Background technology
Along with development in science and technology is rapid, various electronic product is constantly brought forth new ideas, and renewal, graceful function more are provided.In various electronic product, how to realize various electrical functionality by circuit board and various electronic building brick.In the manufacture process of electronic product, various electronic building bricks can pass through surface mount technology (Surface Mount Technology, SMT) or wave soldering technology (Wave Soldering Technology) be welded on the circuit board.Yet, in the manufacture process of traditional electronic product, when electric wire such as power line or signal line can't be directly fixed on the circuit board by above-mentioned surface mount technology or wave soldering technology, then must earlier electric wires such as power line or signal line be joined with first connector earlier, again with circuit board on second connector join, by more than one connector wire rod is linked on the circuit board by this.Be described as follows in this measure one traditional connected mode.
Please refer to Fig. 1, it is depicted as a kind of traditional electric wire 400 and the connection diagram of circuit board 500.At first, the end of one first connector 410 in electric wire 400 is set.Then, one second connector 510 is set on circuit board 500.First connector 410 and second connector 510 are the right connector of a public parent phase interworking.At last, again first connector 410 and second connector 510 are interconnected.
Yet the traditional electric wire 400 and the connected mode of circuit board 500 be by two connectors (first connector 410 and second connector 510), material cost height not only, its assembly program trouble that also seems.
In addition, if electric wire 400 is not provided with first connector 410, perhaps electric wire 410 set connectors are not to be first connector 410, and then electric wire 400 can't be connected on the circuit board 500 at all.When product needed maintenance or replacing wire rod, inconvenience considerably seems.
Therefore, how to research and develop the connected mode of a kind of electric wire and circuit board, to improve efficient, one of direction that reality is made great efforts for present industry.
Embodiment
According to the flow chart of the assemble method of preferred embodiment electronic building brick 1000 of the present invention, the schematic diagram of the step of shown in Fig. 2 A~2G, carrying out.As Fig. 2 C, electronic building brick 1000 comprises at least one electric wire 100, a circuit board 200 and a connector 300.At first please refer to Fig. 2 A.One circuit board 200 is provided, and it has at least one first through hole 200c.Circuit board 200 can for example be computer main frame panel (Main Board) or power board (PowerBoard).In the present embodiment, circuit board 200 has a first surface 200a, a second surface 200b and four first through hole 200c.First surface 200a is with respect to second surface 200b.These first through holes 200c runs through first surface 200a and second surface 200b and L arrangement along a straight line.
Then please refer to Fig. 2 B.A connector 300 is fixed on the first surface 200a of circuit board 200.Connector 300 comprises a body 310 and a movable part 320, and body 310 is welded on the first surface 200a of circuit board 200.Body 310 has at least one second through hole 310c.In the present embodiment, body 310 has four second through hole 310c, and each second through hole 310c corresponds respectively to each first through hole 200c, and arranges along straight line L.320 of movable parts are inserted among the chute S of body 310.
Wherein, present embodiment is to be fixed on the circuit board 200 by the body 310 of surface mount technology (SMT) with connector 300.Its fixed form is not only quite rapid, more can accurately connector 300 be arranged at the precalculated position, makes each second through hole 310c exactly corresponding to each first through hole 200c.
Please refer to Fig. 2 C~2D then.Insert at least one electric wire 100 in the second through hole 310c.Electric wire 100 comprises an insulating outer layer 110 and one metal-cored 120.The insulating outer layer 110 of electric wire 100 cut-outs is with metal-cored 120 of exposed part.When electric wire 100 inserts among the second through hole 310c, Qie Chu insulating outer layer 110 is not arranged in the second through hole 310c, exposed metal-cored 120 then are inserted in the first through hole 200c on the circuit board 200 (because the first through hole 200c is the second surface 200b that is positioned at circuit board 200, can't watch exposed metal-coredly 120 in Fig. 2 C~2D, please refer to following Fig. 2 E explanation).
Please refer to Fig. 2 E, if by the second surface 200b of circuit board 200, exposed metal-cored 120 protrude from outside the first through hole 200c.
Then please refer to Fig. 2 F.Movable part 320 is pushed towards body 310, to move to a clip position.Make electric wire 100 be held among the second through hole 300c.
Please refer to Fig. 2 G then.Be welded on the second surface 200b of circuit board 200 protruding from metal-cored 120 outside the first through hole 200c.So far, can successfully electric wire 100 electric connections and mechanicalness be connected in circuit board 200, and finish the Assembly Action of electronic building brick 1000.
The step that will protrude from outer metal-cored 120 welding of the first through hole 200c in the present embodiment can be finished by modes such as wave soldering technology or artificial welding procedures.With wave soldering technology is example, and circuit board 200 is placed on the guide rail, and guide rail drives circuit board 200 through the wave soldering groove, so that metal-cored 120 are welded in second surface 200b.Because connector 300 has been welded in the first surface 200a of circuit board 200, and electric wire 100 has been held on the connector 300.Therefore, in the transport process of circuit board 200, electric wire 100 can not toppled over, and metal-cored 120 can keep and are exposed to outside the first through hole 200c.
