CN101396684A - Coating device and nozzle - Google Patents

Coating device and nozzle Download PDF

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Publication number
CN101396684A
CN101396684A CNA2007101617704A CN200710161770A CN101396684A CN 101396684 A CN101396684 A CN 101396684A CN A2007101617704 A CNA2007101617704 A CN A2007101617704A CN 200710161770 A CN200710161770 A CN 200710161770A CN 101396684 A CN101396684 A CN 101396684A
Authority
CN
China
Prior art keywords
nozzle
filter
coating apparatus
nozzle body
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101617704A
Other languages
Chinese (zh)
Inventor
王艺华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Himax Display Inc
Original Assignee
Himax Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Himax Display Inc filed Critical Himax Display Inc
Priority to CNA2007101617704A priority Critical patent/CN101396684A/en
Publication of CN101396684A publication Critical patent/CN101396684A/en
Pending legal-status Critical Current

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention relates to a coating device which comprises a storing device, a pump and a nozzle, wherein, the storing device is used for storing coating liquid. The pump is provided with an input end and an output end, wherein, the input end is coupled with the storing device and is used for extracting the coating liquid. The nozzle is coupled with the output end of the pump. The nozzle comprises a nozzle body and a filter which is arranged in the nozzle body. Therefore, the coating device can improve the yield of the processing.

Description

Coating apparatus and nozzle
Technical field
The invention relates to a kind of process apparatus, and particularly relevant for a kind of coating apparatus and nozzle.
Background technology
In manufacture of semiconductor, often use various liquid to carry out different processing procedures.For example, in photoresist (photoresist) coating process (coating process), just use jet-coating photoresit on wafer (wafer), to carry out micro-photographing process.
Because the impurity in the photoresist can have influence on the yields of processing procedure, therefore when photoresist extracts after, also to pass through filter in the photoresist bottle, with impurity screening or become the photoresist of glue.
Yet, through after the filter, the photoresist that flows in pipeline still might produce glue or other impurity because put for a long time, even detergent line, can't guarantee that also the photoresist in the pipeline can not produce glue, and detergent line will spend extra time and cost.
Summary of the invention
The object of the present invention is to provide a kind of coating apparatus, to provide impurity content lower coating fluid.
Another object of the present invention is to provide a kind of nozzle, to filter the impurity in the coating fluid.
For reaching above-mentioned purpose, the present invention proposes a kind of coating apparatus, and it comprises a storage device, a pump and a nozzle, and wherein storage device is in order to store a coating fluid.Pump has an input and an output, and wherein input is coupled to storage device, in order to extract coating fluid.Nozzle is coupled to delivery side of pump, and wherein nozzle comprises a nozzle body and one first filter, and first filter deployment is in nozzle body.
For reaching above-mentioned purpose, the present invention proposes a kind of nozzle, and it comprises a nozzle body and a filter, and wherein nozzle body has an innter blocking part, and filter deployment is in nozzle body.Filter comprises that one has the filtering medium of microporosity structure, in order to filter the impurity of a coating fluid.
Based on above-mentioned, the present invention is configuration filter in nozzle, and with the impurity in the filtering coating fluid, the manufacture of semiconductor that therefore adopts coating apparatus of the present invention and carried out will have higher processing procedure yields.
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the schematic diagram according to a kind of coating apparatus of one embodiment of the invention.
Fig. 2 is the profile of the nozzle among Fig. 1.
The main element symbol description
100: coating apparatus
110: storage device
120: pump
120a: input
120b: output
130: nozzle
132: nozzle body
132a: innter blocking part
132b: external screw thread
134: the first filters
140: pipeline
150: the second filters
The specific embodiment
Fig. 1 is the schematic diagram according to a kind of coating apparatus of one embodiment of the invention, and Fig. 2 is the profile of the nozzle among Fig. 1.Please refer to Fig. 1 and Fig. 2, the coating apparatus 100 of present embodiment comprises a storage device 110, a pump 120 and a nozzle 130, and wherein storage device 110 is in order to store a coating fluid.Coating fluid can be photoresist liquid, developer solution or other chemical agents.When coating fluid was photoresist liquid, storage device 110 can be the photoresist bottle.Pump 120 has an input 120a and an output 120b, and wherein input 120a is coupled to storage device 110, and input 120a is in order to extract coating fluid.In addition, nozzle 130 is coupled to the output 120b of pump 120, and nozzle 130 comprises a nozzle body 132 and one first filter 134, and first filter 134 is disposed in the nozzle body 130.In the present embodiment, coating apparatus 100 also can comprise a pipeline 140, and pipeline 140 is coupled to the output 120b and the nozzle 130 of pump 120 respectively.Therefore, the coating fluid that output 120b exported of pump 120 just can input to nozzle 130 via pipeline 140.In addition, coating apparatus 100 also can comprise one second filter 150, and it is between pipeline 140 and pump 120, to filter the impurity from the coating fluid that pump 120 is exported.
Please refer to Fig. 1 and Fig. 2, more specifically, nozzle body 132 has an external screw thread 132b, so that assemble with pipeline 140.In other words, nozzle 130 is assembled via external screw thread 132b with pipeline 140.Remove this, nozzle body 132 also can socket or other modes be assembled to pipeline 140.In addition, nozzle body 132 has an innter blocking part 132a, fixing first filter 134, and has at least two contact points between the innter blocking part 132a and first filter 134.In the present embodiment, innter blocking part 132a can be a collar flange, and therefore first filter 134 just can be filled in nozzle body 132 and contact with innter blocking part 132a.Similarly, first filter 134 also can adopt other modes to be assembled to nozzle body 132.First filter 134 comprises that one has filtering medium or other filter materials of microporosity structure, and with the impurity in the filtration coating fluid, and second filter 150 can be identical with the structure of first filter 134.
Because nozzle 130 has first filter 134, to filter the impurity in the coating fluid, therefore the manufacture of semiconductor that adopts this coating apparatus 100 to be carried out will have higher processing procedure yields.In addition, when coating fluid was photoresist liquid, under the situation of putting for a long time, the photoresist liquid in the pipeline 140 between second filter 150 and nozzle 130 just may take place rotten and become glue, and first filter 134 just can this is gluey the photoresist liquid filtering, to improve the processing procedure yields.Person in addition, other process apparatus need not change circuit design, only needs the nozzle 130 of collocation present embodiment just can remove impurity, to improve the processing procedure yields.Moreover, only need substitute first filter 134 and can recover normal filtering function, so this coating apparatus 100 is less required maintenance time, and maintenance cost is also lower.
Though the present invention with preferred embodiment openly as above; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.

