CN101373206B - Test component - Google Patents
Test component Download PDFInfo
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- CN101373206B CN101373206B CN2007101407797A CN200710140779A CN101373206B CN 101373206 B CN101373206 B CN 101373206B CN 2007101407797 A CN2007101407797 A CN 2007101407797A CN 200710140779 A CN200710140779 A CN 200710140779A CN 101373206 B CN101373206 B CN 101373206B
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- test
- mozzle
- flow
- air
- temperature
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Abstract
The invention discloses a test component which is suitable for testing an element to be tested. The test component comprises a test environment simulating device and a test platform, wherein the test environment simulating device comprises a temperature-controlled cabinet, a fan and a honeycomb duct; the temperature-controlled cabinet is provided with an opening, and the fan is arranged at the opening part; the fan is suitable for generating an airflow, and the airflow has a temperature and a flow speed; the honeycomb duct is provided with an air inlet and an air outlet; and the honeycomb duct is connected to the temperature-controlled cabinet, and the air inlet is corresponding to the opening, so that the airflow can flow inside the honeycomb duct. The test platform is positioned outside the honeycomb duct, and the element to be tested is positioned inside the honeycomb duct, and electrically connected to the test platform. The test component can separately test the element to be tested.
Description
Technical field
The invention relates to a kind of test suite, and particularly relevant for a kind of temperature of air-flow and test suite of flow velocity controlled.
Background technology
Computer is becoming the indispensable handling implement of general masses in the society gradually now.Host computer has interface card miscellaneous usually, and these interface cards all can be through the test of different phase before formal volume production shipment.
With regard to the mode of test, traditional test mode is at first interface card to be measured to be plugged on the mainboard of a test platform.Then, interface card to be measured and test platform are placed in the controlled test space of environmental baseline (for example temperature or air-flow velocity).Afterwards, tester's testing electrical property of being correlated with for interface card to be measured.
Yet, above-mentioned test mode must interface card to be measured need controlled environmental baseline and test platform just can carry out under the prerequisite that conforms to of patient environmental baseline.If when the patient environmental baseline of tester existing test platform institute needs controlled environmental baseline not conform to interface card to be measured, above-mentioned test mode can't be carried out.
Summary of the invention
The invention provides a kind of test suite, it can be tested at element under test separately.
The present invention proposes a kind of test suite, is suitable for testing an element under test.Test suite comprises the device and a test platform of a simulation test environment.The device of simulation test environment comprises a temperature-controlled cabinet, a fan and a mozzle.Temperature-controlled cabinet has an opening, and fan arrangement is in opening part.Fan is suitable for producing an air-flow, and air-flow has a temperature and a flow velocity.Mozzle has an air intake vent and an air outlet.Mozzle is connected to temperature-controlled cabinet, and the corresponding opening of air intake vent, makes the internal flow of air-flow at mozzle.Test platform is positioned at outside the mozzle, and element under test is positioned at mozzle and is electrically connected to test platform.Above-mentioned test suite also comprises a switching element, and it passes a tube wall of mozzle.The part of switching element is positioned at mozzle, and another part of switching element is positioned at outside the mozzle, and switching element electrically connects element under test and test platform.
In an embodiment of the present invention, element under test can be an interface card to be measured, and switching element can be an adapter, and test platform comprises a mainboard, and switching element electrically connects element under test and mainboard.
In an embodiment of the present invention, the device of above-mentioned simulation test environment also comprises a block piece, and it is disposed in the mozzle.
Because the test platform of element under test and test suite of the present invention lays respectively in the mozzle and outside the mozzle, so the tester can test at element under test separately.In addition, because the block piece that is positioned at mozzle can allow the flow velocity of the air-flow of flowing through produce change, so test suite of the present invention can be in response to the demand of the different test environment of element under test miscellaneous.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and the conjunction with figs. formula is described in detail below.
Description of drawings
Fig. 1 illustrates the schematic perspective view that the part of a kind of test suite of first embodiment of the invention is decomposed.
Fig. 2 illustrates the solid combination synoptic diagram of the test suite of Fig. 1.
Fig. 3 illustrates the solid combination synoptic diagram of a kind of test suite of second embodiment of the invention.
