CN101358327B - Printed circuit board tin spray apparatus and method - Google Patents
Printed circuit board tin spray apparatus and method Download PDFInfo
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- CN101358327B CN101358327B CN200810027562XA CN200810027562A CN101358327B CN 101358327 B CN101358327 B CN 101358327B CN 200810027562X A CN200810027562X A CN 200810027562XA CN 200810027562 A CN200810027562 A CN 200810027562A CN 101358327 B CN101358327 B CN 101358327B
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Abstract
The invention discloses a printed circuit board tin spraying device and a method thereof; in the device, the upper side and the lower side of a front air blade and a rear air blade are symmetrically provided with roller units made of material which is not tined; each roller unit comprises a front roller arranged on the front air blade and a rear roller arranged on the rear air blade; the front roller and the rear roller are in parallel with the axial direction of the air blade openings and extend out of the vertical surfaces at the air blade openings, to hand the printed circuit board at the bottom of a hook; the printed circuit board receives superficial treatment tining from the surface of a tin groove arranged between the front roller and the rear roller, and then the printed circuit board is lifted and gas is sprayed from the air blade openings. The device has the advantages of improving the evenness of superficial fining of large-size printed circuit boards, effectively solving the problem that the solder masks on the tining surface of thin boards are scratched and greatly improving the conformity rate of tined products.
Description
Technical field
The present invention relates to a kind of tin jet device and method thereof of printed circuit board.
Background technology
Printed circuit board in order need to prevent copper face oxidation in transportation and use of welding position, need carry out surface treatment after accomplishing hole metallization, forming circuit and silk-screen.Hot air leveling (being called spray tin again) technology is exactly that surface-treated is a kind of; Like Fig. 1, shown in 2; The air knife mouth 8 of air knife 5 and back air knife 6, two air knives before molten tin bath 1 top of tin jet device is provided with, be provided with first guide rail 2 and second guide rail 3 that extend vertically in the molten tin bath 1 between 9, printed circuit board 4 is suspended on link plate hook 7 bottoms; Can in molten tin bath 1, move up and down along first guide rail 2 and second guide rail 3; Tin spray process is to hang over the printed circuit board 4 that has applied soldering flux on the link plate hook 7, immerses in the high-temperature solder of the molten state in the molten tin bath 1 along first guide rail 2 and second guide rail 3, from molten tin bath 1, promotes rapidly after the infiltration regular hour; Utilize the high-temperature high-pressure air flow of front and back, molten tin bath 1 top air knife mouth 8,9 ejections to blow the scolder on the plate face smooth simultaneously; After cooling, generate comparatively smooth solid-state tin and the gun-metal layer of one deck on copper surface, this metal level can protect copper face in subsequent process not by the oxidation of air institute.
Because tinsolder has consistency and higher safety preferably to later welded, the hot air leveling surface treatment is widely used the process of surface treatment of making printed circuit board.
But in the hot air leveling process, bigger from the stream pressure of air knife mouth ejection, there is following problem aborning:
1, produce larger-size printed board, like 16Inch * 21Inch and when surpassing the printed circuit board of this size, because the plate area is bigger, the reactive force that the plate face receives air-flow is bigger, when causing hot air leveling plate face generation deformation bigger, the thick lack of homogeneity of plate face tin;
2, at the thin printed circuit board of production size; During less than 1.4mm, soft after printed board is heated in molten tin bath and is raised up like thickness of slab, plate face deformation meeting is bigger when impacted by high-temperature high-pressure air flow; In the lifting process very easily by air knife mouth scratch solder mask; Cause that the lead below the solder mask reaches the standard grade and short circuit, thereby cause serious mass defect, higher condemnation factor.
Solution in the industry and existing problems are as follows at present:
1, change surface treatment: change to other technology to process of surface treatment, like heavy tin, turmeric etc.These processing modes are little to the consumer electronics product influence, but can not change the very high printed circuit board of welding reliability requirement such as military project, automobile, aviation, and the production difficulty is bigger.
2, change small size: adopt less big board size to produce, like 12Inch * 10Inch.But this can reduce the production efficiency of all the other production processes greatly, and can not guarantee that printed board pad tin face is smooth.
3, use netted anchor clamps: adopt titanium endoplasmic reticular anchor clamps, spray tin to thin big plate holder therein, though this method can solve the problem of big plate surface resistance weldering scuffing, can bring has problems such as wire mark, the accumulation of tin face such as bond pad surface.
Summary of the invention
The purpose of this invention is to provide a kind of printed circuit board tin spray apparatus and method that can improve the homogeneity of spray tin, effectively avoid spraying the scuffing of sheet tin face solder mask and can improve the production qualification rate.
