CN101409188A - Method for preparing shadow mask type plasma display board addressing electrode - Google Patents

Method for preparing shadow mask type plasma display board addressing electrode Download PDF

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Publication number
CN101409188A
CN101409188A CNA2008101557394A CN200810155739A CN101409188A CN 101409188 A CN101409188 A CN 101409188A CN A2008101557394 A CNA2008101557394 A CN A2008101557394A CN 200810155739 A CN200810155739 A CN 200810155739A CN 101409188 A CN101409188 A CN 101409188A
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China
Prior art keywords
photosensitive layer
electrode
glass substrate
plasma display
shadow mask
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CNA2008101557394A
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Chinese (zh)
Inventor
林洁
张�雄
樊兆雯
朱立锋
林青园
王保平
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Nanjing Huaxian High Technology Co Ltd
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Nanjing Huaxian High Technology Co Ltd
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Priority to CNA2008101557394A priority Critical patent/CN101409188A/en
Publication of CN101409188A publication Critical patent/CN101409188A/en
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Abstract

The invention relates to a method for preparing a shadow mask type plasma display panel addressing electrode. Firstly, a layer of photosensitive coating (14) is manufactured at the upper part of a back underlay glass baseplate (4); secondly, a mask plate (15) with an electrode design is contacted with the surface of the photosensitive coating (14) and is irradiated by ultraviolet ray light (16) for exposing; thirdly, the exposed back underlay glass baseplate (4) is developed; fourthly, conductive silver paste (20) is filled at the position of an uncured photosensitive coating (18) and is dried; and fifthly, a solidified photosensitive coating (17) is removed from the back underlay glass baseplate (4) with a prepared electrode in a specific device, and an electrode which meets the design requirement of the size and the shape of the electrode by a sintering technology. The invention has the advantages of saving the manufacturing cost of a display panel, improving the production efficiency and preventing the electrode from hemming.

