CN101357768B - Method for preparing waterglass by waste circuit board - Google Patents
Method for preparing waterglass by waste circuit board Download PDFInfo
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- CN101357768B CN101357768B CN2008103044839A CN200810304483A CN101357768B CN 101357768 B CN101357768 B CN 101357768B CN 2008103044839 A CN2008103044839 A CN 2008103044839A CN 200810304483 A CN200810304483 A CN 200810304483A CN 101357768 B CN101357768 B CN 101357768B
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- circuit board
- parts
- printed circuit
- waterglass
- waste printed
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention relates to a preparation method of water glass, in particular to a method for preparing water glass by using waste breadboards. The preparation method with low energy consumption and simple operation specifically comprises: a. 2 parts of non-metal material powder and 1.4-2 parts of alkali in the waste breadboards react with 76-86 parts of water to obtain suspension solution; wherein, the alkali is sodium hydroxide or potassium hydroxide; b. the suspension solution prepared by step a is put into an autoclave; water vapor is aerated to be heated to 160-175 DEG C; the pressure is controlled between 0.6-0.8MPa; the solution reacts for 8-12h and is cooled to normal temperature; c. after the undissolved substances are filtrated, the reaction solution prepared by step b is concentrated to obtain the water glass. By effectively separating the epoxide resin from the glass fiber in the non-metal material of the waste breadboards and applying the glass fiber to water glass production, the method provides a new solution for the resource reuse of the waste breadboards, reduces the discard volume of solid wastes and achieves the purpose of environment protection.
Description
Technical field
The present invention relates to the preparation method of waterglass, particularly utilize discarded circuit board to prepare the method for waterglass.
Background technology
Along with the fast development of electronics technology, the upgrading of various electronic products is frequent day by day.And all basically electronic products all in various degree contain printed substrate, the printed substrate of eliminating in the electronic product that gets off mainly is made up of electronic component, printed wire base board and the scolder that connects electronic component and printed wire base board.Printed substrate wherein is behind separate electronic components and parts and scolder, remaining printed wire base board is through being crushed to certain particle size, separate metal components such as copper, tin, lead by methods such as wet concentration, selection by winnowing, nonmetal compositions such as remaining at last epoxy/resin and glass fibre.
Current, processing to the nonmetal composition of wiring board mainly is by burning and landfill, the burning meeting pollutes environment on the one hand, glass fibre belongs to danger wastes on the other hand, the curable epoxide thing can not pass through natural degradation, simple landfill will cause huge hidden danger to environment, but waste a large amount of renewable resources materials simultaneously.
Though the epoxy/resin in the wiring board nonmetallic materials and a large amount of short glass fiber have higher recycle value, also do not occur recovery method easy and simple to handle, that energy consumption is low at present.
Summary of the invention
Technical problem to be solved by this invention provides a kind of method of utilizing nonmetallic materials in the waste printed circuit board to prepare waterglass, and this method energy consumption is low, and good operational environment has solved the environment and the renewable resources difficult problem of the solid refuse of this danger of glass fibre.
The nonmetallic materials main component is glass fibre and Phenolic Resin with Epoxy Resin solidfied material in the waste printed circuit board, and the concrete preparation method of waterglass is as follows:
2 parts in nonmetallic materials powder, 1.4～2 parts in alkali and 76～86 parts of reactions of water obtain aaerosol solution in a, the waste printed circuit board; Described alkali is NaOH or potassium hydroxide;
The aaerosol solution that b, step a make is put into the compressive reaction still, water flowing Steam Heating to 160～175 ℃, and pressure is controlled at 0.6～0.8MPa, is cooled to normal temperature behind reaction 8～12h;
After the reacting liquid filtering that c, step b make falls insoluble matter, concentrate and promptly get waterglass.
Wherein, the nonmetallic materials powder is to be obtained by preliminary treatment by waste printed circuit board in the waste printed circuit board, and concrete grammar is: waste printed circuit board fragmentation, washing, precipitation are separated metal with nonmetallic materials; Nonmetallic materials were crushed to 200 mesh sieves, and washed, remove by filter residual metal by 5%～10% dilute sulfuric acid, and 55 ℃～70 ℃ dry backs of handling are standby.Nonmetallic materials powder size after handling by this method is thin, and containing metal impurity not, makes the subsequent step reaction effect good, the product purity height that makes.
Further, 2 parts in nonmetallic materials powder, 1.5～1.9 parts in alkali and 82～84 parts of prepared in reaction waterglass of water in the step a waste printed circuit board.
The described compressive reaction still of step b has agitator, and reaction solution is mixed.
The modulus of water glass that the employing said method makes can satisfy the demands the product modulus by adjusting raw material proportioning and reaction time between 1.45～2.55.
The reacted insoluble matter of step c is by interpolation material dry, that can be used for preparing epoxy resin after pulverizing.
The inventive method is effectively separated epoxy resin and glass fibre in the waste printed circuit board nonmetallic materials; glass fibre is used to prepare waterglass; for the renewable resources of waste printed circuit board provides new solution route, reduce the amount of abandoning of solid waste, reach the purpose of protection environment.
The specific embodiment
The invention will be further elaborated below in conjunction with embodiment.Embodiment only is used to illustrate the present invention, rather than limits the present invention by any way.
