CN101302639A - Microstructure body and manufacturing method thereof - Google Patents
Microstructure body and manufacturing method thereof Download PDFInfo
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- CN101302639A CN101302639A CNA2008100887895A CN200810088789A CN101302639A CN 101302639 A CN101302639 A CN 101302639A CN A2008100887895 A CNA2008100887895 A CN A2008100887895A CN 200810088789 A CN200810088789 A CN 200810088789A CN 101302639 A CN101302639 A CN 101302639A
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Abstract
A superfine construct and the method of producing the same; the method is able to simply produce the superfine construct having anodic oxide; the anodic oxide has a plurality of micro holes; the micro hole has excellent connectivity to connect to the electrical conductor. The method comprises: preparing anodized metal (10), anodizing the anodized metal (10), until the midway to form a plurality of anodized parts (11) having bottom micro holes (12) on the opening of the anodizing surface (10S) of the anodized metal (10) and non-anodized parts (13); dry etching the anodized part (14b) between bottom having a plurality of micro holes (12) and the non-anodized parts (13) to the non-anodized parts (13), thereby removing the same.
Description
Technical area
The present invention relates to have on the surface micro architecture body and the manufacture method thereof of a plurality of minute apertures, particularly relate to metal is carried out anodic oxidation and the micro architecture body that obtains.
Background technology
A plurality of minute aperture inner stuffing matter of the anodic oxide coating that obtains in that metal is carried out anodic oxidation and make it have functional device to be suggested.Metal (Al etc.) is carried out anodic oxidation and the anodic oxide coating (Al that obtains
2O
3Deng) be to have the aperture that in anodised process, on the anodic oxide coating surface, is formed naturally and the metal oxide of roughly regularly arranged a plurality of minute apertures with nanometer scale.Therefore, for example, filler metal in a plurality of minute apertures of anodic oxide coating, fine metal body with size of nanometer scale just can become with the dielectric medium be media and roughly arrange regularly, the fixed micro architecture body.Micro architecture body with such metal superfine structure produces the local plasma oscillator by means of the irradiation meeting of light on the fine metal body, thereby can be used as the electric field enhance device of utilizing the caused electric field reinforcing effect of this local plasma oscillator and be applied to senser element, surface-enhanced Raman device etc.
As the fill method of metal in a plurality of minute apertures, can adopt the whole bag of tricks such as vacuum vapour deposition, but,, can adopt electrolysis plating method in occasion of filling etc. to the degree of depth minute aperture big with respect to the ratio in aperture.In the occasion that adopts electrolysis plating method, form electrical conductor as electrode in a metal filled side that begins to carry out minute aperture, in minute aperture, fill in addition electrolysis of plating solution, make metal separate out from electrode surface, by metallic growth in minute aperture filler metal.
Anodic oxide coating is carried out oxidizing reaction in the approximate vertical direction and is formed from being gone up by a surface of anodized metallization body, along with it carries out and forms a plurality of minute apertures from the surface to depth direction.Carry out anodised occasion fully not making by the anodized metallization body, non-anodic oxidation portion can be residual, has the anodic oxidation portion that is called the blocking layer and exist between the bottom surface of non-anodic oxidation portion and minute aperture.
In occasion, because the blocking layer is thin, so can utilize non-anodic oxidation portion as electrical conductor filler metal as electrode and in minute aperture from the bottom filler metal of minute aperture.In this occasion, do not need to form new electrode, can be with simple technology filler metal, but, because the existence on blocking layer, need carry out plating under the high current potential of current potential and handle, and the occupied state of metal be easy to generate deviation than separating out, this is known.
As the plating that can carry out under the low potential, for the method for occupied state inhibition deviation, studied the minute aperture that is made as anodic oxide coating and made communicating pores, between electrical conductor and minute aperture, there is not the method for the formation on blocking layer.In patent documentation 1, put down in writing and be made as the pore terminal point parts that form Ti, Nb, precious metal etc. on by a face of anodized metallization body, implement anodic oxidation from its opposition side, connect to pore terminal point parts up to minute aperture, remove the formation on the blocking layer between minute aperture and the pore terminal point parts, pore terminal point parts are implemented the technology that the electrolysis plating handles (embodiment 12 of patent documentation 1, the embodiment 4 of patent documentation 2 and other) as electrode.
