CN101389900B - Illuminating apparatus - Google Patents

Abstract

The invention provides a lighting device to irradiate light from a plurality of light-emitting modules in a plurality of different directions, while avoiding deterioration in the heat radiation efficiency of fins. In a lighting device 10, having a plurality of light-emitting element modules 1 with fins 1e1 to radiate heat generated by a light-emitting element 1a, the light-emitting element modules 1-1, 1-4, ..., 1-8 are arranged so that the main optical axis L1-1 of one light-emitting element module 1-1 and the main optical axes L1-4, L1-5, ..., L1-8 of the other light-emitting element modules 1-4, 1-5, ..., 1-8 form an angle larger than 0 DEG, or form a positional relation of torsion. The fins 1-1e1, 1-2e1, ..., 1-8e1 are arranged so that all the fins 1-1e1, 1-2e1, ..., 1-8e1 are parallel to the perpendicular face, and the base portion of the fins is positioned at the same height as that of the tip portion of the fins or positioned at a side lower than the tip portion of the fins.

Description

Lighting device

Technical field

The present invention relates to lighting device, this lighting device is provided with a plurality of light-emitting device modules, and these a plurality of light-emitting device modules have the fin that is used for the heat that the bulk storage light-emitting component produced.

Background technology

For example in the lighting device that patent documentation 1 is put down in writing, be provided with a plurality of light-emitting device modules (led light source module), these a plurality of light-emitting device modules have the fin that is used for the heat that bulk storage light-emitting component (LED) produced.

In this lighting device, on the surface that is used for the bridge part (base portion) of bridge joint in abutting connection with the bottom of fin, be to dispose light-emitting component (LED) on the face of same side with disposing gelled, the ligthing paraphernalia housing is connected to and disposes gelled and is the face of opposition side.As a result, the heat that light-emitting component (LED) is produced, and is conducted heat to the ligthing paraphernalia housing via bridge part (base portion) from the fin bulk storage via bridge part (base portion).

In addition, in the lighting device that Fig. 9 put down in writing of patent documentation 1, although be provided with a plurality of light-emitting device modules (led light source module), a plurality of light-emitting device modules are configured to: make the key light axis of a light-emitting device module and the primary optical axis line parallel of other light-emitting device modules.Therefore, the light from a plurality of light-emitting device modules can not be shone to a plurality of different directions.

On the other hand, in the direction of the key light axis of wanting to change light-emitting device module so that from the light of a plurality of light-emitting device modules when a plurality of different directions irradiation, can hinder the ascending air of the air that is heated from fin, thus, might cause the radiating efficiency of fin to descend.

[patent documentation 1] TOHKEMY 2004-55229 communique

Summary of the invention

In view of the above problems, the purpose of this invention is to provide a kind of radiating efficiency of fin of avoiding and descend, simultaneously the lighting device that the light from a plurality of light-emitting device modules can be shone to a plurality of different directions.

According to the present invention, a kind of lighting device is provided, this lighting device is provided with a plurality of light-emitting device modules, this light-emitting device module has light-emitting component and is used for the fin of the heat that the described light-emitting component of bulk storage produced, this lighting device is characterised in that, described fin is arranged in parallel with the optical axis direction of described light-emitting device module, a plurality of light-emitting device modules are configured to make the primary optical axis line of the key light axis of a light-emitting device module and other light-emitting device modules to form angle greater than 0 °, perhaps form the position relation of reversing, and all fin arrangement become: all fin are parallel to vertical plane, and the bottom of fin is positioned at the height identical with the leading section of this fin or is positioned at the downside of the leading section of this fin.

And, the present inventor has carried out wholwe-hearted research at following situation: form under the tectal situation on which part on the surface of the thermal component that is used for the heat that the bulk storage light-emitting component produced, just can improve the cooling effectiveness of thermal component to light-emitting component the biglyyest.

Result of study, the present inventor finds, when in the surface at thermal component with part that air contacts on when having formed cover layer, can improve from thermal component to airborne radiating efficiency, the result, although can improve the cooling effectiveness of thermal component to light-emitting component, yet when in the surface at thermal component with part that light-emitting component contacts on when having formed cover layer, heat transmission resistance between light-emitting component and the thermal component increases, as a result, descend by the cooling effectiveness of thermal component to the light-emitting component cooling.

That is, the present inventor finds, do not form cover layer and can improve the cooling effectiveness of thermal component to light-emitting component in the surface of thermal component with on the part that light-emitting component contacts.

And, the present inventor finds, keep as green surface with the part that will contact with light-emitting component in the surface of thermal component and to compare, this part is ground the heat transmission resistance that can reduce between light-emitting component and the thermal component, as a result, can improve the cooling effectiveness of thermal component to light-emitting component.

And, the present inventor finds, keep as green surface with the part that will contact with light-emitting component in the surface of thermal component and to compare, on this part, dispose grease-like for example, lamellar etc. thermal conductivity interface material, can reduce the heat transmission resistance between light-emitting component and the thermal component, as a result, can improve the cooling effectiveness of thermal component to light-emitting component.

And the present inventor is not only to light-emitting component and the direct-connected situation of thermal component, and also the cooling effectiveness of the light-emitting component under the situation that light-emitting component and thermal component are connected via heat transfer component has carried out wholwe-hearted research.

Result of study, the present inventor finds, when in the surface at heat transfer component with part that air contacts on when having formed cover layer, can improve the efficient of to air, dispelling the heat from heat transfer component, the result can improve the cooling effectiveness of heat transfer component to light-emitting component.That is, the present inventor finds that heat transfer component can be used as thermal component and plays a role.

And, result of study, the present inventor finds, when the part that contacts with light-emitting component in the surface at heat transfer component and with part that thermal component contacts on when having formed cover layer, heat transmission resistance between heat transmission resistance between light-emitting component and the heat transfer component and heat transfer component and the thermal component increases, as a result, the cooling effectiveness of light-emitting component descends.

That is, the present inventor finds, the part that in the surface of heat transfer component, contacts with light-emitting component and with part that thermal component contacts on do not form cover layer, can improve the cooling effectiveness of light-emitting component.

And, the present inventor finds, compare as the situation that green surface keeps with the part that will contact with light-emitting component in the surface of heat transfer component and with the part of thermal component contact, these parts are ground the heat transmission resistance that can reduce between light-emitting component and the heat transfer component and the heat transmission resistance between heat transfer component and the thermal component, as a result, can improve the cooling effectiveness of light-emitting component.

And, the present inventor finds, compare as the situation that green surface keeps with the part that will contact with light-emitting component in the surface of heat transfer component and with the part of thermal component contact, can reduce heat transmission resistance between light-emitting component and the heat transfer component and the heat transmission resistance between heat transfer component and the thermal component at configuration thermal conductivity interface material on these parts, as a result, can improve the cooling effectiveness of light-emitting component.

And, the present inventor has carried out wholwe-hearted research according to identical idea to following: carrying out just can improving the cooling effectiveness of thermal component to light-emitting component under the situation that roughening handles on which part on the surface of the thermal component that is used for the heat that the bulk storage light-emitting component produced the biglyyest.

Result of study, the present inventor finds, when having carried out roughening when handling in the surface at thermal component with on the part that air contacts, can improve the efficient of to air, dispelling the heat from thermal component, the result, although can improve the cooling effectiveness of thermal part to light-emitting component, yet when having carried out roughening when handling in the surface at thermal component with on the part that light-emitting component contacts, heat transmission resistance between light-emitting component and the thermal component increases, as a result, thermal component descends to the cooling effectiveness of light-emitting component.

That is, the present inventor finds, do not carry out the roughening processing in the surface of thermal component with on the part that light-emitting component contact, can improve the cooling effectiveness of thermal component to light-emitting component.

In lighting device of the present invention, a plurality of light-emitting device modules are configured to make the primary optical axis line of the key light axis of a light-emitting device module and other light-emitting device modules to form greater than 0 ° angle or form the position relation of reversing.Therefore, the light from a plurality of light-emitting device modules can be shone to a plurality of different directions.

And when fin arrangement becomes when being greater than 0 ° angle with respect to vertical plane, the ascending air of the fin lower air of being heated from fin is hindered by this fin, result, the radiating efficiency of fin descend (problem 1); When fin arrangement becomes to make the bottom of fin to be positioned at the upside of leading section of fin, the ascending air of the air that is heated from fin is subjected to being used for bridge joint and hinders in abutting connection with the bridge part of the bottom of fin, as a result, the problem (problem 2) that has the radiating efficiency decline of fin.

