CN101385190A - Multichannel wave-guide construction - Google Patents
Multichannel wave-guide construction Download PDFInfo
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- CN101385190A CN101385190A CNA2004800420695A CN200480042069A CN101385190A CN 101385190 A CN101385190 A CN 101385190A CN A2004800420695 A CNA2004800420695 A CN A2004800420695A CN 200480042069 A CN200480042069 A CN 200480042069A CN 101385190 A CN101385190 A CN 101385190A
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- Prior art keywords
- transmission line
- groove
- dielectric substrate
- slot transmission
- plane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/023—Fin lines; Slot lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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Abstract
Slot transmission lines are formed in dielectric substrates. Several such substrates can be stacked together. When the substrates are stacked together, the conductive surfaces that form the transmission lines can be terminated in the same plane whereat the conductive surfaces form contact terminals. The co-planar contact terminals can be coupled to contact points on a circuit board. Signals on the circuit board can thereby be coupled into the slot transmission lines that extend through the dielectric substrates.
Description
Technical field
The present invention relates to the multicircuit electronic communication system, and more specifically, relate to the dedicated transmission channel structure, it is for the usefulness of such system, and can be used in the various piece of transmission system, Chip Packaging, printed circuit board construction, interconnect device, to and initiate from chip, circuit board, interconnected and cable.
Background technology
The various means of known electronic transmission in the prior art.Great majority in these transmission means if not whole, all suffer intrinsic speed limit, move to another required real time from a point such as upper frequency limit and the signal that is commonly referred to as propagation delay within system.They just at first by their structure, secondly by their material composition, are being restricted aspect their Electronic Performance.A conventional method has been utilized conductive pin (conductive pin), as finding in the edge and connector (edge card connector) as shown in Figure 1.In such structure, a plurality of conductive pins or terminal 20 are arranged within the plastic housing 21, and this layout provides about 800 to 900MHz service speed.By being known as " Hi-Spec " in the prior art and edge and connector that show in Fig. 2 is represented, wherein this system comprises the big ground contacts 25 arranged within the insulated connectors shell 27 and little signal contact 26 to the improvement of this normal structure.Less signal contact 26 is coupled to bigger ground contacts 25.Signal contact in these structures is not difference (differential) signal contact, and only is single-ended signal, and meaning is that each signal contact is all joined by the ground contacts side.The service speed of such system it is believed that and is about 2.3Ghz.
Another improvement that also has in this field is known as " ternary " or " triple " connector, wherein, conductive terminal is arranged within the plastic housing 28 with triangular pattern, and this terminal comprises big grounding terminals 29 and two less differential signal terminals 30, as shown in Figure 3, and as U.S. Patent number 6,280,209 in further detail explanation like that.This ternary/triplen has the apparent upper limit speed of about 4Ghz.All these three kinds of methods have all been utilized the conductive pin in the plastic housing on the simplest meaning, so that be provided for the transmission line of electronic signal.
In each of these type structures, all wish to keep the function transmission structure of the whole transport path that runs through system, comprise the source and the load that run through (one or more) circuit board, mating interface and system.When transmission system during, be difficult within system, realize the consistency of expection by independent pin structure.Use discrete point-to-point the connection at these connectors that are used for signal, ground connection and power supply.In these conductors each all is designed to or conductor or the means of electric continuity are provided, and does not consider the transmission line effect usually.Most conductor all is designed to standard pin district (pinfield), so that all pins or terminal all are equal to, and no matter their appointment electric function, and pin is further arranged with spacing, material type and the length of standard.Although performance is satisfactory under low service speed, under high service speed, these systems can think described conductor be influence its operate and the system of speed in discontinuous.
Many Signal Terminals in these systems or pin are connected to identical grounded circuit conductor, and so just produced high signal to the ground connection ratio, this is helpless to high speed transmission of signals, because between signal and ground connection, facilitated big current circuit, described current circuit has reduced bandwidth and has increased crosstalking of system, thereby reduces systematic function probably.
Bandwidth (" BW ") with
Proportional, wherein, L is the inductance of system unit, and C is the electric capacity of system unit, and BW is a bandwidth.Even do not having in the discontinuous system fully evenly, the inductance of signal conveys system and capacitive component also work and have reduced the bandwidth of system.Run through the total path length of system by minimizing, mainly by restriction run through system current path area and reduce total pole plate area (plate area) of system element, these inductance and capacitive component are minimized.Yet along with transmission frequency increases, size reduces its problem that produced: effectively physical length is reduced to quite little size.The system path length that 10Ghz scope and above high frequency cause great majority to calculate is unacceptable.
Except the inductance and electric capacity of gathering as the leap system of limiting performance factor, any non-homogeneous geometry and/or material transition all produce discontinuous.In with the Low Voltage Differential Signal system of about 12.5 Gigabits per seconds (Gbps) operation, use about 3.5Ghz as minimum cut-off frequency, the dielectric that use has about 3.8 dielectric constant can obtain about 0.25 inch critical path length, can tolerate discontinuous on described length.This size causes the ability that is configured in the system that comprises source, traffic load and load within given 1/4th inches unrealistic.Just can see that so the pin arrangement that the progress of electric transmission structure has advanced to the function special use from the pin arrangement of homogeneous texture is again to the interface of attempting single structure, yet path and other factors these structures have still been limited.Use aforementioned prior art constructions, because the physical restriction of these systems and so required short critical path length of transmission are infeasible so transport high-frequency signal.
In order to obtain effective transmission system, must on whole transport path, keep constant and special-purpose transmission line: from the source by interface to load.This can comprise the interconnected and printed circuit board (PCB) that can cooperate, and interconnected signal can enter printed circuit board (PCB) or other transmission mediums, such as cable and or even the semiconductor device chip encapsulation, and from wherein sending.Because pin/terminal is about the variation of the potential demand of each other size, shape and position, thus when conveying system when being designed to the interconnected independent conductive pin structure of other independent conductive pins, this is very difficult to realize.For example, in rigging-angle connector, the relation between pin/terminal in a row not only changes aspect length but also changes aspect electric coupling.Comprise the source of system and the interconnected design principle of high speed of the All Ranges between the load, described system comprises Chip Packaging, printed circuit board (PCB), connector for substrate and cable assembly, just is being used in to have in the transmission system in the source of 2.5Gbps.Such principle is intentional ground connection principle, and it is providing other performance on standard pin district: strengthen coupling between signal and grounding path, and single-ended operation is spoken approvingly of.Another principle of using in such system comprises the impedance adjustment so that discontinuous minimizing.Also having another design principle is the lead-out wire optimization, and wherein signal and return path are assigned to special pin in the pin area so that maximizing performance.The system of these types all is restricted about obtaining above-mentioned critical path length.