Technical solution of the present invention is: a kind of printed circuit board tin spray apparatus; Comprise that the top is provided with the molten tin bath of preceding air knife and back air knife; Be provided with first guide rail and second guide rail that extend vertically in the molten tin bath between the air knife mouth of two air knives; In preceding air knife and the upper side of back air knife and the roller set that lower side respectively is arranged with a Non-Dewetting material; Each roller set comprises front wheel that is arranged on the preceding air knife and the rear roller that is arranged on the air knife of back, front wheel and rear roller and said air knife mouth axially parallel, and extend the vertical surface that belongs to the wind knife-edge part respectively.
Before be respectively equipped with roller set on the homonymy of air knife and back air knife, between front wheel and the rear roller between gap and the air knife mouth gap parallel, and spacing is less than two air knife mouth spacings; Printed circuit board between the front and rear rolling wheel of both sides, makes itself and air knife mouth keep certain distance about laying respectively at through the air knife mouth time like this; Be difficult in the motion being scratched; Simultaneously between the gas zone of action, can stop printed circuit board generation deformation, improve the homogeneity of spray tin, improve the quality problems of spray tin operation.
Said front wheel in each said roller set and said rear roller roll that horizontal minimum spacing is 4-10mm between the face; Help reducing the frictional force resistance between roller and the printed circuit board; Prevent that it from pulling from the link plate hook; While is the deformation extent of switchboard body better, further improves the quality of products.
Each roller in each said roller set rolls face and air knife surface minimum vertical spacing is 10-50mm, can prevent that roller from contacting with the air knife surface because of stressed, influences the motion of printed circuit board, improves the work-ing life of roller.
Each roller in each said roller set rolls that spacing is 3-12mm between the vertical plane of face vertical plane and said wind knife-edge part, further guarantees the homogeneity that tin is sprayed on the printed circuit board surface.
Each roller diameter in each said roller set is 10-50mm, and length is 100-450mm, helps whole accurately location, accurately controls the motion of printed circuit board between the air knife mouth, saves material simultaneously, reduces cost.
Described roller is titanium or ceramic material roller, and self intensity is guaranteed, can improve whole service life, uses pottery more can save cost.
Each said roller set is respectively equipped with two front wheels and two rear rollers, is convenient to process in batch, organizes the deformation that roller can further be controlled printed circuit board more.
Each said roller set is arranged between said first guide rail and second guide rail, and the location that can not influence guide rail is provided with.
A kind of printed circuit board tin spray method provided by the invention; Be that printed circuit board is hung over link plate hook bottom; From immersing molten tin bath internal surface tining along first guide rail and second guide rail between front wheel and the rear roller; Promote printed circuit board then, jet from the air knife mouth simultaneously, printed circuit board is carried out surface treatment.
From the operation of spray tin, the deformation of the printed circuit board in the gas zone of action is controlled like this, and spray tin uniformity coefficient is high, and large-sized thin plate and slab processing quality can be improved.
The invention has the advantages that: can improve the homogeneity of large size printed circuit board surface spray tin, efficiently solve the problem that thin plate spray tin surfaces solder mask is scratched simultaneously, improve qualification rate greatly through spray tin treating product.
Description of drawings
Accompanying drawing 1 is the vertical sectional view of tin jet device in the prior art;
Accompanying drawing 2 is the vertical view of tin jet device in the prior art;
Accompanying drawing 3 is the side structure synoptic diagram at air knife place in the tin jet device of the embodiment of the invention 1;
Accompanying drawing 4 is a tin jet device vertical view in the embodiment of the invention 1;
Accompanying drawing 5 is an A portion partial enlarged drawing among Fig. 3;
Accompanying drawing 6 is a tin jet device vertical view in the embodiment of the invention 2;
1, molten tin bath, 2, first guide rail, 3, second guide rail, 4, printed circuit board, 5, preceding air knife, 6, the back air knife, 7, the air knife mouth, 8, the air knife mouth, 9, front wheel, 10, rear roller, 11, the link plate hook, 12, support.
Embodiment
Embodiment 1:
Consult Fig. 3 and Fig. 4; A kind of printed circuit board tin spray apparatus; Comprise the top be provided with before air knife 5 and molten tin bath 1, two air knife of back air knife 6 air knife mouth 7, be provided with first guide rail 2 and second guide rail 3 that extend vertically in the molten tin bath 1 between 8, in preceding air knife 5 and the upper side of back air knife 6 and the roller set that lower side respectively is arranged with a ceramic material; Each roller set comprise one be arranged on through support 12 before front wheel 9 on the air knife 5; One is arranged on the rear roller 10 of back on the air knife 6 through support 12, front wheel 9 and rear roller 10 respectively with air knife mouth 7 and 8 axially parallels, and extend respectively outside the vertical surface that belongs to the wind knife-edge part.
