CN101312610B - Circuit board preventing electro-static discharge - Google Patents

Circuit board preventing electro-static discharge Download PDF

Info

Publication number
CN101312610B
CN101312610B CN2007100281838A CN200710028183A CN101312610B CN 101312610 B CN101312610 B CN 101312610B CN 2007100281838 A CN2007100281838 A CN 2007100281838A CN 200710028183 A CN200710028183 A CN 200710028183A CN 101312610 B CN101312610 B CN 101312610B
Authority
CN
China
Prior art keywords
circuit board
substrate
static discharge
part surface
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007100281838A
Other languages
Chinese (zh)
Other versions
CN101312610A (en
Inventor
李煌基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitac Computer Shunde Ltd
Shunda Computer Factory Co Ltd
Mitac International Corp
Original Assignee
Mitac Computer Shunde Ltd
Mitac International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Computer Shunde Ltd, Mitac International Corp filed Critical Mitac Computer Shunde Ltd
Priority to CN2007100281838A priority Critical patent/CN101312610B/en
Publication of CN101312610A publication Critical patent/CN101312610A/en
Application granted granted Critical
Publication of CN101312610B publication Critical patent/CN101312610B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Elimination Of Static Electricity (AREA)

Abstract

The invention discloses a static discharge protection structure, which can provide a discharge path for each operation element and prevent error signal or error operation of a signal line or a power line caused by static discharge to protect the elements. The invention can realize the purpose without additional electric elements and improve protection ability resisting static discharge.