Transmission or the conveying system of target of the present invention for improving, it has overcome aforesaid drawbacks and has operated under higher speed.
Summary of the invention
Therefore target of the present invention is the transmission structure of improvement, and it has overcome aforesaid drawbacks, and utilizes the conducting element of grouping to form single mechanical structure, and described mechanical structure provides the complete electron propagation ducts that is similar to fiber optic system in some sense.The electron propagation ducts that provides completely based on copper is provided focus of the present invention, rather than utilize independent conductive pin or with as the separable interface of the copper conductor of transmission channel, transmission channel of the present invention has obtained the bigger control of more predictable electric property and operating characteristic.The system that the present invention improves like this it is believed that being far longer than under 0.25 inch the path of prolongation can reach the service speed of 12.5GHz at least for digital data transmission provides.
Therefore, general objects of the present invention provides the waveguide of design, and it plays the effect of grouping element passage link, and wherein, described link comprises the dielectric body part of elongation and at least two conducting elements arranging along its outer surface.
Another object of the present invention provides high-speed channel link (or transmission line), it has the main part of the elongation of given cross section, described main part is formed by the dielectric of the dielectric constant with selection, and described link has layout two conducting elements on its outer surface in its most of basic structure, described element has similar size and dimension, and be orientated thereon relative to one another, so that by between described two conducting elements, setting up special electric field and magnetic field, and the length that runs through described channel link is kept these, comes guided propagation to pass through the electric energy ripple of described link.
Further purpose of the present invention is, by the conducting element on the outer surface of the main body of regulation elongation optionally and the size in gap therebetween, the impedance that comes the control channel link is to keep balance or unbalanced electromagnetic field.
Of the present invention also have another purpose to provide improved electric transmission channel, it comprises planar substrates and a plurality of grooves that are formed in the described substrate, described groove has relative sidewall, and described groove is spaced by the convex region (land) of inserting described substrate, electroplate or deposition such as passing through, the sidewall of described groove has deposition electric conducting material thereon, to form electron propagation ducts within described groove.
Further purpose of the present invention provides the waveguide of design in advance, wherein, utilize at least one pair of conducting element so that differential signal transmission to be provided, that is signal is gone into ("+") and signal goes out ("-"), described paired conducting element is arranged on the outside of dielectric body, so that allow to set up the propagation delay of inductance, impedance, decay and per unit length of electric capacity, the per unit length of per unit length, and within the passage that described conducting element forms, set up these predetermined performance parameters.
Further purpose of the present invention provides preferably the improvement transmission line of the solid-state link form of circular cross-section uniformly, described link comprises at least one pair of conducting element disposed thereon, it is used for guiding the electric wave by the there, described link comprises at least one filament (thin filament) of the dielectric material with two conductive surfaces disposed thereon, described conductive surface is along the longitudinal extension of described silk, and (circumferential arcuate extent) separates by two arc length extrapolations, described conductive surface further is spaced from each other forming discrete dual-element transmission channel, its reduced current circuit and wherein signal conductor be closely aligned more.
The present invention also has another purpose to provide the non-circular transmission line that is used for high-speed applications, it comprises the rectangle or the square dielectric members of elongation, described dielectric members has outer surface at least four each other fan-shaped (sector) modes disposed thereon, described dielectric members comprises the pair of conductive element, it is aimed at mutually and is arranged on described in fan-shaped two, simultaneously fan-shaped the separating by inserting.
The present invention has finished above-mentioned and other purposes by stacked a plurality of slot transmission line structures.One main aspect in, pass through dielectric by the transmission line that forms of conduction band (strip) along the opposite edges of groove.Some such transmission lines can be formed in the single substrate.When such substrate stack together the time, the conduction band of each transmission line can be in common plane termination, make transmission line structure can be installed to planar substrates,, signal can be routed directly to different transmission lines from the contact point on the circuit board by described planar substrates.By considering following detailed description, can be expressly understood these and other target of the present invention, feature and advantage.
Description of drawings
During this detailed explanation, can carry out reference continually to accompanying drawing, wherein:
Fig. 1 is the schematic plan view of the end face of traditional connector;
Fig. 2 is the schematic plan view of the edge card used in the high speed connector;
Fig. 3 is a schematic elevational view of utilizing ternary or triple high speed connector;
Fig. 4 is the perspective view according to the grouping element passage link of principles of construction of the present invention;
Fig. 5 is the schematic end of the grouping element passage link of Fig. 4, and it has shown the arc extension of conducting element and interval therebetween;
Fig. 6 is the perspective view according to the alternative embodiment of the grouping channel link of principles of construction of the present invention;
Fig. 7 is the schematic diagram that is used to make the transmission link of the present invention that the source is connected with the load that has middle load on transmission link;
Fig. 8 is the schematic diagram that had not only utilized conventional contact " A " but also utilized the connecting element of transmission link of the present invention " B ", and the mode of the detailed part of the amplification of locating with its " A " and " B " has shown the generation of inductance in each system;
Fig. 9 is the perspective view of replacement structure that is formed on the link of the present invention of mode wherein with right-angle bending;
Figure 10 is the schematic diagram that utilizes the transmission line of link of the present invention;
Figure 11 is the perspective view that shows the replacement medium composition of link of the present invention;
Figure 12 is the perspective view of the difform arrangement of dielectric body, and it has shown replacement conductive surface layout;
Figure 13 is the perspective view of arrangement that can be used to form the non-circular cross-section dielectric bodies of link of the present invention;
Figure 14 is the perspective view that is suitable for as another arrangement of the non-circular cross-section dielectric bodies of link of the present invention;
Figure 15 is the exploded view of connector assembly, and it comprises a plurality of element link of the present invention, is used for providing transmission line between two connectors;
Figure 16 is the perspective view that has by the connector assembly of two interconnected connector cases of the transmission link of Figure 15;
Figure 17 is formed on the sketch of transmission channel of the present invention of mode of the relative end of passage with two interconnect modules, and has shown potential soft character of the present invention;
Figure 18 is can be as the perspective view of arrangement of the heteroid dielectric body of the link of the present invention with different lens peculiarities;
Figure 19 is the perspective view that forms a plurality of transmission link extruding (extrusion) of mode thereon with different signalling channels;
Figure 20 is the perspective view of a plurality of transmission links extruding used among the present invention;
Figure 21 is the perspective view of the mating interface that uses with discrete transmission link of the present invention, and wherein mating interface adopts the form of hollow end cap;
Figure 22 is the back perspective view of the end cap of Figure 21, has shown its central opening that receives the transmission link end therein;
Figure 23 is the front perspective view of the end cap of Figure 21, has shown the orientation of outer contacting;
Figure 24 is the plane graph of a plurality of transmission link right angle, curved connector assemblies;
Figure 25 is the perspective view of one replacement structure in the terminal of connector assembly;
Figure 26 is the perspective view that is suitable at the connector that transmission channel link of the present invention is connected to use in the circuit board;
Figure 27 A is the key perspective view of the connector of Figure 26, and its mode with phantom has shown some inner contacts of connector;
Figure 27 B is the perspective view with the inner contact assembly of the connector of Figure 27 A of the removed mode of sidewall, and has shown the structure and the placement of the coupling shackle (coupling staple) on it;
Figure 28 is the cross-sectional view along the connector of Figure 26 of its line 28-28 interceptings;
Figure 29 is the perspective view with dielectric substrate of two slot transmission lines;
Figure 30 is assembled into the perspective view of three dielectric substrates that each substrate wherein all has the structure of two slot transmission lines;
Figure 31 is the end-view of many substrates transmission line structure; And
Figure 32 is the terminal of conduction band of the many dielectric structures shown in Figure 30 and 31 and the perspective view of ground plane.
