CN101334265A - Device for detecting probe position of probe card - Google Patents
Device for detecting probe position of probe card Download PDFInfo
- Publication number
- CN101334265A CN101334265A CNA2008100926796A CN200810092679A CN101334265A CN 101334265 A CN101334265 A CN 101334265A CN A2008100926796 A CNA2008100926796 A CN A2008100926796A CN 200810092679 A CN200810092679 A CN 200810092679A CN 101334265 A CN101334265 A CN 101334265A
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- Prior art keywords
- probe
- camera
- spacing
- object element
- wafer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Abstract
Disclosed is a device for detecting a probe position in a probe card and measuring the distance between the probe and an object. The device is provided with an object unit and a camera unit. The object unit is arranged under a probe card stand with a probe card, the camera unit is used for detecting the accessorial position of the object unit and accessorial distance between the object unit and the object. The distance of the probe and the object is detected according to the accessorial distance. Firstly, the camera detects the position and the accessorial distance of the object unit, and then detects the position and the distance of the probe, thereby preventing the detection error of the probe and measuring accurately the distance of the probe and wafer.
Description
Technical field
The present invention relates to the device of a kind of detector probe card middle probe position, relate in particular to the probe in a kind of this probe of accurate measurement and comprise spacing between the wafer of chip, and this probe orientated as make the stable mutually device that contacts of itself and this wafer.
Background technology
General, the polylith chip is arranged on the semiconductor wafer regularly.Before these chips being separated from this wafer through encapsulation process, on this wafer, detect the electrical characteristics of these chips, and detect the electric defective of these chips, improve the job stability of monolithic chip by this.
The inspection of this chip is carried out by the probe tester that comprises probe usually, has many probes to contact with the conductive welding disk of this chip in this probe.This is used for that the probe tester of chip generally includes probe on the testing wafer, is used to keep the probe frame and the slide holder of this probe, and this slide holder comprises the wafer that this contacts with the probe of probe.
Existing probe tester usually probe with detect the contact position that probe and chip contact with each other on this wafer before chip contacts, guarantee reliability and the accuracy that probe contacts with chip chamber with this.Therefore, probe tester is the position of the probe of detector probe card accurately, and this probe is alignd with predeterminated position.
Fig. 1 is the front elevation of existing apparatus of the probe location of detector probe card.
As shown in Figure 1, camera C is positioned at the below of probe PC, and camera C detects the probe area around the probe N of this probe like this, and measuring probe N and comprise spacing between the wafer of a plurality of chips.
Camera C focuses on this probe area scanning area on every side according to the reference spacing between the chip on probe N and this wafer.This sets in advance in this probe tester with reference to spacing.
When this probe PC replaces with other probe of different size, the position change of probe frame PH, thus the spacing of this probe and chip chamber changes with the kind of probe PC and by the change that cause the contact.
Therefore, when by the caused site error in contact of the position of this probe frame PH and probe N because of this probe replacement adds up repeatedly the time, the actual pitch of this probe greatly departs from this with reference to spacing.Like this, just exist camera C can't detect this problem of probe of this probe, promptly known distance measurement error.
Therefore, when camera C can't detect this probe, the operator manually handled camera C with the probe area of scan-probe N practically.
In addition, use micro-camera as camera C usually.This micro-camera can accurately be measured the spacing between the chip of this probe in the little scanning area and this wafer.Yet when this site error is added up, also outside the reference position, thus, just there is the accurately position of detector probe N of camera C in the position of this probe, promptly known position detection error.
Accurately measure spacing and accurately the position of detector probe N need be used to scan expose thoroughly the zone improved camera.Yet this improved camera is very expensive, has increased the manufacturing cost of semiconductor devices thus.
Therefore, when camera C is set to big zone in this probe of estimated cost interscan, be difficult to accurately to measure the spacing between the chip of this probe and this wafer, probe N can't fully contact mutually with this wafer thus.
In contrast, when camera C be set to this probe of estimated cost interscan than the zonule time, because of the less scan area of camera C, the more frequent manual control of the need of work of this probe tester thus can frequent take place in position detection error.
Summary of the invention
Therefore, embodiments of the invention provide the spacing between probe and the wafer that comprises chip in the accurate measuring probe card and this probe have been placed as and made the stable mutually device that contacts of this probe and this wafer.
Embodiments of the invention also provide and make the distance measurement error be generated as minimum device, and it is reached by the error that records in that caused by the probe frame when the probe in the camera detector probe card and first measurement in relevant this probe is compensated.
Embodiments of the invention also provide and make that position detection error is generated as minimum device in second camera, and it is reached by being sent to second camera by the probe location data that first camera records.