Also have, in patent documentation 1, put down in writing being carried out anodic oxidation by the anodized metallization body, up to midway, afterwards, by using HgCl
2The wet etching of saturated solution and remove non-anodic oxidation portion is removed the blocking layer of minute aperture bottom again by the wet etching that uses phosphoric acid solution, make the technology (embodiment 11 of patent documentation 1 and other) of communicating pores.Yet in the method, in etch stop layer, the next door between the hole of the minute aperture of adjacency also can be etched, thereby do not make the words of the extreme attenuation in next door between the hole just can not guarantee sufficient connectivity.In patent documentation 3, keep having under the state of abundant thickness the method that connects to the anodic oxide coating in the hole of electrode as being produced on next door between the hole, disclosed for by the anodized metallization body, employing is by forming above the lower layer that the aluminium alloy that has the anodic oxide coating of processable with respect to etching solution constitutes, the thing of the upper layer gained that lamination is made of the aluminium alloy that can form the anodic oxide coating with insoluble, implement anodic oxidation, until lower layer midway, with processable thus make the bottom of minute aperture and the manufacture method of the porous plastid that lateral etching dissimilates.
Patent documentation 1: the spy opens the 2001-105400 communique
Patent documentation 2: the spy opens the 2001-9800 communique
Patent documentation 3: the spy opens the 20016-283122 communique
Summary of the invention
The problem that solution is planned in invention
In the enforcement anodic oxidation of above-mentioned patent documentation 1 and patent documentation 2 records and up to making minute aperture connect to the method for pore terminal point parts, as what also put down in writing in the paragraph of patent documentation 3, carry out anodic oxidation and become the words of communicating pores up to minute aperture, then anodic oxide coating is peeled off from pore terminal point parts easily, is difficult to stably make anodic oxide coating.
Also have, passing through in the method for anodic oxide coating that wet etching obtains having communicating pores of patent documentation 3 record, in order stably to obtain good connectivity, the side of minute aperture need have insoluble with respect to etching solution, and the aluminium alloy that forms the anodic oxide coating with processable need carry out anodic oxidation by not residual non-anodic oxidation portion and the mode that does not become communicating pores.Therefore, need make thickness and the blocking layer of the aluminium alloy that forms anodic oxide coating roughly the same, need accurate film thickness monitoring and, the technology complexity that can become the control of the anodic oxidation end point of each minute aperture with processable.
The present invention In view of the foregoing proposes, purpose is to provide simply a kind of and stably makes the method for the micro architecture body that possesses the anodic oxidation object and the micro architecture body that adopts this manufacture method to make, above-mentioned anodic oxidation object has a plurality of minute apertures, above-mentioned minute aperture has good connectivity, connects to electrical conductor.
Solve the scheme of problem
The manufacture method of the 1st micro architecture body of the present invention, it is characterized in that, preparation is by the anodized metallization body, this is carried out anodic oxidation by the anodized metallization body, up to midway, have in anodic oxidation portion that end minute aperture is arranged by the anodised surperficial upper shed of beginning of anodized metallization body a plurality of and non-anodic oxidation portion thereby form, anodic oxidation portion between a plurality of bottom surfaces that end minute aperture arranged and non-anodic oxidation portion is carried out dry etching, up to non-anodic oxidation portion, thereby be removed.
