glass, and its machinability is more excellent, and heating resistance element can be to make at low cost thus.
In addition, in foregoing invention, be under the state that adheres to mutually at the mating surface of mating surface at the bottom of the isolation liner and heat build-up layer, at the bottom of the isolation liner and the heat build-up layer can mutually combine by being heated to annealing point to the temperature range of softening point.
The result, even if when forming by identical glass material with the heat build-up layer at the bottom of the isolation liner, isolate substrate and the heat build-up layer also can easily mutually combine, and at the bottom of the isolation liner and the difference of the thermal coefficient of expansion between the heat build-up layer can be eliminated, to suppress because the warpage (wrap) that heat causes or be out of shape.
In addition, in foregoing invention, hollow space can fully seal with the external world, and its inside can be filled with gas.
As a result, the thrust that imposes on heating resistor can be supported by the pressure of the gas that charges into hollow space, therefore, can provide the heating resistance element with high voltage endurance capability.
In addition, in foregoing invention, gas is preferably inert gas.
Therefore, can prevent heating resistor degeneration (as oxidation), and can improve its reliability and durability.
In addition, the invention provides the thermal head that comprises above-mentioned any heating resistance element.
Based on the present invention,, and can prevent to descend because of the print quality that phenomenon caused such as hangover even if after long-time the use, can prevent that also hollow space from becoming the unfavorable of thermal source.
In addition, the invention provides the printer that comprises above-mentioned thermal head.
Based on the present invention, can be low-cost, long-time clear and print without interruption.
In addition, the invention provides the manufacture method that is used for heating resistance element, comprising: recess forms step, promptly at the bottom of the isolation liner and the mating surface between the heat build-up layer form recess on one of them at least; Integrating step promptly makes at the bottom of the isolation liner and the mating surface between the heat build-up layer adheres to mutually, with in conjunction with at the bottom of this isolation liner and the heat build-up layer; And resistor forms step, promptly the certain position place on the heat build-up layer forms heating resistor, this position is relative with recess, and wherein, this recess forms step and comprises that recess is positioned at inner surface on the isolation liner bottom side to be processed into and to have 0.2 μ m or bigger surface roughness Ra.
Based on the present invention, form in the step at recess, the inner surface of recess on the isolation liner bottom side is processed into has 0.2 μ m or bigger surface roughness Ra, therefore, can make a kind of heating resistance element, its form make hollow space the surface on the isolation liner bottom side and the smooth surface that makes hollow space (this hollow space forms by mutually combining with the heat build-up layer at the bottom of making isolation liner) by etching or similar approach situation about being formed on the isolation liner bottom side compare more coarse fully.The result, the gaseous molecular and the chance that contacts at the bottom of the isolation liner that are included in the gas in the hollow space have been improved, and at the bottom of promoting that heat is lost to isolation liner from gas more actively, even if the result also can prevent hollow space to become the unfavorable of thermal source after long-time the use.
In foregoing invention, recess forms step and can comprise by sandblast formation recess.In addition, recess formation step can comprise by using mould (die) to carry out high temperature compacting formation recess.
The result, can easily be formed on each place, bight by the compacting of sandblast or high temperature and all have the 10 μ m or the recess of larger radius of curvature more, and this recess is compared with the situation that forms recess by etching or similar approach glossily and had more coarse fully inner surface.Correspondingly, except above-mentioned effect, improved the gaseous molecular that is included in the gas in the hollow space (forming) by the sealing recess with at the bottom of the isolation liner between the chance that contacts, at the bottom of promoting that heat is lost to isolation liner from gas more actively, the result can easily make heating resistance element, becomes the unfavorable of thermal source even if also avoid hollow space after the long-time use of this heating resistance element.
Based on the present invention, obtained to suppress to be included in heat build-up in the gas in the hollow space to improve the effect of print quality.
