CN101362366B - Diffusion film die and manufacturing method thereof - Google Patents
Diffusion film die and manufacturing method thereof Download PDFInfo
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- CN101362366B CN101362366B CN2007101435180A CN200710143518A CN101362366B CN 101362366 B CN101362366 B CN 101362366B CN 2007101435180 A CN2007101435180 A CN 2007101435180A CN 200710143518 A CN200710143518 A CN 200710143518A CN 101362366 B CN101362366 B CN 101362366B
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- diffusion film
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Abstract
In the invention, a positioning material is arranged at one side of a bottom plate, a plurality of macro-particles are arranged and positioned on the bottom plate via the positioning material, depositing and electroplating are performed in sequence at one side where the macro-particles are arranged on the bottom plate, therefore, a diffusion film die is formed, the produced diffusion film die is mainly provided with a base plate, a plurality of sunken parts concavely arranged on the surface are arranged on one surface of the base plate, and when the diffusion film die is used for fabricating a diffusion film, a microstructural body corresponding to each sunken part is formed on the diffusion film.
Description
Technical field
The manufacture method of relevant a kind of mould of the present invention and diffusion barrier mould refers to a kind of mould and the manufacture method that can be applicable to diffusion film die in the backlight module especially.
Background technology
Thin Film Transistor-LCD (TFT-LCD) at present can be as the more widely used commodity of the display of Presentation Function, and it mainly is made up of two big members, and the one, display floater, one provides the backlight module of this display floater light source.This backlight module is according to its light source position difference, and can divide has side light type back light module and direct type backlight module.Side light type back light module be applied to mostly general in, undersized display is used, the light source of its collocation then has light emitting diode (LED) or CCFL.Direct type backlight module then is applied to the display of large-size mostly, such as television set etc.
Be illustrated in figure 1 as in the known direct type backlight module 1, possess a housing 11, these housing 11 inner faces generally are coated with the reflective coating that can do the light reflection, or are pasted with one deck reflectance coating 12, to do the reflection of light source; A plurality of light sources 13 have been spaced again in regular turn, and one diffuser plate 14 is set in light source 13 tops, then dispose one or more optical diffusion film sheet 15 and one or more brightening film sheet 16 combines with display floater 17 at last again, and form a Thin Film Transistor-LCD (TFT-LCD) in diffuser plate 14 tops.
As shown in the figure, be arranged at after light source 13 turn-on powers in the housing 11, can be emitted beam immediately, this light part is directly injected towards diffuser plate 14, a part then can the reflected back housing in 11 other positions, and carry out reflex through reflectance coating 12, make light can go into to be provided with diffuser plate 14 once more, the light that enters diffuser plate 14 spreads in diffuser plate 14, be incident upon optical diffusion film sheet 15 again and do further light source diffusion evenly, and do the light harvesting of light source by the diaphragm 16 that adds lustre to, the action of optically focused provides to give display floater 17 at last, so that display floater 17 obtains even and enough light sources, use when being enough to show.
Diffuse optical structures such as aforementioned diffuser plate or light diffusing sheet are mostly with acryl, Merlon (PC) or acryl and the cinnamic copolymer plate demihull shapes that material was constituted such as (MS), and have certain light transmittance.In order to reach light source diffusion and effect of uniform, generally can be when it be made, the one-tenth milky shape that adds pigment and make reaches evenly with the diffusion that helps light source, even can add many small diffusion particulates 140 that are again, as shown in Figure 2, it is mainly by the setting of spreading particulate 140, to reach the purpose of light diffusion.
As shown in Figure 3, each set-up mode that spreads particulate 140 also can make an addition in the colloid 141, utilizes and coats base material 18 surfaces, and order diffusion particulate 140 is able to be positioned base material 18 surfaces by colloid 141, form the diffusion barrier structure, respectively spread particulate 140 and then form the diffuse optical structure; Only, this kind utilizes coating each diffusion particulate 140 to be arranged at the mode on base material 18 surfaces, uncontrollable arrangement of respectively spreading particulate 140 makes it arrange poor effect, so that the diffuse optical structure of this diffusion barrier can't reach the effect of preferable light diffusion and homogenising.
Summary of the invention
Main purpose of the present invention, be provided with the location material prior to base plate one side, by the location material plural particulate arrangement is positioned on the base plate, in base plate an atomic side being set deposits in regular turn and electroplates, then can form diffusion film die, and the diffusion film die of making mainly is provided with a substrate, this a substrate wherein surface is provided with the recessed depression in the surface portion of plural number, when this diffusion film die is applied to make diffusion barrier, on this diffusion barrier and be formed with the microstructured bodies of corresponding each depressed part.
