CN101339579A - Aluminum plate fin type radiator vacuum brazing furnace temperature field equilibrium method - Google Patents
Aluminum plate fin type radiator vacuum brazing furnace temperature field equilibrium method Download PDFInfo
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- CN101339579A CN101339579A CNA2008100688660A CN200810068866A CN101339579A CN 101339579 A CN101339579 A CN 101339579A CN A2008100688660 A CNA2008100688660 A CN A2008100688660A CN 200810068866 A CN200810068866 A CN 200810068866A CN 101339579 A CN101339579 A CN 101339579A
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Abstract
The invention discloses a temperature equalization method for the temperature field of an aluminum plate-fin typed radiator vacuum brazing furnace, which belongs to a temperature equalization method for the temperature field of a vacuum brazing furnace and aims at providing a method for guaranteeing a more uniform product temperature at varied positions in the vacuum furnace. The invention has specific methods that: 1) a furnace body mathematical model is established; 2) a product mathematical model is established according to a heat conduction formula; 3) a simulation heating curve is set and a simulation temperature field is established on a computer according to an actual art heating curve and a thermal radiation formula; 4) the simulation heating curve is modified according to the actual temperature; 5) the putting position of the product mathematical model in the furnace body mathematical model is adjusted according to the distribution of the high temperature and low temperature areas of simulation temperature fields; 6) the putting of the products in actual production is guided according to rules for putting products and the correctness of the simulation heating curve is validated according to the actual temperature. The temperature equalization method provided by the invention can effectively improve the uniform temperature of products in the vacuum furnace, thus being an ideal method for improving the vacuum brazing quality of the aluminum plate-fin typed radiator.
Description
Technical field:
The present invention relates to the temperature equalizing method in a kind of vacuum drying oven temperature field, relate in particular to the temperature equalizing method of a kind of vacuum brazing furnace temperature field.
Background technology:
At present, when adopting vacuum drying oven that product (aluminum plate fin type radiator) is carried out soldering, the putting position of product in vacuum drying oven almost do not require.Because the temperature fluctuation of zones of different is bigger in the vacuum drying oven, there is the alternation procedure of high and low warm area, this just causes the product temperature of diverse location widely different; So when being in the product of high-temperature region burn-off phenomenon is arranged, and there is lack of penetration phenomenon in the product that is in low-temperature space, has to a certain degree reduced the soldering qualification rate of product, therefore is badly in need of a kind ofly can improving the inhomogeneity method of product temperature in the vacuum drying oven.
Summary of the invention:
At the above-mentioned defective that exists in the prior art, the present invention aims to provide the temperature equalizing method of a kind of aluminum plate fin type radiator vacuum brazing furnace degree field, this method can be passed through the brazing process of computer simulation technique analog equipment in vacuum brazing furnace, distribution situation according to temperature field in the vacuum drying oven is rationally put product, guarantees that the product temperature of diverse location is tending towards uniform purpose in the vacuum drying oven thereby reach.
To achieve these goals, the present invention is by the following technical solutions:
1) vacuum brazing furnace is surveyed and drawn and utilize software set up by computer simulation, inside is provided with the body of heater realistic model of simulation heating band;
2) product is surveyed and drawn the back by following heat conduction formula
Carry out equivalent process, utilize the product model of software foundation by computer simulation; In the formula,
Q---heat transfer capacity,
K---heat-conduction coefficient,
A---heat transfer area,
Wherein, product is respectively along the heat-conduction coefficient of height, length and thickness direction in a structural cycle:
k
High=(h
1+ h
2+ 2t
3) ÷ (h
1÷ k
Cold limit+ h
2÷ k
Hot limit+ 2t
3÷ k
Aluminium)
k
Long=(2t
3+ 0.5t
2) * k