Description of drawings
In the accompanying drawings:
Fig. 1 is the vertical cross-section diagram that shows according to the thermo printer structure of the embodiment of the invention;
Fig. 2 is the front view that shows according to the thermal head of the embodiment of the invention, and wherein, this thermal head is arranged in the thermo printer of Fig. 1;
Fig. 3 shows the heating resistance element according to the embodiment of the invention for the vertical cross-section diagram that α-the α line is intercepted along Fig. 2, and wherein heating resistance element is arranged in the thermal head of Fig. 2;
Fig. 4 A is a front view, and the vertical cross-section diagram of Fig. 4 B for being intercepted along the a-a line of Fig. 4 A, and Fig. 4 C is the vertical cross-section diagram that the b-b line along Fig. 4 A is intercepted is used for the shape of hollow space of the heating resistance element of key diagram 3;
Fig. 5 A to Fig. 5 F is the view of manufacture method that is used for the heating resistance element of key diagram 3;
Fig. 6 A and Fig. 6 B are curve map, show the thermo-responsive for each surface roughness of the hollow space inner surface in the heating resistance element of Fig. 3;
Fig. 7 shows the curve map that concerns between the surface roughness of temperature that repeats to heat the back heating resistance element and hollow space inner surface;
Fig. 8 is the front view that shows the modification of thermal head among Fig. 2; And
Fig. 9 A and Fig. 9 B are for showing the vertical cross-section diagram of the modification of heating resistance element among Fig. 3 respectively.
The specific embodiment
Be used for thermal head 2 based on the heating resistance element 1 of this embodiment at the thermo printer shown in Fig. 13.
The flat shape that thermal head 2 forms as shown in the front view of Fig. 2, and comprise a plurality of isolated heating resistance elements 1.As shown in the vertical cross-section diagram of Fig. 3, each heating resistance element in a plurality of heating resistance elements 1 includes at the bottom of the isolation liner 9, heat build-up layer 10, heating resistor 11 and the protective film 12 that is in laminated state.
9 are combined on the heat sink (not shown) at the bottom of the isolation liner.
At the bottom of the isolation liner 9 and heat build-up layer 10 form by alkali-free glass (Coming 1737), and by be heated to form at the bottom of the isolation liner 9 and the annealing point (720 ℃) of the material of heat build-up layer 10 to the temperature range of softening point (975 ℃), under the state that adheres to mutually, mutually combine.
Heat build-up layer 10 forms to have more than or equal to 2 μ m and smaller or equal to the thickness of 100 μ m.
At the bottom of the isolation liner 9 and any one mating surface at least (9 mating surface 9a at the bottom of being isolation liner in the present embodiment) of heat build-up layer 10 on, recess 16 is formed in the zone relative with each heating resistor 11.When at the bottom of the isolation liner 9 and the state that adhering to of heat build-up layer 10 under when mutually combining, the opening of recess 16 is sealed by the flat surfaces of heat build-up layer 10, the result at the bottom of the isolation liner 9 and heat build-up layer 10 between the position relative with heating resistor 11 hollow space 17 of sealing is provided.
In this case, recess 16 can have suitable shape, and its size compare with heating resistor 11 can be greater or lesser, as long as this size approaches the size of heating resistor 11.
When observing recess 16 from a side of heating resistor 11 along laminating direction, under recess 16 was made for than the big situation of effective heating surface (area) (HS of heating resistor 11, the heat-proof quality at the bottom of heating resistor 11 and the isolation liner between 9 can be improved.On the other hand, under the size of recess 16 was made for than the little situation of effective heating surface (area) (HS of heating resistor 11, the mechanical strength of heating resistance element 1 can be improved with respect to the thrust on the laminating direction.
In this embodiment, recess 16 is arranged at the bottom of the isolation liner side of 9, and form quadrangle, when from a side of heating resistor 11 when laminating direction is observed recess 16, this quadrangle roughly has with heating resistor 11 similar shapes and is a bit larger tham this heating resistor 11.In addition, the depth D of recess 16 is set at more than or equal to 1 μ m and smaller or equal to 100 μ m.In other words, in heating resistance element 1, the gas layer thickness in the hollow space 17 guarantees to be 1 μ m or thicker fully, and remarkable by the effect of heat insulation that gas blanket obtained.In addition, be set at 100 μ m or more hour, the gauge of heating resistance element 1 can be suppressed enough for a short time when the depth D of recess 16.