Description

Circuit board preventing electro-static discharge
Technical field
The present invention is about a kind of circuit board, particularly about a kind of energy circuit board preventing electro-static discharge.
Background technology
The generation of static is immanent, can endanger the sensitivity of electronic component especially especially.Show that according to data the people walks on carpet, the electrostatic potential of generation is above 2000 volts; Wear or the moment when undressing, voltage can reach 50,000~100,000 volts.When one produces static, as long as touch metal, or during suitable conductor, therefore electrostatic charge can be taken away by conductor rapidly, when body surface has static, if when contacting the electronic component a little less than the electrostatic defending (as semiconducter IC), because electronic component itself is exactly to be used for transmitting electric signal, with respect to human body is a good conductor, therefore remains in the electrostatic charge of body surface, will be taken away by electronic component rapidly.Be integrated circuit at present based on metal-oxide semiconductor to the most responsive element of static discharge.For instance, it is 200 volts that the complementary matal-oxide semiconductor chip in the computer can bear electrostatic impact voltage, and DRAM (Dynamic Random Access Memory), Erasable ﹠Programmable ROM chip are 300 volts, and the bipolar transistor chip is 1000 volts.
For instance; palmtop computer-hand held satellite navigation system with high sensitivity GPS signal receiving system; because it is light and handy; convenient by use that masses accept; but be different from general household electronic device the antistatic protection loop can be installed separately; especially its enclosure material and interface operation button all are to use as plastics; rubber and chemical fibre class and so on manufacturing; be to have the high material of insulation resistance; therefore; when the user searches for map reference in outdoor desire; see through the interface operation button when operation is searched; be easy to because of friction and peel off produce high-pressure electrostatic; its electrostatic potential may be up to tens of kV, and generally when antistatic element not being set, high-pressure electrostatic can just puncture its internal electron part easily; thereby reduce its sensitivity, even can fault.In fact; static is to be present in natural a kind of phenomenon; human body is an electrified body; more often utilize antistatic element to reach the function of protection electronic installation at present in the routine techniques; but its shortcoming is to increase cost; and carrying out under limited space has its difficulty, and also therefore, routine techniques has urgent improved necessity just.
Summary of the invention
In view of above problem, the object of the present invention is to provide a kind of structure of preventing electro-static discharge, provide a conductive material in executive component, when static takes place, can be discharged to ground connection by conductive material.
Therefore, for reaching above-mentioned purpose, the structure of the preventing electro-static discharge that the present invention disclosed is applied to a substrate, and this substrate is a kind of printed circuit board (PCB) (Printed Circuit Board is called for short PCB), includes solder side, part surface, conductive layer.
Solder side (Solder Side) is attached to one side of substrate, with in all line sets so far on the solder side.
Part surface (Component Side) is attached to the another side of substrate.In part surface (Component Side) Shang setting element, the lead of its element (conductor pattern) is all contained to solder side (SolderSide), and utilizes guide hole (via) that each element is connected to solder side (Solder Side).
Wherein, part surface (Component Side) surface is covered with conductive material (dew copper), forms a conductive layer, conductive layer (the copper part is revealed on the surface) is joined with ground plane (Ground).
In addition, again the ground plane (Ground) of part surface (Component Side) is connected with the ground plane (Ground) of other circuit board.
Comprehensively above-mentioned, by realizing a kind of structure of preventing electro-static discharge, utilize its static characteristic, can be discharged to the article that can discharge with nearest distance; And its design principle provides the discharge path ground plane (Ground) of copper (reveal) to each executive component exactly, and be unlikely to because of static discharge by signal line or power line, make machine produce mistake signal or misoperation, and cause component wear.In addition, the present invention's electrostatic defending must not add antistatic (ESD) element again, only utilizes circuit design method, can put into practice, and in this, can reduce the cost of cost.
Description of drawings
The schematic diagram of the structure of the preventing electro-static discharge that Fig. 1 is carried by the present invention.
The schematic rear view of the structure of the preventing electro-static discharge that Fig. 2 is carried by the present invention.
The front schematic view of the structure of the preventing electro-static discharge that Fig. 3 is carried by the present invention.
Embodiment
For making purpose of the present invention, structure, feature and function thereof there are further understanding, cooperate embodiment to be described in detail as follows now.
With reference to shown in Figure 1, the structure of the preventing electro-static discharge that it is carried by the present invention, it is applied on the circuit board, it is a printed circuit board (PCB), this circuit board can be applicable to personal computer, global positioning system personal digital assistant (GPS PDA), mobile phone and carry-on dish etc., includes substrate 300, solder side 600, part surface 500, conductive layer 100, ground plane 120 and several elements.In addition, first element 200, second element 210, three element 220 and quaternary part 230 or the like other several elements are arranged on the part surface 500, this part surface 500 is one side of substrate 300, and the circuit of all elements is arranged at the another side of substrate 300, just solder side 600, and on part surface 500, be covered with conductive material, to form a conductive layer 100, this conductive layer 100 more joins with ground plane 120.
The structure of the present invention's preventing electro-static discharge, utilize static characteristic, can be discharged to ground connection with nearest distance, therefore, provide the path of a conductive layer 100 to executive component as static discharge, can avoid because of static discharge via signal line or power line, make machine produce mistake signal or misoperation and cause component wear.
And printed circuit board (PCB) more can be divided into soft printed circuit board or rigid printed circuit board (PCB); According to research staff's circuit design, the electric wiring of connecting circuit part can be made wiring figure, and then, on insulator, make electric conductor reappear the circuit board that is constituted in modes such as the machining of designing institute appointment, surface treatments; In addition, the manufacture process of circuit board is that technology such as application of printed, photograph, etching and plating are made accurate distribution, and as supporting the assembling base that circuit continues mutually between electronic component and part, therefore, it is substrate 300 that this circuit board more can be described as.
Please refer to shown in Figure 2, solder side 600 for the present invention, be attached to the one side of substrate 300, and lead all in this substrate 300 620 is concentrated solder side 600 so far, and utilize guide hole 610 (via) that each element is connected to solder side 600 (Solder Side).
Referring again to shown in Figure 3, part surface 500 for the present invention, be attached to the another side of substrate 300, and with first element 200, second element 210, three element 220 and quaternary part 230 or the like, be arranged at this part surface 500, this first element 200, second element 210, three element 220 and quaternary part 230 or the like can be transistor, switch element or other electron component, and on this part surface 500 lead 620 are not set.Wherein, when static discharge takes place, can prevent holding wire or the power line discharge of static, and then cause the misoperation of electronic product or cause damage via component ambient.
Conductive layer 100, utilize gold, silver or copper or the like conductive material, utilize the preferable metal material of its conductance, and be covered with, and more extend its scope in this part surface 500, this conductive layer 100 is connected with ground plane 120, in this, when electronic equipment during in executable operations, if produce static, can utilize this conductive layer 100 as a discharge path, the static on the element be conducted to ground plane 120 through conductive layer 100 discharge in order to ground connection.In addition, in other embodiment, more this can be had the substrate 300 of preventing electro-static discharge structure and the ground plane 120 of other substrate 300 and join,, can enlarge the range of application of protection static in this.
The comprehensive above explanation about content of the present invention, the structure of the present invention's preventing electro-static discharge can be used substrate 300, also can be used in intelligent mobile phone, Espresso and hand held radio satellite navigation system or other associated electrical product.
For instance, in hand held automobile satellite navigation system and personal digital assistant; When the generation high-pressure electrostatic directly impacts on executive component, high-pressure electrostatic will see through along the surface conductance layer 100 of part surface 500 (Component Side) and be connected with ground plane 120 (Ground) and discharge, and can prevent that hand held automobile satellite navigation system and personal digital assistant are owing to static discharge comes to harm.