Each roller set is arranged between first guide rail 2 and second guide rail 3, and the location that therefore can not influence guide rail is provided with.
When suitable this device sprays tin; Printed circuit board 4 is hung over link plate hook 11 bottoms; From immersing molten tin bath 1 internal surface tining along first guide rail 2 and second guide rail 3 between front wheel 9 and the rear roller 10; Promote printed circuit board 4 then, from air knife mouth 7,8 ejection high temperature and high pressure gas, printed circuit board 4 is carried out surface treatment simultaneously.
Owing to be respectively equipped with roller set on the homonymy of preceding air knife 5 and back air knife 6; The gap is with air knife mouth 7, the gap is parallel between 8 between front wheel 9 and the rear roller 10, and spacing is less than two air knife mouth spacings, and printed circuit board 4 is through the wind effect zone time like this; Be held in respectively between the front and rear rolling wheel of both sides up and down; Make itself and air knife mouth keep certain distance, be difficult in the motion being scratched, between the gas zone of action, can stop printed circuit board generation deformation simultaneously; Improve the homogeneity of spray tin, improved the quality problems of spray tin operation.
Consult Fig. 5; Each roller in each said roller set rolls face and air knife surface minimum vertical interval S is 30mm; Each roller in each said roller set rolls that spacing M is 9mm between the vertical plane of face vertical plane and said wind knife-edge part; Said front wheel in each said roller set and said rear roller roll that horizontal minimum spacing K is 8mm between the face, and each roller diameter in each said roller set is 50mm, and length is 400mm.
Consult Fig. 6; A kind of printed circuit board tin spray apparatus; Comprise the top be provided with before air knife 5 and molten tin bath 1, two air knife of back air knife 6 air knife mouth 7, be provided with first guide rail 2 and second guide rail 3 that extend vertically in the molten tin bath 1 between 8, in preceding air knife 5 and the upper side of back air knife 6 and the roller set that lower side respectively is arranged with a ceramic material; Each roller set comprise two be arranged on through support 12 before front wheel 9 on the air knife 5; Two are arranged on the rear roller 10 of back on the air knife 6 through support 12, front wheel 9 and rear roller 10 respectively with air knife mouth 7 and 8 axially parallels, and extend respectively outside the vertical surface that belongs to the wind knife-edge part.Each roller in each said roller set rolls face and air knife surface minimum vertical interval S is 20mm; Each roller in each said roller set rolls that spacing M is 6mm between the vertical plane of face vertical plane and said wind knife-edge part; Said front wheel in each said roller set and said rear roller roll that horizontal minimum spacing K is 6mm between the face, and each roller diameter in each said roller set is 30mm, and length is 100mm; The other technologies characteristic is identical with embodiment 1, does not repeat them here.
A kind of printed circuit board tin spray apparatus; The difference of itself and embodiment 1 is that it is 50mm with the surperficial minimum vertical interval S of air knife that each roller in each said roller set rolls face; Each roller in each said roller set rolls that spacing M is 12mm between the vertical plane of face vertical plane and said wind knife-edge part; Said front wheel in each said roller set and said rear roller roll that horizontal minimum spacing K is 10mm between the face, and each roller diameter in each said roller set is 50mm, and length is 400mm.
A kind of printed circuit board tin spray apparatus; The difference of itself and embodiment 2 is that it is 10mm with the surperficial minimum vertical interval S of air knife that each roller in each said roller set rolls face; Each roller in each said roller set rolls that spacing M is 3mm between the vertical plane of face vertical plane and said wind knife-edge part; Said front wheel in each said roller set and said rear roller roll that horizontal minimum spacing K is 4mm between the face, and each roller diameter in each said roller set is 10mm, and length is 100mm.
Below further specify beneficial effect of the present invention through comparative tests.
The specification of test test printed wiring is: thickness of slab 1.2mm, size 18Inch * 24Inch, basic copper thickness 35um.
Contrast case: after adopting ordinary method spray tin, on average whenever test a data points, adopt X-RAY test tin thick at a distance from 2Inch at the plate face.
Embodiment: after adopting spray tin method spray tin of the present invention, average every separated 2Inch tests a data points at the plate face, adopts X-RAY test tin thick.