Embodiment
Fig. 4 has shown the grouping element passage link 50 according to principles of construction of the present invention.What can see is, link 50 comprises the dielectric body 51 of elongation, and it is preferably cylindrical wire, is similar to the length of fiberoptics material.It and its difference are that link 50 serves as the waveguide and the special-purpose transmission medium of design in advance.In this, main body 51 forms by the specialized dielectric with certain dielectric constant with to a plurality of conducting elements 52 that it applies.In Figure 4 and 5, conducting element 52 is shown as extension, trace (trace) or the band 52 of the elongation of electric conducting material, and similarly, they can be traditional copper or the noble metal extensions with definite cross section, and it can be molded or on the contrary such as the dielectric body that is attached to link 50 by adhesive or other means.They can also be such as being formed on the outer surface 55 of main body 51 by suitable plating or vacuum deposition process.Conductive trace 52 is arranged on the outer surface, and is had along the width of the circumferential extension of dielectric body.
At least two such conductors are used on each link, and the signal that typically is used for the differential signal such as+0.5 volt and-0.5 volt transmits.The use that such differential signal is arranged allows us architectural characteristic of the present invention to be turned to the waveguide of keeping basically of design in advance on the whole length in signal conveys path.The use of dielectric body 51 provides the preferred coupling that takes place within link.In simple embodiment, as shown in Figure 5, conducting element is arranged on two opposite faces, so that the electrical affinity of each in the conducting element (electrical affinity) interacts by the dielectric body that supports them thereon, perhaps under the situation of the such and conductive channel shown in Figure 29-30 that will explain in further detail after a while, conducting element is arranged on two or more inner faces of cavity/a plurality of cavitys, to set up the main coupled mode of crossing over cavity clearance and running through air dielectric.In this way, link of the present invention can be considered to and fiberoptics passage or the electric equivalence of extension.
Target of the present invention is the electric wave conduit.Waveguide of the present invention be intended to from about 1.0Ghz to 12.5Ghz and preferably higher high frequency are kept the signal of telecommunication under the electrical affinity of expection level at least.As the U.S. Patent number 6,377 of issue on April 23rd, 2002, the optical waveguides as described in 741 typically relies on single external coating or coating, and it has mirror like reflectivity properties, with the luminous energy that moves on the direction that maintains selection.The light that opening in external coating/coating can cause passing waveguide disperses, this negative effect the light beam of waveguide.Microwave plumbing is used under very high frequency guiding the energy of microbeam, rather than transmits it, as the U.S. Patent number 6,114,677 of issue on September 5th, 2002 demonstrated like that, wherein, microwave plumbing is used for guiding microwave in the central part office of stove.Such directional aim is used for the microwave antenna technology equally.In each example, the waveguide of these types is used for concentrating and guiding and pass their light or the energy of microwave, and in the present invention, the whole wave guide structure is designed to constant impedance and reduces the mode that decays is kept the signal of telecommunication under higher propagation rate propagation.
The effect of link of the present invention depends on, by utilizing two or more conductive surfaces of electric container (electricalcontainment), guides and keep digital signal by channel link.This will comprise that the integrality of keeping signal, control distributes and the loss by link is minimized.Channel link of the present invention so that preferred coupling will be provided, and comprises the electromagnetic field by the signal of its transmission by the material of control channel link and the geometry of system unit.In brief, by zone that is the dielectric body 51 of regulation by the electrical affinity of the conductor of opposite charges that is negative and positive differential signal that is 52 gauges of conductive surface, the present invention has produced the transmission line of design.
Better as shown in Figure 5, two conductive surfaces 52 are arranged on the dielectric body 51 relative to one another.The dielectric body 51 that shows among Fig. 4 has been taked the form of cylindrical bar, and the dielectric body that shows among Fig. 5 then has the ellipticity structure.In each such example, conductive surface or trace 52 each other arc length of continuity.The Figure 4 and 5 both has represented " balance " of the present invention link, and wherein, the circumference extension or the arc length C of two conductive surfaces 52 are identical, and the circumference extension of the non-conductive outer surface 55 of dielectric body 51 or arc length C1 also are identical.Can consider that this length is with the cardinal principle spacing between the regulation conductive surface (gross separation) D.As following will the explanation, in a mode that has than another bigger arc length in the conductive surface, link can be " unbalanced ", and in such example, transmission line is suitable for single-ended or non-differential signal application most.In dielectric body and link is that link can serve as contact pilotage (contact pin) in the example of circle, thereby can use in connector is used.This circular cross section has been showed the structure with traditional round contact pilotage same type.