The manufacture method of the 2nd micro architecture body of the present invention, it is characterized in that, implement successively: prepare by the anodized metallization body, this is carried out anodic oxidation by the anodized metallization body, up to midway, thereby form the operation (A) have in anodic oxidation portion that end minute aperture is arranged by the anodised surperficial upper shed of beginning of anodized metallization body a plurality of and non-anodic oxidation portion; Filler is filled in a plurality of bottoms that end minute aperture is arranged, implements the operation (B) that the finishing that the moisture-proof etching is given in a plurality of sides that end minute aperture arranged is handled; And remove filler, and the anodic oxidation portion between a plurality of bottom surfaces that end minute aperture arranged and non-anodic oxidation portion is carried out wet etching, up to non-anodic oxidation portion, thus the operation that is removed (C).
Preferably, above-mentioned is to be the thing of main component with aluminium (Al) by the anodized metallization body.
In this manual, " main component " is defined as the above composition of content 90 quality %.
Micro architecture body of the present invention possesses: have from the teeth outwards opening and connect to the anodic oxidation object of a plurality of minute apertures at the back side; And the electrical conductor that on the back side of anodic oxidation object, forms, it is characterized in that, be to adopt the manufacture method of the micro architecture body of the invention described above to make.
As the optimal way of micro architecture body of the present invention, the thing of metal has been filled in the bottom at least that can be set forth in above-mentioned a plurality of minute apertures.Preferably, this metal is handled by plating and is filled.
Other optimal ways as micro architecture body of the present invention, can enumerate the thing that above-mentioned a plurality of minute aperture all has the fine metal body, above-mentioned fine metal body is made of the filling part and the protuberance that are filled in the minute aperture, above-mentioned protuberance is outstanding and forms from the surface on above-mentioned filling part, possesses to have than the diameter of filling part greatly and can respond to the head of diameter of the size of local plasma oscillator.
Preferably, above-mentioned fine metal body is to handle by implement plating in a plurality of minute apertures, gives prominence to and the thing of formation from the surface up to a part.
The invention effect
The manufacture method of micro architecture body of the present invention is to being carried out anodic oxidation by the anodized metallization body, up to midway, thereby form and to have a plurality of anodic oxidation portions that end minute aperture arranged and non-anodic oxidation portion, under the situation of residual non-anodic oxidation portion, remove be called the blocking layer in the anodic oxidation portion that has between a plurality of bottom surfaces that end minute aperture arranged and the non-anodic oxidation portion, make the extremely non-anodic oxidation of a plurality of minute apertures perforations portion, thereby anodic oxidation object and the electrical conductor that forms on its back side constitute by the anodic oxidation portion of anodized metallization body and non-anodic oxidation portion by one originally, so can not waste and electrical conductor can not peeled off.
Also have, the operation that connects all is to make a plurality of minute aperture 12 unified perforations by etch processes.In the method that connects by dry etching, because the rectilinear propagation of dry etching, thereby the influence that the side in the minute aperture etc. is brought is little, connects so can stably only remove the blocking layer.Also have, in the method that connects by wet etching, press the not etched mode in side of minute aperture inside, after the enforcement finishing of side, only remove the blocking layer by wet etching, thereby not extremely attenuation of the next door between the hole.Therefore, adopt which kind of etching method method can both implement etch processes and guarantee sufficient connectivity.
Therefore, according to the present invention, can be simply and stably make the micro architecture body that possesses the anodic oxidation object, above-mentioned anodic oxidation object has a plurality of minute apertures, and above-mentioned minute aperture has good connectivity, connects to electrical conductor.
Description of drawings
Fig. 1 (a)～(c) is the stereographic map of manufacturing process of the micro architecture body of expression the 1st embodiment involved in the present invention.
Fig. 2 (a)～(c) is the manufacturing process sectional drawing corresponding with Fig. 1.
Fig. 3 (a) is illustrated in the stereographic map of having filled an example of metal in the minute aperture of micro architecture body of the manufacture method manufacturing of adopting first embodiment involved in the present invention, (b) is the sectional drawing corresponding with (a).
Fig. 4 (a)～(f) is the sectional drawing of manufacturing process of the micro architecture body of expression the 2nd embodiment involved in the present invention.