In lighting device of the present invention, all fin arrangement become: all fin are parallel to vertical plane, and the bottom of fin is positioned on the height identical with the leading section of this fin or is positioned at the downside of the leading section of this fin.Therefore, solve the problems referred to above 1 and 2, can avoid the radiating efficiency of fin to descend.

That is,, can when descending, the radiating efficiency of avoiding fin will shine to a plurality of different directions from the light of a plurality of light-emitting device modules according to lighting device of the present invention.

In order to make fin be parallel to vertical plane, and make the bottom of fin be positioned on the height identical or be positioned at the downside of the leading section of fin, light-emitting device module is rotated install with the leading section of fin.

On the other hand, form at the luminous intensity distribution figure of light-emitting device module under the situation of polygonal shape for example, have such danger, that is: when light-emitting device module rotates, the position deviation target location (problem 3) that arrives from the light of light-emitting device module.

In order to deal with problems 3, in lighting device of the present invention, preferably, the luminous intensity distribution figure of light-emitting device module forms with the key light axis of the light-emitting device module circular shape as the center.

In lighting device of the present invention, preferably, each light-emitting device module is provided with the light-emitting component of a circular.

Perhaps, in lighting device of the present invention, preferably, on the circle of key light axis, be arranged with two above light-emitting components as the center with light-emitting device module.

In detail, in lighting device of the present invention, preferably, the luminous intensity distribution figure of light-emitting device module forms with the key light axis of the light-emitting device module circular shape as the center, even make the light-emitting device module rotation, the position that arrives from the light of light-emitting device module can not change yet.

Thus, can reduce such danger, that is: follow the rotation of light-emitting device module, from the position deviation target location that light arrived of light-emitting device module.

In lighting device of the present invention, preferably, on the surface of the thermal component that is used for the heat that the bulk storage light-emitting component produced and part that air contacts, be formed with cover layer.Therefore,, the efficient that the part that contacts with air is dispelled the heat can be improved from the surface of thermal component in air, thus, the cooling effectiveness of thermal component can be improved light-emitting component according to lighting device of the present invention.

And, in lighting device of the present invention, preferably, on the surface of the thermal component that is used for the heat that the bulk storage light-emitting component produced and part that material beyond the air contacts, do not form cover layer.Therefore, owing to form cover layer on the part that in the surface of thermal component, contacts with air material in addition, cause this air material and heat transmission resistance between the thermal component in addition to increase, the result can avoid descending by the cooling effectiveness of thermal component light-emitting component cooling.Promptly, according to lighting device of the present invention, compare with the tectal situation of formation on the part that in the surface of thermal component, contacts with air material in addition, can reduce material beyond this air and the heat transmission resistance between the thermal component, thus, can improve the cooling effectiveness that adopts thermal component that light-emitting component is cooled off.

That is,, the efficient that the part that contacts with air is dispelled the heat be can improve from the surface of thermal component in air, material beyond the air and the heat transmission resistance between the thermal component reduced simultaneously according to lighting device of the present invention.

In lighting device of the present invention, preferably, on the surface of the thermal component that is used for the heat that the bulk storage light-emitting component produced and part that air contacts, carried out the roughening processing.Therefore, the efficient that the part that contacts with air is dispelled the heat can be improved from the surface of thermal component in air, thus, the cooling effectiveness of thermal component can be improved light-emitting component.

And, in lighting device of the present invention, preferably, on the surface of the thermal component that is used for the heat that the bulk storage light-emitting component produced and part that material beyond the air contact, do not carry out the roughening processing.Therefore, because carrying out roughening on the part that contacts with air material in addition in the surface of thermal component handles, cause this air material and heat transmission resistance between the thermal component in addition to increase, the result can avoid by the decrease in efficiency of thermal component to the light-emitting component cooling.Promptly, according to lighting device of the present invention, compare with the situation of carrying out the roughening processing on the part that in the surface of thermal component, contacts with air material in addition, can reduce material beyond this air and the heat transmission resistance between the thermal component, thus, can improve the efficient of thermal component to the light-emitting component cooling.

That is,, the efficient that the part that contacts with air is dispelled the heat be can improve from the surface of thermal component in air, material beyond the air and the heat transmission resistance between the thermal component reduced simultaneously according to lighting device of the present invention.

In lighting device of the present invention, preferably, be used for the part that the surface of the thermal component of the heat that the bulk storage light-emitting component produced contacts with material beyond the air and ground.Thus, compare as the situation that green surface keeps with the part that will contact with the material beyond the air in the surface of thermal component, can reduce material beyond the air and the heat transmission resistance between the thermal component, the result can improve the cooling effectiveness of thermal component to light-emitting component.

In lighting device of the present invention, preferably, on the surface of the thermal component that is used for the heat that the bulk storage light-emitting component produced and part that material beyond the air contacts, dispose the thermal conductivity interface material.Thus, compare as the situation that green surface keeps with the part that will contact with the material beyond the air in the surface of thermal component, material beyond the air and the heat transmission resistance between the thermal component can be reduced, thus, the cooling effectiveness of thermal component can be improved light-emitting component.

In lighting device of the present invention, preferably, be used for the attaching parts that the light-emitting component power consumption utmost point and outer electrode couple together are configured in the space and do not use resin to seal, wherein the light-emitting component power consumption utmost point is used for powering to light-emitting component.Thus, compare, can reduce the thermal stress that imposes on attaching parts with the situation that attaching parts use resin to seal.

And in lighting device of the present invention, preferably, attaching parts are constrained for: the terminal that is connected with the light-emitting component power consumption utmost point in two terminals of attaching parts is a stiff end, and the terminal that is connected with outer electrode is a free end.In other words, attaching parts are constrained for and are essentially the single armed girder construction.Thus, with terminal that is connected in the light-emitting component power consumption utmost point and the terminal that is connected in outer electrode all is that the situation of stiff end is compared, that is, be constrained for the situation that is essentially the built-in beam structure with attaching parts and compare, can reduce the thermal stress that imposes on attaching parts.

That is, in lighting device of the present invention, preferably, the terminal that only is connected with the light-emitting component power consumption utmost point in two terminals of attaching parts is restrained, and other parts are not restrained.Therefore, even follow the heating of light-emitting component in attaching parts and under the situation about heating up, also can not apply thermal stress to attaching parts, attaching parts can freely be carried out thermal expansion.

In other words,, the thermal stress that imposes on attaching parts can be reduced, reliability can be improved according to lighting device of the present invention.

In lighting device of the present invention, preferably, more disposing the thermal component that is used for the heat that the bulk storage light-emitting component produced on the position near light-emitting component than the light-emitting component power consumption utmost point.Thus, be configured in than the light-emitting component power consumption utmost point with the thermal component that will be used for the heat that the bulk storage light-emitting component produced and compare, can reduce the thermal stress that imposes on attaching parts further from the locational situation of light-emitting component.

In lighting device of the present invention, preferably, used to be used for light-emitting component is fixed on bonding agent on the thermal component, lighting device is provided with anti-flow unit, is used to prevent that this bonding agent from flowing out between light-emitting component and thermal component.Thus, can avoid arriving the light-emitting component power consumption utmost point from the bonding agent that flows out between light-emitting component and the thermal component.

In lighting device of the present invention, preferably, use flexible substrate as attaching parts.And, on flexible substrate, be formed with the slotted hole that is used for flexible substrate is directed to the outer electrode side.Thus,, can suppress thermal stress and impose on flexible substrate, simultaneously flexible substrate is directed to the outer electrode side by slidably projection is set in the slotted hole of flexible substrate.

Description of drawings

Fig. 1 is the figure of light-emitting device module 1 that the part of the lighting device that constitutes the 1st embodiment is shown.

Fig. 2 is the figure that illustrates from the luminous intensity distribution figure of the light of light-emitting device module shown in Figure 11 irradiation.

Fig. 3 illustrates the figure of a part that is used to that the installing component 2 of light-emitting device module shown in Figure 11 is installed and is used to support the pillar 3 of installing component 2.

Fig. 4 illustrates the figure of a part that is used to that the installing component 2 of light-emitting device module shown in Figure 11 is installed and is used to support the pillar 3 of installing component 2.

Fig. 5 is illustrated in the figure that the state of eight light-emitting device modules shown in Figure 11 (1-1,1-2,1-3,1-4,1-5,1-6,1-7,1-8) is installed on Fig. 3 and the installing component 2 shown in Figure 4.