Embodiment
[first embodiment]
Fig. 1 illustrates the schematic perspective view that the part of a kind of test suite of first embodiment of the invention is decomposed.Fig. 2 illustrates the solid combination synoptic diagram of the test suite of Fig. 1.Please refer to Fig. 1 and Fig. 2, the test suite 200 of present embodiment is suitable for testing an element under test 20.Test suite 200 comprises the device 210 and a test platform 220 of a simulation test environment.The device 210 of simulation test environment comprises a temperature-controlled cabinet 212, a fan 214 and a mozzle 216.Temperature-controlled cabinet 212 has an opening 212a, and fan 214 is disposed at opening 212a place.Fan 214 is suitable for producing an air-flow F, and air-flow F has a temperature and a flow velocity.
This mandatory declaration be, the tester can be controlled at specific scope by the temperature that temperature-controlled cabinet 212 will be positioned at its gas, and the rotating speed that the tester can be by fan with the flow speed control of air-flow F in specific scope.Therefore, but temperature that air-flow F is had and flow velocity testee are controlled in the specific scope.
Mozzle 216 has an air intake vent 216a and an air outlet 216b.Mozzle 216 is connected to temperature-controlled cabinet 212, and the corresponding opening 212a of air intake vent 216a, makes the internal flow of air-flow F at mozzle 216.Element under test 20 is positioned at mozzle 216.Test platform 220 is positioned at outside the mozzle 216, and element under test 20 is electrically connected to test platform 220.
In detail, in the present embodiment, test suite 200 also comprises a switching element 230, and it passes a tube wall 216c of mozzle 216.The part of switching element 230 is positioned at mozzle 216, and another part of switching element 230 is positioned at outside the mozzle 216, and switching element 230 electrically connects element under test 20 and test platform 220.In addition, element under test 20 can be an interface card to be measured, and switching element 230 can be an adapter, and test platform 220 comprises a mainboard 222.Switching element 230 electric connections that for example are adapter for example are the element under test 20 and mainboard 222 of interface card to be measured.
Below the switching element 230 of process be disposed on to(for) the element under test 20 of present embodiment explain.After on the mainboard 222 that for example is plugged in test platform 220 for the switching element 230 of adapter, switching element 230 passes tube wall 216c via the opening 216d on the tube wall 216c that is positioned at mozzle 216.Then, raise another tube wall 216e of mozzle 216, and will for example be plugged in switching element 230 for the element under test 20 of interface card to be measured.Then, place tube wall 216c to go up and covering opening 216d one anti-leak element 218, when making test suite 200 runnings, air-flow F is difficult for being leaked by opening 216d.Afterwards, tube wall 216e is covered.
After above-mentioned steps is finished, the tester can start-up temperature control box 212, fan 214 with mainboard 222, make air-flow F flow in the mozzle 216, and the air-flow F in the mozzle 216 have required environmental baseline.So, but the testing electrical property that the tester promptly is correlated with for element under test 20.
Since element under test 20 and test platform 220 lay respectively in the mozzle 216 with mozzle 216 outside, so the tester can test at element under test 20 separately.In other words, element under test 20 can not be subject to 220 patient environmental baselines of test platform.
In this mandatory declaration is that for the specification of each member of test suite 200, the tester can design according to the test request of element under test 20.For example, the requirement of supposing the test environment of element under test 20 is that the flow velocity of air-flow F is that 2.0 (m/s) and inlet environment temperature (inlet ambience temperature) are 70 degree Celsius.The tester can calculate mozzle 216 required external form and size, the rotating speed of fan 214 required adjustment or the temperature-controlled cabinet 212 required temperature of keeping according to above-mentioned requirements in advance.Certainly, element under test 20 also is the factor that must consider with the size of switching element 230.
In detail, with regard to the temperature of air-flow F, in fact the tester can control temperature by temperature-controlled cabinet 212.Though air-flow F may have thermal loss at air intake vent 216a place, the temperature that the tester can a little raising temperature-controlled cabinet 212 be kept makes air-flow F meet the requirement of above-mentioned inlet environment temperature in the temperature of air intake vent 216a to compensate above-mentioned thermal loss.It should be noted that not produce the phenomenon of condensing be principle not damage fan 214 and mozzle 216 basically for temperature that temperature-controlled cabinet 212 kept.In addition, with regard to the flow velocity of air-flow F, for example under the situation that the flow of air-flow F is fixed, and according to the flow of air-flow F (that is, the volume that air-flow F flows through in unit interval) relational expression (that is the flow of air-flow F is the sectional area that the flow velocity of air-flow F multiply by mozzle 216), the tester can reduce the sectional area of mozzle 216 if want to increase the flow velocity of air-flow F.In another was implemented, the tester also can take other modes to change the flow velocity of air-flow F, sees for details following.