As shown in Figure 6, link of the present invention can be revised, so that a plurality of conducting elements as the part of total system transmissions medium not only to be provided, but also the consistent and coaxial fiber-optic waveguide that is used to transmit light and light signal can be incorporated within it into.In this, dielectric body 51 is removed core, to produce the central opening 57 of optical fiber 58 by its extension.The signal of telecommunication can be as the light signal 60 by this link transmission.
Fig. 7 schematically illustrates transmission line 70, and it is included in the link of the present invention 50 that extends between source 71 and the load 72.The conductive surface 52 of link is used for making source and load, and other secondary loads (secondary load) 73 in the middle of source and the load, is interconnected at together.Such secondary load can be added to system runs through system with control impedance.Line impedance is set up at the place, source, and can revise by adding secondary load to transmission line.
Fig. 8 has schematically shown the difference between link of the present invention and the conventional conductor, and they all are shown as by electrolyte blocks 76 and support.Two discrete conventional conductor 77 are formed by copper or another kind of electric conducting material, and extend through piece 76 in the mode of pin.As amplifying shown in " A ", two discrete conductor have represented the open cell structure with big inductance (L) because of the current circuit that enlarges.Very different is, because conductive surface is closer to each other, as dielectric body 51 location, so link of the present invention has less inductance (L) under constant impedance.Can in manufacture process, control the size of these links 50, and extruding will be the preferred process of making: the mode of extending or apply dividually extruding with conductive surface with dielectric body, select electroplating process such as passing through, so that consequent structure has the shaping of plating diversity.Such extrusion process can easily be controlled the volume of dielectric body 51 and the interval between the conducting element disposed thereon.Conductive surface preferably continues the length of dielectric body, and in hope with transmission line termination to the position of connector, circuit board or like, before its end, can finish lightly.
As shown in Figure 9, dielectric body can be spent the form of right-angle bendings or have crooked 80 with any other angular orientation with 90 of demonstration forward.As showing like that, the separation pitch between identical they that conductive surface 52 begins and finishes with it with conductive surface extends through bending 80 with the mode of identical width.Dielectric body 51 and conductive surface 52 have easily been kept their spacing and have been separated by bending to eliminate any potential loss.
Figure 10 has shown the transmission line that uses link of the present invention.Link 50 is considered to the transmission cable that formed by one or more single dielectric bodies 51, and its end 82 terminates to printed circuit board (PCB) 83.In order to make any discontinuous the minimizing at circuit board place, this termination can be straight.Also provide and made any discontinuous minimum short transit link 84 that maintains.These links 84 are kept the grouping aspect of transmission link.Terminal interface 85 can be provided, and wherein, the discontinuous or discontinuous mode of impedance terminates to connector to link with minimum geometry.In this way, on the length of transmission line, keep the grouping of conductive surface, caused geometry and electric both uniformity.
Figure 11 has shown the multiple different cross section of transmission link 50 of the present invention.In rightmost link 90, center conductor 93 by hollow dielectric body 94 around, described dielectric body 94 supports a plurality of conductive surfaces 95 successively, it is separated at interval by the partially filled insertion with dielectric body 94 preferably.This structure is suitable for using in power application, and wherein power is transported by center conductor 93.In the link 91 of the centre of Figure 11, the center covers (centralcover) 96 and is preferably made by the dielectric of selecting, and has the conductive surface 97 that is supported on above it.Preferably provide protection external insulation sleeve 98, to protect and/or to make the inner link insulation.The leftmost link 92 of Figure 11 has protection overcoat 99, and it encloses the polymeric rings (polymeric ring) 100 of electrodepositable, described polymeric rings 100 around or core 101 conduction or insulation.Ring 100 part 101 usefulness plated with conductive material also separate two or more conductive surfaces of wishing on the main body with the regulation ring by the part of not electroplating.Selectively, perhaps surround element core or link 92 no matter which, can use fills with air, and can via suitable standoff (standoff) or analog internally parts separate.
Figure 12 has shown that the perimeter that makes them combines with dielectric body 51 with the arrangement of the link 110-113 that forms dissimilar transmission links.Link 110 has (that is unbalanced) two conductive surface 52a, 52b of the different arc of arranging on the outer surface of dielectric body 51, so link 110 can provide the single-ended signal operation.Link 111 has (or " balance ") conducting element 52 of two equally spaced and given sizes, so that effective differential signal operation to be provided.
Figure 13 has shown as the square configuration of link 120 or as the arrangement of one type non-circular link 120-122 of the polygonal structure of rectangular configuration of link 121-122 and so on.Dielectric body 51 can be extruded has outstanding convex region part 125, and it is electroplated or covers with electric conducting material on the contrary.Independent conductive surface is arranged on the independent side of dielectric body, and preferably, the differential signal of conductive surface is on the opposite flank that is arranged in main body.These convex region parts 125 can be used for by this way " embedding " and go into connection tank to terminator terminating junctor: the contact between connector terminal (not shown) and the conductive surface 125 is easy to realize.
Figure 14 has shown some the other dielectric bodies that can use with the present invention.A main body 130 is shown as convex surface, and other two main bodys 131,132 are shown as common concave configuration.The circular cross-section of dielectric body has the trend that electric field strength is concentrated on conductive surface corner, and the slight convex form shown in main body 130 then has the trend of concentrating electric field strength equably, and it causes lower decay.Concave surface main body shown in dielectric body 131,132 can have the useful minimizing aspect of crosstalking, because it inwardly concentrates electric field.The width of these conductive surfaces or arc length, as shown in figure 14, less than the width or the arc length of each main body side of supporting them.
Importantly, transmission link can form single extruding 200 (Figure 15-16), carries a plurality of signalling channels thereon, and each such passage comprises pair of conductive surface 202-203.These conductive surfaces 202,203 are spaced from each other by insertion dielectric body 204 that supports them and the connecting plate part 205 that they are interconnected at together.This extruding 200 can be as the part of total connector assembly 220, and wherein, this extruding is received in the opening 210 of the complementary shape that forms in the connector case 211.The inwall of opening 210 can optionally be electroplated, and perhaps contact 212 can be inserted in the shell 211 with the contact conductive surface, and mounted on surface or through-hole tail are provided where necessary.