The index explanation:
When spray tin qualification rate is then added up thickness of slab less than 1.4mm, when producing, printed circuit board tin spray scratches the data of situation.
Below be the detail parameters and the data of contrast test:
It can also be seen that through the contrast experiment S value is too little, roller contacts with air knife after the stressed generation deformation in spray tin process easily; Cause and freely to rotate; The S value is too big, and the support moment of support 12 pair rollers of fixed idler whell is bigger on air knife, behind the use certain hour; The loosening easily even fracture of support 12, work-ing life can be lower.M distance is too near, and it is thick thin excessively to cause spraying tin tin, is lower than the standard-required of lower limit 2um, and the M distance is excessive then can to cause on the pad spray tin tin thick blocked up and exceed requirement.The too little frictional force that can increase when plate promotes in the spray tin process of K value increases the pulling force of printed circuit board plate to the link plate hook, is prone to cause printed board hanging hole place to be broken and problem that board falling occurs; It is bigger that the K value too greatly then can cause being sprayed sheet tin deformation, and effect of deformation takes place for it not have due control.Each roller diameter is 10-50mm, when length is 100-450mm, helps whole accurately location, accurately controls the motion of printed circuit board between the air knife mouth, saves material simultaneously, reduces cost.
Above-listed detailed description is to the specifying of possible embodiments of the present invention, and those embodiment are not in order to limiting claim of the present invention, and the equivalence that all the present invention of disengaging do is implemented or change, all should be contained in the claim of this case.
Claims (5)
1. printed circuit board tin spray apparatus; Comprise that the top is provided with the molten tin bath of preceding air knife and back air knife; Be provided with first guide rail and second guide rail that extend vertically in the molten tin bath between the air knife mouth of two air knives; It is characterized in that: air knife and the upper side of back air knife and the roller set that lower side respectively is arranged with a Non-Dewetting material before said, each roller set comprise the front wheel and the rear roller that is arranged on the air knife of said back, front wheel and rear roller and said air knife mouth axially parallel that is arranged on the said preceding air knife; And extend the vertical surface of place wind knife-edge part respectively; Front wheel and rear roller spacing be less than two air knife mouth spacings, between front wheel and the rear roller between gap and the air knife mouth gap parallel, it is 10-50mm with the surperficial minimum vertical spacing of air knife that each roller in each roller set rolls face; Each roller set is arranged between said first guide rail and second guide rail, and front wheel in each roller set and rear roller roll that horizontal minimum spacing is 4-10mm between the face.
2. a kind of printed circuit board tin spray apparatus according to claim 1 is characterized in that: each roller diameter in each said roller set is 10-50mm, and length is 100-450mm.
3. a kind of printed circuit board tin spray apparatus according to claim 1 and 2 is characterized in that: described roller is titanium or ceramic material roller.
4. a kind of printed circuit board tin spray apparatus according to claim 3 is characterized in that: each said roller set is respectively equipped with two front wheels and two rear rollers.
5. method of utilizing printed circuit board tin spray apparatus as claimed in claim 1 to carry out printed circuit board tin spray; It is characterized in that: printed circuit board is hung over link plate hook bottom; From immersing molten tin bath internal surface tining along first guide rail and second guide rail between front wheel and the rear roller; Promote printed circuit board then, jet from the air knife mouth simultaneously, printed circuit board is carried out surface treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810027562XA CN101358327B (en) | 2008-04-21 | 2008-04-21 | Printed circuit board tin spray apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810027562XA CN101358327B (en) | 2008-04-21 | 2008-04-21 | Printed circuit board tin spray apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101358327A CN101358327A (en) | 2009-02-04 |
| CN101358327B true CN101358327B (en) | 2012-06-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200810027562XA Active CN101358327B (en) | 2008-04-21 | 2008-04-21 | Printed circuit board tin spray apparatus and method |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036495B (en) * | 2010-12-23 | 2012-12-26 | 北大方正集团有限公司 | Method, device and system for processing printed circuit boards on floating bed |
| CN102689068A (en) * | 2011-03-24 | 2012-09-26 | 代芳 | Tin spraying technology added with spraying solder tiny particles |
| CN102825050B (en) * | 2012-08-14 | 2014-10-29 | 深圳市华星光电技术有限公司 | Cleaning machine for glass substrates |
| CN113630980A (en) * | 2020-05-07 | 2021-11-09 | 南通深南电路有限公司 | PCB tin spraying device |
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| CN101358327A (en) | 2009-02-04 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A tin spraying device and method for a printed circuit board Effective date of registration: 20220815 Granted publication date: 20120606 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd. Registration number: Y2022980012596 |
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