CN101373878B - Holding method for welding connector to circuit board - Google Patents

Holding method for welding connector to circuit board Download PDF

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Publication number
CN101373878B
CN101373878B CN2007101479371A CN200710147937A CN101373878B CN 101373878 B CN101373878 B CN 101373878B CN 2007101479371 A CN2007101479371 A CN 2007101479371A CN 200710147937 A CN200710147937 A CN 200710147937A CN 101373878 B CN101373878 B CN 101373878B
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CN
China
Prior art keywords
connector
housing
holding
openend
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007101479371A
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Chinese (zh)
Other versions
CN101373878A (en
Inventor
林宪昌
许金汉
王福卿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northstar Systems Inc
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Northstar Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northstar Systems Inc filed Critical Northstar Systems Inc
Priority to CN2007101479371A priority Critical patent/CN101373878B/en
Publication of CN101373878A publication Critical patent/CN101373878A/en
Application granted granted Critical
Publication of CN101373878B publication Critical patent/CN101373878B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention discloses a holding method applied in the process of welding a connector to a circuit board, which is characterized in that the circuit substrate is provided; the circuit substrate is provided with a plurality of conducting welding spots; a heat source supplying device is provided to heat the conducting welding spots into a fused state; a connector is provided; the connector is provided with a housing; an open end is arranged on one side of the housing; a plurality of conducting parts extend and protrude from the housing; a holding device is inserted in the open end of the electronic card connector; the holding device is provided with a holding part and a shielding part used for wrapping the electronic card connector, the out shape of the holding part corresponds to the open end, and the holding part is tightly jointed to an inner surface of an accommodating space; the electronic card connector is disposed in the circuit substrate; and the conducting parts are respectively connected with the conducting welding spots. Therefore, the shielding part wraps the shell on the same side as the open end to isolate the heat produced during the reflow soldering process, thereby protecting the housing; furthermore, the holding part supports the housing to prevent the housing from deforming.