Figure 17 has shown the layout of two transmission channels 50, its arrange as showing, terminate to connector block 180 an end, and pass right angle block 182, described right angle block 182 comprises a series of right angle channel 183 that are formed on wherein, it receives transmission channel link, as showing.In layout as shown in figure 17, will be understood that transmission channel link can make in continuous manufacture process, such as by extruding, and each such passage can be manufactured with inherent or integrated conducting element 52.In the manufacturing of these elements, geometry that can control transmission passage self, and the spacing of the conducting element on the dielectric body and location, so that transmission channel can be carried out as an electron waves conduit of making peace single, described waveguide is with single passage or " route " of supporting signal (communication) amount.Because it is quite soft that the dielectric body of transmission channel link can be made, thus the various paths on the length that system of the present invention is suitable for extending easily, and the remarkable electric property of sacrificial system not.A connector end block 180 can be kept transmission link perpendicular alignmnet, and piece 182 can be kept the end of transmission channel link with right angle orientation, is used to terminate to miscellaneous part.
Figure 18 has shown one group of convex surface electrolyte blocks or body 300-302, and wherein, distance of separation L changes, and the curve 305 of described outer surface 306 rises among link 300-302.In this way, should be understood that the shape that can select main body is used for concentrating the electric field that produces so that different lens peculiarities to be provided when conducting element is energized.
Figure 19 has shown to have by the interconnected a series of dielectric bodies of connecting plate 402 or the multichannel extruding 400 of piece 401, and wherein, conductive surface 403 is a plurality of or character is complicated.As the structure that shows among Figure 13, a plurality of signalling channels are supported in such extruding 400, and each in the described passage preferably includes a pair of differential signal conducting element.
Figure 20 has shown the standard extruding 200 shown in Figure 15 and 16.Link of the present invention can terminate in connector and other housings.Figure 21-23 has shown a terminal interface as certain conical end cap, and described end cap has hollow body 501, and it has central opening 502.Main body can be supported a pair of terminal 504, and it matches with the conductive surface 52 of dielectric body 51.End cap 500 can be inserted in the various openings in connector case or the circuit board, and similarly, preferably includes conically to insert terminal 510.End cap 500 can be configured to the only single transmission line of termination, and shown in Figure 21-23, perhaps it can become part and a plurality of each other transmission line of termination of a plurality of terminal interfaces, shown in Figure 24 and 25.
Figure 24 has shown the end cap 500 on a series of links 520 appropriate locations, and described link 520 terminates to end block 521, and it has surface mount termination 522, so that end block 521 can be attached to the circuit board (not shown).End cap does not need to take the conical structure that shows in the accompanying drawing, but can take other shapes and structure, show below being similar to and explanation like that.
Figure 25 has shown the replacement structure of end block 570.In this layout, transmission line or link 571 are formed by dielectric, and comprise on the outer surface that is formed on them pair of conductive extension 572 (for the sake of clarity, only on a side, shown extension 572, the extension of their correspondence then be formed on link 571 in the face of on the surface in the paper of Figure 25).The conductive path 575 that these conduction extensions 572 form via the inside of circuit board 574 is connected to the trace 573 on the circuit board 574.If desired, such path also can be configured within the main body of end block 570.Path 575 preferably splits as showing, and their two current-carrying parts are by inserting gap 576 separately, to keep the separation of two conductive transmission channels under the level of plate.
Figure 26 has shown end cap or the piece 600 that is installed to printed circuit board (PCB) 601.The end cap 600 of this style serves as connector, and thereby comprise housing 602, it has central channel 603, described central channel 603 has the various keyways 604 of the ledge of accepting transmission link.End cap connector 600 can have a plurality of windows that are used to visit 620, is welded to corresponding opposite trace on the circuit board 601 with the conduction afterbody 606 with contact 607.In the example of the mounted on surface afterbody as showing, afterbody 606 can make their horizontal component 609 pleat below end cap housing rise, to reduce the board pads size that needs and the system electric capacity at the circuit board place.
Figure 27 A has shown the local key view of end cap connector 600, and has shown how contact or terminal 607 are supported within the connector case 602, and extends through connector case 602.Terminal 607 can comprise two-wire contact jaw 608, is used for redundant contact (and being used to provide parallel circuit), and connector 600 can comprise coupling shackle 615, and it has inverted U-shaped and strengthens the coupling of the terminal of crossing over housing.Can see that coupling shackle 615 has the trunk of elongation, its longitudinal extension is by connector case 602.Extend downwards towards circuit board by interval a plurality of supporting legs spaced apart from each other of length, and each such supporting leg all has the width greater than the respective width of its relative terminal along the coupling shackle.As shown in drawings, settle coupling shackle supporting leg with terminal with aiming at.The afterbody of these two-wire terminal 607 has strengthened the stability of connector.In this, it also provides the control to terminal, and described terminal has constituted the passage of (laterally) leap enclosure slot 601.Dual contact path not only provides path redundancy, but also has reduced the inductance by the system of terminal.Figure 27 B is the view of the inner contact assembly that uses in the end cap connector 600 of Figure 26 and Figure 27 A.Terminal 607 is arranged on the opposite sides of connector, and is installed within each back-up block 610.These back-up blocks 610 are spaced from each other the distance of selecting in advance, and it helps to make terminal contact 608 to separate.
No matter aforementioned, Figure 29 is an alternative embodiment of the present invention, is known as multichannel transmission line substrate 700 hereinafter, and so name is because there are two transmission lines that separate 708 and 730 that form within the single plane dielectric substrate 702.As shown in figure 29, plane dielectric substrate 702 both had the plane " on " surface 704, have D score surface, plane 706 again.Between upper surface 704 and lower surface 706 is dielectric material, and its thickness is indicated as " T " in Figure 29.
At this, a surface is designated as " on " surface, the apparent surface is designated as the D score surface, just in order to be reduced at the description that this illustrates.Plane dielectric substrate 702 can have any spatial orientation; Arbitrary surface can both become " on " or D score surface.
First slot transmission line 708 (its conductor also is shown, for " L1 " around) be formed in the upper surface 704 of plane dielectric substrate 702.Slot transmission line 708 is partly formed by the groove 710 that runs through substrate 702.The groove 710 that runs through substrate is a feature with two facing surfaces or " face " with reference number 712 and 714 identifications.These surfaces are spaced from each other by inserting distance or width W.It between apparent surface or face the bottom 716 of groove.
The interface point formation groove 710 of opposite face 712 and upper surface 704 " on " edge 718.The interface point formation second of another face 714 and upper surface 704 " on " edge 719.