In addition, in this embodiment, shown in Fig. 4 A to Fig. 4 C, the bight R1 of recess 16, R2 and R3 all form has the 10 μ m or the shape of larger radius of curvature more.In addition, the inner surface of recess 16 forms and has 0.2 μ m or bigger surface roughness Ra.Fig. 4 A is the front view of the recess 16 seen from a side of opening, Fig. 4 B and Fig. 4 C vertical cross-section diagram for being intercepted along the b-b line of the a-a line of Fig. 4 A and Fig. 4 A respectively.
What note is in the opening size W of recess 16 or the radius of curvature R 1 in L and each bight, to have following relation between R2 or the R3.Just, 10 μ m≤R1≤1/2L, 10 μ m≤R2≤1/2W, 10 μ m≤R3≤1/2L (when L≤W), or 10 μ m≤R3≤1/2W (when W≤L).
Next heating resistance element 1 and the manufacture method that is used for according to the thermal head 2 of this embodiment are described.
At first, the recess 16 with desired depth is formed at the bottom of the isolation liner in 9 the surf zone, forms heating resistor 11 (recess formation step) in this zone.
Shown in Fig. 5 A to Fig. 5 F, recess 16 forms as follows.Can absorb photoresist 18 that the urethanes sill impacts is applied on the surface that forms at the bottom of the isolation liner 9 alkali-free glass substrate (Fig. 5 A), and use photomask (not shown) to photoresist 18 exposures with predetermined pattern, make and partly solidified outside the zone of hollow space 17 to be formed remove uncured part to form window portion 19 (Fig. 5 B).In this state, 9 remove by blasting treatment (Fig. 5 C) at the bottom of the isolation liner corresponding to the part of window portion 19.As a result, can easily form recess 16, this recess 16 has 10 μ m or bigger radius of curvature at the place, bight, and comprises that surface roughness Ra is 0.2 μ m or bigger inner surface.
Bight radius of curvature and surface roughness can be adjusted to desired value by the suitable adjustment to mask shape, sand grains diameter, blasting pressure, sand grains quantity and spray angle.Under the situation of surface roughness Ra less than 0.2 μ m, it is extremely little that the sand grains diameter requires, and the treating capacity (amount of removing) in the unit interval reduces significantly, and this is not suitable for batch process.In this state, photoresist 18 surface of 9 at the bottom of the isolation liner is removed (Fig. 5 D).What note is that recess 16 can utilize mould to form by high-temperature molding, to replace blasting treatment.
Then, prepare alkali-free glass substrate, and this substrate is attached at the bottom of the isolation liner that forms recess 16 within it on 9 the mating surface 9a, to seal this recess 16 (Fig. 5 E) as heat build-up layer 10.In this state, with at the bottom of the isolation liner 9 and heat build-up layer 10 be heated to the temperature range of the annealing point (720 ℃) of alkali-free glass to softening point (975 ℃), make at the bottom of the isolation liner 9 and heat build-up layer 10 mutually combine (integrating step) thus.
Afterwards, remove the surface (opposite) of heat build-up layer 10 by etching, polishing or similar approach, heat build-up layer 10 is processed into gauge (2 μ m to 100 μ m) (Fig. 5 F) with expectation with mating surface.
Then, form heating resistor layer 13, single in regular turn with electrode 14, common electrode 15 and protective film 12 (resistor formation step).What note is that heating resistor layer 13, single electrode 14, common electrode 15 and protective film 12 used can form by suitable order.
These heating resistor layers 13, list can utilize the manufacture method of those members that are used for conventional heating resistance element to form with electrode 14, common electrode 15 and protective film 12.
Particularly, the film of being made by the material (as the material of tantalum-based materials or silicide base) of heating resistor layer 13 uses film forming method (as reactive sputtering, chemical vapor deposition (CVD), vapour deposition) and is formed on the heat build-up layer 10, and it is molded to use the method for peeling off or etching method to carry out by the film that the material of heating resistor layer 13 is made, and forms the heating resistor layer 13 of required form thus.
Similarly, the film of being made by wiring material (as Al, Al-Si, Au, Ag, Cu or Pg) is formed on the heat build-up layer 10 by reactive sputtering, vapour deposition etc., and afterwards, established film is used peel off method or etching method carries out molded.Alternatively, the wiring material is through serigraphy, and process is cured or similar processing subsequently.Correspondingly, form single electrode 14 and common electrode 15 used with intended shape.