Fig. 6 is illustrated in the figure that the state of eight light-emitting device modules shown in Figure 11 (1-1,1-2,1-3,1-4,1-5,1-6,1-7,1-8) is installed on Fig. 3 and the installing component 2 shown in Figure 4.

Fig. 7 is illustrated in the figure that the state of eight light-emitting device modules shown in Figure 11 (1-1,1-2,1-3,1-4,1-5,1-6,1-7,1-8) is installed on Fig. 3 and the installing component 2 shown in Figure 4.

Fig. 8 is the overall diagram of the lighting device 10 of the 1st embodiment.

Fig. 9 is the figure of light-emitting device module 1 that the part of the lighting device that constitutes the 2nd embodiment is shown.

Figure 10 is the figure that illustrates from the luminous intensity distribution figure of the light of light-emitting device module 1 irradiation of the lighting device of the 2nd embodiment shown in Figure 9.

Figure 11 is the figure of light-emitting device module 1 that the part of the lighting device that constitutes the 4th embodiment is shown.

Figure 12 is the amplification view of thermal interface material (heat transfer component) 1d of the lighting device of the 8th embodiment.

Figure 13 is the amplification view of housing 1e of the lighting device of the 8th embodiment.

Figure 14 is the amplification view of a part of installing component 2 of the lighting device of the 8th embodiment.

Figure 15 is the cutaway view of major part of light-emitting device module of the lighting device of the 28th embodiment.

Figure 16 is the major part plane of light-emitting device module of the lighting device of the 28th embodiment under the state of having pulled down lens 110.

Figure 17 is slot part 104a shown in Figure 15, the enlarged drawing of 104b.

Figure 18 is the major part cutaway view of light-emitting device module of the lighting device of the 33rd embodiment.

Figure 19 is the major part plane of light-emitting device module of the lighting device of the 33rd embodiment under the state of having pulled down lens 110.

The specific embodiment

Below, the lighting device of the 1st embodiment of the present invention is described with reference to Fig. 1～Fig. 8.

Fig. 1 is the figure of light-emitting device module 1 that the part of the lighting device that constitutes the 1st embodiment of the present invention is shown.In detail, Fig. 1 (A) is the left side view that the light-emitting device module 1 that illustrates cuts open in office, Fig. 1 (B) is the front view of light-emitting device module 1, and Fig. 1 (C) is from the front side and the stereogram of lower-left side observation light-emitting device module 1, and Fig. 1 (D) is the bottom view of light-emitting device module 1.

In Fig. 1,1a represents for example such light-emitting component of LED.1b represents to have the reflector of reflecting surface, and this reflecting surface is used to make light (downside of Fig. 1 (A) and Fig. 1 (the B)) reflection downwards from light-emitting component 1a radiation.1c represents to be installed in the lens on the reflector 1b, and it is used for carrying out distribution controls to the direct light that comes self-emission device 1a with from the reverberation of the reflecting surface of reflector 1b.

And in Fig. 1,1d represents thermal interface material, and it is used to support the heat that light-emitting component 1a and reflector 1b and bulk storage or conduction light-emitting component 1a are produced.1e represents to be used to support the housing of thermal interface material 1d.1e1 represents fin, and it constitutes the part of housing 1e.1f represents to be used for the cover of covering luminous element 1a, reflector 1b, lens 1c and thermal interface material 1d.2 expressions are used to install the installing component of light-emitting device module 1.

In the lighting device of the 1st embodiment, the part of the heat that light-emitting component 1a is produced is from thermal interface material 1d bulk storage.And the part of the heat that light-emitting component 1a is produced is transmitted to the fin 1e1 of housing 1e via thermal interface material 1d heat, and from fin 1e1 bulk storage.And the part of the heat that light-emitting component 1a is produced is transmitted to installing component 2 via thermal interface material 1d and housing 1e heat, and from installing component 2 bulk storages.

Fig. 2 is the figure that illustrates from the luminous intensity distribution figure of the light of light-emitting device module shown in Figure 11 irradiation.The left side of Fig. 2 is equivalent to the rear side (the lower-left side of Fig. 1 (C)) of light-emitting device module shown in Figure 11, the right side of Fig. 2 is equivalent to the front side (upper right side of Fig. 1 (C)) of light-emitting device module shown in Figure 11, the upside of Fig. 2 is equivalent to the right side (lower right side of Fig. 1 (C)) of light-emitting device module shown in Figure 11, and the downside of Fig. 2 is equivalent to the left side (upper left side of Fig. 1 (C)) of light-emitting device module shown in Figure 11.

In the lighting device of the 1st embodiment, as depicted in figs. 1 and 2, the optically focused characteristic of lens 1c is configured to: the optically focused degree of left and right directions (outer-inboard direction of Fig. 1 (A), the left and right directions of Fig. 1 (B), upper left-lower right side direction of Fig. 1 (C), the left and right directions of Fig. 1 (D), the above-below direction of Fig. 2) that makes light-emitting device module 1 is less than the optically focused degree of the fore-and-aft direction (outer-inboard direction of the left and right directions of Fig. 1 (A), Fig. 1 (B), upper right-lower-left side direction of Fig. 1 (C), the above-below direction of Fig. 1 (D), the left and right directions of Fig. 2) of light-emitting device module 1.

In other words, in the lighting device of the 1st embodiment, as shown in Figure 2, be configured to from the luminous intensity distribution figure of the light of light-emitting device module 1 irradiation: left and right directions (above-below direction of Fig. 2) is longer than fore-and-aft direction (left and right directions of Fig. 2).

Fig. 3 and Fig. 4 illustrate the figure of a part that is used to that the installing component 2 of light-emitting device module shown in Figure 11 is installed and is used to support the pillar 3 of installing component 2.In detail, Fig. 3 (A) is the plane of the part of installing component 2 and pillar 3, Fig. 3 (B) is the front view of the part of installing component 2 and pillar 3, Fig. 4 (A) is the left side view of the part of installing component 2 and pillar 3, and Fig. 4 (B) is the bottom view of the part of installing component 2 and pillar 3.

In the lighting device of the 1st embodiment, as shown in Figure 3 and Figure 4, installing component 2 is divided into eight subregion 2-1,2-2,2-3,2-4,2-5,2-6,2-7,2-8.In detail, shown in Fig. 3 (A) and Fig. 3 (B), subregion 2-1, the 2-2 of installing component 2,2-3, subregion 2-4,2-5 and subregion 2-6,2-7,2-8 bend to two stages.

Fig. 5～Fig. 7 is illustrated in the figure that the state of eight light-emitting device modules shown in Figure 11 (1-1,1-2,1-3,1-4,1-5,1-6,1-7,1-8) is installed on Fig. 3 and the installing component 2 shown in Figure 4.

In detail, Fig. 5 (A) is the plane that the part of the installing component 2 of light-emitting device module 1 (1-1,1-2,1-3,1-4,1-5,1-6,1-7,1-8) and pillar 3 is installed, and Fig. 5 (B) is the front view that the part of the installing component 2 of light-emitting device module 1 (1-1,1-2,1-3,1-4,1-5,1-6,1-7,1-8) and pillar 3 is installed.Fig. 6 (A) is the left side view that the part of the installing component 2 of light-emitting device module 1 (1-1,1-2,1-3,1-4,1-5,1-6,1-7,1-8) and pillar 3 is installed, and Fig. 6 (B) is the bottom view that the part of the installing component 2 of light-emitting device module 1 (1-1,1-2,1-3,1-4,1-5,1-6,1-7,1-8) and pillar 3 is installed.

And, Fig. 7 (A) be illustrate the light-emitting device module 1-2, the 1-4 that are installed on the installing component 2,1-7 the position relation with the identical figure of Fig. 5 (B), Fig. 7 (B) be illustrate the light-emitting device module 1-2, the 1-5 that are installed on the installing component 2,1-7 the position relation with the identical figure of Fig. 5 (B), Fig. 7 (C) be illustrate the light-emitting device module 1-3, the 1-5 that are installed on the installing component 2,1-8 the position relation with the identical figure of Fig. 5 (B).

Fig. 8 is the overall diagram of the lighting device 10 of the 1st embodiment.In detail, Fig. 8 (A) is the front view of the lighting device 10 of the 1st embodiment, and Fig. 8 (B) is the left side view of the lighting device 10 of the 1st embodiment.

