CN101393875B - 全自动引线键合机键合头力补偿方法 - Google Patents
全自动引线键合机键合头力补偿方法 Download PDFInfo
- Publication number
- CN101393875B CN101393875B CN2008100795412A CN200810079541A CN101393875B CN 101393875 B CN101393875 B CN 101393875B CN 2008100795412 A CN2008100795412 A CN 2008100795412A CN 200810079541 A CN200810079541 A CN 200810079541A CN 101393875 B CN101393875 B CN 101393875B
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- Prior art keywords
- bonding head
- motion
- control card
- keying
- bonding
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Feedback Control In General (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100795412A CN101393875B (zh) | 2008-10-09 | 2008-10-09 | 全自动引线键合机键合头力补偿方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100795412A CN101393875B (zh) | 2008-10-09 | 2008-10-09 | 全自动引线键合机键合头力补偿方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101393875A CN101393875A (zh) | 2009-03-25 |
CN101393875B true CN101393875B (zh) | 2010-07-14 |
Family
ID=40494095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100795412A Expired - Fee Related CN101393875B (zh) | 2008-10-09 | 2008-10-09 | 全自动引线键合机键合头力补偿方法 |
Country Status (1)
Country | Link |
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CN (1) | CN101393875B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102343477B (zh) * | 2010-08-02 | 2014-02-19 | 北京中电科电子装备有限公司 | 一种键合头装置 |
CN101969034A (zh) * | 2010-09-03 | 2011-02-09 | 比锐精密设备(深圳)有限公司 | 四环精密位置控制和力控制方法 |
CN104516280B (zh) * | 2013-09-30 | 2017-05-31 | 北京中电科电子装备有限公司 | 一种控制器和引线键合控制装置 |
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2008
- 2008-10-09 CN CN2008100795412A patent/CN101393875B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101393875A (zh) | 2009-03-25 |
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Date | Code | Title | Description |
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EE01 | Entry into force of recordation of patent licensing contract |
Assignee: CETC BEIJING ELECTRONIC EQUIPMENT Co.,Ltd. Assignor: THE 45TH Research Institute OF CETC Contract fulfillment period: 2008.10.10 to 2014.12.29 Contract record no.: 2009990000524 Denomination of invention: Force compensation method for keying head of full-automatic wire keying machine License type: Exclusive license Record date: 20090518 |
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LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.10.10 TO 2014.12.29; CHANGE OF CONTRACT Name of requester: BEIJING ZHONGDIAN SCIENCE ELECTRONIC EQUIPMENT CO. Effective date: 20090518 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100714 Termination date: 20111009 |