Aluminium÷ (h
1+ h
2+ 2t
3)
k
Thick=(2t
3+ 0.5t
1) * k
Aluminium÷ (h
1+ h
2+ 2t
3)
Above-mentioned various in,
k
Cold limit---the pyroconductivity of the cold limit fin of product, k
Cold limit=k
Aluminium* t
1÷ b
1,
k
Aluminium---the pyroconductivity of aluminium,
t
1---the cold limit fin thickness of product,
b
1---the spacing between the cold limit fin of product,
h
1---the cold limit fin height of product,
k
Hot limit---the pyroconductivity of the hot limit fin of product, k
Hot limit=k
Aluminium* t
2÷ b
2,
t
2---the hot limit fin thickness of product,
b
2---the spacing between the hot limit fin of product,
h
2---the hot limit fin height of product;
3) according to the technology heating temperature curve of reality, according to heat radiation equation q=ε δ A
1Φ
12(Γ
1 4-Γ
2 4) the simulation heating temperature curve of described simulation heating band is set on computers, obtain the analog temperature field in the described body of heater realistic model; In the formula,
Q---the thermal efficiency,
The radiance of ε---actual object,
δ---Si Difen-Boltzmann constant,
A
1---the area of radiating surface I,
Φ
12---by the shape coefficient of radiating surface I to radiating surface II,
Γ
1---the absolute temperature of radiating surface I,
Γ
2---the absolute temperature of radiating surface II;
4) in described analog temperature field by computer simulation, extract that thermopair compares in the actual temperature of correspondence position collection in the analog temperature of a certain position on the described product model and the practical vacuum soldering oven, and the described simulation heating temperature curve of simulation heating band revised, coincide until analog temperature and described actual temperature;
5) the analog temperature distribution situation in the analysis mode temperature field, distribution situation according to high-temperature area in the analog temperature field and low-temperature region is adjusted the putting position of product model in the body of heater realistic model, until temperature province in the solder fusing, the temperature of institute analog temperature field reaches unanimity, and obtains the product placement standard; In the temperature province of solder fusing, the maximum temperature difference of analog temperature field is controlled in 5 ℃;
6) according to described product placement standard with product placement in the vacuum brazing furnace of reality, in position thermopair is set respectively corresponding to described high-temperature area and low-temperature region, the actual temperature that a certain moment thermopair is collected on product compares: if maximum temperature difference≤5 of actual temperature ℃, then described product placement standard is effective; Otherwise, if above steps then need be repeated, in the actual temperature that each thermopair fed back all drops on the temperature province of solder fusing in maximum temperature difference＞5 of actual temperature ℃.
Compared with the prior art, the present invention is owing to adopted technique scheme, therefore can utilize ANSYS software that the process of vacuum brazing is simulated, analyzed, be combined in and insert the data that thermopair collects on the product repeatedly, can determine high-temperature area and the low temperature low area in the vacuum drying oven and provide each regional physical coordinates; Thereby finally can carry out rational allocation, make that the uniform temperature of product obtains very big improvement in the vacuum drying oven, improve brazing quality thereupon the product size that is in the different temperatures zone, spacing etc.
Description of drawings:
Fig. 1 is the structural representation of aluminum plate fin type radiator;
Fig. 2 is the body of heater realistic model structural representation by computer simulation.
Among the figure: hot limit fin 1 dividing plate 2 cold limit fins 3 body of heater models 4 anchor clamps 5 product models 6 simulation heating bands 7
Embodiment:
The invention will be further described below in conjunction with accompanying drawing and specific embodiment, and concrete grammar is as follows:
1) vacuum brazing furnace is surveyed and drawn, and utilize ANSYS software set up by computer simulation, inside is provided with the body of heater realistic model of simulation heating band; As shown in Figure 2: this body of heater realistic model by body of heater model 4, be arranged on the polylith simulation heating band 7 in this body of heater model and many product models 6 that are placed in the body of heater model 4 by anchor clamps 5 constitute, simulation heating band 7 carries out heat transferred by thermal-radiating mode and product model 6;
