CN101362241B - Solder reflow sample position limiter - Google Patents
Solder reflow sample position limiter Download PDFInfo
- Publication number
- CN101362241B CN101362241B CN2008100537603A CN200810053760A CN101362241B CN 101362241 B CN101362241 B CN 101362241B CN 2008100537603 A CN2008100537603 A CN 2008100537603A CN 200810053760 A CN200810053760 A CN 200810053760A CN 101362241 B CN101362241 B CN 101362241B
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- adjusting
- sample
- frame
- bolt
- nut
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Abstract
A reflow soldering sample-limiting device consists of a frame used for setting welded samples, a feed bolt and a locking nut which are used for positioning the samples and a chock. The structure of the frame is a rectangular frame, the inner space of the frame is provided with the limited sample and every two symmetric edge frames forming the frame respectively form corresponding screw holes along the plane direction; the through screw holes used for running through the edge frame by the feed bolt support the samples and is locked by locking the nut, and the chock is plugged into the gaps of the samples. The device also comprises an adjusting slider the end of which forms the through screw hole, an adjusting bolt which runs through the through screw hole on the adjusting slider, and an adjusting nut used for adjusting the adjusting bolt and the adjusting slider; the adjusting bolt is positioned on the upper part of the frame; and the adjusting slider which is sheathed on the adjusting bolt is positioned between the sample and a frame which is parallel with the sample through an adjusting card of the adjusting nut. The invention has the advantages of high limited precision, simple structure and easy adjustment with the precision of up to 0.02mm and can effectively eliminate the defects such as serious sample offset and the like during the process of welding.
Description
Technical field
The present invention relates to a kind of stopping means.Particularly relate to a kind of limit accuracy height, simple in structure, easy to adjust, the test solder reflow sample position limiter that can satisfy various joint samples commonly used and the spacing requirement of components and parts Reflow Soldering.
Background technology
Reflow soldering process is widely used in the Electronic Packaging, and the accurate limiting of components and parts or sample is extremely important to guaranteeing welding quality in the welding process.Usually adopt vacuum suction to fix and locate or be fixed in the large-scale production on the supporting plate of location components and parts to be carried out spacing, and in the new product development test, need carry out spacing under the more susceptible condition the various terminal sample.Because test center tap pattern varied (shown in Figure 12 (a), 12 (b), 12 (c), 12 (d), 12 (e)), specimen size changes greatly, at every kind of joint categories, each size test specimen is made corresponding stopping means can waste great amount of manpower and material resources, therefore is badly in need of a kind of device that can satisfy various joint samples commonly used and the spacing requirement of common components and parts.Existing most researchers in test sample is sticked on carry out on the flat board spacing, the major defect of this method is in welding process because binding agent fusing generation sample is offset defectives such as serious, thereby also having part Study person that column is fixed on dull and stereotyped going up carries out spacing to sample, the major defect of the method is that versatility is poor, specimen size changes slightly, and device then need carry out bigger change.Therefore, develop a kind of limit accuracy height, simple in structure, easy to adjust, can satisfy or the partial devices parts are made an amendment slightly and can satisfy test and have practical significance with the device of various joint samples commonly used and the spacing requirement of components and parts Reflow Soldering.
Summary of the invention
Technical problem to be solved by this invention is, a kind of limit accuracy height, simple in structure, easy to adjust, the test solder reflow sample position limiter that can satisfy various joint samples commonly used and the spacing requirement of components and parts Reflow Soldering are provided.
The technical solution adopted in the present invention is: a kind of solder reflow sample position limiter includes and is used to be provided with by the framework of weldering sample, is used for a plurality of feeding bolt and lock nuts and chock to the sample location; Described framework is a rectangular frame structure, and the framework inner space is placed limited sample, is formed with corresponding perforation screwed hole along in-plane respectively on the frame of per two symmetries of formation framework; The perforation screwed hole of described feeding bolt-through frame withstands on the sample and by locking nut locks; Described chock is filled in the gap of sample.
Described framework inner space is criss-cross opening.
One end of described feeding bolt is formed with nut, and the termination of the other end is smooth cylinder, is formed with external screw thread between nut and smooth cylinder.
Also be provided with the end and be formed with adjusting slider that connects screwed hole and the adjusting bolt that runs through the perforation screwed hole on the adjusting slider, and the adjusting nut that is used to adjust and lock adjusting bolt and adjusting slider, described adjusting bolt is positioned at the top of framework, describedly is enclosed within the adjusting by adjusting nut of the adjusting slider regulated on the bolt and is stuck between the frame of sample and the framework parallel with sample.
