CN101329927A - Conducting adhesive tape off film and conducting adhesive tape - Google Patents
Conducting adhesive tape off film and conducting adhesive tape Download PDFInfo
- Publication number
- CN101329927A CN101329927A CNA2008101341296A CN200810134129A CN101329927A CN 101329927 A CN101329927 A CN 101329927A CN A2008101341296 A CNA2008101341296 A CN A2008101341296A CN 200810134129 A CN200810134129 A CN 200810134129A CN 101329927 A CN101329927 A CN 101329927A
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- conductive adhesive
- adhesive layer
- layer
- release film
- release
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Abstract
The invention discloses a conductive tape release film and a conductive tape. The conductive tape release film is combined with one side of a conductive adhesive layer of the conductive tape; the conductive tape release film comprises a buffer layer, a first release layer and a second release layer. The buffer layer has compression allowance at the direction of thickness. The first release layer is arranged at one side of the buffer layer. The second release layer is arranged at the other side of the buffer layer and can be combined with the conductive adhesive layer. The conductive tape disclosed by the invention comprises the conductive adhesive layer and the release film combined with one side of the conductive adhesive layer which is used for being electrically connected with a first circuit component and a second circuit component. When hot lamination is carried out, the compression allowance of the buffer layer on the release film can cause pressure applied by a pressure head to be evenly applied to the conductive adhesive layer.
Description
[technical field]
The present invention relates to a kind of conductive tape release film and conductive tape, particularly about a kind of conductive tape release film and conductive tape with resilient coating.
[background technology]
In the structure of available liquid crystal display, (anisotropic conductive film ACF) carries out hot binding, to form a conductive path that electrically connects to utilize anisotropic conductive between liquid crystal panel and the flexible electric circuit board usually.As shown in Figure 1, existing anisotropic conductive adhesive tape 1 comprises conductive adhesive layer 11 and release film 12.Described conductive adhesive layer 11 contains several conducting particless 111.Described release film 12 comprises substrate layer 120, silicon layer 121 and leaching membrane layer 122.The material of described substrate layer 120 is a paper, and because the very thin thickness of substrate layer 120, therefore described substrate layer 120 does not have shock-absorbing capacity.Described silicon layer 121 is incorporated into a side of described substrate layer 120.Described leaching membrane layer 122 is incorporated into the opposite side of described substrate layer 120, and can remove be incorporated into described conductive adhesive layer 11.
Please refer to Fig. 2.Fig. 2 shows the schematic diagram of the hot pressing processing procedure of existing anisotropic conductive adhesive tape.When need be with the conductive adhesive layer 11 of anisotropic conductive adhesive tape 1 when terminal 21 on being arranged at liquid crystal panel 2 combines, net pressure head 3 carries out the processing procedure of a hot binding.At first, described anisotropic conductive adhesive tape 1 is positioned on the terminal 21 of described liquid crystal panel 2.Then, described pressure head 3 applies a pressure and acts on described release film 12 and the conductive adhesive layer 11, and described like this conductive adhesive layer 11 can be combined on the terminal 21 of described liquid crystal panel 2.At last, remove described release film 12, exposing conductive adhesive layer 11, and in next processing procedure, flexible electric circuit board (illustrating) can be incorporated on the conductive adhesive layer 11.Yet, be incorporated in the processing procedure of terminal 21 of liquid crystal panel 2 at conductive adhesive layer 11, because keeping parallelism just not necessarily between the surface of the surface of described pressure head 3 and described silicon layer 121, therefore under the not good state of the depth of parallelism, described conductive adhesive layer 11 possible discontinuity.Simultaneously, the substrate layer 120 of described release film 12 can't provide any compression nargin again, therefore causes taking place between described conductive adhesive layer 11 and the terminal 21 hot pressing easily and attaches bad problem, and influence the assembling yield of follow-up lcd products.