Description

Be applied to connector is welded to the holding method of the process of circuit board
Technical field
The present invention relates to a kind of holding method, particularly relate to a kind of holding method that is applied to connector is welded to the process of circuit board.
Background technology
Along with science and technology is constantly progressive, information products all present the powerful tenability of product itself in integrated mode at present, as portable electronic products such as mobile phone, digital camera, e-dictionary, PDA, notebooks, all can support all size electronic cards to peg graft, by the platform of electronic cards jockey as the data link exchange, make data and electronic product transmission in the electronic cards, reach the access of data and the expansion support of electronic product function; And in order above-mentioned information products to be reached read the ability of electronic cards, connecting reading device corresponding to the electronic cards that reads electronic cards must be connected with system in the mode of external or interior dress.
But the reading device major applications reflow of electronic cards connection at present manufacturing process is directly welded on motherboard or the circuit board; Reflow manufacturing process is an interconnection technique, mainly be that heating makes the solder joint on the motherboard present molten condition, the set stitch of assembly that will be connected again on this motherboard is placed on the solder joint of these fusions, can realize dress electronic cards reading device in the system like this.
But be configured in the actual fabrication process as above-mentioned electronic cards, still have following defective:
1, because the reflow process temperature must be brought up to certain high temperature, just can make the solder joint fusion on the motherboard, and this high temperature may cause the temperature distortion of electronic cards connection reading device, the situation that causes electronic cards to plant.
2, connect under the situation of reading device temperature distortion in electronic cards, the situation of relative displacement just takes place in the conductive welding spots on electronic cards because of the deformation of this electronic cards, will cause in follow-up welding procedure the situation of free weldering like this and the electronic cards reading device can't be worked.
3, the electronic cards hull outside that connects reading device may adapt to the needs of technology and first prewelding tie point, and under the high temperature of reflow process, these prewelding tie points are Yin Gaowen and to damage the rate of finished products that causes follow-up welding procedure not high most probably.
Summary of the invention
The object of the present invention is to provide a kind of holding method that is applied to connector is welded to the process of circuit board, this connector shell can be fixed by holding unit, and this holding unit can provide the support force of a mechanics and enclose this connector of bundle, makes this housing be difficult for producing deformation; Reducing assorted bits in the manufacturing process, foreign matter etc. simultaneously enters in this connector.
Another object of the present invention is to provide a kind of holding method that is applied to connector is welded to the process of circuit board; can coat this housing and position electric connection point on this housing with the influence that effectively isolated hot gas causes this electronic card coupler, further protect this electronic card coupler.
Another object of the present invention is to provide a kind of holding method that is applied to connector is welded to the process of circuit board, can improve the stability of this housing external form, so can effectively get rid of the problem that causes empty weldering because of distortion.
To achieve these goals, the invention provides a kind of holding method that is applied to connector is welded to the process of circuit board, it is characterized in that comprising following steps: step 1: a circuit substrate is provided, and this circuit substrate has several conductive welding spots; Step 2 a: heat source accommodation device is provided, heats these conductive welding spots and make it present molten condition; Step 3: a connector is provided, and it is provided with a housing and is provided with an openend and is provided with several conducting terminal groups in a side and this connector inside of this housing; This several terminals group is extended outstanding these several conductive parts of housing moulding; Step 4: plug the openend of a holding unit in this electronic card coupler, this holding unit comprises a holding parts and in order to coat the shielding portion of this electronic card coupler, this holding parts external form is corresponding to this openend, and this holding parts fits tightly in the inner surface of the accommodation space of this openend; And step 5: this electronic card coupler is positioned over this circuit substrate, and these conductive parts are connected in these conductive welding spots respectively.
As above-mentioned structure, one fixture can provide the solid power of a support to avoid the distortion of electronic cards shell from inside to outside, especially this electronic cards is welded under the situation on the circuit board via the reflow process flow process, more can avoid causing because of thermal effect the damage of electronic cards mechanism or other solder joint.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the three-dimensional exploded view of first embodiment of the invention;
Fig. 2 is the end view of first embodiment of the invention;
Fig. 3 is the three-dimensional exploded view of second embodiment of the invention;
Fig. 4 is the three-dimensional combination figure of first embodiment of the invention;
Fig. 5 is the three-dimensional combination figure of third embodiment of the invention; And
Fig. 6 is a flow chart of the present invention.
Wherein, Reference numeral:
1 has the connector of holding unit
10 housings, 103 openends
104 conductive parts
1,011 first electrically connect point
1,012 second electrically connect point
1013 the 3rd electrically connect point
11 terminal group
11a the first terminal group
11b second terminal group
11c the 3rd terminal group
12 holding units
121 holding parts
122 shielding portions
1221 ribs
1222 flutings
1223 protuberances
Embodiment
At first, please refer to Fig. 1 to shown in Figure 5, the present invention proposes a connector 1 with holding unit, and comprise: a housing 10, several terminals group 11 and a holding unit 12 are formed; Wherein this housing 10 offers an openend 103, and inside moulding one accommodation space of this openend, and this accommodation space subcard of can powering is planted, with the transmission of carrying out data with read.
In addition, these terminal group 11 are laid in the inner surface of this accommodation space, in the present embodiment, these terminal group 11 comprise the first terminal group 11a, the second terminal group 11b and the 3rd terminal group 11c, and above-mentioned terminal group all is arranged in the inner surface of this accommodation space according to the specification of each corresponding electronic cards.