In the lighting device 10 of the 1st embodiment, as Fig. 5～shown in Figure 7, be configured in key light axis L1-4, the L1-5 directed downwards of light-emitting device module 1-4, the 1-5 of central authorities, the lower right is pointed in configuration light-emitting device module 1-1,1-2, the key light axis L1-1 of 1-3, L1-2, the L1-3 in left side in the drawings, and disposing in the drawings, light-emitting device module 1-6,1-7, the 1-8 on right side point to the lower left.

And the key light axis of the light-emitting device module about being configured in staggers on fore-and-aft direction with key light axis L1-4, the L1-5 of the light-emitting device module 1-4, the 1-5 that are configured in central authorities, forms the position relation of reversing mutually.For example there is the relation of reversing between the key light axis L1-1 of the key light axis L1-4 of light-emitting device module 1-4 and light-emitting device module 1-1,1-2,1-6,1-7, L1-2, L1-6, the L1-7.Equally, there is the relation of reversing between the key light axis L1-2 of the key light axis L1-5 of light-emitting device module 1-5 and light-emitting device module 1-2,1-3,1-7,1-8, L1-3, L1-7, the L1-8.

And, be positioned at light-emitting device module on the opposed locations of both sides and be configured to make each other primary optical axis line to form predetermined angular greater than 0 °.That is, the formed angle of key light axis L1-8 of the key light axis L1-3 of the formed angle of key light axis L1-7 of the key light axis L1-2 of the formed angle of key light axis L1-6 of the key light axis L1-1 of light-emitting device module 1-1 and light-emitting device module 1-6, light-emitting device module 1-2 and light-emitting device module 1-7 and light-emitting device module 1-3 and light-emitting device module 1-8 is the predetermined angular greater than 0 °.

By taking above-mentioned configuration, the light from eight light-emitting device module 1-1,1-2,1-3,1-4,1-5,1-6,1-7,1-8 can be shone to different directions.

And in the lighting device 10 of the 1st embodiment, the bottom that all fin 1-1e1～1-8e1 of light-emitting device module 1-1～1-8 are configured to be parallel to vertical plane and to make fin is positioned at the downside of the leading section of fin.

With light-emitting device module 1-1 is that example describes, shown in Fig. 5 (A), Fig. 5 (B) and Fig. 6 (A), all fin 1-1e1 of light-emitting device module 1-1 are configured to: make all fin 1-1e1 be parallel to vertical plane, and make the bottom (the lower right side part of Fig. 5 (B)) of fin 1-1e1 be positioned at the downside of the leading section (the upper left side part of Fig. 5 (B)) of fin 1-2e1.

Therefore, the air that is heated from the fin 1-1e1 of light-emitting device module 1-1 can along the surface of fin 1-1e1 to directly over rise.As a result, can improve the radiating efficiency of fin 1-1e1 the biglyyest.

These all fin 1-1e1～1-8e1 for all light-emitting device module 1-1～1-8 all are the same, thus, can avoid the radiating efficiency of fin 1-1e1,1-2e1,1-3e1,1-4e1,1-5e1,1-6e1,1-7e1,1-8e1 to descend, the light from eight light-emitting device module 1-1,1-2,1-3,1-4,1-5,1-6,1-7,1-8 can be shone to a plurality of different directions simultaneously.

And, in the lighting device 10 of the 1st embodiment, be not roughly consistent with the irradiation area of lighting device integral body by the zone of a light-emitting device module 1 irradiation, the zone of being shone by a light-emitting device module 1 is less than the irradiation area of lighting device integral body.

In detail, the irradiation area of lighting device integral body is divided into a plurality of zonules, and a zonule is assigned with the irradiation area of a light-emitting device module 1.And, in the irradiation area of two light-emitting device modules 1, be provided with repeating part.

The lighting device of the 2nd embodiment is described below with reference to Fig. 9 and Figure 10.

In the lighting device of the 2nd embodiment, with the difference of the 1st embodiment be to use light-emitting device module 1 shown in Figure 9 to replace light-emitting device module shown in Figure 11.Except this point, with the lighting device 10 of above-mentioned the 1st embodiment be roughly the same formation, can obtain roughly the same effect.

Fig. 9 is the figure of light-emitting device module 1 that the part of the lighting device that constitutes the 2nd embodiment is shown.In detail, Fig. 9 (A) is the plane of light-emitting device module 1 of the lighting device of the 2nd embodiment, and Fig. 9 (B) is the left side view of the light-emitting device module 1 of office's lighting device of cuing open the 2nd embodiment that illustrates.Fig. 9 (C) is the front view of light-emitting device module 1 that the lighting device of the 2nd embodiment that illustrates cuts open in office, and Fig. 9 (D) is the bottom view of light-emitting device module 1 of the lighting device of the 2nd embodiment.

Figure 10 is the figure that illustrates from the luminous intensity distribution figure of the light of light-emitting device module 1 irradiation of the lighting device of the 2nd embodiment shown in Figure 9.

In the lighting device 10 of the 1st embodiment, as shown in Figure 1, light-emitting device module 1 is provided with three light-emitting component 1a, as shown in Figure 2, from the luminous intensity distribution figure of the light of light-emitting device module 1 irradiation be configured to (above-below direction of Fig. 2) on the left and right directions than on fore-and-aft direction (left and right directions of Fig. 2) long, yet in the lighting device of the 2nd embodiment, replace, as shown in Figure 9, light-emitting device module 1 is provided with the light-emitting component 1a of a circular, as shown in figure 10, be configured to key light axis L1 (with reference to Fig. 9 (B) and Fig. 9 (C)) as the circular shape at center from the luminous intensity distribution figure of the light of light-emitting device module 1 irradiation with light-emitting device module 1.

In detail, in the lighting device of the 2nd embodiment, the luminous intensity distribution figure of light-emitting device module 1 forms the circular shape as the center with the key light axis L1 of light-emitting device module 1, even make light-emitting device module 1 with respect to installing component 2 (with reference to Fig. 3 and Fig. 4) rotation, the position that arrives from the light of light-emitting device module 1 does not change yet.

In the lighting device of the 2nd embodiment, the same with the lighting device 10 of the 1st embodiment, shown in Fig. 5 (B), Fig. 7 (A) and Fig. 7 (C), subregion 2-1, the 2-2, light-emitting device module 1-1,1-2 on the 2-3, the key light axis L1-1 of 1-3, L1-2, the L1-3 that are installed in installing component 2 point to the lower right, and subregion 2-6, the 2-7, light-emitting device module 1-6,1-7 on the 2-8, the key light axis L1-6 of 1-8, L1-7, the L1-8 that are installed in installing component 2 point to the lower left.

Replace, as the 3rd embodiment, subregion 2-1, the 2-2, light-emitting device module 1-1,1-2 on the 2-3, the key light axis L1-1 of 1-3, L1-2, the L1-3 that are installed in installing component 2 can point to lower right and the place ahead, and subregion 2-6, the 2-7, light-emitting device module 1-6,1-7 on the 2-8, the key light axis L1-6 of 1-8, L1-7, the L1-8 that are installed in installing component 2 can point to lower left and the place ahead.

In the lighting device of the 3rd embodiment, by light-emitting device module 1 (with reference to Fig. 9) rotatably is installed on the installing component 2 with respect to installing component 2 (with reference to Fig. 3 and Fig. 4), the same with the lighting device of the 1st and the 2nd embodiment, the air that is heated from the fin 1e1 of all light-emitting device modules 1 can along the surface of fin 1e1 to directly over rise.In detail, in the lighting device of the 3rd embodiment, by light-emitting device module 1 (with reference to Fig. 9) rotatably is installed on the installing component 2 with respect to installing component 2 (with reference to Fig. 3 and Fig. 4), all fin 1e1 can be configured to: make all fin 1e1 be parallel to vertical plane, and make the bottom of fin 1e1 be positioned at the downside of the leading section of this fin 1e1.As a result, the same according to the lighting device of the 3rd embodiment with the lighting device of the 1st and the 2nd embodiment, can improve the radiating efficiency of fin 1e1 the biglyyest.

The lighting device of the 4th embodiment is described below with reference to Figure 11.

The lighting device of the 4th embodiment uses light-emitting device module 1 shown in Figure 11 to replace light-emitting device module shown in Figure 11, except this point, with the lighting device 10 of above-mentioned the 1st embodiment be roughly the same formation, can obtain roughly the same effect.