Please refer to Fig. 3.Fig. 3 shows the schematic diagram of another hot pressing processing procedure of existing anisotropic conductive adhesive tape.In order to improve the problems referred to above, described pressure head 3 can be arranged in pairs or groups and be used fender 4 to carry out the processing procedure of a hot binding, and described fender 4 can provide suitable compression nargin.Like this, described pressure head 3 can apply a pressure and stepless action on described release film 12 and conductive adhesive layer 11 by described fender 4, makes described conductive adhesive layer 11 can be combined in really on the terminal 21 of described liquid crystal panel 2.Yet, use described fender 4 but can produce following problems: (1), because described fender 4 are running stores, so can significantly increase production cost.(2), need shut down operation when changing described fender 4, influence ordinary production and production capacity.(3), board feed mechanism and maintenance that described fender 4 must be installed, the board maintenance cost is higher relatively.Described fender 4 breakages (4), often take place, or described fender 4 is stained with abnormal conditions such as sticking described conductive adhesive layer 11, can produces a large amount of defective productss or cause shutting down.
Therefore, be necessary to provide a kind of new conductive tape release film and conductive tape, to solve the existing in prior technology problem.
[summary of the invention]
A purpose of the present invention provides a kind of conductive tape release film, its release film itself possesses resilient coating, do not need additionally to use fender, can save the time of accent machine and exchange buffering material, the reduction fender uses unusual and causes a large amount of products bad, and then helps simplifying pressure programming, reduction pressing cost, raising pressing yield.
Another object of the present invention provides a kind of conductive tape, include the release film that possesses resilient coating, in the hot pressing processing procedure of this conductive tape, do not need additionally to use fender, can save the time of accent machine and exchange buffering material, the reduction fender uses unusual and causes a large amount of products bad, and then helps simplifying pressure programming, reduction pressing cost, raising pressing yield.
For reaching above-mentioned purpose, the invention provides a kind of conductive tape release film, it is incorporated into a side of conductive adhesive layer, and described release film comprises: resilient coating, first release layer and second release layer.Described resilient coating has the compression nargin of a thickness direction.Described first release layer is arranged at a side of described resilient coating.Described second release layer is arranged at the opposite side of described resilient coating, and can be incorporated into described conductive adhesive layer.When carrying out hot pressing, the compression nargin of described resilient coating can make the applied pressure stepless action of pressure head institute on described conductive adhesive layer.
In a preferred embodiment of the invention, the manufacturing materials of described resilient coating be selected from polytetrafluoroethylene, silica gel, glass fabric, the macromolecule resin any one or multiple compound.The thickness of described resilient coating is between between the 0.05mm to 0.25mm.
In a preferred embodiment of the invention, the surface roughness of described second release layer is higher than the surface roughness of described first release layer.The manufacturing materials of described first release layer is a silicone oil.The manufacturing materials of described second release layer is for drenching film.
In a preferred embodiment of the invention, described conductive adhesive layer is an anisotropic conductive adhesive layer.
For reaching above-mentioned purpose, the present invention also provides a kind of conductive tape, and it comprises conductive adhesive layer and release film, and described conductive adhesive layer can be used for electrically connecting first circuit unit and second circuit assembly, and described release film is incorporated into a side of described conductive adhesive layer.Described release film comprises: resilient coating, first release layer and second release layer, described resilient coating have the compression nargin of a thickness direction; Described first release layer is arranged at a side of described resilient coating; Described second release layer is arranged at the opposite side of described resilient coating, and is incorporated into described conductive adhesive layer.
In a preferred embodiment of the invention, the manufacturing materials of described resilient coating be selected from polytetrafluoroethylene, silica gel, glass fabric, the macromolecule resin any one or multiple compound.The thickness of described resilient coating is between between the 0.05mm to 0.25mm.
In a preferred embodiment of the invention, the surface roughness of described second release layer is higher than the surface roughness of described first release layer.The manufacturing materials of described first release layer is a silicone oil.The manufacturing materials of described second release layer is for drenching film.