After forming groove 710, the conduction band 720 and 722 of isolating by each two electricity in top edge 718 and 719 forms first slot transmission line 708.Replacement and embodiment of equal value consider first slot transmission line by single conduction band formation, by described single conduction band, groove 710 is machined, etching, cutting, grind or form differently, and described single conduction band is sectioned into the conductors that two electricity are isolated.Another embodiment considers such band 720 and 722, its on upper surface, but retreat or leave from groove edge 718 and 719, the band 720 of even now and 722 placement show in the accompanying drawings.
It should be recognized by those skilled in the art that groove 710 is to form by the process that is suitable for the special substrate material.Form the process of groove or a plurality of process and do not have substantial connection by it in this present invention who discloses with statement.In a preferred embodiment, groove dielectric material of no use is filled; Groove is instead used air " filling ", yet it has dielectric property really.
The conduction band of being separated by groove 710 width " W " 720 and 722 can have distributed capacitance " C " between them.Their capacitive coupling can be following function: the spacing between the band 720 and 722; If any, fill the dielectric material that inserts interval W; And also has the surface area in the face of each band of its relative band of per unit length.
Second slot transmission line 730 (its conductor also is shown, for " L2 " around) also be formed in the upper surface 704 of plane dielectric substrate 702, though among Figure 29, be indicated as the distance of " S " from the first slot transmission line lateral displacement.As shown in figure 29, the groove of first and second slot transmission lines is parallel to each other, but is separated from each other on the direction of the longitudinal axis that is orthogonal to groove.Therefore term " lateral displacement " should be interpreted as being meant the sidesway of a slot transmission line from another.In Figure 29, the lateral displacement between two slot transmission lines 708 and 730 is " S ".
The same with first slot transmission line 708, form second slot transmission line 730 by cutting or forming differently the groove 732 that runs through substrate 702.Second groove of describing among Figure 29 732, it has two facing surfaces or " face " equally corresponding to second slot transmission line 730, with reference number 734 and 736 identifications.The apparent surface 734 of groove 730 and 736 is spaced from each other by inserting distance or width W.The bottom of second groove 732 is discerned with reference number 738.
Should be noted in the discussion above that spacing W between the apparent surface 734 and 736 does not need and the apparent surface 712 and 714 of first slot transmission line between spacing identical.Similarly, the depth D of each groove and need not be identical.Slot transmission line can have the different width and/or the different degree of depth by its groove that forms.In addition, the conduction band in abutting connection with each groove edge can have different width, thickness and/or length.In a preferred embodiment, the conduction band each all transport differential signal.
The same with first groove, second groove 732 has two and goes up " edge ".Form an edge 740 of second groove 732 by the interface point of face 734 and upper surface 704; Interface point by another opposite face 736 and upper surface 704 forms another edge 742.As first slot transmission line 708, after forming second groove 732, by each plating in top edge 740 and 742 or differently apply the conduction bands 744 and 746 that two electricity are isolated, form second slot transmission line 730.Replace and embodiment of equal value considers second slot transmission line that forms by single conduction band, by described single conduction band, cutting groove 732, thus single conduction band is sectioned into the conductors 744 and 746 of two electric isolation that show among Figure 29.
Although the structure that shows among Figure 29 provides the structure with a plurality of slot transmission lines, but Figure 30 has shown the transmission line structure of being made up of the multichannel transmission line substrate 700 that shows among three Figure 29 900, though added the groove that forms on the lower surface of the transmission line structure that shows among Figure 29.
In Figure 30, illustrating in the description of the multichannel transmission line 700 that shows among Figure 29, form first or top multichannel transmission line substrate 700-1 as above-mentioned.In the upper surface 704-1 of first substrate 702-1, form groove 750 and 752.Conduction band 754 and 756 formation adjacent to groove 750 are identified as " L
1" " first slot transmission line ".Conduction band 758 and 760 formation adjacent to groove 752 are identified as " L
2" second slot transmission line.The first multichannel transmission line structure 700-1, it is by two slot transmission line L
1And L
2Form, also be formed with it the bottom or lower surface 766 in have groove 762 and 764.Groove 762 and 764 each all have such degree of depth, it " makes progress " and extends in the substrate 702-1, but just partly enters into the thickness T of plane dielectric substrate 702-1.These " bottom " grooves 762 and 764 in the top multichannel transmission line structure 700-1 extend into substrate 702-1 distance " d
1".As showing, poor between the groove 750 that forms in " d1 " upper surface and 752 the degree of depth " D " less than thickness " T " and substrate 702-1, so that after forming lower channel, dielectric material separates " bottom " of upper slot 750 and 762 and " bottom " of lower channel 762 and 764.Lower channel 762 and 764 the degree of depth " d
1" enough dark; not contact; in the middle of described groove 790 and 792 is formed and runs through or second substrate 702-2, and form second or middle multichannel transmission line 700-2 by described groove 790 and 792 adjacent to the conduction band 780,782,784 of groove 790 and 792 and 786 surface.
The same with the first multichannel transmission line structure 700-1, the second multichannel transmission line structure 700-2 has two slot transmission lines that form by in abutting connection with the conduction band that runs through the groove that substrate 702-3 forms.And, the same with the first multichannel transmission line structure 700-1, second such structure 700-2 be formed with it the bottom or lower surface 798 in have groove 794 and 796. Groove 794 and 796 has depth d
2, it just partly extends in the thickness T of plane dielectric substrate 702-2 equally.
At last, the 3rd multichannel transmission line structure 700-3 also has two slot transmission lines that form by in abutting connection with the conduction band that runs through groove 802 that substrate 702-3 forms and 804.Different with first and second multichannel transmission line structure 700-1 with 700-2, the 3rd such structure 700-3 it the bottom or lower surface 806 in do not have groove.
In Figure 30, can see, form the groove in the lower surface of each layer, so that lower surface channels 762; 764; 794; 796 upper surface grooves 750 in their correspondences; 752; 790; Also relative with it under 792, but also on the groove that forms in the substrate under them.For example, lower surface channels 762 is also relative with it under upper surface groove 750, but on groove 790.Lower surface channels 794 is also relative with it under upper surface groove 790, but on groove 802.Lower surface channels 764 is also relative with it under upper surface groove 752, and on groove 792, described groove 792 is in layer 700-2.The groove that forms in the lower surface of each layer (that is " lower surface channels ") is arranged essentially parallel to the conductive surface (and the groove in the upper surface of the layer under the lower surface channels) that they cover.