Fig. 5 is illustrated in the sectional drawing of having filled an example of metal in the minute aperture of micro architecture body of the manufacture method manufacturing of adopting the 2nd embodiment involved in the present invention.
Nomenclature
1～4 micro architecture body
10 by the anodized metallization body
10s is by the anodized metallization surface
11 anodic oxide coatings (anodic oxidation portion, anodic oxidation object)
11s anodic oxide coating surface
The 11r anodic oxide coating back side
12 minute apertures
The bottom of 12b fine holes
13 non-anodic oxidation portions (electrode)
The anodic oxidation portion (blocking layer) of 14b between the bottom surface of minute aperture and non-anodic oxidation portion
20 fine metal bodies
21 filling parts
22 protuberances (head)
31 fillers
32 finishinges
Embodiment
" the 1st embodiment of the manufacture method of micro architecture body "
The 1st embodiment of the manufacture method of micro architecture body involved in the present invention is described with reference to accompanying drawing.Fig. 1 and Fig. 2 are the process picture sheets of expression manufacture method, and Fig. 1 is a stereographic map, and Fig. 2 is the sectional drawing corresponding with Fig. 1.
At first, as by anodized metallization body 10, preparing with aluminium (Al) is main component, can contain trace impurity by anodized metallization body 10 (Fig. 1 (a), Fig. 2 (a)).Shape by anodized metallization body 10 is unrestricted, can enumerate tabular etc.Also having, also can be to use under making by the form of anodized metallization body 10 by the band supporters such as thing of stratiform film forming gained on the supporter.
Secondly, to being carried out anodic oxidation,, form by having a plurality of aluminum oxide (Al that end minute aperture 12 is arranged until midway by anodized metallization body 10
2O
3) layer anodic oxide coating (anodic oxidation portion, anodic oxidation object) 11 that constitutes.Shown in Fig. 1 (b), Fig. 2 (b), anodic oxidation be from surperficial 10s (figure presentation surface) to carrying out oxidizing reaction with the direction of this surface approximate vertical, generate anodic oxide coating 11 with roughly straight minute aperture 12.
Anodic oxidation for example be by anodized metallization body 10 as negative electrode, carbon, aluminium etc. as negative electrode (comparative electrode), are immersed in anodic oxidation to them with in the electrolytic solution, apply between anode and negative electrode that voltage implements.As electrolytic solution, unrestricted, preferably use the acid electrolyte more than a kind or 2 kinds that contains in sulfuric acid, phosphoric acid, chromic acid, oxalic acid, thionamic acid (acid of ス Le Off ア ミ Application), Phenylsulfonic acid, the thionamic acid acid such as (acid of ア ミ De ス Le ホ Application).
The anodic oxide coating 11 that generates by anodic oxidation is to have the thing of overlooking roughly orthohexagonal fine column 14 adjacency of serving as reasons, arranging the structure that forms.Approximate centre position at each fine column 14 has formed minute aperture 12 from surperficial 11s to depth direction.Also have, the bottom surface of each minute aperture 12 and fine column 14 has the shape of band circle as shown in the figure.The structure of the anodic oxide coating that generates by anodic oxidation is recorded in beneficial Tian Xiushu, " adopt anonizing how mesoporous aluminium making and as the application of functional materials ", material technology Vol.15, No.10,1997, p.34 etc.
Anodic oxidation condition non-anodic oxidation portion can be residual scope in suitably design get final product.With the occasion of oxalic acid,, can enumerate concentration of electrolyte 0.5M, 15 ℃ of liquid temperature, input voltage 40V as the condition example that is fit to as electrolytic solution.Change the anodic oxide coating 11 that electrolysis time just can generate any bed thickness.As long as in advance before the anodic oxidation must be thicker by the thickness setting of anodized metallization body 10 than the anodic oxide coating 11 that is generated, non-anodic oxidation portion 13 will be residual, just can obtain in non-anodic oxidation portion 13, being provided with, overlook for many minute apertures 12 of same shape roughly at the 11s upper shed of anodic oxide coating surface, the regularly arranged anodic oxide coating that forms 11 roughly.