Have, this holding unit 12 is inserted in this openend 103 again, and this holding unit 12 comprises a holding parts 121 and a shielding portion 122 corresponding to this openend 103, and this shielding portion 122 takes shape in a side of this holding parts 121; And this holding parts 121 is corresponding to this openend 103.
When this connector 1 with holding unit enters a welding process flow, can utilize this holding parts 121 to support this housing 10 to avoid the distortion of this housing 10; And when this holding parts 121 was inserted in this openend 103, this shielding portion coated with the housing of this openend homonymy and protects this housing with the hot gas of isolated welding process flow.
Below be described in detail at this holding unit 12.These holding parts 121 external forms are corresponding to this openend 103, because this has the electronic cards of the connector 1 of holding unit applicable to multiple different size, so this openend 103 is complicated polygon, it is opposite if this connector 1 with holding unit reads the electronic cards of single specification merely, then the external form of this openend 103 is comparatively simple, no matter and the overall appearance of this openend 103, these holding parts 121 external forms all must be consistent with this openend 103, in addition when this holding parts 121 is inserted in this openend 103, the surface of this holding parts 121 fits tightly the inner surface in this accommodation space, just from the cross section, but these holding parts 121 entities fill up this accommodation space.
In addition this holding parts 121 extends one section preset distance, moulding one shielding portion 122 of transferring again, and this shielding portion 122 is parallel to this holding parts that is inserted in this openend 103 121, and formation one gap between two parallel holding parts 121 and the shielding portion 122.When this holding parts 121 was inserted in this openend 103, the surface of this housing 10 can be inserted in this gap relatively, so this shielding portion 122 may extend to the top of this housing 10 in order to coat this housing 10, with isolated hot gas.Perhaps, this shielding portion 122 can be not parallel to holding parts 121, but still can form a gap between the two, makes this shielding portion 122 may extend to the top of this housing 10 in order to coat this housing 10.
And the upper surface of this shielding portion 122 is provided with at least one rib 1221, in the middle of an embodiment, this shielding portion 122 has been longitudinally set with two ribs 1221, and this rib 1221 can be strengthened the intensity and the stiffness (stiffness) of this shielding portion 122, to strengthen integrally-built mechanical strength; This shielding portion 122 is provided with a fluting 1222 (please refer to Fig. 4) simultaneously, and the number and the form of this fluting 1222 are not limited, and it can effectively reduce the manufacturing materials of this holding unit 12.Fig. 5 then shows another embodiment of this case, and this shielding portion 122 has been horizontally set with a rib 1221 and has been provided with two flutings 1222, and this shielding portion 122 also extends a protuberance 1223 simultaneously.
Refer again to Fig. 2, the loam cake of this housing 10 is the substrate of a non-metallic material, this substrate is provided with several and electrically connects point, and these electrically connect point and electrically connect with these terminal group, these electrically connect point and comprise that first electrically connects point 1011, second and electrically connect point the 1012 and the 3rd and electrically connect point 1013 in the present embodiment, wherein first electrically connect point 1011, second and electrically connect point the 1012 and the 3rd and electrically connect point 1013 and electrically connect with the first terminal group 11a, the second terminal group 11b and the 3rd terminal group 11c respectively; And several conductive parts 104 extend outstanding this housing 10, in order to circuit substrate on conductive welding spots electrically connect.
As above-mentioned structure, when this holding parts 121 was inserted in this openend 103, this shielding portion 122 may extend to the top of this housing 10 and causes bad influence to avoid the technological process heat to electrically connecting point in order to coat this housing 10 and further to cover this first electric connection point 1011.
So when above-mentioned holding unit 12 was applied to the reflow process flow process, its holding method step that is applied to connector procedure was as follows, please refer to Fig. 6:
Step 1: a circuit substrate is provided, and this circuit substrate has several conductive welding spots;
Step 2 a: heat source accommodation device is provided, heats these conductive welding spots and make it present molten condition;
Step 3: a connector is provided, and it is provided with a housing 10 and is provided with an openend 103 and is provided with several conducting terminal groups 11 in a side and this electronic card coupler inside of this housing, and these conducting terminal groups 11 are extended outstanding these several conductive parts 104 of housing 10 moulding;
Step 4: plug the openend 103 of a holding unit 12 in this connector, this holding unit 12 is provided with a shielding portion 122 in order to coat this housing 10; And
Step 5: this connector 1 with holding unit is positioned on this circuit substrate, and these conductive parts 104 are connected to these conductive welding spots.
Comprise after step 5 that wherein these conductive welding spots of cooling make it present the step of solid state; In addition, comprise that also one provides the step of a heat shield after the step 3, wherein this heat shield (not shown) is attached to the upper surface of this loam cake, and is coated on the electric connection point away from this openend, and just this heat shield covers this second electric connection point the 1012 and the 3rd electric connection point 1013.
But in another embodiment, the loam cake of this housing 10 is a metal material (as shown in Figure 3), and then this loam cake is not provided with these and electrically connects point, and 122 of this shielding portions have the effect of isolated hot gas equally in order to cover this metal top cover.
In sum, the present invention has following each advantage:
When 1, the present invention is inserted in the openend 103 of this connector shell 10 by the holding parts 121 with a holding unit 12, can provide the bed knife on the mechanics from these housing 10 inside, and this housing 10 can be kept shape and external form whereby.
When 2, the present invention is inserted in the openend 103 of this electronic card coupler housing 10 by the holding parts 121 with a holding unit 12, this holding unit 12 can be with these openend 103 sealings, effectively the foreign matter in the manufacturing process is got rid of in the formed accommodation space of this housing outside.
3, the present invention can be coated on the top of this housing 10 by the shielding portion 122 of holding unit 12; can effectively completely cut off the influence of hot gas to this housing 10; especially the top of this housing 10 is provided with when electrically connecting point, and this shielding portion 122 can cover and protect these to electrically connect the injury that point is not heated.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.