In a preferred embodiment of the invention, described first circuit unit is liquid crystal panel or circuit board.Described second circuit assembly comprises chip packing-body or glass top chip packaging body on flexible electric circuit board, the soft board.
In a preferred embodiment of the invention, described conductive adhesive layer is an anisotropic conductive adhesive layer.
Compared to prior art; the release film of conductive tape of the present invention possesses resilient coating; do not need additionally to use fender; so time, the reduction fender that can save accent machine and exchange buffering material use unusual and cause a large amount of products bad; and can avoid taking place pressure head and be stained with the abnormal conditions of gluing conductive adhesive layer; thereby help simplifying pressure programming, reduce the pressing cost, improve the pressing yield, and reduce the shutdown maintenance probability.
[description of drawings]
Fig. 1: the cutaway view of existing anisotropic conductive adhesive tape.
Fig. 2: the schematic diagram of the hot pressing processing procedure of existing anisotropic conductive adhesive tape.
Fig. 3: the schematic diagram of another hot pressing processing procedure of existing anisotropic conductive adhesive tape.
Fig. 4: the cutaway view of the conductive tape of preferred embodiment of the present invention.
Fig. 5: the schematic diagram before the hot pressing processing procedure is carried out in preferred embodiment of the present invention.
Fig. 6: the schematic diagram when the hot pressing processing procedure is carried out in preferred embodiment of the present invention.
Fig. 7: the schematic diagram when preferred embodiment of the present invention removes release film.
Fig. 8: preferred embodiment combined flexible circuit board of the present invention is to the schematic diagram of conductive adhesive layer.
[embodiment]
For allowing above-mentioned purpose of the present invention, feature and advantage become apparent, preferred embodiment of the present invention cited below particularly, and conjunction with figs. are described in detail below:
Please refer to Fig. 4, it shows the conductive tape 5 of preferred embodiment of the present invention, and conductive tape 5 comprises conductive adhesive layer 51 and release film 52.Described conductive adhesive layer 51 is anisotropic conductive adhesive layer preferably, the optional resin material of the base material of described conductive adhesive layer 51 from thermmohardening or thermoplasticity, and described base material contains several conducting particless 511.Described conducting particles 511 is generally conductive metal particles, and its average diameter is about 3 to 5 microns (μ m).Described conductive adhesive layer 51 can pass through described conducting particles 511, to electrically connect first circuit unit and second circuit assembly.In this preferred embodiment, described first circuit unit is liquid crystal panel (LCD panel), and described second circuit assembly is flexible electric circuit board (flexible PCB), yet it is not in order to restriction the present invention.In other embodiments of the invention, described first circuit unit also can be selected from circuit board (rigid PCB), described second circuit assembly also can be selected from chip packing-body on the soft board (chip on film, COF) or the glass top chip packaging body (chip on glass, COG).
As shown in Figure 4, the release film 52 of preferred embodiment of the present invention is a side that is incorporated into described conductive adhesive layer 51 that can remove, and described release film 52 comprises: resilient coating 520, first release layer 521 and second release layer 522.Described resilient coating 520 has the compression nargin of a thickness direction, and its compression factor is difference to some extent according to the difference of manufacturing materials.In the present embodiment, the manufacturing materials of described resilient coating 520 is selected from the material with elastic compression nargin, for example be selected from polytetrafluoroethylene (PTFE, be called Teflon Teflon again), in the silica gel (silicone), glass fabric (glass fabrics), macromolecule resin (macromolecularresin) any one or multiple compound, wherein polytetrafluoroethylene has good thermal endurance, chemical inertness and excellent insulation stability and low frictional properties, especially is fit to as good padded coaming.The compression nargin of the manufacturing materials of described resilient coating 520 is all greater than the compression nargin of the substrate layer (paper) of existing release film.Moreover the thickness of described resilient coating 520 is preferably between between the 0.05mm to 0.25mm.