2) product is surveyed and drawn the back by following heat conduction formula
Carry out equivalent process, utilize the product model of ANSYS software foundation by computer simulation; In the formula,
Q---heat transfer capacity,
K---heat-conduction coefficient,
A---heat transfer area,
---along the rate of temperature change of x direction;
Wherein, product is respectively along the heat-conduction coefficient of height, length and thickness direction in a structural cycle:
k
High=(h
1+ h
2+ 2t
3) ÷ (h
1÷ k
Cold limit+ h
2÷ k
Hot limit+ 2t
3÷ k
Aluminium)
k
Long=(2t
3+ 0.5t
2) * k
Aluminium÷ (h
1+ h
2+ 2t
3)
k
Thick=(2t
3+ 0.5t
1) * k
Aluminium÷ (h
1+ h
2+ 2t
3)
Above-mentioned various in,
k
Cold limit---the pyroconductivity of the cold limit fin of product, k
Cold limit=k
Aluminium* t
1÷ b
1,
k
Aluminium---the pyroconductivity of aluminium,
t
1---the cold limit fin thickness of product,
b
1---the spacing between the cold limit fin of product,
h
1---the cold limit fin height of product,
k
Hot limit---the pyroconductivity of the hot limit fin of product, k
Hot limit=k
Aluminium* t
2÷ b
2,
t
2---the hot limit fin thickness of product,
b
2---the spacing between the hot limit fin of product,
h
2---the hot limit fin height of product;
3) according to the technology heating temperature curve of reality, and by certain correction, on computers the simulation heating band application is added temperature loading with time correlation, this simulation heating band can be followed heat radiation equation q=ε δ A
1Φ
12(Γ
1 4-Γ
2 4) to product model transmission heat its temperature is raise by thermal-radiating mode over time gradually, thereby obtain the analog temperature field in the body of heater realistic model; In the formula,
Q---the thermal efficiency,
The radiance of ε---actual object (or being called blackness), its span is 0～1,
δ---Si Difen-Boltzmann constant,
A
1---the area of radiating surface I,
Φ
12---by the shape coefficient of radiating surface I to radiating surface II,
Γ
1---the absolute temperature of radiating surface I,
Γ
2---the absolute temperature of radiating surface II;
4) product model that in analog temperature field, is provided with by computer simulation, extract that thermopair compares in the actual temperature of correspondence position collection in the analog temperature of a certain position on this product model and the practical vacuum soldering oven, and the described simulation heating temperature curve of simulation heating band revised, coincide until analog temperature and described actual temperature;
5) the analog temperature distribution situation in the analysis mode temperature field, distribution situation according to high-temperature area in the analog temperature field and low-temperature region is adjusted the putting position (transposing of product size, spacing, angle, product space etc.) of product model in the body of heater realistic model, temperature province until the solder fusing, the temperature of analog temperature field reaches unanimity, and obtains the product placement standard; In the temperature province of solder fusing, the maximum temperature difference of analog temperature field is controlled in 5 ℃;
6) according to described product placement standard with product placement in the vacuum brazing furnace of reality, in position thermopair is set respectively corresponding to described high-temperature area and low-temperature region, the actual temperature that a certain moment thermopair is collected on product compares, verifies: if actual temperature maximum temperature difference≤5 ℃, then described product placement standard is effective; Otherwise, if above steps then need be repeated in actual temperature maximum temperature difference＞5 ℃, in the actual temperature that each thermopair fed back all drops on the temperature province of solder fusing.
As shown in Figure 1: the structure of the product in the foregoing description (aluminum plate fin type radiator) is folded by some hot limits fin 1 and some cold limits fin 3 alternate codes and is fixedly formed, and is separated by dividing plate 2 between each hot limit fin 1 and each the cold limit fin 3.Because the structure more complicated of product, its structure is hot limit fin, cold limit fin, hot limit fin ... the periodic variation, therefore set up with the identical product mathematical model of actual product very difficultly, will simplify processing to it by the mode of Equivalent Calculation.