Description

A kind of preparation method of shadow mask type plasma display board addressing electrode
Technical field
The present invention relates to a kind of manufacturing technology of plasma display panel back substrate glass substrate addressing electrode, particularly a kind of addressing electrode manufacture method of utilizing the shadow mask plasma display panel back substrate glass substrate that thin film photolithography technology and thick film technology combine, specifically a kind of preparation method of shadow mask type plasma display board addressing electrode.
Background technology
At present, shadow mask plasma display panel adopts the planar mask of using always in the color cathode ray tube CRT production in its manufacture craft be that the metal gate web plate substitutes barrier manufacturing complicated among the plasma display panel PDP, independent processing metal aperture plate plate, and make fluorescent material thereon.Shadow mask plasma display panel mainly comprises prebasal plate, metacoxal plate and shadow mask.Metacoxal plate comprises the back substrate glass substrate, on the back substrate glass substrate addressing electrode is arranged, and the dielectric layer of formation is being arranged on the backsight glass substrate of addressing electrode and form protective layer on dielectric layer; Prebasal plate comprises preceding substrate glass glass substrate, forms the scan electrode vertical with addressing electrode at preceding substrate glass substrate lower surface, is having and form dielectric layer on the preceding substrate glass substrate of scan electrode and at dielectric layer surface formation protective layer; Being clipped in the middle shadow mask of forward and backward substrate is by electric conducting material, the metal foil web plate that comprises the mesh array that for example iron or its alloy process.Will above-mentioned prebasal plate, charge into predetermined working gas after shadow mask and the metacoxal plate assembling sealing-in, various inert gases for example assemble in the mode of " sandwich " and to make whole screen, have promptly formed shadow mask plasma display panel, as shown in Figure 2.
What use was many in the electrode preparation conventional method commonly used at present is photosensitive silver-colored slurry method, on substrate, put in order plate exactly and print certain thickness photosensitive silver slurry, dry the back and use special-purpose mask, obtain required electrode pattern through exposure, development, through oversintering, finish the making of electrode again.Need print to glass substrate whole to slurry but this method prepares electrode, and the slurry of the final figure that forms only has an appointment 30%, has caused the unnecessary wasting of resources and has increased manufacturing expense.In addition, also have the two end portions of electrode mode that the problem of perk crimping takes place easily.Therefore, existing electrode preparation method can not reach high-quality, high efficiency, low-loss requirement, can not satisfy existing production needs.
Summary of the invention
The objective of the invention is at the wasting of resources of the method for making its electrode existence that has plasma display panel now big, the problem of perk crimping takes place in the two end portions of electrode mode easily, and a kind of quality of production of proposition is good, the preparation method of the shadow mask plasma display panel addressing electrode of the high and low cost of efficient.
Technical scheme of the present invention is:
1, a kind of preparation method of shadow mask type plasma display board addressing electrode is characterized in that it may further comprise the steps:
A. clean the back substrate glass substrate, make photosensitive layer at the back substrate glass baseplate surface;
B. be tiled in the surface of photosensitive layer with the mask plate that has an electrode pattern, mask plate and the photosensitive layer that has an electrode pattern with ultraviolet light irradiation exposes again, forms the photosensitive layer that solidifies and uncured photosensitive layer;
C. the back substrate glass substrate after will exposing is put into developing apparatus and is developed, and sprays the back substrate glass substrate of above-mentioned exposure with developer solution, removes uncured photosensitive layer, forms the back substrate glass substrate of the photosensitive layer of the curing that has required figure;
D. the corresponding position filled conductive silver slurry of the uncured photosensitive layer that is removed at the back substrate glass substrate forms needed electrode pattern;
E. the surface there is the back substrate glass substrate oven dry of the conductive silver paste of the photosensitive layer of curing and filling, removes the partial solvent in the conductive silver paste, make the conductive silver paste set form the electrode of required figure, and attached on the back substrate glass substrate;
F. make the back substrate glass substrate of electrode with the spray solution spray, the photosensitive layer and the spray solution of curing are fully reacted, the photosensitive layer that solidifies breaks away from the back substrate glass substrate, stays the electrode of the required figure that conductive silver paste solidify to form on the back substrate glass substrate;
G. with firing furnace the back substrate glass substrate for preparing required pattern electrodes is carried out sintering, insulation, thoroughly remove the solvent in the conductive silver paste, electrode finally is shaped.
2, photosensitive layer thickness of the present invention is 5~20 μ m, and photosensitive layer contains the PVA photosensitive material.
3, developer solution of the present invention is 0.1~1.0% sodium carbonate developer solution.
4, bake out temperature of the present invention is 80~150 ℃, and drying time is 20~60 minutes.
5, spray solution of the present invention is 0.5~8% ethanolamine solutions.
6, sintering temperature of the present invention is 530~600 ℃, and temperature retention time is 30~60 minutes.
7, the photosensitive layer of the curing of the exposure of the present invention and the back formation of developing is an inverse taper.
8, the curing conductive of final shaping of the present invention silver slurry is for trapezoidal.
Beneficial effect of the present invention:
1, the preparation method of shadow mask type plasma display board addressing electrode of the present invention utilizes photosensitive material, only the part that forms the virtual electrode figure is formed electrode, stop the waste of unnecessary conductive silver paste, reduce the manufacturing expense of display floater, and can enhance productivity.
2, the final curing conductive silver slurry that is shaped of the present invention can effectively prevent the generation of edge-curl phenomenon for trapezoidal, improves the quality of products.
Description of drawings
Fig. 1 is the preparation process schematic diagram of shadow mask type plasma display board addressing electrode of the present invention.
Fig. 1 a is the structural representation of photosensitive layer; Fig. 1 b is the exposure status schematic diagram;
Fig. 1 c is the development view; Fig. 1 d is filled conductive silver slurry and oven-dried condition schematic diagram;
Fig. 1 e is a view of removing the photosensitive layer that solidifies; Fig. 1 f is the end-state figure of electrode thermal sintering.
Fig. 2 is the structure chart of shadow mask plasma display panel of the present invention.
Embodiment