In this embodiment, for a heating resistor layer 13 be provided with two independent single with electrodes 14, and common electrode 15 is arranged to be used for to hide two single separately one of them with electrode 14, so that reduce the connection resistance value of common electrode 15.
Then, heating resistor layer 13, single form with electrode 14, common electrode 15 after, by the material of protective film 12 (as SiO
2, Ta
2O
5, SiAlON, Si
3N
4Or the carbon of DLC) film of making is formed on the heat build-up layer 10 by reactive sputtering, ion plating method, CVD or similar approach, to form protective film 12.As a result, made thermal head 2, it comprises a plurality of heating resistance elements 1 according to this embodiment.
According to the heating resistance element 1 and the thermal head 2 that form thus based on this embodiment, hollow space 17 be formed at the bottom of the isolation liner 9 and heat build-up layer 10 between in the zone relative with heating resistor 11, and be formed on the effect that gas blankets in the hollow space 17 play thermal insulation layer, control autohemagglutination thermosphere 10 heat flow of 9 at the bottom of the isolation liner.In this embodiment, the depth D of recess 16 is 1 μ m or bigger, can form enough thick gas blanket thus, and obtains significant effect of heat insulation.
In addition, the thickness setting of heat build-up layer 10 is 100 μ m or littler, and therefore, the thermal capacity of heat build-up layer 10 itself is very little, and has prevented to be absorbed by heat build-up layer 10 by the heat that heating resistor 11 produces.
In this manner, according to heating resistance element 1 and thermal head 2 based on this embodiment, the heat that is produced by heating resistor 11 can be used effectively, and does not need the heat that heating resistor 11 is produced is discharged into a side of heat build-up layer 10.Therefore, the efficiency of heating surface of heating resistor 11 can be improved, to reduce power consumption.
In addition, the heat that heating resistor 11 is produced is difficult to be delivered at the bottom of the isolation liner 9, even if this temperature that helps whole thermal head 2 also is difficult to raise after repeatedly using this thermal head 2.
In addition, in heating resistance element 1 according to this embodiment, 9 are formed by identical glass material at the bottom of heat build-up layer 10 and the isolation liner, therefore do not have the difference of thermal coefficient of expansion, consequently can not cause warpage or distortion because of the heat that heating resistor 11 is produced.
In addition, in the heating resistance element 1 according to this embodiment, 9 are formed by alkali-free glass at the bottom of heat build-up layer 10 and the isolation liner, even if so basic ion can be after heating resistance element 1 long-time the use by wash-out yet.Therefore, can prevent basic ion to being positioned at the bottom of heat build-up layer 10 and the isolation liner near heating resistor 11 9, single, or the driver IC that is provided with in its vicinity has a negative impact with electrode 14 and common electrode 15.
Alkali-free glass is more cheap than Pyrex (registration mark) glass, and its machinability is more excellent, can make heating resistance element 1 at low cost thus.
In addition, the coefficient of heat conduction of glass is 0.9W/mK, and the coefficient of heat conduction of air is 0.02W/mK, and the coefficient of heat conduction of silicon is 168W/mK.Adopt the alkali-free glass substrate to replace conventional silicon substrate, therefore can reduce the coefficient of heat conduction fully, and prevented heat from heat build-up layer 10 via 9 scattering and disappearing at the bottom of the isolation liner.Correspondingly, can improve the thermal efficiency further.
In addition, in heating resistance element 1 according to this embodiment, the surface roughness Ra of the inner surface of the recess 16 of formation hollow space 17 is set at 0.2 μ m or bigger, therefore, with by etching or similar approach the recess inner surface that forms glossily compare, the surface area of this inner surface can increase manyly.Therefore, can increase the gas molecule that charges in the hollow space 17 and collide at the bottom of the isolation liner 9 chance.
For example, Fig. 6 A and Fig. 6 B have shown the thermo-responsive of heating resistance element 1 for each surface roughness of recess 16.In Fig. 6 A and Fig. 6 B, curve t1 and t2 show the variations in temperature of thermal head 2 when thermal head 2 being applied the voltage of predetermined amount of time and stop until the preset time section subsequently.Curve t3 and t4 are imaginary curves, have formed the point of the temperature of indication thermal head 2 before applying voltage, and this curve is that thermal head 2 according to the present invention for convenience of explanation increases.