Claims (1)
1. the temperature equalizing method of an aluminum plate fin type radiator vacuum brazing furnace degree field is characterized in that concrete grammar is as follows:
1) vacuum brazing furnace is surveyed and drawn and utilize software set up by computer simulation, inside is provided with the body of heater realistic model of simulation heating band;
2) product is surveyed and drawn the back by following heat conduction formula
Carry out equivalent process, utilize the product model of software foundation by computer simulation; In the formula,
Q---heat transfer capacity,
K---heat-conduction coefficient,
A---heat transfer area,
Wherein, product is respectively along the heat-conduction coefficient of height, length and thickness direction in a structural cycle:
k
High=(h
1+ h
2+ 2t
3) ÷ (h
1÷ k
Cold limit+ h
2÷ k
Hot limit+ 2t
3÷ k
Aluminium)
k
Long=(2t
3+ 0.5t
2) * k
Aluminium÷ (h
1+ h
2+ 2t
3)
k
Thick=(2t
3+ 0.5t
1) * k
Aluminium÷ (h
1+ h
2+ 2t
3)
Above-mentioned various in,
k
Cold limit---the pyroconductivity of the cold limit fin of product, k
Cold limit=k
Aluminium* t
1÷ b
1,
k
Aluminium---the pyroconductivity of aluminium,
t
1---the cold limit fin thickness of product,
b
1---the spacing between the cold limit fin of product,
h
1---the cold limit fin height of product,
k
Hot limit---the pyroconductivity of the hot limit fin of product, k
Hot limit=k
Aluminium* t
2÷ b
2,
t
2---the hot limit fin thickness of product,
b
2---the spacing between the hot limit fin of product,
h
2---the hot limit fin height of product;
3) according to the technology heating temperature curve of reality, according to heat radiation equation q=ε δ A
1Φ
12(Г
1 4-Г
2 4) the simulation heating temperature curve of described simulation heating band is set on computers, obtain the analog temperature field in the described body of heater realistic model; In the formula,
Q---the thermal efficiency,
The radiance of ε---actual object,
δ---Si Difen-Boltzmann constant,
A
1---the area of radiating surface I,
Φ
12---by the shape coefficient of radiating surface I to radiating surface II,
Г
1---the absolute temperature of radiating surface I,
Г
2---the absolute temperature of radiating surface II;
4) in described analog temperature field by computer simulation, extract that thermopair compares in the actual temperature of correspondence position collection in the analog temperature of a certain position on the described product model and the practical vacuum soldering oven, and the described simulation heating temperature curve of simulation heating band revised, coincide until analog temperature and described actual temperature;
5) the analog temperature distribution situation in the analysis mode temperature field, distribution situation according to high-temperature area in the analog temperature field and low-temperature region is adjusted the putting position of product model in the body of heater realistic model, temperature province until the solder fusing, the temperature of analog temperature field reaches unanimity, and obtains the product placement standard; In the temperature province of solder fusing, the maximum temperature difference of analog temperature field is controlled in 5 ℃;
6) according to described product placement standard with product placement in the vacuum brazing furnace of reality, in position thermopair is set respectively corresponding to described high-temperature area and low-temperature region, the actual temperature that a certain moment thermopair is collected on product compares: if maximum temperature difference≤5 of actual temperature ℃, then described product placement standard is effective; Otherwise, if above steps then need be repeated, in the actual temperature that each thermopair fed back all drops on the temperature province of solder fusing in maximum temperature difference＞5 of actual temperature temperature ℃.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100688660A CN101339579B (en) | 2008-08-15 | 2008-08-15 | Aluminum plate fin type radiator vacuum brazing furnace temperature field equilibrium method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100688660A CN101339579B (en) | 2008-08-15 | 2008-08-15 | Aluminum plate fin type radiator vacuum brazing furnace temperature field equilibrium method |
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| Publication Number | Publication Date |
|---|---|
| CN101339579A true CN101339579A (en) | 2009-01-07 |
| CN101339579B CN101339579B (en) | 2011-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100688660A Active CN101339579B (en) | 2008-08-15 | 2008-08-15 | Aluminum plate fin type radiator vacuum brazing furnace temperature field equilibrium method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104148912A (en) * | 2014-06-30 | 2014-11-19 | 美的集团武汉制冷设备有限公司 | Parallel flow heat exchanger and method for controlling distance between fins of parallel flow heat exchanger |
| CN108170897A (en) * | 2017-12-05 | 2018-06-15 | 沈阳东博热工科技有限公司 | A kind of structural optimization method of vacuum heat treatment furnace heater |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100385601C (en) * | 2004-01-14 | 2008-04-30 | 电子科技大学 | Forced-convection asymmetrical radiator |
-
2008
- 2008-08-15 CN CN2008100688660A patent/CN101339579B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104148912A (en) * | 2014-06-30 | 2014-11-19 | 美的集团武汉制冷设备有限公司 | Parallel flow heat exchanger and method for controlling distance between fins of parallel flow heat exchanger |
| CN104148912B (en) * | 2014-06-30 | 2016-06-22 | 美的集团武汉制冷设备有限公司 | The control method of parallel-flow heat exchanger and a fin pitch of fins thereof |
| CN108170897A (en) * | 2017-12-05 | 2018-06-15 | 沈阳东博热工科技有限公司 | A kind of structural optimization method of vacuum heat treatment furnace heater |
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| Publication number | Publication date |
|---|---|
| CN101339579B (en) | 2011-07-27 |
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