Figure 11 is the figure of light-emitting device module 1 that the part of the lighting device that constitutes the 4th embodiment is shown.In detail, Figure 11 (A) is the plane of light-emitting device module 1 of the lighting device of the 4th embodiment, and Figure 11 (B) is the left side view of the light-emitting device module 1 of office's lighting device of cuing open the 4th embodiment that illustrates.Figure 11 (C) is the front view of light-emitting device module 1 that the lighting device of the 4th embodiment that illustrates cuts open in office, and Figure 11 (D) is the bottom view of light-emitting device module 1 of the lighting device of the 4th embodiment.

In the lighting device of the 4th embodiment, as shown in figure 11, on the circle (chain-dotted line of Figure 11 (D)) of key light axis L1, be arranged with four light-emitting component 1a1,1a2,1a3,1a4 as the center with light-emitting device module 1, as shown in figure 10, be configured to key light axis L1 (with reference to Figure 11 (B) and Figure 11 (C)) as the circular shape at center from the luminous intensity distribution figure of the light of light-emitting device module 1 irradiation with light-emitting device module 1.

In detail, in the lighting device 10 of the 1st embodiment, as shown in Figure 1, by light-emitting component 1a, reflector 1b, the group that lens 1c and thermal interface material 1d constitute is arranged on three groups of straight lines, yet in the lighting device of the 4th embodiment, as shown in figure 11, by light-emitting component 1a1, reflector 1b1, the group that lens 1c1 and thermal interface material 1d1 constitute, by light-emitting component 1a2, reflector 1b2, the group that lens 1c2 and thermal interface material 1d2 constitute, by light-emitting component 1a3, reflector 1b3, the group that lens 1c3 and thermal interface material 1d3 constitute, and by light-emitting component 1a4, reflector 1b4, the group that lens 1c4 and thermal interface material 1d4 constitute is arranged on the circle.

In more detail, the luminous intensity distribution figure of light-emitting device module 1 forms the circular shape as the center with the key light axis L1 of light-emitting device module 1, even make light-emitting device module 1 with respect to installing component 2 (with reference to Fig. 3 and Fig. 4) rotation, the position that arrives from the light of light-emitting device module 1 does not change yet.

In the lighting device of the 4th embodiment, the same with the lighting device 10 of the 1st embodiment, shown in Fig. 5 (B), Fig. 7 (A) and Fig. 7 (C), subregion 2-1, the 2-2, light-emitting device module 1-1,1-2 on the 2-3, the key light axis L1-1 of 1-3, L1-2, the L1-3 that are installed in installing component 2 point to the lower right, and subregion 2-6, the 2-7, light-emitting device module 1-6,1-7 on the 2-8, the key light axis L1-6 of 1-8, L1-7, the L1-8 that are installed in installing component 2 point to the lower left.

Replace, lighting device as the 5th embodiment, subregion 2-1, the 2-2, light-emitting device module 1-1,1-2 on the 2-3, the key light axis L1-1 of 1-3, L1-2, the L1-3 that are installed in installing component 2 can point to lower right and the place ahead, and subregion 2-6, the 2-7, light-emitting device module 1-6,1-7 on the 2-8, the key light axis L1-6 of 1-8, L1-7, the L1-8 that are installed in installing component 2 can point to lower left and the place ahead.

In the lighting device of the 5th embodiment, by light-emitting device module 1 (with reference to Figure 11) rotatably is installed on the installing component 2 with respect to installing component 2 (with reference to Fig. 3 and Fig. 4), the same with the lighting device of the 1st and the 4th embodiment, the air that is heated from the fin 1e1 of all light-emitting device modules 1 can along the surface of fin 1e1 to directly over rise.In detail, in the lighting device of the 5th embodiment, by light-emitting device module 1 (with reference to Figure 11) rotatably is installed on the installing component 2 with respect to installing component 2 (with reference to Fig. 3 and Fig. 4), all fin 1e1 can be configured to: make all fin 1e1 be parallel to vertical plane, and make the bottom of fin 1e1 be positioned at the downside of the leading section of this fin 1e1.As a result, the same according to the lighting device of the 5th embodiment with the lighting device of the 1st and the 4th embodiment, can improve the radiating efficiency of fin 1e1 the biglyyest.

In the lighting device of the 4th embodiment, as shown in figure 11, four light-emitting component 1a1,1a2,1a3,1a4 are arranged on the circle of key light axis L1 as the center with light-emitting device module 1, and as the 6th embodiment, the light-emitting component of plural any number can be arranged on the circle of key light axis L1 as the center with light-emitting device module 1, and can form the circular shape as the center with the key light axis L1 of light-emitting device module 1 from the luminous intensity distribution figure of the light of light-emitting device module 1 irradiation.

And in the lighting device 10 of the 1st embodiment, as shown in Figure 3 and Figure 4, installing component 2 is directly installed on the pillar 3, yet as the 7th embodiment, installing component 2 can be installed on the pillar 3 indirectly.

Below, as the 8th～the 27th embodiment,, the embodiment of the raising that realizes cooling effectiveness and heat transfer efficiency is described at the outer structure that is configured to of the fin of light-emitting device module.

The lighting device of the 8th embodiment at first, is described with reference to Figure 12～Figure 14.This lighting device except aspect described later, with the lighting device of above-mentioned the 1st embodiment be roughly the same formation.

In the lighting device of the 8th embodiment, the same with the lighting device of the 1st embodiment, the part of the heat that light-emitting component 1a is produced is from thermal interface material (heat transfer component) 1d bulk storage.That is, the same with the lighting device of the 1st embodiment in the lighting device of the 8th embodiment, thermal interface material (heat transfer component) 1d not only has heat transmission function, and has heat sinking function.

Figure 12 is the amplification view of thermal interface material (heat transfer component) 1d (with reference to Fig. 1) of the lighting device of the 8th embodiment.In the lighting device of the 1st embodiment, in surface with on the part that air contacts, do not form cover layer with the thermal interface material of heat sinking function (heat transfer component) 1d, yet in the lighting device of the 8th embodiment, as Fig. 1 and shown in Figure 12, in surface with on the part 1d4 that air contacts, be formed with cover layer with the thermal interface material of heat sinking function (heat transfer component) 1d.As a result, improved the cooling effectiveness to light-emitting component 1a cooling by thermal interface material (heat transfer component) 1d.

In addition, the part 1d4 that contacts with air that is substituted in thermal interface material (heat transfer component) 1d go up to form cover layer, can be in the surface of thermal interface material (heat transfer component) 1d with part 1d4 that air contact on carry out roughening processing (the 9th embodiment).

And, in the lighting device of the 8th embodiment,, do not form cover layer on the part that in surface, contacts with air material in addition with the thermal interface material of heat transmission function (heat transfer component) 1d as Fig. 1 and shown in Figure 12.In detail, on the part 1d1 that in the surface of thermal interface material (heat transfer component) 1d, the contacts part 1d2 that goes up, contact with reflector 1b with light-emitting component 1a and with part 1d3 that housing 1e contacts on do not form cover layer.

Have in the surface of thermal interface material (heat transfer component) 1d of heat transmission function and do not form tectal part, promptly the part 1d1 that contacts with light-emitting component 1a, the part 1d2 that contacts with reflector 1b and the part 1d3 that contacts with housing 1e are ground.As a result, reduced heat transmission resistance between thermal interface material (heat transfer component) 1d and light-emitting component 1a, reflector 1b and the housing 1e.

In addition, these parts 1d1,1d2,1d3 can keep (the 10th embodiment) as green surface without grinding.

Figure 13 is the amplification view of housing 1e (with reference to Fig. 1) of the lighting device of the 8th embodiment.In the lighting device of the 1st embodiment, do not form cover layer on the part of the fin 1e1 that in the surface of the housing 1e with heat sinking function, contacts and except that fin 1e1 and the part that air contacts with air, yet in the lighting device of the 8th embodiment, as Fig. 1 and shown in Figure 13, be formed with cover layer on the part of the fin 1e1 that in the surface of the housing 1e with heat sinking function, contacts and except that fin 1e1 and the part 1e4 that air contacts with air.As a result, improved the cooling effectiveness to light-emitting component 1a cooling by housing 1e.

In addition, be substituted in the part of the fin 1e1 that contacts with air in the surface of housing 1e and the part 1e4 that contacts with air except that fin 1e1 and go up the formation cover layer, handle (the 11st embodiment) and can on these parts, carry out roughening.