Fig. 6 A show according to the minimal surface roughness (Ra:0.2 μ m) of this embodiment with according to the thermo-responsive curve under surface roughness (Ra:0.02 μ m) the contrast situation of prior art, Fig. 6 B show according to the maximum surface roughness (Ra:3 μ m) of this embodiment with according to the thermo-responsive curve under surface roughness (Ra:0.02 μ m) the contrast situation of prior art.These curves show, compared with prior art, use the temperature rising that causes can be suppressed forr a short time according to this embodiment owing to long-time.
Fig. 7 has shown as Fig. 6 A and Fig. 6 B and has been shown in relation between the surface roughness of the temperature that repeats to heat (after 0.025 second) heating resistance element 1 after 10 pulses and hollow space 17 inner surfaces.
These curves show, according to the heating resistance element 1 based on this embodiment, the heat that is delivered to gas blanket can promptly be delivered at the bottom of the isolation liner 9 to scatter and disappear.
In addition, in heating resistance element 1 according to this embodiment, the bight R1 to R3 that forms the recess 16 of hollow space 17 forms has 10 μ m or larger radius of curvature round-shaped more, has therefore suppressed in the R1 to R3 of bight caused stress and has concentrated, thereby improved mechanical strength.In addition, by means of higher mechanical strength, even if also can provide heating resistance element 1 during for 2 μ m to 100 μ m when the thickness setting of heat build-up layer 10 with sufficient mechanical strength.When heat build-up layer 10 was made thinlyyer, the efficiency of heating surface can further improve.
Correspondingly, according to the thermo printer 3 that comprises based on the thermal head 2 of this embodiment, even if after using for a long time, the heat that heating resistor 11 is produced also is difficult to accumulate in heat build-up layer 10 or the hollow space 17, the result is that heat can be used effectively, and can prevent that hollow space 7 from becoming thermal source.As a result, can prevent to descend owing to the phenomenon such as hangover causes print quality.In addition, the warpage or the distortion that cause owing to the difference of thermal coefficient of expansion aspect can not occur in the thermal head 2, and therefore, the contact between thermal head 2 and the heat-sensitive paper 6 can not change, and this can prevent the decline of print quality.
In addition, the mechanical strength of thermal head 2 is higher, even if therefore when thrust for a long time during repeat function thermal head 2 also can keep good state.
Correspondingly, can be provided and all had safe long-term reliability and high efficiency heating resistance element 1, thermal head 2 and thermo printer 3.
In addition, according to the manufacture method that is used for based on the heating resistance element 1 of this embodiment, 9 annealing point to temperature ranges of softening point by being heated to alkali-free glass mutually combine at the bottom of heat build-up layer of being made by identical alkali-free glass 10 and the isolation liner, therefore do not need adhesive layer, and be used for the material of adhesive layer and the formation step of adhesive layer also is unnecessary.Therefore, heating resistance element 1 can be easy at short notice to make at low cost.
What note is, in heating resistance element 1 according to this embodiment, 9 are formed by identical alkali-free glass with heat build-up layer 10 at the bottom of the isolation liner, but are not to be subject to this, and can be formed by identical soda glass material or identical Pyrex (registration mark) glass material.Under the situation of soda glass material, by being heated to annealing point (540 ℃) to the temperature between the softening point (730 ℃), and under the situation of Pyrex (registration mark) glass material, by being heated to annealing point (565 ℃) to the temperature between the softening point (820 ℃), at the bottom of the isolation liner 9 and heat build-up layer 10 also can easily mutually combine.
In addition, in this embodiment, be arranged at the bottom of the isolation liner recess 16 in 9, the inner hollow space 17 that is filled with air is provided thus by 10 sealing of smooth heat build-up layer.Yet different therewith is, shown in Fig. 9 A, recess 16 can be arranged in the heat build-up layer 10, and by 9 sealings at the bottom of the smooth isolation liner to form hollow space 17.Alternatively, shown in Fig. 9 B, recess 16 can be arranged on the heat build-up layer that will mutually combine 10 with at the bottom of the isolation liner 9 among the two, to form hollow space 17.