With artificial welding procedure is example, circuit board 200 must upset after, with the second surface 200b of circuit board 200 up, manually to weld.Because connector 300 has been welded in the first surface 200a of circuit board 200, and electric wire 100 has been held on the connector 300.Therefore, after circuit board 200 upsets, electric wire 100 can not break away from, and metal-cored 120 still are exposed to outside the first through hole 200c.
Please refer to Fig. 3 A, it is depicted as the longitudinal section of the electronic building brick 1000 of Fig. 2 D.When movable part 320 is not pushed into clip position, has one first space D 1 between movable part 320 and the body 310.First space D 1 is greater than the aperture D310c of the second through hole 310c.That is to say that movable part 320 does not protrude from the hole wall of the second through hole 310c.Electric wire 100 can successfully be inserted among the second through hole 310c and the first through hole 200c.In this example, the insulating outer layer 110 of electric wire 100 is positioned at the second through hole 310c, and metal-cored 120 evaginations of electric wire 100 are outside the first through hole 200c.
Please refer to Fig. 3 B, it is depicted as the longitudinal section of the electronic building brick 1000 of Fig. 2 F.When movable part 320 is pushed into clip position, have the aperture D310c of one second space D, 2, the second space D 2 between movable part 320 and the body 310 less than the second through hole 310c.That is to say that movable part 320 protrudes from the hole wall of the second through hole 310c.Preferably, second space D 2 is slightly less than the diameter D110 of the insulating outer layer 110 of electric wire 100, makes movable part 320 that the insulating outer layer 110 of electric wire 100 is held in the second through hole 310c tightly.
Please refer to Fig. 4 A, it is depicted as the vertical view of the electronic building brick 1000 of Fig. 2 D.When movable part 320 was not pushed into clip position, the movable part 320 of part was positioned at outside the body 310.
Please refer to Fig. 4 B, it is depicted as the vertical view of the electronic building brick 1000 of Fig. 2 F.The chute S inside of body 310 has one first and fastens surperficial 310a.In this example, movable part 320 can comprise a cantilever 321, and cantilever 321 has one second and fastens surperficial 321a.When movable part 320 inserted main body 310, cantilever 321 inserted chute S, and was sticked in the surperficial 310a of first fastening with the surperficial 321a of second fastening, so that movable part 320 is positioned clip position.
Shown in Fig. 4 B, preferably, movable part 320 has a curved surfaces 320a.Movable part 320 is with curved surfaces 320a clamping electric wire 100, and when making movable part 320 clamping electric wires 100, movable part 320 can't damage electric wire 100.
In addition, the material of body 310 and movable part 320 is an insulating material.Therefore, between several electric wires 100, can not produce the electrical influence that parasitic capacitance or galvanomagnetic effect etc. can't be expected because of body 310 and movable part 320.
Disclosed connector of the above embodiment of the present invention and electronic building brick assemble method are to utilize single connector to be arranged on the circuit board, electric wire can be connected on the circuit board, and no longer need second connector, and have following advantage:
The first, " reduction material cost ": a connector only need be set, and not need additionally to be provided with another connector on electric wire.
The second, " applicability is wide ": need not consider the male and female marriage problem of connector, when product needed maintenance or replacing wire rod, considerably convenient.
Three, " the welding yield height of electric wire ": in the process of weld metal core, because connector has been fixed in the first surface of circuit board, and electric wire is held on the connector.Therefore, no matter be that the neither meeting of electric wire is toppled over or broken away from wave soldering technology or artificial welding procedure, and metal-cored keeping be exposed to outside first through hole, so the conductive effect of electric wire after welding can be maintained at high yield.
Four, " electric wire can be held in second through hole tightly ": second spacing between movable part and the body is slightly less than the diameter of the insulating outer layer of electric wire, makes movable part the insulating outer layer of electric wire can be held in second through hole tightly.
Five, " running of movable part is smooth and easy and can be positioned clip position ": when movable part inserted main body, second on can movable part fastened the surface and is sticked in first of main body and fastens the surface, and movable part is positioned clip position.
Six, " can not damage electric wire ": the protection crust of movable part clamping electric wire, so during clamping, movable part can't damage electric wire.
Seven, " can not produce the electrical influence that can't expect ": the material of body and movable part is an insulating material.Therefore, between several electric wires, can not produce the electrical influence that parasitic capacitance or galvanomagnetic effect etc. can't be expected because of body and movable part.
Eight, " weld strength is good ": the metal-cored mode and the circuit board by welding of electric wire electrically connects.Generally speaking, the mode of welding connects the performance that excellence is all arranged in electric connection and mechanicalness.
In sum, though the present invention with preferred embodiment exposure as above, yet it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when doing various changes that are equal to and retouching.Therefore, protection scope of the present invention is when looking being as the criterion that claims define.