CN101323937B - Method for preparing high strength high conductivity copper thin slab by severe plastic deformation - Google Patents
Method for preparing high strength high conductivity copper thin slab by severe plastic deformation Download PDFInfo
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- CN101323937B CN101323937B CN200710011723A CN200710011723A CN101323937B CN 101323937 B CN101323937 B CN 101323937B CN 200710011723 A CN200710011723 A CN 200710011723A CN 200710011723 A CN200710011723 A CN 200710011723A CN 101323937 B CN101323937 B CN 101323937B
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Abstract
The invention relates to a preparation method of a brass sheet with the property of high intensity and high conductivity, particularly to a method for producing a brass sheet with supper high intensity and high conductivity by making use of the technique of severe plastic deformation technology. The method of the invention respectively makes use of the two techniques of the deformation of low-temperature dynamic high-speed and the deformation of room-temperature quasi-static low-speed; the speed of dynamic high-speed deformation rate is 10< 2 > to 10< 4 > s <-1>, and the deformation amount is1.8 to 2.5 (calculating method: Epsilon1 is equal to lnH0/H); the deformation temperature is from minus 196 DEG C to minus 100 DEG C; the speed of the quasi-static low-speed deformation is 10<-3> to 10< -2 > s< -1 >, and the deformation amount is 10 percent to 97 percent (calculating method: Epsilon2 is equal to (A0-A)/A0) multiplied by100 percent; the deformation temperature is room temperature.The brass sheet prepared by adopting the method of the invention has a tensile strength of 550 to 600MPa, a resistivity of 17.8 to 18.1n Omega question mark m and a uniform deformation amount of 5 percent, thereby being a supper high intensity and high conductivity brass sheet with a certain uniform elongation. The high intensity and high conductivity brass sheet produced by the invention has an important value and application space to the computer industry and electronic industry which develop rapidly.
Description
Technical field
The present invention relates to have the technology of preparing of the high strength copper sheet of high conduction and certain uniform elongation, a kind of method of utilizing severe plastic deformation to prepare high strength high conductivity copper thin slab is provided especially, under the prerequisite that keeps the high conduction of copper product and certain uniform elongation, increase substantially the intensity of copper product by the viscous deformation processing technology of two kinds of different distortion speed.
Background technology
The principal feature of copper is conduction, good heat conductivity, and good plasticity and wear resistance are arranged, and is the indispensable metallic substance of industrial sector such as electric power, chemical industry, instrument, shipbuilding and machinofacture.For fine copper, it has very high deformability, and intensity is lower.Therefore the industrial certain methods that adopted comes it is strengthened, and for example solution strengthening, second is methods such as reinforcement, viscous deformation mutually.Solution strengthening is strengthened the intensity that can significantly improve metallic substance mutually with second, but the adding of alloying element will change the physics and the chemical property of material, especially significantly reduce the electric conductivity of fine copper, influence its use in electron trade.In addition, by viscous deformation, under the prerequisite that does not change material chemical composition, can improve intensity by introducing defective (as crystal boundary, dislocation), but general plasticity is relatively poor.As the purity of passage extruding preparation such as to utilize be 99.95% block body ultrafine grain copper (document 1F.Dalla Torre, Acta Materialia, 2004; 52:4819), average grain size is about 200～300nm, and the room temperature tensile yield strength is 400MPa, is more than 7 times of common annealing fine copper, but while plasticity relatively poor (～2%).Simultaneously, the viscous deformation of room temperature low speed be because therefore the generation of dislocation and bury in oblivion and can reach a balance very soon can only introduce the defective of limited density in material, when deformation strain reaches a certain amount of, and the deformable material intensity value of reaching capacity.For example, less than 7 o'clock, be out of shape no longer strain hardening of fine copper (document 2Cairns etc., J.Inst.Metals, 1971 in deformation strain; 99:93).In addition, according to results reported in the document (document 3Yinmin Wang etc., Nature, 2002; 419:912), low-temperature deformation can further suppress material the burying in oblivion of dislocation in deformation process, thereby allows material to store more highdensity defective, thereby makes material have higher intensity, but plasticity is also relatively poor.Though further annealing can obtain plasticity preferably, strength degradation is very obvious, and the intensity that makes low-temperature deformation improve is most of to disappear.