Preferably under any circumstance, the inner surface that is arranged on the hollow space 17 in the heat build-up layer 10 forms glossily, and the inner surface that is arranged at the bottom of the isolation liner hollow space 17 in 9 forms and has 0.2 μ m or bigger surface roughness Ra.As a result, suppressed the heat transmission of autohemagglutination thermosphere 10, and promoted can prevent thus that certainly 9 the heat transmission at the bottom of the isolation liner of this gas blanket hollow space 17 from becoming the unfavorable of thermal source to the gas blanket of hollow space 17.
Be provided with in heat build-up layer 10 under the situation of recess 16, the thickness of least part is preferably more than and equals 2 μ m and smaller or equal to 100 μ m in the heat build-up layer 10.
In addition, recess 16 can be separately positioned at the bottom of the isolation liner on the mating surface of 9 mating surface and heat build-up layer 10, so that mutually combine and form hollow space 17 thus.
In addition, hollow space 17 can be filled with the inert gas of replacement air (as N
2, He or Ar).As a result, even if when gas passes heat build-up layer 10 arrival heating resistor 11, also can prevent heating resistor 11 through oxidated or performance degradation, thereby can improve its reliability and durability.
In addition, hollow space 17 can fully seal, and the pressure in the hollow space 17 can be reduced to atmospheric pressure or lower.As a result, can improve the effect of heat insulation that is obtained by hollow space 17.
In addition, in this embodiment, hollow space 17 is arranged to relative with each heating resistor 11 individually.Yet, as shown in Figure 8, replace above-mentioned recess 16 and hollow space 17, shared recess 16 ' and shared hollow space 17 ' can be set, they all are arranged to relative with a plurality of heating resistor 11.
Claims (11)
1. heating resistance element comprises:
At the bottom of the isolation liner;
Be attached to the lip-deep heat build-up layer at the bottom of the described isolation liner; And
Be arranged on the heating resistor on the described heat build-up layer,
Wherein:
At the bottom of the described isolation liner and at least on one of them of the mating surface between the described heat build-up layer, at the bottom of the described isolation liner with described heat build-up layer one of them is provided with recess in the zone relative with described heating resistor at least, to form hollow space; And
Described hollow space comprises the inner surface that is positioned on the described isolation liner bottom side, and described inner surface is processed into has 0.2 μ m or bigger surface roughness Ra.
2. heating resistance element according to claim 1 is characterized in that, the degree of depth of described hollow space is more than or equal to 1 μ m and smaller or equal to 100 μ m.
3. according to claim 1 or the described heating resistance element of claim 2, it is characterized in that, at the bottom of the described isolation liner and described heat build-up layer comprise alkali-free glass.
4. according to claim 1 each described heating resistance element to the claim 3, it is characterized in that, at the bottom of the described isolation liner and the described mating surface between the described heat build-up layer be under the state that adheres to mutually, at the bottom of the described isolation liner and described heat build-up layer mutually combine by being heated to annealing point to the temperature range of softening point.
5. according to claim 1 each described heating resistance element to the claim 4, it is characterized in that the described hollow space and the external world fully seal, and the inside of described hollow space is filled with gas.
6. heating resistance element according to claim 5 is characterized in that described gas comprises inert gas.
7. thermal head comprises according to claim 1 each described heating resistance element to the claim 6.
8. a printer comprises thermal head according to claim 7.
9. manufacture method that is used for heating resistance element comprises:
Recess forms step, promptly at the bottom of the isolation liner and the mating surface between the heat build-up layer form recess on one of them at least;
Integrating step promptly makes at the bottom of the described isolation liner and the described mating surface between the described heat build-up layer adheres to mutually, with in conjunction with at the bottom of the described isolation liner and described heat build-up layer; And
Resistor forms step, and promptly the certain position place on described heat build-up layer forms heating resistor, and described position is relative with described recess,
Wherein, described recess forms step and comprises that the inner surface that will be positioned at the described recess on the described isolation liner bottom side is processed into and has 0.2 μ m or bigger surface roughness Ra.
10. the manufacture method that is used for heating resistance element according to claim 9 is characterized in that, described recess forms step and comprises by sandblast and form described recess.
