CN101324756B - Method for improving prepared thin film thickness in rotary coating method - Google Patents

Method for improving prepared thin film thickness in rotary coating method Download PDF

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Publication number
CN101324756B
CN101324756B CN2008100455143A CN200810045514A CN101324756B CN 101324756 B CN101324756 B CN 101324756B CN 2008100455143 A CN2008100455143 A CN 2008100455143A CN 200810045514 A CN200810045514 A CN 200810045514A CN 101324756 B CN101324756 B CN 101324756B
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spin
film
thickness
film thickness
coating
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CN2008100455143A
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CN101324756A (en
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杜晓松
蒋亚东
胡佳
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University of Electronic Science and Technology of China
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University of Electronic Science and Technology of China
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Abstract

The invention discloses a method for improving the thickness of a film prepared in the spincoating. Raised steps 5 Mu m to 500 Mu m high are formed on a coated baseplate through spincoating photoresist or sticking adhesive tapes, thus forming a closed frame. A solution is dropped in the area enclosed by the frame, and a film is prepared through the spincoating. By adopting the method, the thickness of the spincoated film can be significantly improved. The method is applicable for a plurality of fields needing preparation of thick films, and can reduce the frequency of repeated spincoating. The method has the advantages of simple process, strong maneuverability and large application value.

Description

A kind of method that in spin-coating method, improves prepared film thickness
Technical field
The present invention relates to the film preparing technology field, be specifically related to a kind of method that in spin-coating method, improves prepared film thickness.
Background technology
Characteristics such as spin-coating method is a kind of method for manufacturing thin film commonly used, and it has, and equipment is simple, productive capacity strong, the film size of preparation is big, thickness is even are widely used in fields such as CD, semiconductor devices, electronic devices and components.
The thickness of spin-coated thin film can be by changing spin coating solution concentration, viscosity, solvent types, spin coating the time rotating speed and parameter such as time regulate, also can adopt the method for multiple spin coating to realize.The method that wherein increases film thickness most effectively is to strengthen the concentration of spin coating solution, viscosity and adopt the multiple spin coating method.But along with the increase of solution concentration and viscosity, the roughness of spin-coated thin film increases, the film thickness uniformity variation; And adopt the multiple spin coating method can increase operation, reduce production efficiency.
In the making of Love wave device, need on the piezoelectric substrate that has the plane interdigital electrode, make waveguide film, polymethylmethacrylate (PMMA) is the waveguide film material of using always, adopts the spin-coating method preparation.Even for guaranteeing waveguide film compact structure, no hole bubble, surfacing, thickness, be good with the effect of employing lean solution spin coating waveguide film.But the thickness of PMMA waveguide film need reach about 2 μ m, and with the thickness of the each film of lean solution spin coating below 100nm, need to repeat more than 10 time, technology is loaded down with trivial details, workload is big, inefficiency.
Summary of the invention
Technical matters to be solved by this invention is how a kind of method that improves prepared film thickness in spin-coating method is provided, and this method can effectively improve the thickness of resultant film after each spin coating.
Technical matters proposed by the invention is to solve like this: a kind of method that improves prepared film thickness in spin-coating method is provided, it is characterized in that, coated basal plate is carried out pre-service, make zone, substrate edge have the step of projection, step forms closed frame, film spin coating preparation is in the enclosed region that frame forms, and the thickness of spin-coated thin film is regulated by the height of regulating step.
According to the method that in spin-coating method, improves prepared film thickness provided by the present invention, it is characterized in that described step is the method formation by spin coating photoresist or Continuous pressing device for stereo-pattern, the height of step is 5-500 μ m.
According to the method that in spin-coating method, improves prepared film thickness provided by the present invention, it is characterized in that the thickness of spin-coated thin film and thickness homogeneous area can be regulated by height, enclosed region area and the shape of regulating step.
According to the method that in spin-coating method, improves prepared film thickness provided by the present invention, it is characterized in that the shape of described enclosed region is annular or polygon.
According to the method that in spin-coating method, improves prepared film thickness provided by the present invention, it is characterized in that the preparation process of described photoresist step comprises: 1. spin coating photoresist; 2. under mask, expose; 3. develop and form step; 4. high-temperature baking solidifies.
According to the method that in spin-coating method, improves prepared film thickness provided by the present invention, it is characterized in that rotating speed and time when the concentration that the thickness of spin-coated thin film also can be by changing spin coating solution, viscosity, solvent types, spin coating are regulated.In addition, can increase the thickness of film by multiple spin coating.
Essence of the present invention is to arrange the frame of a projection around film plating substrate, with flowing of confined liquid, thereby increases the thickness of each spin-coated thin film greatly.Need not the number of times of multiple spin coating or minimizing spin coating like this, just can reach predetermined film thickness, simplified technology, improved efficient.Adopt spin coating technique of the present invention, can preferentially select the spin coating liquid of low concentration and viscosity for use, thereby guarantee that resulting spin-coated thin film thickness is even, surfacing.
Description of drawings
Fig. 1 is the device architecture synoptic diagram of spin coating thin films;
Fig. 2 is the vertical view of stair step patterns of the present invention;
Fig. 3 is the schematic flow sheet of spin coating proceeding of the present invention;
Fig. 4 is for adopting the relation of step spin coating proceeding rear film thickness of the present invention and bench height;
Wherein: the 1st, piezoelectric chip, the 2nd, electrode, the 3rd, pad, the 4th, lead, the 5th, step, the 6th, waveguide film.
Embodiment
The present invention is further illustrated below in conjunction with accompanying drawing and embodiment.
Method with preparation Love wave waveguide film a kind of spin coating thin films that to be example propose this paper describes.The Love wave device structurally is divided into three layers up and down: bottom is a piezoelectric chip, and the middle layer is an electrode, and the superiors are waveguide films.Electrode is made up of a pair of interdigital transducer (IDT) usually, also can comprise reflecting grating.As shown in Figure 1, the PMMA waveguide film will prepare on electrode 2, and the thickness of PMMA waveguide film need reach about 2 μ m, adopt frame spin coating proceeding of the present invention for this reason.
The method of a kind of spin coating thin films provided by the present invention following (example):
According to the profile of Love wave device, make rectangular frame in the outer of piezoelectric chip 1, as shown in Figure 2.Frame forms by Continuous pressing device for stereo-pattern paper.Frame is trapped among central authorities with electrode 2, constitutes coating film area; And pad 3 is covered by frame, can not plate film.Electrode 2 is of a size of 13mm * 1.5mm, and frame is arranged on 1-1.5mm place, electrode outer.
The spin coating process of waveguide film is as follows: use 1, the 2-ethylene dichloride is the PMMA solution of solvent preparation massfraction 5%, with dropper drips of solution is expired the zone that whole frame surrounds, after the rotating speed rotation 2min with 2500rpm, remove adhesive tape, the baking oven baking 2h that film is put into 180 ℃ carries out crosslinking curing.Resulting film schematic cross-section is shown in Fig. 3 (d), and core is a flat site, and can progressively increase and swell at the marginal portion film thickness.Because the size of frame is far longer than the size of electrode, make the waveguide film that is positioned at directly over the electrode 2 have good flatness and homogeneity, satisfy the requirement of device performance.
In the present embodiment, adopted the step of 50 μ m, 100 μ m, 150 μ m and 200 μ m height respectively, the thickness of gained film is respectively 0.5 μ m, 1 μ m, 1.6 μ m and 2.3 μ m, as shown in Figure 4, and do not adopt step, as seen the thickness of each spin coating adopt the step spin coating proceeding below 0.1 μ m, particularly adopt higher step can increase the thickness of each spin coating gained film effectively.
Although original intention of the present invention is to improve the thickness of PMMA waveguide film, application of the present invention is not limited to this, can be applicable to adopt any field of the thicker film of spin-coating method preparation.