[second embodiment]
Please refer to Fig. 3, it illustrates the solid combination synoptic diagram of a kind of test suite of second embodiment of the invention.The test suite 300 of present embodiment is that with the main difference part of the test suite 200 of the foregoing description the device 310 of the simulation test environment of the test suite 300 of present embodiment also comprises a block piece 319, and it is disposed in the mozzle 316.
In the present embodiment, block piece 319 for example is a link stopper.The block piece 319 that is positioned at mozzle 316 can allow the flow velocity of the air-flow F ' that flows through produce to change, with the demand in response to the different test environment of element under test 30 miscellaneous.
In sum, test suite of the present invention has following advantage at least:
One, because the test platform of element under test and test suite of the present invention lays respectively in the mozzle and outside the mozzle, so the tester can test at element under test separately.
Two, because the block piece that is positioned at mozzle can allow the flow velocity of the air-flow of flowing through produce change, so test suite of the present invention can be in response to the demand of the different test environment of element under test miscellaneous.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when with being as the criterion that claim was defined.
Claims (3)
1. a test suite is suitable for testing an element under test, comprising:
The device of one simulation test environment comprises:
One temperature-controlled cabinet has an opening;
One fan is disposed at this opening part, and wherein this fan is suitable for producing an air-flow, and this air-flow has a temperature and a flow velocity; And
One mozzle has an air intake vent and an air outlet, and wherein this mozzle is connected to this temperature-controlled cabinet, and this air intake vent is to should opening, makes the internal flow of this air-flow at this mozzle; And
One test platform is positioned at outside this mozzle, and wherein this element under test is positioned at this mozzle and is electrically connected to this test platform; And
One switching element passes a tube wall of this mozzle, and wherein the part of this switching element is positioned at this mozzle, and another part of this switching element is positioned at outside this mozzle, and this switching element electrically connects this element under test and this test platform.
2. test suite as claimed in claim 1 is characterized in that, this element under test is an interface card to be measured, and this switching element is an adapter, and this test platform comprises a mainboard, and this switching element electrically connects this element under test and this mainboard.
3. test suite as claimed in claim 1 is characterized in that the device of this simulation test environment also comprises a block piece, is disposed in this mozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101407797A CN101373206B (en) | 2007-08-21 | 2007-08-21 | Test component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101407797A CN101373206B (en) | 2007-08-21 | 2007-08-21 | Test component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101373206A CN101373206A (en) | 2009-02-25 |
| CN101373206B true CN101373206B (en) | 2011-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101407797A Expired - Fee Related CN101373206B (en) | 2007-08-21 | 2007-08-21 | Test component |
Country Status (1)
| Country | Link |
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| CN (1) | CN101373206B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101504478B (en) * | 2009-03-04 | 2010-12-29 | 众达光通科技(苏州)有限公司 | Novel jig for optical receiving-transmitting module test |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5859540A (en) * | 1995-05-23 | 1999-01-12 | Advantest Corporation | Constant temperature chamber in a handler for semiconductor device testing apparatus |
| CN1526076A (en) * | 2001-07-12 | 2004-09-01 | ��ʽ���簮������� | Apparatus for handling electronic components and method for controlling temperature of electronic components |
-
2007
- 2007-08-21 CN CN2007101407797A patent/CN101373206B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5859540A (en) * | 1995-05-23 | 1999-01-12 | Advantest Corporation | Constant temperature chamber in a handler for semiconductor device testing apparatus |
| CN1526076A (en) * | 2001-07-12 | 2004-09-01 | ��ʽ���簮������� | Apparatus for handling electronic components and method for controlling temperature of electronic components |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2000-162268A 2000.06.16 |
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| Publication number | Publication date |
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| CN101373206A (en) | 2009-02-25 |
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