Coated when the bottom of each substrate layer, when electroplating or differently covering with conductive layer, such conductive layer has become and has been used for effective electromagnetic signal shielding that there is the signal that transports on thereon the conductor in conductive layer.In Figure 30, the electric conducting material that covers the different layers lower surface is discerned with reference number 811.By whole lower surface with electric conducting material 811 overlay planes dielectric substrates, comprise the groove in the lower surface, and the sort of material on each layer is coupled to reference potential voltage, and the signal that transports on the various slot transmission lines is shielded effectively mutually, and shields from external electromagnetic interference.In a preferred embodiment, the conductive layer 811 on the lower surface of each layer is coupled to zero volt, and it is also referred to as " ground connection " electromotive force.
Bottom of each layer or the conductive surface on the lower surface are coupled to other such surfaces via conduction " through hole " 808, and described through hole 808 extends through each layer 700-1,700-2 and 700-3, and electrically contact the conductive surface on the bottom of each layer.For the purpose of stating structure, " through hole " is considered to any path by layer.The example of " through hole " or path can comprise extension fully by the layer hole or passage." conductive through hole " should be considered to run through any conductive path of dielectric substrate, by it, and a lip-deep ground plane and another lip-deep another ground plane electrical communication.
Figure 31 has shown the end-view of the multilayer transmission line structure 901 as describing among Figure 30, though have top cover layer 700-4, the bottom of described top cover layer 700-4 has covering and forms the conduction band 754,756,758 of transmission line conductors and 760 groove 813,815 as mentioned above.The bottom 809 of structure 901 also is coated with electric conducting material 811, and it is electrically coupled to the electric conducting material 811 on the lower surface of other layers via aforementioned conductive through hole 808.
Conduction each in the band 754,756,758,760,780,782,784,786,803,805,807 and 809 all extends into the plane that Figure 31 is arranged in, and can carry out signal in the conduction band each there and connect.In the ground plane 811 each also extends in the plane of Figure 31, so that also can connect ground plane 811.
Figure 32 is the stereogram of multilayer transmission line structure 903, and described multilayer transmission line structure 903 has the some waveguide modules 900-1,900-2 and 900-3 that are stacked, and each in them is all consistent with the transmission line structure described in Figure 29 and 30.Yet in Figure 32, each waveguide module all makes its conductive layer extend to common plane, there, is embodied in terminal 904 on the plane terminal 906 to the electrical connection of different conductive layers.
Shown in figure 32, a waveguide module with reference number 900-1 identification has flat surfaces up and down.The machinery and the second waveguide module that is electrically coupled to the first waveguide module are with reference number 900-2 identifications.The 3rd waveguide module is discerned with reference number 900-3.All these three kinds of waveguide modules are termination in common plane 906 all.In the waveguide module each all has aforesaid conduction band, is embodied in aforementioned terminals 904 to the electrical connection of described conduction band, and in addition with the reference numerals of discerning them in the above with it.
All have slot transmission line and various conduction bands (and earthed surface) are extended to the several layers of common plane end by assembling each, the waveguiding structure of describing among Figure 32 900 helps to use in the mode of circuit board.Electric terminals 904 on the planar end 906 can be coupled to the Signal Terminal on the circuit board easily, the terminal 905 on its location and the pitch match waveguiding structure.The groove that can be associated with waveguiding structure in each layer with the mode arrangement of alternately skew to reduce the coupling between the vertical adjacent wave conduit, shields if use to insert.
Claims (14)
1. multichannel transmission line comprises:
The plane dielectric substrate, it has upper surface and lower surface and thickness T;
First slot transmission line, it is formed in the upper surface of described plane dielectric substrate; And
Second slot transmission line, it is formed in the upper surface of described plane dielectric substrate, and described second slot transmission line is from the described first slot transmission line lateral displacement, and parallel with it basically.
2. multichannel transmission line as claimed in claim 1, wherein, each all is made up of described first slot transmission line and described second slot transmission line following:
The groove that runs through the upper surface formation of described plane dielectric substrate, described groove has first and second opposite faces spaced apart from each other by the first insertion interval W, fixed first groove edge of the handing-over wire gauge of described first opposite face and described upper surface, fixed second groove edge of the handing-over wire gauge of described second opposite face and described upper surface, described groove has depth D;
The first conduction band, it is on the upper surface of described plane dielectric substrate, and adjacent described first groove edge; And
The second conduction band, it is on the upper surface of described plane dielectric substrate, and adjacent described second groove edge.
3. multichannel transmission line as claimed in claim 2, wherein, the described groove that comprises described first slot transmission line has width W
1, and the described groove that comprises described second slot transmission line has width W
2, it is different from W
1
4. multichannel transmission line as claimed in claim 2, wherein, described first conduction band and the described second conduction band can transport differential signal.
5. multichannel transmission line as claimed in claim 2, further comprise the groove in the dielectric substrate lower surface of described plane, groove in the described lower surface has the degree of depth less than T-D, and, be arranged at least one the opposite of running through groove that described upper surface forms in described first and second slot transmission lines each.
6. multichannel transmission line as claimed in claim 2, further comprise: first groove in the dielectric substrate lower surface of described plane, first groove in the described lower surface has the degree of depth less than T-D, and is positioned at the opposite of the described groove that comprises described first slot transmission line; And
Second groove in the described dielectric substrate lower surface, second groove in the described lower surface is parallel to first groove in the described lower surface, and also has the degree of depth less than T-D, and is positioned at the opposite of the described groove that comprises described second slot transmission line.
7. multichannel transmission line as claimed in claim 6 further comprises conductive layer, and it covers the lower surface of described plane dielectric substrate basically, and covers described first and second grooves in the described lower surface basically.
8. multichannel transmission line as claimed in claim 7, wherein, described conductive layer is electrically coupled to the reference potential that is used for the differential signal on described first and second slot transmission lines.
9. multichannel transmission line as claimed in claim 8, wherein, described reference potential is zero volt.
10. transmission line structure, it is made up of following:
The first multichannel transmission line comprises: the plane dielectric substrate, and it has upper surface and lower surface and thickness T;
First slot transmission line, described first slot transmission line is formed by the groove that runs through described plane dielectric substrate upper surface, and has width W
1And depth D
1
Second slot transmission line, described second slot transmission line is formed by the groove that runs through described plane dielectric substrate, and has width W
2And depth D
2
First groove in the described dielectric substrate lower surface, first groove in the described lower surface has less than T-D
1The degree of depth, and be positioned under described first slot transmission line; And
Second groove in the described dielectric substrate lower surface, second groove in the described lower surface is parallel to first groove in the described lower surface, and also has less than T-D
2The degree of depth, and be positioned under described second slot transmission line, be positioned at its opposite;
Conductive layer, it covers the lower surface of described plane dielectric substrate basically, and covers described first and second grooves in the described lower surface basically; And
The second multichannel transmission line, it has the plane dielectric substrate, and the upper surface of described plane dielectric substrate is coupled to the lower surface of the described first multichannel transmission line.