Usually, minute aperture 12 pitch each other adjacent to each other can be controlled in the scope of 10～500nm, and the controllable aperture of minute aperture is built in the scope of 5～400nm.Open in 2001-9800 communique and the Te Kai 2001-138300 communique the spy and to have disclosed the formation position of controlling minute aperture more subtly, the method in aperture.Adopt these methods just can roughly arrange regularly and be formed on the minute aperture 12 that has any aperture and the degree of depth in the above-mentioned scope.
Secondly, implement dry etch process and remove the 14b of anodic oxidation portion (blocking layer) between bottom surface that end minute aperture 12 is arranged and non-anodic oxidation portion 13, minute aperture 12 is connected to non-anodic oxidation portion 13, obtain on the back side 11r of the anodic oxide coating 11 of surperficial 11s upper shed gained, possessing the micro architecture body 1 (Fig. 1 (c), Fig. 2 (c)) of the electrical conductor that constitutes by non-anodic oxidation portion 13 at minute aperture 12 as a plurality of communicating poress.As dry etch process, be not particularly limited, can enumerate reactive ion etching etc.The rectilinear propagation height of dry etching, thereby implement dry etching from the peristome side of minute aperture 12, blocking layer 14b can be removed by etching in side that hardly can etching minute aperture 12.At this moment, the surperficial 11s of anodic oxide coating 11 is removed by dry etching, thereby preferably considers the caused amount of removing of dry etching and design the bed thickness of anodic oxide coating 11 in advance.
By the micro architecture body 1 of making present embodiment with upper type.
The manufacture method of the micro architecture body 1 of present embodiment is to being carried out anodic oxidation by anodized metallization body 10, thereby form and to have a plurality of anodic oxide coatings 11 that end minute aperture 12 arranged and non-anodic oxidation portion 13, removing the 14b of anodic oxidation portion between a plurality of bottom surfaces that end minute aperture 12 arranged and non-anodic oxidation portion 13 that is called the blocking layer under the situation of residual non-anodic oxidation portion 13, make the extremely non-anodic oxidation of a plurality of minute apertures 12 perforations portion, thereby anodic oxide coating 11 and the electrical conductor that forms on its back side constitute by the anodic oxidation portion 11 of anodized metallization body 10 and non-anodic oxidation portion 13 by one originally, so can not waste and electrical conductor can not peeled off.
Also have, the operation that connects is to make a plurality of minute aperture 12 unified perforations by etch processes.In the present embodiment that connects by dry etching, because the rectilinear propagation of dry etching, thereby the influence that the side in the minute aperture 12 etc. is brought is little, connects so can stably only remove blocking layer 14b, can implement etch processes and guarantees sufficient connectivity.
Therefore, according to present embodiment, can be simply and stably make the micro architecture body 1 that possesses anodic oxide coating 11, this anodic oxide coating 11 has a plurality of minute apertures 12, and this minute aperture 12 has good connectivity, connects to electrical conductor.
As shown in the figure, micro architecture body 2 is the things that possess the fine metal body 20 that is made of filling part 21 and protuberance 22 in roughly regularly arranged a plurality of minute apertures 12 of micro architecture body 1, fine metal body 20 be non-anodic oxidation portion 13 as electrode, minute aperture 12 is implemented that the electrolysis platings are handled and the thing that forms.
In the occasion of carrying out the electrolysis plating, metal is preferentially separated out from non-anodic oxidation portion 13 1 sides of the minute aperture 12 of electric-field strength.Proceed this electrolysis plating and handle, will be in minute aperture 12 filler metal and form the filling part 21 of fine metal body 20.Form after the filling part 21, proceed the words that the electrolysis plating is handled again, filler metal will overflow from minute aperture 12, but, near because the electric-field strength the minute aperture 12, so metal can continue to separate out from minute aperture 12 peripheries, outstanding from anodic oxide coating surface 11s on filling part 21, form the protuberance 22 that possesses head with diameter bigger than the diameter of filling part 21.In the present embodiment, be that protuberance 22 is by constituting that the head with diameter bigger than the diameter of filling part 21 is formed.