As shown in Figure 4, first release layer 521 of preferred embodiment of the present invention is arranged at a side of described resilient coating 520; Described second release layer 522 is arranged at the opposite side of described resilient coating 520, and is incorporated into described conductive adhesive layer 51.In one embodiment, the manufacturing materials of described first release layer 521 is preferably silicone oil; The manufacturing materials of described second release layer 522 is preferably the pouring film.Moreover, the surface roughness of described second release layer 522 is higher than the surface roughness of described first release layer 521, and the adhesion that described like this second release layer 522 is incorporated into described conductive adhesive layer 51 can be incorporated into the adhesion of described conductive adhesive layer 51 relatively greater than described first release layer 521.
Please refer to Fig. 5 to Fig. 8.Fig. 5 shows preferred embodiment of the present invention and carries out hot pressing processing procedure schematic diagram before.The schematic diagram that Fig. 6 shows preferred embodiment of the present invention when carrying out the hot pressing processing procedure.Schematic diagram when Fig. 7 shows preferred embodiment of the present invention and removes release film.Fig. 8 shows the schematic diagram of preferred embodiment combined flexible circuit board of the present invention to conductive adhesive layer.In the present embodiment, when the terminal 61 desired in conjunction with described conductive adhesive layer 51 and liquid crystal panel 6, net pressure head 7 carries out the processing procedure of a hot binding.At first, described conductive tape 5 is positioned on the terminal 61 of described liquid crystal panel 6.Then, as shown in Figure 6, described pressure head 7 applies a pressure and acts on described release film 52 and the conductive adhesive layer 51.At this moment, if keeping parallelism just not necessarily between the surface of the surface of described pressure head 7 and described silicon layer 521, the compression nargin of one thickness direction is provided by described resilient coating 520, the present invention still can make described pressure stepless action below described conductive adhesive layer 51 on, can guarantee that in this way described conductive adhesive layer 51 firmly is combined on the terminal 61 of described liquid crystal panel 6.
Moreover as shown in Figure 6, during the processing procedure of hot binding, described conductive adhesive layer 51 can also outwards produce the glue that overflows and be out of shape towards periphery because of the effect of being under pressure usually.At this moment, described resilient coating 520 is also because have the compression nargin of thickness direction, and strain towards periphery.In the present invention; has suitable one-tenth-value thickness 1/10 by preestablishing described conductive adhesive layer 51; the excessive glue amount that the deflection that may command is out of shape described resilient coating 520 towards periphery is out of shape towards periphery greater than described conductive adhesive layer 51; can avoid like this abnormal conditions that described pressure head 7 is stained with sticking described conductive adhesive layer 51 take place, and then help reducing the shutdown maintenance probability.
At last, as shown in Figures 7 and 8, after finishing the processing procedure of hot binding, can remove described release film 52, and carry out another road pressure programming, make the circuit 81 of described conductive adhesive layer 51 combined flexible circuit boards 8.By above-mentioned processing procedure, the terminal 61 of described liquid crystal panel 6 can be by the circuit 81 of described conductive adhesive layer 51 in conjunction with described flexible electric circuit board 8.
As mentioned above; the existing anisotropic conductive adhesive tape 1 described fender 4 of use of must arranging in pairs or groups just can make the pressure stepless action of described pressure head 3 on described conductive adhesive layer 11 in Fig. 3; and produce the cost increase or be stained with shortcomings such as glutinous; the release film 52 of conductive tape 5 of the present invention itself promptly possesses described resilient coating 520 among Fig. 4; do not need additionally to use fender; so the time that can save accent machine and exchange buffering material; the reduction fender uses unusual and causes a large amount of products bad; and can avoid taking place described pressure head 7 and be stained with the abnormal conditions of gluing described conductive adhesive layer 51; and then help simplifying pressure programming; reduce the pressing cost; improve the pressing yield, and reduce the shutdown maintenance probability.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that disclosed embodiment does not limit the scope of the invention.On the contrary, being contained in the spirit of claims and the modification and impartial setting of scope is included in the scope of the present invention.