Be formed with the perforation screwed hole more than 2 or 2 on two long margin frames of described rectangular frame respectively.
Be formed with the perforation screwed hole more than 1 or 1 on two minor face frames of described rectangular frame respectively.
Solder reflow sample position limiter of the present invention, limit accuracy height, simple in structure and be easy to regulate, degree of regulation can reach 0.02mm, can effectively eliminate in the welding process owing to the spacing inaccurate or unstable sample that produces is offset defectives such as serious, do not need to change existing welding procedure, can satisfy multiple joint sample and the spacing requirement of components and parts Reflow Soldering commonly used.
Description of drawings
Fig. 1 is an overall structure schematic diagram of the present invention;
Fig. 2 is the left view of Fig. 1;
Fig. 3 is the vertical view of Fig. 1;
Fig. 4 is the stereogram of Fig. 1;
Fig. 5 is a frame structure schematic diagram of the present invention;
Fig. 6 is the structural representation of the flat cutting face of Fig. 5;
Fig. 7 is the A-A sectional schematic diagram of Fig. 5;
Fig. 8 is the vertical view of Fig. 5;
Fig. 9 is the structural representation of feeding bolt of the present invention;
Figure 10 is the structural representation of adjusting slider of the present invention;
Figure 11 is the structural representation of chock of the present invention;
Figure 12 (a), 12 (b), 12 (c), 12 (d), 12 (c) are the schematic diagrames of different weld joint samples.
Wherein:
1: framework 2: the feeding bolt
3: chock 4: adjusting slider
5: locking nut 6: sample
7: solder joint 8: connect screwed hole
9: nut 10: smooth cylinder
11: external screw thread 12: regulate bolt
13: adjusting nut 14: connect screwed hole
The specific embodiment
Below in conjunction with embodiment and accompanying drawing solder reflow sample position limiter of the present invention is made a detailed description.
As Fig. 1, Fig. 3~shown in Figure 7, solder reflow sample position limiter of the present invention includes and is used to place by the framework 1 of weldering sample 6, is used for to sample 6 spacing a plurality of feeding bolts 2 and locking nut 5 and chock 3; Described framework 1 is a rectangular frame structure, space at framework 1 inboard cross opening is provided with the sample 6 that is positioned, be formed with corresponding perforation screwed hole 8 along in-plane respectively on the frame of per two symmetries of formation framework 1, wherein, be formed with the perforation screwed hole 8 more than 2 or 2 on two long margin frames of described rectangular frame 1 respectively, be formed with the perforation screwed hole 8 more than 1 or 1 on two minor face frames of described rectangular frame 1 respectively; The perforation screwed hole 8 that described feeding bolt 2 runs through frame withstands on the sample 6 also by locking nut 5 lockings; Described chock 3 is filled in the gap of sample 6, chock 3 decapacitation accurately guarantee between sample outside the relative gap, can also effectively stop in the welding process scolder to spill into gap location and produce defectives such as incompletely filling, the shape of chock and size should be done the adaptability change with specimen types and change in size.
As shown in Figure 8, an end of described feeding bolt 2 is formed with nut 9, and the termination of the other end is smooth cylinder 10, and the cylinder outer face is obvious to the position-limiting action of sample.Between nut 9 and smooth cylinder 10, be formed with external screw thread 11.
As shown in Figure 2, also be provided with the end and be formed with adjusting slider 4 that connects screwed hole 14 and the adjusting bolt 12 that runs through the perforation screwed hole 14 on the adjusting slider 4, and the adjusting nut 13 that is used to adjust and lock adjusting bolt 12 and adjusting slider 4, described adjusting bolt 12 is positioned at the top of framework 1, describedly is enclosed within the adjusting by adjusting nut 13 of the adjusting slider 4 regulated on the bolt 12 and is stuck between the frame of sample 6 and the framework 1 parallel with sample 6.By some adjusting sliders 4 being connected the assist location that can be used for sample 6 with adjusting bolt 12, adjusting nut 13, also alternative chock 3 when the gap of sample 6 is big.
For guaranteeing the precision and the service life of solder reflow sample limit device of the present invention, the little heat-resistance stainless steel of thermal coefficient of expansion is adopted in suggestion, also can adopt aluminium alloy when less demanding.