Claims (4)

1. method that in spin-coating method, improves prepared film thickness, it is characterized in that, coated basal plate is carried out pre-service, make zone, substrate edge have the step of projection, step forms closed frame, film spin coating preparation is in the enclosed region that frame forms, and the thickness of spin-coated thin film is regulated by the height of regulating step.
2. the method that improves prepared film thickness in spin-coating method according to claim 1 is characterized in that, described step is the method formation by spin coating photoresist or Continuous pressing device for stereo-pattern, and the height of step is 5-500 μ m.
3. the method that improves prepared film thickness in spin-coating method according to claim 1 is characterized in that the shape of described enclosed region is annular or polygon.
4. the method that improves prepared film thickness in spin-coating method according to claim 1 is characterized in that the preparation process of described photoresist step comprises: 1. spin coating photoresist; 2. under mask, expose; 3. develop and form step; 4. high-temperature baking solidifies.
CN2008100455143A 2008-07-10 2008-07-10 Method for improving prepared thin film thickness in rotary coating method Expired - Fee Related CN101324756B (en)

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Application Number Priority Date Filing Date Title
CN2008100455143A CN101324756B (en) 2008-07-10 2008-07-10 Method for improving prepared thin film thickness in rotary coating method

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CN101324756B true CN101324756B (en) 2011-04-06

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105895809B (en) * 2016-05-09 2018-12-28 浙江海洋大学 A kind of preparation method of the ZnO film for reversed structure polymer solar battery

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1476367A (en) * 2000-12-01 2004-02-18 �����֯��ʽ���� Polishing pad, method of mfg. polishing pad, and cushion layer polishing pad
CN101055830A (en) * 2007-01-18 2007-10-17 复旦大学 Making method of self-limited boundary film graphics
CN101104780A (en) * 2006-02-28 2008-01-16 日东电工株式会社 Masking tape for board
CN101175553A (en) * 2005-05-13 2008-05-07 索尼德国有限责任公司 A method of fabricating a polymeric membrane having at least one pore

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1476367A (en) * 2000-12-01 2004-02-18 �����֯��ʽ���� Polishing pad, method of mfg. polishing pad, and cushion layer polishing pad
CN101175553A (en) * 2005-05-13 2008-05-07 索尼德国有限责任公司 A method of fabricating a polymeric membrane having at least one pore
CN101104780A (en) * 2006-02-28 2008-01-16 日东电工株式会社 Masking tape for board
CN101055830A (en) * 2007-01-18 2007-10-17 复旦大学 Making method of self-limited boundary film graphics

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