On fine metal body 20, the size of protuberance 22 (head) but, is considered the wavelength of incident light L so long as can respond to the size of local plasma oscillator and get final product, and the diameter of protuberance 22 is the following scope of the above 300nm of 10nm preferably.
Local plasma oscillator phenomenon is because the unbound electron of protuberance and the electric field resonance of light, thereby produce the phenomenon of strong electric field at the protuberance periphery, thereby, as fine metal body 20, be not particularly limited, Au, Ag, Cu, Pt, Ni, Ti etc. be can enumerate, the high Au of electric field reinforcing effect, Ag etc. particularly preferably are.
" the 2nd embodiment of the manufacture method of micro architecture body "
The 2nd embodiment of the manufacture method of micro architecture body involved in the present invention is described with reference to accompanying drawing.Fig. 4 is the process profile diagram of expression manufacture method.
Be to remove the 14b of anodic oxidation portion (blocking layer) between the bottom surface of minute aperture 12 and non-anodic oxidation portion 13 in the 1st embodiment by dry etching, connect to non-anodic oxidation portion 13 and formed minute aperture 12, and be to carry out removing of blocking layer 14b in the 2nd embodiment by wet etching.Except the etching method method, the same with the 1st embodiment, but, compare with dry ecthing method with rectilinear propagation, in wet etching, the part that contacts with etching solution can same reaction and etched, thereby carries out wet etching afterwards by the pre-treatment that the not etched mode of lateral anodic oxidation object of minute aperture 12 only carries out lateral parts is implemented the finishing of elching resistant.This manufacture method below is described.
(operation (A))
The same with the 1st embodiment, at first, as by anodized metallization body 10, preparation is a main component with aluminium (Al), can contain trace impurity by anodized metallization body 10 (Fig. 4 (a), it is implemented anodic oxidation,, form by having a plurality of aluminum oxide (Al that end minute aperture 12 is arranged until midway
2O
3) layer anodic oxide coating 11 (anodic oxidation portion) and non-anodic oxidation 13 (Fig. 4 (b)) of portion that constitute.Anodised optimum condition, material etc. are the same with the 1st embodiment.
(operation (B))
Operation (B) is the side of minute aperture 12 to be implemented the operation of the finishing processing of moisture-proof etching as the pre-treatment of carrying out wet etching process.At first, shown in Fig. 4 (c), fill weighting material 31 at bottom 12b by the mode of the bottom 12b of minute aperture 12 not being carried out finishing.As weighting material 31, handle as long as can protect bottom 12b to avoid finishing, be not particularly limited, can enumerate fusing points such as carbon, Pb, Sn, the Zn metal lower, polystyrene (PS) ball etc. than Al.Waiting the occasion of filling weighting material 31 by evaporation, as shown in the figure, can on the surperficial 11s of anodic oxide coating 11, also adhere to the material the same with weighting material 31.
Preferably only make the bottom 12b of its contact minute aperture 12 and fill weighting material 31.In the occasion etc. of filling weighting material 31 in the side that makes its contact minute aperture 12, to just can not implementing finishing in the side of this part, may only remove blocking layer 14b well by back operation (C).Therefore, preferably, before finishing is handled, minute aperture 12 is implemented reaming (Port ア ワ イ De) handle, enlarge the aperture of minute aperture 12, thereby make weighting material 31 not contact the side of minute aperture 12.Handle as reaming, can enumerate and make weighting material 31 not dissolve, and the constituent material of anodic oxide coating 11 (aluminum oxide) dissolved thing, perhaps compare with the constituent material of anodic oxide coating 11, make and the slow thing (phosphoric acid etc.) of dissolution rate of weighting material 31 make the side dissolved method of minute aperture 12 etc.Secondly, shown in Fig. 4 (d), the side of minute aperture 12 is implemented the finishing 32 of elching resistant.Handle as finishing, get final product so long as the reagent that uses by with respect to wet etching the time becomes the processing that the mode of insoluble carries out finishing to the side, for example can enumerate by the silicate of handling with metso and handle the processing of giving acid-resistant property etc.