Claims (15)

1. coating apparatus comprises:
One storage device is in order to store a coating fluid;
One pump has an input and an output, and wherein this input is coupled to this storage device, in order to extract this coating fluid; And
One nozzle is coupled to this output of this pump, and wherein this nozzle comprises a nozzle body and one first filter, and this first filter deployment is in this nozzle body.
2. coating apparatus according to claim 1, wherein this coating fluid is a photoresist liquid.
3. coating apparatus according to claim 1, wherein this nozzle body has an innter blocking part, to fix this first filter.
4. coating apparatus according to claim 3 wherein has at least two contact points between this innter blocking part and this first filter.
5. coating apparatus according to claim 3, wherein this innter blocking part is a collar flange.
6. coating apparatus according to claim 1 also comprises a pipeline, is coupled to this output and this nozzle of this pump respectively.
7. coating apparatus according to claim 6, wherein this nozzle body has an external screw thread, and this nozzle and this pipeline are via this external screw thread assembling.
8. coating apparatus according to claim 6 also comprises one second filter, between this pipeline and this pump.
9. coating apparatus according to claim 1, wherein this first filter comprises that one has the filtering medium of microporosity structure.
10. nozzle comprises:
One nozzle body has an innter blocking part; And
One filter is disposed in this nozzle body, and this filter comprises that one has the filtering medium of microporosity structure, in order to filter the impurity of a coating fluid.
11. nozzle according to claim 10, wherein this coating fluid is a photoresist liquid.
12. nozzle according to claim 10, wherein this nozzle body is by this innter blocking part, to fix this filter.
13. nozzle according to claim 10 wherein has at least two contact points between this innter blocking part and this filter.
14. nozzle according to claim 10, wherein this innter blocking part is a collar flange.
15. nozzle according to claim 10, wherein this nozzle body has an external screw thread.
CNA2007101617704A 2007-09-26 2007-09-26 Coating device and nozzle Pending CN101396684A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2007101617704A CN101396684A (en) 2007-09-26 2007-09-26 Coating device and nozzle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2007101617704A CN101396684A (en) 2007-09-26 2007-09-26 Coating device and nozzle

Publications (1)

Publication Number Publication Date
CN101396684A true CN101396684A (en) 2009-04-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101617704A Pending CN101396684A (en) 2007-09-26 2007-09-26 Coating device and nozzle

Country Status (1)

Country Link
CN (1) CN101396684A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107029953A (en) * 2015-10-30 2017-08-11 普罗科技有限公司 Pump position-feedback type dispensing device and apply method of completing the square

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107029953A (en) * 2015-10-30 2017-08-11 普罗科技有限公司 Pump position-feedback type dispensing device and apply method of completing the square
CN107029953B (en) * 2015-10-30 2019-05-21 普罗科技有限公司 It pumps position-feedback type dispensing device and applies method of completing the square

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Open date: 20090401