Below in conjunction with accompanying drawing 1 and embodiment content of the present invention is further described.
The preparation method of shadow mask type plasma display board addressing electrode of the present invention may further comprise the steps:
A. clean back substrate glass substrate 4, make photosensitive layer 14 on back substrate glass substrate 4 surfaces;
B. exposure: use the mask plate 15 that has electrode pattern to be tiled in the surface of photosensitive layer 14, shine the mask plate 15 and the photosensitive layer 14 that have electrode pattern with ultraviolet 16 again and expose, form the photosensitive layer 17 of curing and uncured photosensitive layer 18;
C. develop: the back substrate glass substrate 4 after will exposing is put into developing apparatus and is developed, back substrate glass substrate 4 with the above-mentioned exposure of developer solution 19 sprays, remove uncured photosensitive layer 18, form the back substrate glass substrate 4 of the photosensitive layer 17 of the curing that has required figure;
D. the filling of conductive silver paste: the corresponding position filled conductive silver slurry 20 of the uncured photosensitive layer 18 that the part that the conductive silver paste 20 usefulness methods of scraping are filled in photosensitive layer uncured on the back substrate glass substrate 4 18 promptly is removed at back substrate glass substrate 4 forms needed electrode pattern;
E. oven dry: the surface there are back substrate glass substrate 4 oven dry of the photosensitive layer 17 of curing and the conductive silver paste 20 of filling, remove the partial solvent in the conductive silver paste 20, make the electrode of the required figure of conductive silver paste 20 sets formation, and attached on the back substrate glass substrate 4;
F. remove the photosensitive layer that solidifies, stay the electrode pattern that conductive silver paste forms: the back substrate glass substrate 4 of making electrode with spray solution 21 sprays, the photosensitive layer 17 of curing is fully reacted with spray solution 21, the photosensitive layer 17 that solidifies breaks away from back substrate glass substrates 4, stays the electrode of the required figure that conductive silver paste 20 solidify to form on back substrate glass substrate 4;
G. sintering, conductive silver paste forms electrode: with firing furnace the back substrate glass substrate 4 for preparing required pattern electrodes is carried out sintering, insulation, thoroughly remove the solvent in the conductive silver paste 20, electrode finally is shaped.
During concrete enforcement:
Shadow mask plasma display panel adopts the planar mask of using always in the color cathode ray tube CRT production in its manufacture craft be that the metal gate web plate substitutes barrier manufacturing complicated among the plasma display panel PDP, independent processing metal aperture plate plate, and make fluorescent material thereon.As shown in Figure 2, shadow mask plasma display panel, comprise metacoxal plate 1, prebasal plate 2, shadow mask 3, wherein shadow mask 3 is encapsulated in preceding 2, between the metacoxal plate 1, described metacoxal plate 1 mainly is made up of back substrate glass substrate 4, second electrode 5, dielectric layer 6 and diaphragm 7, and wherein second electrode pair 5 is parallel on the back substrate glass substrate 4, dielectric layer 6 covers on second electrode pair 5, and 7 of diaphragms cover on the dielectric layer 6; Described prebasal plate 2 mainly is made up of preceding substrate glass substrate 8, first electrode 9, dielectric layer 10, wherein first electrode 9 is positioned on the preceding substrate glass substrate 8, dielectric layer 10 covers on first electrode 9,5 one-tenth spatial vertical quadratures of second electrode pair on first electrode 9 and the metacoxal plate 1, described shadow mask 3 is for comprising the conductive plate of grid hole 12 arrays, and shadow mask 3, first electrode 9 and second electrode 5 are formed the elementary cell that medium blocking type exchanges the subtend discharge-type.Metacoxal plate 1, shadow mask 3, prebasal plate 2 are put well by the fixed position, use the glass powder with low melting point hermetic seal all around, shadow mask can or be imprinted on conducting film on the substrate by lead-in wire and draw with external circuit and be connected, at last to wherein charging into a certain amount of required working gas, carry out sealing-in, form shadow mask plasma display panel.
During the making of shadow mask type plasma display board addressing electrode, at first, clean back substrate glass substrate 4, make one deck photosensitive layer 14 on the surface of back substrate glass substrate 4 with pressure sintering, photosensitive layer should be smooth, and design sketch as shown in Figure 1a.
Secondly, exposure: the surface that is tiled in photosensitive layer 14 with the mask plate 15 that has electrode pattern, the mask plate 15 and the photosensitive layer 14 that have electrode pattern again with ultraviolet 16 irradiations, the above-mentioned mask plate 15 of electrode pattern that has is because diffraction of light and refraction effect formation inverse taper in the exposure process, ultraviolet 16 penetrates transparent region on the mask plate 15 that has electrode pattern and shines the corresponding site of photosensitive layer 14, this part photosensitive material is solidified, form the photosensitive layer 17 that solidifies; Have the irradiation that zone of opacity on the mask plate 15 of electrode pattern can shielding of ultraviolet light 16 and make the appropriate section of photosensitive layer 14 that any variation not take place, form uncured photosensitive layer 18, shown in Fig. 1 b.
The 3rd step, develop: the back substrate glass substrate 4 after will exposing is put into developing apparatus, sodium carbonate developer solution 19 spray back substrate glass substrates 4 with 0.1~1.0%, 19 pairs of uncured photosensitive layers of developer solution 18 carry out chemical corrosion, remove uncured photosensitive layer 18, form the photosensitive layer 17 of the curing of inverse taper, shown in Fig. 1 c.
The 4th step, on back substrate glass substrate 4, do not form the partially filled conductive silver slurry layer of above-mentioned figure, and oven dry has slurry to fill the back substrate glass substrate 4 that forms figure, bake out temperature is 80~150 ℃, drying time is 20~60 minutes, the conductive silver paste 20 that forms required figure is solidified, shown in Fig. 2 d.
The 5th step, remove the photosensitive material that solidifies: the back substrate glass substrate 4 that will make electrode is put into specific equipment, with i.e. 0.5~8% the ethanolamine solutions spray back substrate glass substrate 4 of the spray solution that configures 21, the photosensitive layer 17 that solidifies fully breaks away from back substrate glass substrate 4 in the reaction back with spray solution 21, electrode material can resist the erosion of the spray solution 21 of the removal photosensitive material that is disposed, and stays the conductive silver paste 20 of the curing of needed electrode pattern at last on back substrate glass substrate 4.
At last, sintering: adopt firing furnace that the back substrate glass substrate 4 for preparing is carried out sintering, sintering temperature is 530~600 ℃, and temperature retention time is 30~60 minutes, obtains i.e. second electrode 5 of required addressing electrode, shown in Fig. 2 e.
The part that the present invention does not relate to prior art that maybe can adopt all same as the prior art is realized.