Wherein, utilization is provided with the positional alignment and the density difference of location material, make particulate form different the arrangement and density, and then adjust each depressed part and form different the arrangement and density, so that the diffuse optical structure of this diffusion film die institute moulding, the effect of preferable light diffusion and homogenising can be reached,, and the diffusion barrier that preferable microstructured bodies is arranged can be formed with the minimizing processing procedure time.
For reaching above-mentioned purpose, the manufacture method of a kind of diffusion film die of the present invention comprises the following steps:
One base plate and plural particulate are provided, and this base plate one side is provided with plural groove, and each groove also has crest portion and trough portion, is provided with the location material in trough portion, and this particulate is oval spherical, and it has a major axis, a minor axis;
Should locate material and be filled in this trough portion and form a Breadth Maximum, and make this atomic major axis greater than this Breadth Maximum, minor axis then is equal to or less than this Breadth Maximum;
This particulate arrangement is positioned on this base plate, this particulate is covered on the material of location, and this atomic major axis is parallel to this groove bearing of trend configuration;
In base plate an atomic side is set and deposits, make this side form metal film layer;
Become certain thickness in the enterprising electroplating of this metal film layer, and form diffusion film die.
Description of drawings
Fig. 1 is the structural representation of general direct type backlight module;
Fig. 2 is for practising the light diffusion schematic diagram that diffuser plate is arranged;
Fig. 3 has the diffusion particulate to arrange structural representation in base material for practising;
Fig. 4 is the forming step schematic diagram of diffusion film die among the present invention;
Fig. 5 is the molding structure schematic diagram of diffusion film die among the present invention;
Fig. 6 is the structural representation of diffusion film die among the present invention;
Fig. 7 makes the structural representation of diffusion barrier for diffusion film die among the present invention;
Fig. 8 is another molding structure schematic diagram of diffusion film die among the present invention;
Fig. 9 is arranged in the structural representation of base plate for particulate among the present invention;
Figure 10 is another structural representation of diffusion film die among the present invention.
[figure number explanation]
Resin A diffusion barrier B
Surface B1, B2 optical scattering structure B3
Major axis C minor axis D
Direct type backlight module 1 housing 1
Diffuser plate 14 diffusion particulates 140
Colloid 141 metal film layers 141
Diffusion film die 142 micro-structurals 143
Optical diffusion film sheet 15 brightening film sheets 16
Particulate 23 grooves 24
241 trough portions 242 of crest portion
The specific embodiment
Characteristics of the present invention can be consulted the detailed description of the graphic and embodiment of this case and obtained to be well understood to.
The present invention aims to provide a kind of manufacture method of diffusion film die, as Fig. 4 and shown in Figure 5, comprises the following steps:
A, provide a flat base plate 21, these base plate 21 1 sides are provided with location material 22, and this location material 22 can be arranged on the base plate 21 for adhesive agent utilizes coating method.
B, utilization location material 22 are arranged plural particulate 23 and are positioned on the base plate 21, plural particulate 23 can be covered on the material 22 of location, this particulate 23 is a spherical shape as shown in the figure, utilize again and rock or the mode of vibrating bottom plate, unnecessary particulate is removed, made each particulate 23 be able to be positioned on the base plate 21 by location material 22; Certainly, this location material can be coated on the whole plate face of base plate as shown in the figure, can also selectivity be arranged at ad-hoc location, and particulate is positioned on the ad-hoc location.
C, deposit, the side that particulate 23 is set in base plate 21 is carried out physics or chemical deposition, makes this side form metal film layer 31.
D, electroplate, become certain thickness in these metal film layer 31 enterprising electroplatings, and formation diffusion film die 32, this diffusion film die 32 mainly is provided with a substrate 321, this substrate 321 a wherein surface is provided with the spherical depressed part 322 of semicircle that plural number is recessed into surface and corresponding each particulate 23, as shown in Figure 6.
At last, utilize this diffusion film die 32 to form diffusion barrier 4 in the mould molding mode, as shown in Figure 7, these diffusion barrier 4 surfaces then are formed with the microstructured bodies 41 of corresponding each depressed part 322; What deserves to be mentioned is, the present invention utilizes on the ready-made diffusion film die, utilization is provided with the positional alignment and the density difference of location material, make particulate form different the arrangement and density, and then adjust each depressed part and form different the arrangement and density, so that the diffuse optical structure of this diffusion film die institute moulding, can reach the effect of preferable light diffusion and homogenising, with the minimizing processing procedure time, and can form the diffusion barrier that preferable microstructured bodies is arranged.