Summary of the invention
The purpose of this invention is to provide a kind of method of utilizing severe plastic deformation to prepare high strength high conductivity copper thin slab, by dynamic high speed deformation technology and the combined method of quasistatic low speed deformation technology, the metal fine copper is carried out viscous deformation to be handled, by dislocation that increases material and the intensity that twin density increases substantially pure copper material, keep its higher electroconductibility and plasticity simultaneously, make it have good electrical conductivity and certain uniform elongation.
Technical scheme of the present invention is:
A kind of method of utilizing severe plastic deformation to prepare high strength high conductivity copper thin slab, concrete steps are as follows:
(1) at first, utilize the dynamic high speed deformation technology, carry out the low temperature folk prescription to repeatedly handling processing parameter:
Deformation strain speed: 10
2-10
4s
-1
The deformation strain amount: total deformation be 1.8-2.5 (method of calculation:
), ε
1Be deflection, H
0Be thickness before the material deformation, H is a thickness behind the material deformation;
Texturing temperature :-196 ℃ to-100 ℃;
(2) then, utilize quasistatic low speed deformation technology, it is rolling to multi-pass to carry out the room temperature folk prescription, processing parameter:
Deformation strain speed: 10
-3-10
-2s
-1
The deformation strain amount: deflection be 10%-97% (method of calculation:
), ε
2Be total deformation, A
0Be the sectional area (promptly being out of shape the sectional area of back material at a high speed) of material before rolling, A is the sectional area (being the sectional area of low speed distortion back material) of rolling back material;
Texturing temperature: room temperature.
The present invention has following advantage:
1. the preparation method is simple.The present invention utilizes the combination of distortion at a high speed and low speed deformation technology, and method is simple, is easy to controlled deformation processing parameter and texturing temperature.Concerning being out of shape at a high speed, present traditional deformation technology is carried out necessary improvement, optimize processing parameter and texturing temperature and get final product.And concerning the low speed distortion, the rolling of the present invention's employing is industrial cold rolling process the most commonly used, therefore by the method for two kinds of simple plastic distortion, can prepare the new copper material of excellent performance.
2. sample quality is stable.By the material of the present invention's preparation, sample densification, pollution-free, simultaneously by control process parameters, sample quality is stable.
3. suitability is strong.The present invention just improves the performance of material by the change of material microstructure under the prerequisite that does not change material chemical composition.
A kind of combined method that improves metal strength provided by the invention to the distortion that fine copper has been used two kinds of differing tempss, strain rate simultaneously, makes intensity, electric conductivity, the plasticity of fine copper all be better than the fine copper performance of other viscous deformation technical finesses at present.The copper sheet tensile strength 550-600MPa of preparation, resistivity 17.8-18.1n Ω m, the homogeneous deformation amount reaches 5%, is superstrength combarloy thin plate, and has certain uniform elongation.The high strength and high conductivity copper sheet of the present invention's preparation has important value and great application space to computer industry and the electron trade that develops rapidly.
Description of drawings
Fig. 1: the microtexture transmission electron micrograph of the high-strength highly-conductive fine copper that utilizes the present invention to handle to obtain.
Fig. 2: the high-strength highly-conductive fine copper that utilizes the present invention to handle to obtain and the room temperature tensile curve ratio of common annealing fine copper are.
Embodiment
Below by embodiment in detail the present invention is described in detail.
Embodiment 1
The copper sheet sample original size of present embodiment is: 200mm * 50mm * 1mm (thick).