Claims (8)

1, a kind of preparation method of shadow mask type plasma display board addressing electrode is characterized in that it may further comprise the steps:
A. clean back substrate glass substrate (4), make photosensitive layer (14) on back substrate glass substrate (4) surface;
B. be tiled in the surface of photosensitive layer (14) with the mask plate (15) that has electrode pattern, mask plate (15) and the photosensitive layer (14) of using ultraviolet (16) irradiation to have electrode pattern again expose, and form the photosensitive layer (17) of curing and uncured photosensitive layer (18);
C. the back substrate glass substrate (4) after will exposing is put into developing apparatus and is developed, back substrate glass substrate (4) with the above-mentioned exposure of developer solution (19) spray, remove uncured photosensitive layer (18), form the back substrate glass substrate (4) of the photosensitive layer (17) of the curing that has required figure;
D. the corresponding position filled conductive silver slurry (20) of the uncured photosensitive layer (18) that is removed at back substrate glass substrate (4) forms needed electrode pattern;
Back substrate glass substrate (4) oven dry of the conductive silver paste (20) that e. surface is had the photosensitive layer (17) of curing and fill, remove the partial solvent in the conductive silver paste (20), make the electrode of the required figure of conductive silver paste (20) set formation, and attached on the back substrate glass substrate (4);
F. use spray solution (21) spray to make the back substrate glass substrate (4) of electrode, make the photosensitive layer (17) and fully reaction of spray solution (21) of curing, the photosensitive layer (17) that solidifies breaks away from back substrate glass substrate (4), stays the electrode of the required figure that conductive silver paste (20) solidify to form on back substrate glass substrate (4);
G. with firing furnace the back substrate glass substrate (4) for preparing required pattern electrodes is carried out sintering, insulation, thoroughly remove the solvent in the conductive silver paste (20), electrode finally is shaped.
2, the preparation method of a kind of shadow mask type plasma display board addressing electrode according to claim 1 is characterized in that described photosensitive layer (14) thickness is 5~20 μ m, and photosensitive layer (14) contains the PVA photosensitive material.
3, the preparation method of a kind of shadow mask type plasma display board addressing electrode according to claim 1 is characterized in that described developer solution (19) is 0.1~1.0% sodium carbonate developer solution.
4, the preparation method of a kind of shadow mask type plasma display board addressing electrode according to claim 1 is characterized in that described bake out temperature is 80~150 ℃, and drying time is 20~60 minutes.
5, the preparation method of a kind of shadow mask type plasma display board addressing electrode according to claim 1 is characterized in that described spray solution (21) is 0.5~8% ethanolamine solutions.
6, the preparation method of a kind of shadow mask type plasma display board addressing electrode according to claim 1 is characterized in that described sintering temperature is 530~600 ℃, and temperature retention time is 30~60 minutes.
7, the preparation method of a kind of shadow mask type plasma display board addressing electrode according to claim 1 is characterized in that described exposure and the photosensitive layer (17) of the curing that the back of developing forms is inverse taper.
8, the preparation method of a kind of shadow mask type plasma display board addressing electrode according to claim 1, the curing conductive silver slurry (20) that it is characterized in that described final shaping is for trapezoidal.
CNA2008101557394A 2008-10-14 2008-10-14 Method for preparing shadow mask type plasma display board addressing electrode Pending CN101409188A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101526402B (en) * 2009-04-16 2011-02-02 南京华显高科有限公司 Method for judging accuracy and uniformity of furnace temperature of firing furnace

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101526402B (en) * 2009-04-16 2011-02-02 南京华显高科有限公司 Method for judging accuracy and uniformity of furnace temperature of firing furnace

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Open date: 20090415