Moreover, this base plate also can be formed with channel form, as shown in Figure 8, these base plate 21 1 sides are provided with plural groove 24, and each groove 24 and crest portion 241 is arranged and trough portion 242, be provided with location material 22 in trough portion 242, and this location material 22 is filled in the 242 1 Breadth Maximum L of this trough portion, utilize location material 22 that plural particulate 23 is arranged and be positioned on the base plate 21, please consult this particulate 23 shown in Figure 9 simultaneously for oval spherical, it has length, minor axis C, D, and this major axis C is greater than this Breadth Maximum L, minor axis D then is equal to or less than this Breadth Maximum L, so when this particulate 23 is arranged on the base plate 21, be parallel to this groove 24 bearing of trends configuration with major axis C; After each particulate 23 arrangement is positioned on the base plate 21, deposit (forming metal film layer 31) more in regular turn and electroplate into certain thickness, can form diffusion film die 32 equally; These diffusion film die 32 surfaces then are formed with the depressed part 322 of corresponding each particulate 23, so 322 of each depressed parts are oval hemispherical, as shown in figure 10; Certainly, utilize this diffusion film die to form diffusion barrier in the mould molding mode, this diffusion barrier surface then is formed with the oval hemispherical microstructured bodies of corresponding each depressed part.
Technology contents of the present invention and technical characterstic the sixth of the twelve Earthly Branches disclose as above, yet the personage who is familiar with this technology still may do various replacement and the modifications that do not deviate from this case invention spirit based on announcement of the present invention.Therefore, protection scope of the present invention should be not limited to those disclosed embodiments, and should comprise various do not deviate from replacement of the present invention and modifications, and is contained by following claim.
Claims (3)
1. the manufacture method of a diffusion film die is characterized in that, comprises the following steps:
One base plate and plural particulate are provided, and this base plate one side is provided with plural groove, and each groove also has crest portion and trough portion, is provided with the location material in trough portion, and this particulate is oval spherical, and it has a major axis, a minor axis;
Should locate material and be filled in this trough portion and form a Breadth Maximum, and make this atomic major axis greater than this Breadth Maximum, minor axis then is equal to or less than this Breadth Maximum;
This particulate arrangement is positioned on this base plate, this particulate is covered on the material of location, and this atomic major axis is parallel to this groove bearing of trend configuration;
In base plate an atomic side is set and deposits, make this side form metal film layer;
Become certain thickness in the enterprising electroplating of this metal film layer, and form diffusion film die.
2. the manufacture method of diffusion film die according to claim 1 is characterized in that this diffusion film die mainly is provided with a substrate, and this a substrate wherein surface is provided with the recessed surface of plural number and corresponding each atomic depressed part.
3. as the manufacture method of diffusion film die as described in the claim 2, it is characterized in that this depressed part is on the oval hemispherical surface that is arranged at substrate.
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CN2007101435180A CN101362366B (en) | 2007-08-08 | 2007-08-08 | Diffusion film die and manufacturing method thereof |
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CN2007101435180A CN101362366B (en) | 2007-08-08 | 2007-08-08 | Diffusion film die and manufacturing method thereof |
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CN101362366A CN101362366A (en) | 2009-02-11 |
CN101362366B true CN101362366B (en) | 2011-01-12 |
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CN107179572B (en) * | 2016-03-11 | 2020-11-13 | 台达电子工业股份有限公司 | Diffuser, laser light source module using same and manufacturing method thereof |
CN106154367B (en) * | 2016-08-23 | 2020-03-20 | 苏州大学 | Light diffusion sheet |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2857040Y (en) * | 2005-12-07 | 2007-01-10 | 政翔精密股份有限公司 | High brightness light conducting board |
JP2007025090A (en) * | 2005-07-14 | 2007-02-01 | Hitachi Chem Co Ltd | Diffuse reflecting plate, laminated body for transfer molding, processing method of metallic mold for transfer molding and processing apparatus therefor |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007025090A (en) * | 2005-07-14 | 2007-02-01 | Hitachi Chem Co Ltd | Diffuse reflecting plate, laminated body for transfer molding, processing method of metallic mold for transfer molding and processing apparatus therefor |
CN2857040Y (en) * | 2005-12-07 | 2007-01-10 | 政翔精密股份有限公司 | High brightness light conducting board |
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