Claims (6)
1. a solder reflow sample position limiter is characterized in that, includes to be used to be provided with by the framework (1) of weldering sample (6), to be used for a plurality of feeding bolts (2) and locking nut (5) and chock (3) to sample (6) location; Described framework (1) is a rectangular frame structure, and framework (1) inner space is placed limited sample (6), is formed with corresponding perforation screwed hole (8) along in-plane respectively on the frame of per two symmetries of formation framework (1); The perforation screwed hole (8) that described feeding bolt (2) runs through frame withstands on that sample (6) is gone up and by locking nut (5) locking; Described chock (3) is filled in the gap of sample (6).
2. solder reflow sample position limiter according to claim 1 is characterized in that, described framework (1) inner space is criss-cross opening.
3. solder reflow sample position limiter according to claim 1, it is characterized in that, one end of described feeding bolt (2) is formed with nut (9), and the termination of the other end is smooth cylinder (10), is formed with external screw thread (11) between nut (9) and smooth cylinder (10).
4. solder reflow sample position limiter according to claim 1, it is characterized in that, also be provided with the end and be formed with adjusting slider (4) that connects screwed hole (14) and the adjusting bolt (12) that runs through the perforation screwed hole (14) on the adjusting slider (4), and the adjusting nut (13) that is used for adjusting and locking adjusting bolt (12) and adjusting slider (4), described adjusting bolt (12) is positioned at the top of framework (1), describedly is enclosed within the adjusting by adjusting nut (13) of the adjusting slider (4) regulated on the bolt (12) and is stuck between the frame of sample (6) and the framework (1) parallel with sample (6).
5. solder reflow sample position limiter according to claim 1 is characterized in that, is formed with the perforation screwed hole (8) more than 2 or 2 on two long margin frames of described rectangular frame (1) respectively.
6. solder reflow sample position limiter according to claim 1 is characterized in that, is formed with the perforation screwed hole (8) more than 1 or 1 on two minor face frames of described rectangular frame (1) respectively.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100537603A CN101362241B (en) | 2008-07-04 | 2008-07-04 | Solder reflow sample position limiter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100537603A CN101362241B (en) | 2008-07-04 | 2008-07-04 | Solder reflow sample position limiter |
Publications (2)
Publication Number | Publication Date |
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CN101362241A CN101362241A (en) | 2009-02-11 |
CN101362241B true CN101362241B (en) | 2010-08-11 |
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Application Number | Title | Priority Date | Filing Date |
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CN2008100537603A Expired - Fee Related CN101362241B (en) | 2008-07-04 | 2008-07-04 | Solder reflow sample position limiter |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106964933B (en) * | 2017-03-28 | 2019-04-26 | 马钢(集团)控股有限公司 | A kind of sheet coupon spot welding clamping and positioning device |
CN113172298B (en) * | 2021-04-30 | 2022-09-27 | 中国船舶重工集团公司第七二三研究所 | Process device for brazing and positioning three-type rectangular waveguide tube and flange plate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1239340A (en) * | 1998-06-12 | 1999-12-22 | 惠特克公司 | Board mount type connector assembly |
US6047875A (en) * | 1995-09-20 | 2000-04-11 | Unitek Miyachi Coporation | Reflow soldering self-aligning fixture |
US6182819B1 (en) * | 1988-06-15 | 2001-02-06 | Rehm Anlagenbau Gmbh + Co. | Article carrier with adjustable support elements and a reflow soldering system provided with such an article carrier |
CN1695896A (en) * | 2005-05-26 | 2005-11-16 | 上海交通大学 | Flexible device for multipoint clamping and positioning spatial 3D thin wall part |
-
2008
- 2008-07-04 CN CN2008100537603A patent/CN101362241B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6182819B1 (en) * | 1988-06-15 | 2001-02-06 | Rehm Anlagenbau Gmbh + Co. | Article carrier with adjustable support elements and a reflow soldering system provided with such an article carrier |
US6047875A (en) * | 1995-09-20 | 2000-04-11 | Unitek Miyachi Coporation | Reflow soldering self-aligning fixture |
CN1239340A (en) * | 1998-06-12 | 1999-12-22 | 惠特克公司 | Board mount type connector assembly |
CN1695896A (en) * | 2005-05-26 | 2005-11-16 | 上海交通大学 | Flexible device for multipoint clamping and positioning spatial 3D thin wall part |
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CN101362241A (en) | 2009-02-11 |
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Granted publication date: 20100811 Termination date: 20120704 |