According to an aspect of the present invention, the device that the probe location in a kind of detector probe card is provided and has measured spacing between this probe and the object.This device comprises object element and camera unit.This order unit is arranged under the probe frame that this probe is installed, and this camera unit detects the position of this auxiliary object element and measures this auxiliary object element and the spacing between this object.Spacing between this probe and the object records according to this auxiliary compartment distance.
Among one embodiment, this camera unit comprises first camera that is used to detect this aided location, measures this auxiliary compartment distance and measure this probe location, and second camera that is used to measure the spacing between this auxiliary compartment distance and this probe and the object.
Among one embodiment, this second camera utilization detects this auxiliary compartment distance by the position probing of this auxiliary object element of this first phase machine testing, and utilizes this this probe location by the first phase machine testing to measure spacing between this probe and the object.
Among one embodiment, the position of this object element that this second phase machine testing is auxiliary, and, revise the relative position of this second camera for this first camera by measuring at this second camera before the spacing between this probe and the object by this first and second difference between position data of this auxiliary object element of machine testing mutually.
Among one embodiment, this object element is in the position of the probe of close this probe under this probe frame.
Among one embodiment, this object element comprises the target box, and it is positioned under this probe frame and in its bottom and has perforation, and comprises object block, it is arranged in this target box and exposes to the open air via this perforation, so that this first and second camera detects this object block via this through hole.
According to embodiments of the invention, first and second camera at first detects first spacing of the position and the measurement target unit of object element, secondly position of detector probe and second spacing of measuring probe are with the detection error that prevents this probe by this and accurately measure this second spacing between this probe and the wafer.Therefore, by this device, the probe of this probe can contact with this wafer is stable.
Description of drawings
In conjunction with the accompanying drawings and referring to detailed description of the present invention, can know above-mentioned and other characteristics of the present invention and advantage, wherein:
Fig. 1 is the front elevation of existing apparatus of the probe location of detector probe card;
Fig. 2 is the front elevation according to the device of the detector probe card middle probe position of the embodiment of the invention;
Fig. 3 is the partial enlarged drawing of the part A among Fig. 2; And
Fig. 4 is the diagram of the process of use device detector probe card middle probe shown in Figure 2 position.
Embodiment
Referring to the accompanying drawing that the embodiment of the invention is shown, hereinafter the present invention will be described in more detail.Yet the present invention can realize with many different forms, and should not be construed as the restriction of the embodiment that is subjected in this proposition.More properly, it is abundant and complete open in order to reach proposing these embodiment, and makes those skilled in the art understand scope of the present invention fully.In these accompanying drawings, for clarity sake, may amplify the size and the relative size in layer and zone.
Should understand, when element or layer are called another element or layer " on ", in another element or layer " connection " or " lotus root is closed ", its can for directly another element or the layer on, with other element or the layer directly be connected, perhaps the existence occupy therebetween element or layer.In contrast, when element is called " directly on another element or layer ", with another element or layer " directly being connected " or " direct lotus root close ", do not exist the element that occupy therebetween or layer.Same numeral is meant components identical in the whole part of instructions.As used herein, term " and/or " comprise any or all combination of the Listed Items that one or more is relevant.
Although should be understood that and use first, second, third, etc. to describe a plurality of elements, assembly, zone, layer and/or part herein, these elements, assembly, zone, layer and/or part are not limited to these terms.These terms only are used to make an element, assembly, zone, layer or part and another zone, layer or part difference to come.Thus, hereinafter be referred to as first element, assembly, zone, layer or part and can be described as second element, assembly, zone, layer and/or part, and do not break away from instruction of the present invention.
Statement with space correlation, as " ... under (beneath) ", " ... below (below) ", " down (lower) ", " ... top (above) ", " going up (upper) " etc., use in this article is for the element as shown in the figure of statement easily or the relation of parts and another element or parts.The statement that should be understood that these and space correlation except that orientation shown in the figure, also be intended to contain this equipment use or work in different azimuth.For example, if this equipment upset among the figure, the element that is described as " under other element or parts ", " below other element or parts " then can be defined as " above other element or parts ".This exemplary statement thus, " ... the below " can contain simultaneously " ... the top " with " ... the below " both.This equipment can be other towards (revolve turn 90 degrees or other towards), and corresponding explanation is also done in the statement of these and space correlation used herein.
Statement used herein only is used to describe certain embodiments, and and is not intended to limit the present invention.As described herein, the article of singulative is intended to comprise plural form, unless its context is expressed.Will also be understood that, in this instructions, use in the statement " comprising ", offered some clarification on and had described parts, integral body, step, operation, element and/or assembly, but do not got rid of the existence or the interpolation of one or more other parts, integral body, step, operation, element, assembly and/or their combination.
Unless describe in detail separately, the meaning of employed all terms of this paper (comprising scientific and technical terminology) is consistent with those skilled in the art institute common sense.Should also be understood that such as defined term in the general dictionary should be interpreted as with correlative technology field in aggregatio mentium, and should not be construed as Utopian or excessive mechanical implication, unless clearly definition is arranged in the text in addition.