(operation (C))
Operation (C) is to remove after the weighting material 31, removes the operation of blocking layer 14b by wet etching.
At first, shown in Fig. 4 (e), remove the weighting material 31 of filling and expose blocking layer 14b at the bottom of minute aperture 12 12b.As the method for removing of weighting material 31, only otherwise remove finishing 32 but remove weighting material 31 and get final product, be not particularly limited, adopt preferable methods to get final product according to the material of weighting material 31.Be the occasion of carbon for example in weighting material 31 grades, for the occasion of low-melting metal, remove by thermal treatment, being that occasion such as PS ball adopts organic solvent etc., its dissolving is removed get final product.On the surperficial 11s of anodic oxide coating 11, adhered to the occasion of the material the same, also this attachment material and weighting material 31 have been removed simultaneously with weighting material 31.
Secondly, shown in Fig. 4 (f), remove non-anodic oxidation portion 13 by wet etching, minute aperture 12 is connected to blocking layer 14b, obtain on the back side of the anodic oxide coating 11 of surperficial 11s upper shed, possessing the micro architecture body 3 of the electrical conductor that constitutes by non-anodic oxidation portion 13 at minute aperture 12 as a plurality of communicating poress.As wet etch solution,, can enumerate phosphoric acid etc. as long as the constituent material (aluminum oxide) of solubilized anodic oxide coating 11 is not particularly limited.
By the micro architecture body 3 of making present embodiment with upper type.
The manufacture method of the micro architecture body 3 of present embodiment be except the perforation operation difference of minute aperture 12 with the much the same method of above-mentioned micro architecture body 1, also the not etched mode in side in wet etching by the inside of minute aperture 12, after the enforcement finishing of side, only remove blocking layer 14b, thereby can implement etch processes and not extremely attenuation of next door between the hole, guarantee sufficient connectivity.Therefore, have the effect the same with the manufacture method of above-mentioned micro architecture body 1, also be in the present embodiment, can be simply and stably make the micro architecture body 3 that possesses anodic oxide coating 11, this anodic oxide coating 11 has a plurality of minute apertures 12, this minute aperture 12 has good connectivity, connects to electrical conductor.
As shown in the figure, micro architecture body 4 is except having the finishing 32 formation the same with micro architecture body 2 on the side of minute aperture 12, thereby can adopt the method the same with micro architecture body 2 to make, and its effect too.Therefore, micro architecture body 4 also can be applied to senser element, surface-enhanced Raman device etc. as the electric field enhance device that produces the local plasma oscillator by means of the irradiation of light on the fine metal body.
(design alteration example)
The anodic oxidation portion that micro architecture body has been described in the above-described embodiment is the situation of anodic oxide coating, but, also goes for having the micro architecture body of anodic oxide coating anodic oxidation object in addition.
Also have,, only enumerated Al, but, also can use and to carry out anodised any metal as by the main component of anodized metallization body 10.As the anodised metal that carries out beyond the Al, can enumerate Ti, Ta, Hf, Zr etc.Also having, also can be to contain the thing that can carry out anodised metal more than 2 kinds by anodized metallization body 10.
Adopting anodised occasion,, also can obtain the low structure of systematicness according to the difference of condition.The concavo-convex metal substrate that service regulations are low, the micro architecture body that obtains with the method the same with above-mentioned embodiment is also contained among the present invention.
Also have, be illustrated for the situation that possesses the fine metal body 20 that is made of filling part 21 and protuberance 22 in a plurality of minute apertures 12 of micro architecture body 1 and micro architecture body 3, but, the filling morphology of metal is not particularly limited.
Industrial applicibility
Micro architecture body of the present invention can be applicable to the middle sensings of using such as biology sensor well Device, raman spectroscopy device.