Claims (6)

1. circuit board preventing electro-static discharge, it includes:
One substrate;
One solder side, it is positioned at one of this substrate surface, and has at least one lead on this solder side;
One part surface, another surface that it is positioned at this substrate includes a conductive layer and a ground plane, and wherein this conductive layer is arranged at the surface of this part surface with distributing and is connected with this ground plane; And
Several elements are arranged at this part surface, and whenever the lead of this element is arranged at this solder side.
2. circuit board preventing electro-static discharge as claimed in claim 1 is characterized in that, this conductive layer utilizes a conductive material to be covered with in this part surface.
3. circuit board preventing electro-static discharge as claimed in claim 2 is characterized in that, this conductive material is selected from one by gold, silver, and the group that forms of copper.
4 circuit board preventing electro-static discharges as claimed in claim 1 is characterized in that this substrate more includes several guide holes, see through several guide holes in order to this element whenever with this part surface and are bonded at this solder side.
5 circuit board preventing electro-static discharges as claimed in claim 1 is characterized in that, this substrate is a bakelite plate substrate.
6 circuit board preventing electro-static discharges as claimed in claim 1 is characterized in that, this substrate is a glass fibre substrate.
7. a discharging structure is applied to a circuit board, and this circuit board includes: be positioned at one of this circuit board surface, and the lead that every this element is set is in a solder side; This discharging structure includes:
One part surface, another surface that it is positioned at this circuit board includes a conductive layer and a ground plane, and wherein this conductive layer is arranged at the surface of this part surface with distributing and is connected with this ground plane.
8. as the discharging structure as described in the claim 7, it is characterized in that this conductive layer utilizes a conductive material to be covered with in this part surface.
9. as the discharging structure as described in the claim 8, it is characterized in that this conductive material is selected from one by gold, silver, and the group that forms of copper.
CN2007100281838A 2007-05-25 2007-05-25 Circuit board preventing electro-static discharge Expired - Fee Related CN101312610B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2007100281838A CN101312610B (en) 2007-05-25 2007-05-25 Circuit board preventing electro-static discharge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2007100281838A CN101312610B (en) 2007-05-25 2007-05-25 Circuit board preventing electro-static discharge

Publications (2)

Publication Number Publication Date
CN101312610A CN101312610A (en) 2008-11-26
CN101312610B true CN101312610B (en) 2011-01-19

Family

ID=40100984

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007100281838A Expired - Fee Related CN101312610B (en) 2007-05-25 2007-05-25 Circuit board preventing electro-static discharge

Country Status (1)

Country Link
CN (1) CN101312610B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6836397B2 (en) * 2003-05-21 2004-12-28 Arima Computer Corporation Electrostatic discharge protection apparatus for a circuit board
CN1574026A (en) * 2003-06-03 2005-02-02 日东电工株式会社 Wired circuit board
CN2747819Y (en) * 2004-08-06 2005-12-21 上海环达计算机科技有限公司 Printed circuit board preventing ESD

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6836397B2 (en) * 2003-05-21 2004-12-28 Arima Computer Corporation Electrostatic discharge protection apparatus for a circuit board
CN1574026A (en) * 2003-06-03 2005-02-02 日东电工株式会社 Wired circuit board
CN2747819Y (en) * 2004-08-06 2005-12-21 上海环达计算机科技有限公司 Printed circuit board preventing ESD

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开平6-77622A 1994.03.18
吕俊霞.印制电路板的安装工艺与要求.《印刷电路信息》.2006,(第9期),67-70. *

Also Published As

Publication number Publication date
CN101312610A (en) 2008-11-26

Similar Documents

Publication Publication Date Title
US8604626B2 (en) Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly
US7872841B2 (en) In package ESD protections of IC using a thin film polymer
US9134858B2 (en) Touch panel for electrostatic discharge protection and electronic device using the same
US8482072B2 (en) Semiconductor die with integrated electro-static discharge device
US9184130B2 (en) Electrostatic protection for stacked multi-chip integrated circuits
JP2012252718A (en) Wireless communication device using voltage switchable dielectric material
CN105404881A (en) Fingerprint sensor assembly and preparation method thereof
US20100263200A1 (en) Wireless communication device using voltage switchable dielectric material
US9490201B2 (en) Methods of forming under device interconnect structures
KR20180044987A (en) An integrated circuit (IC) package including electrostatic discharge (ESD) protection.
US20120200963A1 (en) System and method for protecting a computing device using vsd material, and method for designing same
TW200729452A (en) Electro static discharge protection circuit and diode thereof
KR20160120496A (en) Mounting module
CN101312610B (en) Circuit board preventing electro-static discharge
EP3132661B1 (en) Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
US20110292612A1 (en) Electronic device having electrically grounded heat sink and method of manufacturing the same
CN204721706U (en) There is the flexible PCB of electrostatic-proof function
CN108770162B (en) Anti-static device and terminal equipment
US8154884B2 (en) Electronic device with electrostatic protection structure
US20080230531A1 (en) Heat block
TWI302810B (en)
CN211238248U (en) Semiconductor package
CN106057741A (en) Multifunctional protection structure of integrated circuit
CN204741017U (en) Ultra -thin MOSFET chip package structure
CN106292865A (en) Electronic installation

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110119

Termination date: 20130525