And, in the lighting device of the 8th embodiment,, do not form cover layer on the part that in the surface of the housing 1e with heat transmission function, contacts with air material in addition as Fig. 1 and shown in Figure 13.In detail, the part 1e2 that in the surface of housing 1e, contacts with thermal interface material (heat transfer component) 1d go up and with part 1e3 that installing component 2 contacts on do not form cover layer.

Not forming tectal part is ground.As a result, reduced heat transmission resistance between housing 1e and heat transfer component 1d and the installing component 2.

In addition, part 1e2 that contacts with thermal interface material (heat transfer component) 1d in the surface of housing 1e and the part 1e3 that contacts with installing component 2 can be used as green surface and keep and do not grind (the 12nd embodiment).

Figure 14 is the amplification view of a part of installing component 2 (with reference to Fig. 1) of the lighting device of the 8th embodiment.In the lighting device of the 1st embodiment, in the surface of installing component 2 with on the part that air contacts, do not form cover layer with heat sinking function, yet in the lighting device of the 8th embodiment, as Fig. 1 and shown in Figure 14, in the surface of installing component 2 with on the part 2b that air contacts, be formed with cover layer with heat sinking function.As a result, improved the cooling effectiveness that cools off by 2 couples of light-emitting component 1a of installing component.

The part 2b that contacts with air in the surface of installing component 2 can carry out roughening to be handled to replace and forms cover layer (the 13rd embodiment).

And, in the lighting device of the 8th embodiment,, do not form cover layer on the part that in the surface of installing component 2, contacts with air material in addition with heat transmission function as Fig. 1 and shown in Figure 14.In detail, do not form cover layer on the part 2a that in the surface of installing component 2, contacts with housing 1e.This part is ground.As a result, reduced heat transmission resistance between installing component 2 and the housing 1e.

The part 2a that contacts with housing 1e in the surface of installing component 2 can be used as the green surface reservation and does not grind (the 14th embodiment).

And, in the lighting device of the 8th embodiment, can between the parts of directly contact, dispose grease-like for example, lamellar etc. thermal conductivity interface material (not illustrating).For example, in the lighting device of the 8th embodiment, as Fig. 1 and shown in Figure 12, the part 1d1 that contacts with light-emitting component 1a in the surface of light-emitting component 1a direct contact heat interface material (heat transfer component) 1d, however can between them, dispose above-mentioned thermal conductivity interface material (the 15th embodiment).

And in the lighting device of the 8th embodiment, reflector 1b directly contacts the part 1d2 of thermal interface material (heat transfer component) 1d that is in contact with it, yet can dispose thermal conductivity interface material (the 16th embodiment) between them.

And, in the lighting device of the 8th embodiment, as Fig. 1, Figure 12 and shown in Figure 13, directly contact in the surface of housing 1e part 1e2 with the part 1d3 of housing 1e contact in the surface of thermal interface material (heat transfer component) 1d, yet can between them, dispose thermal conductivity interface material (the 17th embodiment) with heat transfer component 1d contact.

And, in the lighting device of the 8th embodiment, as Fig. 1, Figure 13 and shown in Figure 14, directly contact in the surface of installing component 2 part 2a with the part 1e3 that parts 2 contacts are installed in the surface of housing 1e, yet can between them, dispose thermal conductivity interface material (the 18th embodiment) with housing 1e contact.

In addition, in the lighting device of the 8th embodiment, as shown in Figure 1, a light-emitting device module 1 is provided with three groups of light-emitting component 1a, reflector 1b and lens 1c, however light-emitting component 1a, reflector 1b and the lens 1c (the 19th embodiment) of any group of number beyond can on a light-emitting device module 1, being provided with three groups.

And, in the lighting device of the 8th embodiment, as shown in Figure 3 and Figure 4, do not form cover layer on the part that in the surface of installing component 2, contacts with lampshade (not illustrating) with heat transmission function.This part is for example ground.As a result, reduced heat transmission resistance between installing component 2 and the lampshade.

In addition, the part that contacts with lampshade in the surface of installing component 2 can be used as the green surface reservation and does not grind (the 20th embodiment).

And, in the lighting device of the 8th embodiment, in surface with on the part that air contacts, be formed with cover layer with the lampshade of heat sinking function (not illustrating).As a result, improved by the cooling effectiveness of lampshade (not illustrating) light-emitting component 1a cooling.

In addition, can be in the surface of lampshade with part that air contacts on carry out roughening and handle to replace and form cover layer (the 21st embodiment).

And, in the lighting device of the 8th embodiment, in the surface of lampshade 3 with heat transmission function with air beyond the part that contacts of material on do not form cover layer, specifically, with part that installing component 2 contacts on do not form cover layer.This part is ground.As a result, reduced heat transmission resistance between lampshade and the installing component 2.

In addition, the part that contacts with installing component 2 in the lampshade can be used as the green surface reservation and does not grind (the 22nd embodiment).

And, in the lighting device of the 8th embodiment, the part of same lampshade (not illustrating) contact directly contacts in the surface of lampshade with the part that parts 2 contacts are installed in the surface of installing component 2, yet can dispose grease-like for example, lamellar etc. thermal conductivity interface material (not illustrating) (the 23rd embodiment) between them.

In the lighting device of the 8th embodiment, as shown in Figure 8, do not form cover layer on the part that in the surface of installing component 2, contacts with pillar 3.This part is preferably ground.As a result, reduced heat transmission resistance between installing component 2 and the pillar 3.

In addition, the part that contacts with pillar 3 in the installing component 2 can be used as the green surface reservation and does not grind (the 24th embodiment).

And, in the lighting device of the 1st embodiment, as shown in Figure 8, in the surface of pillar 3 with on the part that air contacts, do not form cover layer with heat sinking function, yet in the lighting device of the 8th embodiment, in the surface of pillar 3 with on the part that air contacts, be formed with cover layer with heat sinking function.As a result, improved the cooling effectiveness that cools off by 3 couples of light-emitting component 1a of pillar.The part that contacts with air in the surface of pillar 3 can replace the formation cover layer and carry out roughening and handle (the 25th embodiment).

And, in the lighting device of the 8th embodiment, as shown in Figure 8, in the surface of pillar 3 with heat transmission function with air beyond the part that contacts of material on do not form cover layer, specifically, with part that installing component 2 contacts on do not form cover layer.This part is preferably ground.As a result, reduced heat transmission resistance between pillar 3 and the installing component 2.

The part that contacts with installing component 2 in the surface of pillar 3 can be used as the green surface reservation and does not grind (the 26th embodiment).

And, in the lighting device of the 8th embodiment, as shown in Figure 8, directly contact in the surface of pillar 3 with the part that parts 2 contacts are installed with the part of pillar 3 contact in the surface of installing component 2, yet replace, can between them, dispose grease-like for example, lamellar etc. thermal conductivity interface material (not illustrating) (the 27th embodiment).

The lighting device of the 28th embodiment is described below with reference to Figure 15～Figure 17.

Figure 15 is the major part cutaway view of light-emitting device module of the lighting device of the 28th embodiment.Figure 16 is the major part plane of light-emitting device module of the lighting device of the 28th embodiment under the state of having pulled down lens 110.In detail, Figure 16 is the figure of major part of light-emitting device module that observes the lighting device of the 28th embodiment under the state of having pulled down lens 110 from the upside of Figure 15.

Except aspect described later, the lighting device 10 of the lighting device of the 28th embodiment and above-mentioned the 1st embodiment is roughly the same formation.Therefore, according to the lighting device of the 28th embodiment, except aspect described later, can obtain the effect roughly the same with the lighting device 10 of above-mentioned the 1st embodiment.

In the lighting device of the 1st embodiment, as shown in Figure 1, the major part of light-emitting device module 1 is made of light-emitting component 1a, reflector 1b, lens 1c and thermal interface material 1d, yet in the lighting device of the 28th embodiment, replace the major part of light-emitting device module such as Figure 15 and constitute as shown in Figure 16.

In Figure 15 and Figure 16,101 represent for example such light-emitting component of led chip, and 102 expressions are coated on the fluorophor on the light-emitting component 101.103 expressions are used to support the matrix of light-emitting component 101 and fluorophor 102.103a, 103b represent to be formed on the light-emitting component power consumption utmost point on the lower surface of matrix 103, and it is used for to light-emitting component 101 power supplies that are configured on the matrix 103.In the lighting device of the 28th embodiment, for example the such packaging part of LED packaging part is made of light-emitting component 101, fluorophor 102 and matrix 103.And light-emitting component power consumption utmost point 103a is electrically connected with the anode electrode (not illustrating) of light-emitting component 101, and light-emitting component power consumption utmost point 103b is electrically connected with the cathode electrode (not illustrating) of light-emitting component 101.Matrix 103 is formed by the higher material of thermal conductivity.