Fig. 2 is that Fig. 3 is the partial enlarged drawing of the part A among Fig. 2 according to the front elevation of the device of the detector probe card middle probe position of the embodiment of the invention.Fig. 4 is the diagram of the process of the device detector probe card middle probe position of use Fig. 2.
Referring to Fig. 2,3 and 4, the device 900 (location means hereinafter referred to as) of detector probe card middle probe position comprises object element 100 and camera unit 200.
Particularly, object block 120 is orientated a kind of like this form as, and promptly first gap between object block 120 and wafer is greater than the tip of probe N and second gap between the wafer.When this first gap less than this second gap and object block 120 during than more close this wafer of the tip of probe N, object block 120 may disturb probe N to contact with the physics of this wafer.For this reason, in device 900, this first gap needs greater than this second gap.
Among one embodiment, camera unit 200 comprises, has first camera 210 of large-scale camera at big optics angle and second camera 220 with the micro-camera at little optics angle.
The big zone under first camera, the 210 scanning object elements 100 and the position (the primary importance data of object element 100 hereinafter referred to as) of detection object element 100 are finished first scanning of first camera 210 by this.Then, big zone under first camera, the 210 scan-probe N and the position of detector probe N are finished second scanning of first camera 210 by this.
Among one embodiment, second camera 220 also detects the position (second place data of object element 100 hereinafter referred to as) of object element 100, and this first and second position of object element 100 is compared mutually.Therefore, determine the relative position of second camera 220 according to the position of this object element 100 with respect to first camera 210.In case in said process, determined the relative position with respect to these object element 100 positions of first camera 210 and second camera 220, in device 900, kept identical first camera 210 and the relative position between second camera 220.Therefore, when by camera 200 detector probe N, still the relative position of first camera 210 and second camera 220 is remained on the below of probe PC, improve the accuracy of detection of 200 couples of probe N of camera by this.
When replacing old camera when attending device 900 and with new camera, the relative position of above-mentioned definite old magazine this first and second camera is different with the actual relative position of actual new magazine first and second camera, and when using the probe N of this new magazine second camera detector probe card PC, this new magazine relative position skew can cause detecting error.
Therefore, under the situation of replacing this camera, can accurately measure the relative position of first camera 210 and second camera 220 according to object element 100, and revise the actual relative position of first camera 210 and second camera 220 according to the relative position of this first camera 210 determined and second camera 220.Therefore, can prevent that second camera 220 from missing probe N because of detecting error.
Promptly, when replacing camera 200 at every turn, revise the relative position of first cameras 210 and second camera 220 according to object element 100, and according to the probe location by 210 detections of first camera and the probe N that sends, second camera, 220 accurate measuring probe N are from the spacing of this wafer.
In said apparatus 900, detect the position of this probe middle probe N with following method.
With probe PC pack into probe frame PH and the object element 100 under the camera unit 200 detector probe card frame PH.That is, the big zone under the first camera 210 scanning object elements 100 of camera unit 200 is with the position of detecting object element 100 by this and first spacing between the wafer on object element 100 and this slide holder.
Because the micro-camera that will be used to scan than the zonule is used as second camera 220, this position data of object element 100 need be sent to second camera 220, detect the position of object elements 100 like this by first camera 210.
When detecting this position of object element 100 by first camera 210, this first spacing between second camera, 220 accurate measurement target unit 100 and this wafer.Promptly, under the first camera 210 scanning object elements 100 should big zone and this position of object element 100 is sent to second camera 220, and second camera 220 is according to the accurate measurement target of the position data unit 100 of this object element 100 that is detected by first camera 210 and this first spacing between this wafer.
In addition, second camera 220 also detects the position of object element 100, and it is called as object element 100 second places, and this first and second position data of comparison object unit 100.Determine second camera 220 this relative position according to this position of object element 100 with respect to first camera 210.
Then, camera unit 200 moves to this second place under the probe PC by this driver element, and camera unit 200 is located in the below of the probe N of probe PC like this.Big zone under first camera, the 210 scan-probe N is with the position of detector probe N by this, and second camera 220 is according to this position data of the probe N that is detected by first camera 210 and definite first camera 210 and the relative position of second camera 220, accurately this second spacing between measuring probe N and this wafer.
Among one embodiment, probe frame PH can leave a little distance of probe PC, and the levelness of object element 100 can be different with the levelness of probe N, like this, this first spacing between object element 100 and this wafer can and probe N and this wafer between this second spacing different.