(1) at first utilize the high speed deformation technology to prepare high strength block nanometer twin pure copper material;
Equipment: high-speed pneumatic texturing machine;
Deformation strain speed: 10
2-10
4s
-1
The deformation strain amount: total deformation is 2;
Texturing temperature :-196 ℃;
Pure copper material: purity 99.995% (weight percent), through 700 ℃ of annealing 3 hours, grain-size was about the 150-200 micron.
Prepare block high-density nano-scale twin pure copper material, its main microstructure characteristic is a pencil high-density nano-machine twin, and average twin synusia thickness is 30-50nm, and the crystal grain of nano-scale.
(2) carry out room temperature low speed distortion (rolling) on the block high-density nano-scale twin pure copper material that obtains, deflection is 90%, and its main microstructure characteristic is certain amount of nano mechanical twin and ultra-fine crystalline substance.Nano-machine twin lamellae thickness still is 30-50nm, and grain-size reaches the magnitude of ultra-fine crystalline substance.Tensile tests at room result shows that the distortion of room temperature low speed makes the tensile strength decline by the block high-density nano-scale twin pure copper material of distortion preparation at a high speed, is about 550MPa, and plasticity is improved, and uniform elongation is near 5%.Simultaneously final electric conductivity is about 95%IACS, and the high-strength highly-conductive fine copper that utilizes the present invention to handle to obtain and the room temperature resistivity of common annealing fine copper are relatively, and be as shown in table 1.
Table 1
| Sample | The present invention | CG Cu |
| Resistivity (n Ω m) | 17.8 | 17.2 |
(1) at first utilize the high speed deformation technology to prepare high strength block nanometer twin pure copper material;
Equipment: high-speed pneumatic texturing machine;
Deformation strain speed: 10
2-10
4s
-1
The deformation strain amount: total deformation is 2;
Texturing temperature :-196 ℃;
Pure copper material: purity 99.995%, through 700 ℃ of annealing 3 hours, grain-size was about the 150-200 micron.
Prepare block high-density nano-scale twin pure copper material, its main microstructure characteristic is a pencil high-density nano-machine twin, and average twin synusia thickness is 30-50nm, and the crystal grain of nano-scale.
(2) carry out room temperature low speed distortion (rolling) on the block high-density nano-scale twin pure copper material that obtains, deflection is 10%, and its main microstructure characteristic is certain amount of nano mechanical twin and ultra-fine crystalline substance.Nano-machine twin lamellae thickness still is 30-50nm, and grain-size reaches the magnitude of ultra-fine crystalline substance.Tensile tests at room result shows that the distortion of room temperature low speed makes the tensile strength decline by the block high-density nano-scale twin pure copper material of distortion preparation at a high speed, is about 590MPa.
Embodiment 3
(1) at first utilize the high speed deformation technology to prepare high strength block nanometer twin pure copper material;
Equipment: high-speed pneumatic texturing machine;
Deformation strain speed: 10
2-10
4s
-1
The deformation strain amount: total deformation is 1.8;
Texturing temperature :-100 ℃;
Pure copper material: purity 99.995%, through 700 ℃ of annealing 3 hours, grain-size was about the 150-200 micron.
Prepare block high-density nano-scale twin pure copper material, its main microstructure characteristic is a pencil high-density nano-machine twin, and average twin synusia thickness is 30-50nm, and the crystal grain of nano-scale.
(2) carry out room temperature low speed distortion (rolling) on the block high-density nano-scale twin pure copper material that obtains, deflection is 60%, and its main microstructure characteristic is certain amount of nano mechanical twin and ultra-fine crystalline substance.Nano-machine twin lamellae thickness still is 30-50nm, and grain-size reaches the magnitude of ultra-fine crystalline substance.Tensile tests at room result shows that the distortion of room temperature low speed makes the tensile strength decline by the block high-density nano-scale twin pure copper material of distortion preparation at a high speed, is about 530MPa, and plasticity is improved.