And in Figure 15 and Figure 16,104 expressions are used for the substrate of support substrate 103, and 105 expressions are used for matrix 103 is fixed on bonding agent on the substrate 104.Substrate 104 is formed by the higher material of such thermal conductivity such as for example A1, ADC (Aluminium Die-Cast, aluminium diecasting), and bonding agent is made of the higher material of thermal conductivity.

And in Figure 15 and Figure 16,106,107 expressions are used for the outer electrode to light-emitting component 101 power supplies.Outer electrode 106,107 constitutes removable with respect to light-emitting component 101, and perhaps outer electrode 106,107 is configured in apart from light-emitting component 101 position far away, even and the degree that does not also heat up as far as light-emitting component 101 heating outer electrodes 106,107.

And in Figure 15 and Figure 16,108 expressions are as the flexible substrate of the attaching parts that light-emitting component power consumption utmost point 103a and outer electrode 106 are coupled together.108a, 108b represent to be formed on the terminal on the flexible substrate 108, and 108c represents slotted hole, and it is used for and will be directed to outer electrode 106 sides with the flexible substrate 108 that the light-emitting component power consumption utmost point 103a of matrix 103 is connected via terminal 108a.104c represents to be configured in the projection on the upper surface of substrate 104, and it is used for chimeric with slotted hole 108c slidably.Flexible substrate 108 is connected with outer electrode 106 via terminal 108b.

In addition, in the lighting device of the 28th embodiment, the terminal 108a of flexible substrate 108 is connected with light-emitting component power consumption utmost point 103a by scolding tin (not illustrating), the terminal 108b of flexible substrate 108 is connected with outer electrode 106 by scolding tin (not illustrating), yet replace, can pass through connector (not illustrating) the terminal 108a of flexible substrate 108 is connected with light-emitting component power consumption utmost point 103a, and the terminal 108b of flexible substrate 108 is connected (the 29th embodiment) with outer electrode 106 by connector (not illustrating).

And in Figure 15 and Figure 16,109 expressions are as the flexible substrate of the attaching parts that light-emitting component power consumption utmost point 103b and outer electrode 107 are coupled together.109a, 109b represent to be formed on the terminal on the flexible substrate 109, and 109c represents slotted hole, and it is used for and will be directed to outer electrode 107 sides with the flexible substrate 109 that the light-emitting component power consumption utmost point 103b of matrix 103 is connected via terminal 109a.104d represents to be configured in the projection on the upper surface of substrate 104, and it is used for chimeric with slotted hole 109c slidably.Flexible substrate 109 is connected with outer electrode 107 via terminal 109b.

In addition, in the lighting device of the 28th embodiment, the terminal 109a of flexible substrate 109 is connected with light-emitting component power consumption utmost point 103b by scolding tin (not illustrating), the terminal 109b of flexible substrate 109 is connected with outer electrode 107 by scolding tin (not illustrating), yet replace, the terminal 109a and the light-emitting component power consumption utmost point 103b of flexible substrate 109 be can connect by connector (not illustrating), and the terminal 109b and the outer electrode 107 (the 30th embodiment) of flexible substrate 109 connected by connector (not illustrating).

And in Figure 15 and Figure 16,111 expressions are configured in the space between the lower surface of the upper surface of fluorophor 102, matrix 103 and substrate 104 and lens 110.104a represents slot part, and it is as preventing that bonding agent 105 is from flowing out to the anti-flow unit in outer electrode 106 sides (left side of Figure 15) between matrix 103 and the substrate 104.104b represents slot part, and it is as preventing that bonding agent 105 is from flowing out to the anti-flow unit on outer electrode 107 sides (right side of Figure 15) between matrix 103 and the substrate 104.

Figure 17 is slot part 104a shown in Figure 15, the enlarged drawing of 104b.In the lighting device of the 28th embodiment, as Figure 15 and shown in Figure 17, slot part 104a constitutes: even bonding agent 105 is from flowing out to outer electrode 106 sides (left side of Figure 15 and Figure 17) between matrix 103 and the substrate 104, the bonding agent 105 of this outflow is also stopped by slot part 104a and can not arrive light-emitting component power consumption utmost point 103a and terminal 108a.And, slot part 104b constitutes: even bonding agent 105 is from flowing out to outer electrode 107 sides (right side of Figure 15 and Figure 17) between matrix 103 and the substrate 104, the bonding agent 105 of this outflow is also stopped by slot part 104b and can not arrive light-emitting component power consumption utmost point 103b and terminal 109a.

And, in the lighting device of the 28th embodiment, as Figure 15 and shown in Figure 16, the flexible substrate 108 that light-emitting component power consumption utmost point 103a and outer electrode 106 are coupled together and the flexible substrate 109 that light-emitting component power consumption utmost point 103b and outer electrode 107 couple together is configured in the space 111, and do not use resin to seal.Therefore, compare, can reduce the thermal stress that imposes on flexible substrate 108,109 with the situation that flexible substrate 108,109 uses resin to seal.

And in the lighting device of the 28th embodiment, as mentioned above, outer electrode 106 constitutes removable with respect to light-emitting component 101; Perhaps outer electrode 106 is configured on light-emitting component 101 position far away, even and the degree that does not also heat up as far as light-emitting component 101 heating outer electrodes 106.In other words, flexible substrate 108 is constrained for: the terminal 108a that is connected with light-emitting component power consumption utmost point 103a among two terminal 108a, the 108b of flexible substrate 108 is a stiff end, and the terminal 108b that is connected with outer electrode 106 is a free end.In other words, flexible substrate 108 is constrained for and is essentially the single armed girder construction.

Therefore, the situation that is stiff end with terminal 108a that is connected in light-emitting component power consumption utmost point 103a and the terminal 108b that is connected in outer electrode 106 is compared, promptly, being constrained for the situation that is essentially the built-in beam structure with flexible substrate 108 compares, in detail, fixing and outer electrode 106 is configured to compare apart from the nearer situation about heating up at light-emitting component 101 adstante febre outer electrodes 106 that makes of light-emitting component 101 with respect to light-emitting component 101 with outer electrode 106, can reduce the thermal stress that imposes on flexible substrate 108.

That is, in the lighting device of the 28th embodiment, form the terminal 108a that only retrains flexible substrate 108, the structure that does not retrain other parts.Therefore, even follow the heating of light-emitting component 101 at flexible substrate 108 and under the situation about heating up, also can not apply thermal stress, flexible substrate 108 thermal expansion freely to flexible substrate 108.In other words, impose on the thermal stress of flexible substrate 108, can reduce the danger that scolding tin is peeled off, can improve reliability by minimizing.

In addition, in the lighting device of the 28th embodiment, light-emitting component power consumption utmost point 103a is connected by flexible substrate 108 with outer electrode 106, yet replace, can utilize the such any attaching parts of wire rod for example, glass epoxy substrate that light-emitting component power consumption utmost point 103a and outer electrode 106 are coupled together (the 31st embodiment).

In detail, in the lighting device of the 31st embodiment, the same with the lighting device of the 28th embodiment, outer electrode 106 constitutes removable with respect to light-emitting component 101, perhaps outer electrode 106 is configured on light-emitting component 101 position far away, even and the degree that does not also heat up as far as light-emitting component 101 heating outer electrodes 106.In other words, attaching parts are constrained for: the terminal that is connected with light-emitting component power consumption utmost point 103a in two terminals of attaching parts is a stiff end, and the terminal that is connected with outer electrode 106 is a free end.In other words, attaching parts are constrained for and are essentially the single armed girder construction.Therefore, according to the lighting device of the 31st embodiment, can obtain the effect roughly the same with the lighting device of the 28th embodiment.

About the flexible substrate 109 that light-emitting component 101 and outer electrode 107 are coupled together, also identical with flexible substrate 108, because flexible substrate 109 is constrained for and is essentially the single armed girder construction, even thereby follow the heating of light-emitting component 101 and under the situation about heating up at flexible substrate 109, can not apply thermal stress to flexible substrate 109 yet, flexible substrate 109 thermal expansion freely can reduce the danger that scolding tin is peeled off, and can improve reliability.