Yet because this site error of probe frame PH is not added to this preset reference spacing of probe N, this first spacing equates substantially with this second spacing.Therefore, second camera 220 is according to this second spacing of coming measuring probe N prior to this first spacing of the object element 100 of this second distance measurement, and second camera 220 is the distance measurement error that causes with the misalignment that prevents by this because of this scanning area and this probe area of this second spacing of measuring probe N fully.
According to embodiments of the invention, first and second camera at first detects first spacing of the position and the measurement target unit of object element, next detects second spacing of this position and measuring probe, with the detection error that prevents this probe by this and accurately measure this second spacing between this probe and the wafer.Therefore, the probe of probe can contact by device and this wafer are stable.
In addition, camera unit comprises first camera and second camera, described first camera is used for the big zone of scanning and detects this probe location and this object element position by this, and described second camera is used to scan accurate respectively this first and second spacing of measuring this object element and this probe of this position data of utilizing this target location and this probe than the zonule by this.Therefore, can be easily by this device and accurately measure and detect the spacing and the position of this object element and this probe respectively.
Moreover the two detects by this first and second camera in the position system of this object element, can accurately measure the relative position of this first and second camera like this according to the position of this object element.Thereby this second camera can utilize by this probe location of this first phase machine testing and the relative position of this first and second camera, accurately measures the position of this probe.
In addition, this camera unit comprises this first camera that is used to scan big zone and is used to scan this second camera than the zonule, and will be sent to this second camera by this object element of this first phase machine testing and the position data of probe, prevent the detection error when this second camera is measured first and second spacing of this object element and probe respectively by this.
Although already embodiments of the invention were made an explanation, should understand the present invention and be not limited to these embodiment, and the technician can modify within by appended claims institute's restricted portion and spirit of the present invention in the art.
Claims (6)
1, the probe location in a kind of detector probe card and measure the device of the spacing between this probe and the object, this device comprises:
Object element, it is arranged under the probe frame that this probe is installed; And
Camera unit is used to detect the position of this auxiliary object element and measures this auxiliary object element and the spacing between this object, and the spacing between this probe and the object records according to this auxiliary compartment distance.
2, device as claimed in claim 1, wherein this camera unit comprises first camera that is used to detect this aided location, measures this auxiliary compartment distance and measure this probe location, and second camera that is used to measure the spacing between this auxiliary compartment distance and this probe and the object.
3, device as claimed in claim 2, wherein this second camera utilization is measured this auxiliary compartment distance by the aided location of this object element of this first phase machine testing, and utilizes this this probe location by the first phase machine testing to measure spacing between this probe and the object.
4, device as claimed in claim 3, the position of auxiliary this object element of this second phase machine testing wherein, and, revise the relative position of this second camera for this first camera by measuring at this second camera before the spacing between this probe and the object by this first camera and second difference between the position data of this auxiliary object element of machine testing mutually.
5, as claim 1,2,3 or 4 described devices, wherein this object element is in the position of the probe of close this probe under this probe frame.
6, device as claimed in claim 5, wherein this object element comprises:
The target box, it is positioned under this probe frame and in its bottom and has through hole; And
Object block, it is arranged in this target box and exposes to the open air via this perforation, so that this first camera and second camera detect this object block via this perforation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070063575A KR100878213B1 (en) | 2007-06-27 | 2007-06-27 | Probe location perception device for probe card |
| KR1020070063575 | 2007-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101334265A true CN101334265A (en) | 2008-12-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100926796A Pending CN101334265A (en) | 2007-06-27 | 2008-04-21 | Device for detecting probe position of probe card |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100878213B1 (en) |
| CN (1) | CN101334265A (en) |
| TW (1) | TWI366673B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102386462B1 (en) | 2020-09-02 | 2022-04-15 | (주)티에스이 | Probe card and apparatus for aligning thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2913609B2 (en) * | 1991-03-08 | 1999-06-28 | 東京エレクトロン株式会社 | Probing apparatus, probing method and probe card |
| JP3156192B2 (en) * | 1994-04-19 | 2001-04-16 | 東京エレクトロン株式会社 | Probe method and apparatus |
| JP2004152916A (en) | 2002-10-29 | 2004-05-27 | Nec Corp | Inspecting device and inspecting method of semiconductor device |
| JP2004265895A (en) * | 2003-01-20 | 2004-09-24 | Tokyo Electron Ltd | Probe device equipped with optical precision distance meters and method of inspecting probe |
-
2007
- 2007-06-27 KR KR1020070063575A patent/KR100878213B1/en active IP Right Grant
-
2008
- 2008-04-15 TW TW097113700A patent/TWI366673B/en active
- 2008-04-21 CN CNA2008100926796A patent/CN101334265A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW200900702A (en) | 2009-01-01 |
| KR20080114224A (en) | 2008-12-31 |
| TWI366673B (en) | 2012-06-21 |
| KR100878213B1 (en) | 2009-01-13 |
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Open date: 20081231 |