Claims (10)
1, a kind of conductive tape release film is incorporated into a side of conductive adhesive layer, and it is characterized in that: described release film comprises: resilient coating, first release layer and second release layer, described resilient coating have the compression nargin of a thickness direction; Described first release layer is arranged at a side of described resilient coating; Described second release layer is arranged at the opposite side of described resilient coating, and is incorporated into described conductive adhesive layer.
2, conductive tape release film as claimed in claim 1 is characterized in that: the manufacturing materials of described resilient coating be selected from polytetrafluoroethylene, silica gel, glass fabric, the macromolecule resin any one or multiple compound.
3, conductive tape release film as claimed in claim 1, it is characterized in that: the thickness of described resilient coating is between between the 0.05mm to 0.25mm.
4, conductive tape release film as claimed in claim 1, it is characterized in that: the surface roughness of described second release layer is higher than the surface roughness of described first release layer.
5, conductive tape release film as claimed in claim 1 is characterized in that: the manufacturing materials of described first release layer is a silicone oil.
6, conductive tape release film as claimed in claim 1 is characterized in that: the manufacturing materials of described second release layer is for drenching film.
7, conductive tape release film as claimed in claim 1, it is characterized in that: described conductive adhesive layer is an anisotropic conductive adhesive layer.
8, a kind of conductive tape is characterized in that: comprise conductive adhesive layer and release film as claimed in claim 1, described conductive adhesive layer is used for electrically connecting first circuit unit and second circuit assembly, and described release film is incorporated into a side of described conductive adhesive layer.
9, conductive tape as claimed in claim 8 is characterized in that: described first circuit unit is liquid crystal panel or circuit board.
10, conductive tape as claimed in claim 8 is characterized in that: described second circuit assembly comprises chip packing-body or glass top chip packaging body on flexible electric circuit board, the soft board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101341296A CN101329927A (en) | 2008-07-17 | 2008-07-17 | Conducting adhesive tape off film and conducting adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101341296A CN101329927A (en) | 2008-07-17 | 2008-07-17 | Conducting adhesive tape off film and conducting adhesive tape |
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| Publication Number | Publication Date |
|---|---|
| CN101329927A true CN101329927A (en) | 2008-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101341296A Pending CN101329927A (en) | 2008-07-17 | 2008-07-17 | Conducting adhesive tape off film and conducting adhesive tape |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101992573A (en) * | 2010-08-31 | 2011-03-30 | 刘烈新 | Novel release film |
| CN104592908A (en) * | 2014-12-26 | 2015-05-06 | 东莞市纳利光学材料有限公司 | Preparation method and application of protective film in full lamination with mobile terminal |
| CN107236144A (en) * | 2017-07-27 | 2017-10-10 | 南京兰埔成新材料有限公司 | It is a kind of to be used to process mould release membrance combination of battery grade lithium band and preparation method thereof |
| CN113068321A (en) * | 2020-01-02 | 2021-07-02 | 北大方正集团有限公司 | Mounting process of conductive adhesive, production process of circuit board and circuit board |
-
2008
- 2008-07-17 CN CNA2008101341296A patent/CN101329927A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101992573A (en) * | 2010-08-31 | 2011-03-30 | 刘烈新 | Novel release film |
| CN104592908A (en) * | 2014-12-26 | 2015-05-06 | 东莞市纳利光学材料有限公司 | Preparation method and application of protective film in full lamination with mobile terminal |
| CN104592908B (en) * | 2014-12-26 | 2016-08-17 | 东莞市纳利光学材料有限公司 | A kind of preparation method and application of the protecting film of mobile terminal of can comprehensively fitting |
| CN107236144A (en) * | 2017-07-27 | 2017-10-10 | 南京兰埔成新材料有限公司 | It is a kind of to be used to process mould release membrance combination of battery grade lithium band and preparation method thereof |
| CN113068321A (en) * | 2020-01-02 | 2021-07-02 | 北大方正集团有限公司 | Mounting process of conductive adhesive, production process of circuit board and circuit board |
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Open date: 20081224 |