And, can replace flexible substrate 109, for example utilize that wire rod, the such any attaching parts of glass epoxy substrate couple together light-emitting component power consumption utmost point 103b and outer electrode 107 (the 32nd embodiment), can obtain same effect.

And, in the lighting device of the 28th embodiment, as shown in figure 15, more disposing substrate 104 on the position near light-emitting component 101, the thermal component of the heat that this substrate 104 is produced as bulk storage light-emitting component 101 than light-emitting component power consumption utmost point 103a, 103b.In detail, the heat that light-emitting component 101 is produced is transmitted to substrate 104 via matrix 103 and bonding agent 105 heat, and from the lower surface bulk storage of substrate 104.Therefore, be configured in than light-emitting component power consumption utmost point 103a, 103b with the substrate 104 of the thermal component of the heat that is produced as bulk storage light-emitting component 101 and compare, can reduce the thermal stress that imposes on flexible substrate 108,109 further from the locational situation of light-emitting component 101.

Below with reference to Figure 18 and Figure 19 the 33rd embodiment is described.

The lighting device of the 33rd embodiment except aspect described later, with the lighting device of above-mentioned the 28th embodiment be roughly the same formation.Therefore, according to the lighting device of the 33rd embodiment, except aspect described later, can obtain the effect roughly the same with the lighting device of above-mentioned the 28th embodiment.

Figure 18 is the major part cutaway view of light-emitting device module of the lighting device of the 33rd embodiment.Figure 19 is the major part plane of light-emitting device module of the lighting device of the 33rd embodiment under the state of having pulled down lens 110.In detail, Figure 19 is the figure of major part of light-emitting device module that observes the lighting device of the 33rd embodiment under the state of having pulled down lens 110 from the upside of Figure 18.

In the lighting device of the 28th embodiment, as shown in figure 15, light-emitting component power consumption utmost point 103a, 103b are formed on the lower surface of matrix 103, yet in the lighting device of the 33rd embodiment, as shown in figure 18, light-emitting component power consumption utmost point 103a, 103b are formed on the upper surface of matrix 103.

And in the lighting device of the 28th embodiment, as shown in figure 15, substrate 104 constitutes convex, yet in the lighting device of the 33rd embodiment, as shown in figure 18, substrate 104 constitutes concavity.In detail, in the lighting device of the 33rd embodiment, as Figure 18 and shown in Figure 19, substrate 104 constitutes: matrix 103 is positioned in the recess 104e of substrate 104.

And, in the lighting device of the 33rd embodiment, the same with the lighting device of the 28th embodiment, outer electrode 106,107 constitutes removable with respect to light-emitting component 101, perhaps outer electrode 106,107 is configured on light-emitting component 101 position far away, even and the degree that does not also heat up as far as light-emitting component 101 heating outer electrodes 106,107.

In addition, terminal 108a, the 108b of flexible substrate 108 is connected with light-emitting component power consumption utmost point 103a, outer electrode 106 by scolding tin (not illustrating) respectively, yet replace, the terminal 108a and the light-emitting component power consumption utmost point 103a of flexible substrate 108 be can connect by connector (not illustrating), and the terminal 108b and the outer electrode 106 (the 34th embodiment) of flexible substrate 108 connected by connector (not illustrating).

Equally, being connected between terminal 109a, the 109b of flexible substrate 109 and light-emitting component power consumption utmost point 103b and the outer electrode 107 can be used connector rather than scolding tin (the 35th embodiment).

And, in the lighting device of the 33rd embodiment, as Figure 18 and shown in Figure 19, utilize the recess 104 of substrate 104 to prevent that bonding agent 105 is from flowing out to outer electrode 106 sides (left side of Figure 18 and Figure 19) or outer electrode 107 sides (right side of Figure 18 and Figure 19) between matrix 103 and the substrate 104.In detail, be formed with the recess 104e of substrate 104 in the lighting device of the 33rd embodiment, this recess 104e makes bonding agent 105 can not arrive light-emitting component power consumption utmost point 103a, 103b and terminal 108a, the 109a of the upper surface of matrix 103.

In addition, in the lighting device of the 33rd embodiment, light-emitting component power consumption utmost point 103a and outer electrode 106 be connected and light-emitting component power consumption utmost point 103b has used flexible substrate 108 and flexible substrate 109 respectively with being connected of outer electrode 107, yet can replace flexible substrate and use for example wire rod, the such any attaching parts (the 36th embodiment and the 37th embodiment) of glass epoxy substrate.

And, in the lighting device of the 33rd embodiment, as shown in figure 18, more disposing substrate 104 on the position near light-emitting component 101, the thermal component of the heat that this substrate 104 is produced as bulk storage light-emitting component 101 than light-emitting component power consumption utmost point 103a, 103b.In detail, the heat that light-emitting component 101 is produced is transmitted to substrate 104 via matrix 103 and bonding agent 105 heat, and from the lower surface bulk storage of substrate 104.Therefore, be configured in than light-emitting component power consumption utmost point 103a, 103b with the substrate 104 of the thermal component of the heat that is produced as bulk storage light-emitting component 101 and compare, can reduce the thermal stress that imposes on flexible substrate 108,109 further from the situation of the position of light-emitting component 101.

Above-mentioned the 1st to the 37th embodiment can appropriate combination.

Utilizability on the industry

Lighting device of the present invention can be applicable to such as road illumination, street lamp, indoor illumination etc.

Claims (12)

1. lighting device, this lighting device is provided with a plurality of light-emitting device modules, and this light-emitting device module has light-emitting component and is used for the fin of the heat that the described light-emitting component of bulk storage produced, and this lighting device is characterised in that,

Described fin is arranged in parallel with the optical axis direction of described light-emitting device module,

A plurality of light-emitting device modules are configured to: make the primary optical axis line of the key light axis of a light-emitting device module and other light-emitting device modules form angle, perhaps form the position relation of reversing greater than 0 °, and

All fin arrangement become: all fin are parallel to vertical plane, and the bottom of fin is positioned at the height identical with the leading section of this fin or is positioned at the downside of the leading section of this fin.

2. lighting device according to claim 1 is characterized in that, the luminous intensity distribution figure of light-emitting device module forms with the key light axis of the light-emitting device module circular shape as the center.

3. lighting device according to claim 2 is characterized in that each light-emitting device module is provided with the light-emitting component of a circular.

4. lighting device according to claim 2 is characterized in that, is arranged with two above light-emitting components on the circle of key light axis as the center with light-emitting device module.

5. according to each described lighting device in the claim 1～4, it is characterized in that, on the surface of the thermal component that is used for the heat that the described light-emitting component of bulk storage produced and part that air contacts, be formed with cover layer, with part that material beyond the air contacts on do not form cover layer.

6. according to each described lighting device in the claim 1～4, it is characterized in that, on the surface of the thermal component that is used for the heat that the described light-emitting component of bulk storage produced and part that air contacts, carry out roughening and handle, with part that material beyond the air contact on do not carry out the roughening processing.

7. according to claim 5 or 6 described lighting devices, it is characterized in that the part that contacts with air material in addition in the surface of described thermal component has been carried out grinding.

8. according to claim 5 or 6 described lighting devices, it is characterized in that, dispose the thermal conductivity interface material on the part that in the surface of described thermal component, contacts with air material in addition.

9. lighting device according to claim 1, it is characterized in that, described lighting device is provided with and is used for attaching parts that the light-emitting component power consumption utmost point and outer electrode are coupled together, this light-emitting component power consumption utmost point is used for to described light-emitting component power supply, described attaching parts are configured in the space, described attaching parts are constrained for: the terminal that is connected with the described light-emitting component power consumption utmost point in two terminals of described attaching parts is a stiff end, and the terminal that is connected with described outer electrode is a free end.

10. lighting device according to claim 9 is characterized in that, disposes thermal component on the position than the more approaching described light-emitting component of the described light-emitting component power consumption utmost point, and this thermal component is used for the heat that the described light-emitting component of bulk storage is produced.

11. lighting device according to claim 10, it is characterized in that, used to be used for described light-emitting component is fixed on bonding agent on the described thermal component, described lighting device is provided with and is used to prevent the anti-flow unit of described bonding agent from flowing out between described light-emitting component and the described thermal component.

12., it is characterized in that according to each described lighting device in the claim 9～11, use flexible substrate as described attaching parts, on described flexible substrate, be formed with slotted hole, this slotted hole is used for described flexible substrate is directed to described outer electrode side.

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