Claims (7)

1. a holding method that is applied to connector is welded to the process of circuit board is characterized in that, comprising:
Step 1 provides a circuit substrate, and this circuit substrate has several conductive welding spots;
Step 2 provides a heat source accommodation device, heats these conductive welding spots and makes it present molten condition;
Step 3 provides a connector, and it is provided with a housing, and wherein a side of this housing is provided with an openend and this connector inside is provided with several conducting terminal groups, and this several terminals group is extended outstanding these several conductive parts of housing moulding;
Step 4, plug the openend of a holding unit in this connector, wherein this holding unit comprises a holding parts and in order to coat the shielding portion of this connector shell, and this holding parts external form is corresponding to this openend, and this holding parts fits tightly in the inner surface of the accommodation space of this openend; And
Step 5 is positioned over this circuit substrate with this connector, and wherein these conductive parts are connected in these conductive welding spots respectively.
2. the holding method that is applied to connector is welded to the process of circuit board according to claim 1 is characterized in that, comprises after the step 5 that these conductive welding spots of cooling make it present the step of solid state.
3. the holding method that is applied to connector is welded to the process of circuit board according to claim 1 is characterized in that, this shielding portion extends one section preset distance by this holding parts, the moulding of transferring again, and this shielding portion is parallel to this holding parts.
4. the holding method that is applied to connector is welded to the process of circuit board according to claim 3 is characterized in that the upper surface of this shielding portion is provided with at least one rib.
5. the holding method that is applied to connector is welded to the process of circuit board according to claim 1, it is characterized in that, the loam cake of this housing is a non-metallic material, and is covered with several electric connection points on being somebody's turn to do, and these electrically connect point and these terminal group electric connections.
6. the holding method that is applied to connector is welded to the process of circuit board according to claim 5 is characterized in that, this shielding portion coats these electric connection that is positioned at this openend points.
7. the holding method that is applied to connector is welded to the process of circuit board according to claim 1 is characterized in that, the loam cake of this housing is a metal material, and this shielding portion coats this openend.
CN2007101479371A 2007-08-24 2007-08-24 Holding method for welding connector to circuit board Expired - Fee Related CN101373878B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2007101479371A CN101373878B (en) 2007-08-24 2007-08-24 Holding method for welding connector to circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2007101479371A CN101373878B (en) 2007-08-24 2007-08-24 Holding method for welding connector to circuit board

Publications (2)

Publication Number Publication Date
CN101373878A CN101373878A (en) 2009-02-25
CN101373878B true CN101373878B (en) 2011-05-18

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4755268B2 (en) * 2009-03-05 2011-08-24 日本航空電子工業株式会社 Cap and connector device
CN103311773B (en) * 2013-06-13 2015-12-09 惠州Tcl移动通信有限公司 A kind of welding method of HDMI and a kind of data card

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4396245A (en) * 1981-03-12 1983-08-02 Amp Incorporated Cover for multiple terminal electrical connector
US5026295A (en) * 1990-07-31 1991-06-25 Molex Incorporated Cover for an electrical connector
US5249977A (en) * 1991-07-15 1993-10-05 Kel Corporation Electrical connector assembly for positioning on a circuit board by a suction applying tool
CN2373923Y (en) * 1998-11-06 2000-04-12 富金精密工业(深圳)有限公司 Auxiliary welder for connector
CN1614822A (en) * 2003-11-07 2005-05-11 台捷电子股份有限公司 Electric connector and method for welding its circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4396245A (en) * 1981-03-12 1983-08-02 Amp Incorporated Cover for multiple terminal electrical connector
US5026295A (en) * 1990-07-31 1991-06-25 Molex Incorporated Cover for an electrical connector
US5249977A (en) * 1991-07-15 1993-10-05 Kel Corporation Electrical connector assembly for positioning on a circuit board by a suction applying tool
CN2373923Y (en) * 1998-11-06 2000-04-12 富金精密工业(深圳)有限公司 Auxiliary welder for connector
CN1614822A (en) * 2003-11-07 2005-05-11 台捷电子股份有限公司 Electric connector and method for welding its circuit board

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Granted publication date: 20110518

Termination date: 20120824