11. transmission line structure as claimed in claim 10, wherein, each all comprises described first slot transmission line and second slot transmission line: run through the groove that described plane dielectric substrate upper surface forms, described groove has by the first insertion interval, first and second opposite faces spaced apart from each other, fixed first groove edge of the handing-over wire gauge of described first opposite face and described upper surface, and fixed second groove edge of the handing-over wire gauge of described second opposite face and described upper surface, described groove has depth D;
The first differential signal band, it is on described upper surface, and adjacent described first groove edge; And
The second difference band, its on described upper surface, adjacent described second groove edge.
12. transmission line structure as claimed in claim 11, wherein, each all comprises the end that is orthogonal to described upper and lower surface the plane dielectric substrate of the plane dielectric substrate of the described first multichannel transmission line and the described second multichannel transmission line.
13. transmission line structure as claimed in claim 12, wherein, described first and second differential signal band and conductive layer of described first and second slot transmission line of the described first multichannel transmission line, and described first and second differential signal band and conductive layer of described first and second slot transmission line of the described second multichannel transmission line, each all is electrically coupled to the corresponding terminal on the described end of the described first and second multichannel transmission lines.
14. a transmission line structure that piles up is made up of following:
The first waveguide module, it has the upper and lower flat surfaces and first plane terminal, first and second slot transmission lines that form in the last flat surfaces of the described first waveguide module by the described first waveguide module are formed, and described first and second slot transmission lines have the differential signal conductors of termination in described first plane terminal; And
The second waveguide module, it has the upper and lower flat surfaces and second plane terminal, first and second slot transmission lines that form in the last flat surfaces of the described second waveguide module by the described second waveguide module are formed, and be coupled to the described first waveguide module, described first and second slot transmission lines of the described second waveguide module have the differential signal conductors of termination in described second plane terminal, the described first and second plane terminal coplanes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53267403P | 2003-12-24 | 2003-12-24 | |
| PCT/US2004/043548 WO2005064739A1 (en) | 2003-12-24 | 2004-12-23 | Multi-channel waveguide structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101385190A true CN101385190A (en) | 2009-03-11 |
Family
ID=34738821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004800420695A Pending CN101385190A (en) | 2003-12-24 | 2004-12-23 | Multichannel wave-guide construction |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1698017A1 (en) |
| JP (1) | JP2007518310A (en) |
| KR (1) | KR100836967B1 (en) |
| CN (1) | CN101385190A (en) |
| WO (1) | WO2005064739A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035609A (en) * | 2011-09-29 | 2013-04-10 | 美国博通公司 | Wirelessly communicating among vertically arranged integrated circuits in semiconductor package |
| US9075105B2 (en) | 2011-09-29 | 2015-07-07 | Broadcom Corporation | Passive probing of various locations in a wireless enabled integrated circuit (IC) |
| US9318785B2 (en) | 2011-09-29 | 2016-04-19 | Broadcom Corporation | Apparatus for reconfiguring an integrated waveguide |
| CN109119732A (en) * | 2017-06-26 | 2019-01-01 | 株式会社Wgr | Electromagnetic transmission device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6117974A (en) * | 1991-10-02 | 2000-09-12 | Peptor Limited | Libraries of backbone-cyclized peptidomimetics |
| JP2008235408A (en) * | 2007-03-19 | 2008-10-02 | Fujitsu Ltd | Differential transmission circuit board and manufacturing method thereof |
| CN102812591B (en) | 2010-03-31 | 2015-11-25 | 惠普发展公司，有限责任合伙企业 | Wave guide system and method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2806263C2 (en) * | 1978-02-15 | 1986-08-14 | Focke & Co, 2810 Verden | Device for producing sliding packs for cigarettes |
| JP2700553B2 (en) * | 1988-03-31 | 1998-01-21 | 株式会社 潤工社 | Transmission circuit |
| US5519363A (en) * | 1994-05-31 | 1996-05-21 | The Whitaker Corporation | Controlled impedance lines connected to optoelectronic devices |
| JP3114676B2 (en) * | 1997-10-30 | 2000-12-04 | 日本電気株式会社 | High frequency line structure |
| JP3282608B2 (en) * | 1999-03-23 | 2002-05-20 | 日本電気株式会社 | Multilayer board |
-
2004
- 2004-12-23 CN CNA2004800420695A patent/CN101385190A/en active Pending
- 2004-12-23 EP EP04817057A patent/EP1698017A1/en not_active Withdrawn
- 2004-12-23 KR KR1020067014676A patent/KR100836967B1/en not_active IP Right Cessation
- 2004-12-23 WO PCT/US2004/043548 patent/WO2005064739A1/en active Application Filing
- 2004-12-23 JP JP2006547444A patent/JP2007518310A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035609A (en) * | 2011-09-29 | 2013-04-10 | 美国博通公司 | Wirelessly communicating among vertically arranged integrated circuits in semiconductor package |
| US9075105B2 (en) | 2011-09-29 | 2015-07-07 | Broadcom Corporation | Passive probing of various locations in a wireless enabled integrated circuit (IC) |
| US9318785B2 (en) | 2011-09-29 | 2016-04-19 | Broadcom Corporation | Apparatus for reconfiguring an integrated waveguide |
| CN103035609B (en) * | 2011-09-29 | 2016-08-24 | 美国博通公司 | Radio communication between the integrated circuit of arranged perpendicular in semiconductor package part |
| US9570420B2 (en) | 2011-09-29 | 2017-02-14 | Broadcom Corporation | Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package |
| CN109119732A (en) * | 2017-06-26 | 2019-01-01 | 株式会社Wgr | Electromagnetic transmission device |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1698017A1 (en) | 2006-09-06 |
| KR20060128930A (en) | 2006-12-14 |
| KR100836967B1 (en) | 2008-06-10 |
| WO2005064739A1 (en) | 2005-07-14 |
| JP2007518310A (en) | 2007-07-05 |
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Open date: 20090311 |