11. the manufacture method that is used for heating resistance element according to claim 9 is characterized in that, described recess forms step and comprises that using mould to suppress by high temperature forms described recess.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007275570 | 2007-10-23 | ||
| JP2007275570 | 2007-10-23 | ||
| JP2007-275570 | 2007-10-23 | ||
| JP2008218636A JP5200255B2 (en) | 2007-10-23 | 2008-08-27 | Heating resistance element and manufacturing method thereof, thermal head and printer |
| JP2008218636 | 2008-08-27 | ||
| JP2008-218636 | 2008-08-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101417546A true CN101417546A (en) | 2009-04-29 |
| CN101417546B CN101417546B (en) | 2012-12-05 |
Family
ID=40628627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810175033 Expired - Fee Related CN101417546B (en) | 2007-10-23 | 2008-10-23 | Manufacturing method of heating resistor element |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5200255B2 (en) |
| CN (1) | CN101417546B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103182853A (en) * | 2011-12-28 | 2013-07-03 | 精工电子有限公司 | Thermal head, printer, and method of manufacturing thermal head |
| CN108248219A (en) * | 2016-12-29 | 2018-07-06 | 上海新微技术研发中心有限公司 | Thermal bubble ink jet print head chip and method of manufacturing the same |
| CN110139761A (en) * | 2017-03-15 | 2019-08-16 | 惠普发展公司，有限责任合伙企业 | Thermally contact tube core |
| CN111712144A (en) * | 2017-12-07 | 2020-09-25 | 方特慕控股第一私人有限公司 | Electronic smoking device with heating element having modified surface |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5605824B2 (en) * | 2009-12-17 | 2014-10-15 | セイコーインスツル株式会社 | Thermal head and printer |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63249664A (en) * | 1987-04-06 | 1988-10-17 | Oki Electric Ind Co Ltd | Substrate for thermal head and manufacture thereof |
| US5357271A (en) * | 1993-01-19 | 1994-10-18 | Intermec Corporation | Thermal printhead with enhanced laterla heat conduction |
| JP3469958B2 (en) * | 1995-03-31 | 2003-11-25 | 京セラ株式会社 | Thermal head |
| JP4360605B2 (en) * | 2003-04-24 | 2009-11-11 | 京セラ株式会社 | Thermal head and thermal printer using the same |
| JP2006035836A (en) * | 2004-07-26 | 2006-02-09 | Thermal Printer Institute Inc | Thermal print head and its manufacturing method |
| JP4895344B2 (en) * | 2005-09-22 | 2012-03-14 | セイコーインスツル株式会社 | Heating resistance element, thermal head and printer using the same |
| JP5039940B2 (en) * | 2005-10-25 | 2012-10-03 | セイコーインスツル株式会社 | Heating resistance element, thermal head, printer, and method of manufacturing heating resistance element |
| US7843476B2 (en) * | 2006-03-17 | 2010-11-30 | Sony Corporation | Thermal head and printer |
-
2008
- 2008-08-27 JP JP2008218636A patent/JP5200255B2/en not_active Expired - Fee Related
- 2008-10-23 CN CN 200810175033 patent/CN101417546B/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103182853A (en) * | 2011-12-28 | 2013-07-03 | 精工电子有限公司 | Thermal head, printer, and method of manufacturing thermal head |
| CN108248219A (en) * | 2016-12-29 | 2018-07-06 | 上海新微技术研发中心有限公司 | Thermal bubble ink jet print head chip and method of manufacturing the same |
| CN110139761A (en) * | 2017-03-15 | 2019-08-16 | 惠普发展公司，有限责任合伙企业 | Thermally contact tube core |
| US11225086B2 (en) | 2017-03-15 | 2022-01-18 | Hewlett-Packard Development Company, L.P. | Thermal contact dies |
| CN111712144A (en) * | 2017-12-07 | 2020-09-25 | 方特慕控股第一私人有限公司 | Electronic smoking device with heating element having modified surface |
| US11812791B2 (en) | 2017-12-07 | 2023-11-14 | Fontem Ventures B.V. | Electronic smoking device with a heating element having a modified surface |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5200255B2 (en) | 2013-06-05 |
| JP2009119851A (en) | 2009-06-04 |
| CN101417546B (en) | 2012-12-05 |
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