Comparative example
The yield strength of common annealing attitude coarse-grain fine copper is about 40MPa, and behind the cold rolling very big deflection, its yield strength can be brought up to 380MPa, and tensile strength is brought up to 400MPa, but unit elongation is less than 1.5%.Adopt the inventive method, yield strength can reach 480MPa, and tensile strength reaches 550MPa, is significantly improved than common cold rolling attitude, has good plasticity simultaneously.In addition because the introducing of twin when improving the strength of materials, makes material keep higher electric conductivity.
Claims (1)
1. a method of utilizing severe plastic deformation to prepare high strength high conductivity copper thin slab is characterized in that, this method utilizes dynamic high speed deformation technology and quasistatic low speed deformation technology that copper product is handled respectively, and concrete steps are as follows:
(1) at first, utilize the dynamic high speed deformation technology, carry out the low temperature folk prescription to repeatedly handling processing parameter:
Deformation strain speed: 10
2-10
4s
-1
The deformation strain amount: total deformation is 1.8-2.5, method of calculation:
ε
1Be the deflection that is out of shape at a high speed, H
0Be thickness before the material deformation, H is a thickness behind the material deformation;
Dynamic high speed deformation process temperature-196 ℃ is to-100 ℃;
(2) then, utilize quasistatic low speed deformation technology, it is rolling to multi-pass to carry out the room temperature folk prescription, processing parameter:
Deformation strain speed: 10
-3-10
-2s
-1
The deformation strain amount: deflection is 10%-97%, method of calculation:
ε
2Be the deflection of low speed distortion, A
0For being out of shape the sectional area of back material at a high speed, A is the sectional area of low speed distortion back material;
The copper sheet tensile strength 550-600MPa of preparation, resistivity 17.8-18.1n Ω m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710011723A CN101323937B (en) | 2007-06-15 | 2007-06-15 | Method for preparing high strength high conductivity copper thin slab by severe plastic deformation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710011723A CN101323937B (en) | 2007-06-15 | 2007-06-15 | Method for preparing high strength high conductivity copper thin slab by severe plastic deformation |
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| Publication Number | Publication Date |
|---|---|
| CN101323937A CN101323937A (en) | 2008-12-17 |
| CN101323937B true CN101323937B (en) | 2010-05-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710011723A Expired - Fee Related CN101323937B (en) | 2007-06-15 | 2007-06-15 | Method for preparing high strength high conductivity copper thin slab by severe plastic deformation |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103469133A (en) * | 2013-05-28 | 2013-12-25 | 刘敬君 | High-strength high-conductivity pure copper material and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1316304A (en) * | 2000-04-05 | 2001-10-10 | 中国科学院金属研究所 | Process for preparing copper film |
| CN1955329A (en) * | 2005-10-26 | 2007-05-02 | 中国科学院金属研究所 | Superhigh strength high conduction block pure copper material and preparation method |
| CN1955323A (en) * | 2005-10-26 | 2007-05-02 | 中国科学院金属研究所 | Method for raising metal and alloy strength |
-
2007
- 2007-06-15 CN CN200710011723A patent/CN101323937B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1316304A (en) * | 2000-04-05 | 2001-10-10 | 中国科学院金属研究所 | Process for preparing copper film |
| CN1955329A (en) * | 2005-10-26 | 2007-05-02 | 中国科学院金属研究所 | Superhigh strength high conduction block pure copper material and preparation method |
| CN1955323A (en) * | 2005-10-26 | 2007-05-02 | 中国科学院金属研究所 | Method for raising metal and alloy strength |
Non-Patent Citations (2)
| Title |
|---|
| 代秀芝等.超细晶铜带材的组织及力学性能研究.山东冶金28 5.2006,28(5),40-42. |
| 代秀芝等.超细晶铜带材的组织及力学性能研究.山东冶金28 5.2006,28(5),40-42. * |
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