The preparation of embodiment 1 waterglass
Waste printed circuit board fragmentation, washing, precipitation are separated metal with nonmetallic materials; Nonmetallic materials were crushed to 200 mesh sieves, and by dilute sulfuric acid washing, filtration, 55 ℃～70 ℃ dryings of 5%～10% that the nonmetallic materials powder-processed is standby.
In the compressive reaction still, 3.6g NaOH and 200ml water are mixed, add the nonmetallic materials powder 4.8g after the above-mentioned processing, water flowing Steam Heating to 165 ℃, pressure is controlled at 0.6MPa, is cooled to room temperature behind the reaction 9h.Reacting liquid filtering falls insoluble matter, and glass fibre and curable epoxide thing are separated fully, and the liquid concentration after the filtration promptly obtains transparent liquid waterglass.
The preparation of embodiment 2 waterglass
Waste printed circuit board fragmentation, washing, precipitation are separated metal with nonmetallic materials; Nonmetallic materials were crushed to 200 mesh sieves, and by dilute sulfuric acid washing, filtration, 55 ℃～70 ℃ dryings of 5%～10% that the nonmetallic materials powder-processed is standby.
In the compressive reaction still, 4.5g NaOH and 200ml water are mixed, add the nonmetallic materials powder 4.8g after the above-mentioned processing, water flowing Steam Heating to 170 ℃, pressure is controlled at 0.8MPa, is cooled to room temperature behind the reaction 12h.Reacting liquid filtering falls insoluble matter, and glass fibre and curable epoxide thing are separated fully, and the liquid concentration after filtering at last promptly obtains transparent liquid waterglass.
Embodiment 3 waterglass modulus test
Waterglass the modulus method of testing be: carry out twice acid base titration in a sample, the stereometer of the hydrochloric acid standard solution that is consumed according to twice titration in front and back is calculated the modulus K of waterglass, promptly
In the formula, M is a hydrochloric acid standard solution concentration, V
1For consuming for the first time the volume of hydrochloric acid standard solution, V
2For consuming for the second time the volume of hydrochloric acid standard solution.
The modulus of water glass test result of embodiment 1,2 sees Table 1:
Table 1
| V 1 | V 2 | Modulus | Mean value | |
| Embodiment 1 | 5.5 2.6 2.2 | 17.1 9.1 7.7 | 1.510 1.696 1.696 | 1.634 |
| Embodiment 2 | 2.4 3.0 2.3 | 12.5 15.25 12.0 | 2.524 2.460 2.529 | 2.504 |
The inventive method as shown in table 1 can make the waterglass product modulus that makes between 1.45～2.55 by adjusting raw material proportioning and reaction time, can be widely used in fields such as adhesive, cleaning agent, concrete accelerator, refractory material and foundry industry raw material.
Claims (3)
1. utilize waste printed circuit board to prepare the method for waterglass, it is characterized in that: comprise the following steps:
2 parts in nonmetallic materials powder, 1.4～2 parts in alkali and 76～86 parts of reactions of water obtain aaerosol solution in a, the waste printed circuit board; Described alkali is NaOH or potassium hydroxide;
The aaerosol solution that b, step a make is put into the compressive reaction still, water flowing Steam Heating to 160～175 ℃, and pressure is controlled at 0.6～0.8MPa, is cooled to normal temperature behind reaction 8～12h;
After the reacting liquid filtering that c, step b make falls insoluble matter, concentrate and promptly get waterglass.
2. the method for utilizing waste printed circuit board to prepare waterglass according to claim 1 is characterized in that: 2 parts in nonmetallic materials powder, 1.5～1.9 parts in alkali and 82～84 parts of prepared in reaction waterglass of water in the step a waste printed circuit board.
3. the method for utilizing waste printed circuit board to prepare waterglass according to claim 1, it is characterized in that: the nonmetallic materials powder was crushed to 200 mesh sieves for the waste printed circuit board nonmetallic materials in the step a waste printed circuit board, and made after handling by dilute sulfuric acid washing, filtration, 55 ℃～70 ℃ dryings of 5%～10%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103044839A CN101357768B (en) | 2008-09-12 | 2008-09-12 | Method for preparing waterglass by waste circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103044839A CN101357768B (en) | 2008-09-12 | 2008-09-12 | Method for preparing waterglass by waste circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101357768A CN101357768A (en) | 2009-02-04 |
| CN101357768B true CN101357768B (en) | 2010-11-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008103044839A Active CN101357768B (en) | 2008-09-12 | 2008-09-12 | Method for preparing waterglass by waste circuit board |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107879347B (en) * | 2017-09-20 | 2020-11-06 | 中山大学 | Method for preparing silica gel by using non-metal separators in waste circuit boards |
| CN109553800A (en) * | 2018-12-07 | 2019-04-02 | 上海第二工业大学 | A kind of method of glass fibre and epoxy resin separation in useless circuit board non-metal powder |
| KR102374781B1 (en) * | 2019-12-23 | 2022-03-15 | 한국세라믹기술원 | Water glass and fabricating method thereof, and accelerators for shotcrete comprising the same |
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- 2008-09-12 CN CN2008103044839A patent/CN101357768B/en active Active
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