Claims (9)
1. the manufacture method of a micro architecture body is characterized in that,
Preparation is by the anodized metallization body,
This is carried out anodic oxidation by the anodized metallization body,, has in anodic oxidation portion that end minute aperture is arranged by the anodised surperficial upper shed of beginning of anodized metallization body a plurality of and non-anodic oxidation portion thereby form up to midway,
Above-mentioned anodic oxidation portion between above-mentioned a plurality of bottom surfaces that end minute aperture arranged and above-mentioned non-anodic oxidation portion is carried out dry etching,, thereby be removed up to above-mentioned non-anodic oxidation portion.
2. the manufacture method of micro architecture body according to claim 1 is characterized in that, above-mentioned dry etching is a reactive ion etching.
3. the manufacture method of a micro architecture body is characterized in that, implements successively:
Preparation is by the anodized metallization body, this is carried out anodic oxidation by the anodized metallization body, up to midway, thereby form the operation (A) have in anodic oxidation portion that end minute aperture is arranged by the anodised surperficial upper shed of beginning of anodized metallization body a plurality of and non-anodic oxidation portion;
Filler is filled in above-mentioned a plurality of bottom that end minute aperture is arranged, implements the operation (B) that the finishing that the moisture-proof etching is given in above-mentioned a plurality of sides that end minute aperture arranged is handled; And
Remove above-mentioned filler, the above-mentioned anodic oxidation portion between above-mentioned a plurality of bottom surfaces that end minute aperture arranged and above-mentioned non-anodic oxidation portion is carried out wet etching, up to above-mentioned non-anodic oxidation portion, thus the operation that is removed (C).
4. according to the manufacture method of any described micro architecture body in the claim 1～3, it is characterized in that above-mentioned is to be the thing of main component with aluminium (Al) by the anodized metallization body.
5. micro architecture body possesses:
Have from the teeth outwards opening and connect to the anodic oxidation object of a plurality of minute apertures at the back side; And the electrical conductor that on the back side of this anodic oxidation object, forms,
It is characterized in that,
Be to adopt the manufacture method of any described micro architecture body in the claim 1～3 to make.
6. micro architecture body according to claim 5 is characterized in that, has filled metal in the bottom at least of above-mentioned a plurality of minute apertures.
7. micro architecture body according to claim 6 is characterized in that, above-mentioned metal is handled by plating and filled.
8. micro architecture body according to claim 5, it is characterized in that, above-mentioned a plurality of minute aperture all has the fine metal body, above-mentioned fine metal body is made of the filling part and the protuberance that are filled in the above-mentioned minute aperture, above-mentioned protuberance is outstanding and forms from above-mentioned surface on above-mentioned filling part, possesses to have than the diameter of above-mentioned filling part greatly and can respond to the head of diameter of the size of local plasma oscillator.
9. micro architecture body according to claim 8 is characterized in that, above-mentioned fine metal body is to handle by implement plating in above-mentioned a plurality of minute apertures, gives prominence to and the thing of formation from above-mentioned surface up to a part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007122537A JP2008272912A (en) | 2007-05-07 | 2007-05-07 | Fine structure body and its manufacturing method |
| JP2007-122537 | 2007-05-07 |
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| CN101302639A true CN101302639A (en) | 2008-11-12 |
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| CNA2008100887895A Pending CN101302639A (en) | 2007-05-07 | 2008-05-07 | Microstructure body and manufacturing method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103460395A (en) * | 2011-04-05 | 2013-12-18 | 富士胶片株式会社 | Metal substrate having insulating layer, method for manufacturing same, and semiconductor device |
| CN105492659A (en) * | 2013-08-30 | 2016-04-13 | 富士胶片株式会社 | Method for manufacturing metal-filled microstructure |
| CN105934540A (en) * | 2014-01-31 | 2016-09-07 | 富士胶片株式会社 | Method for manufacturing aluminum plate, aluminum plate, collector for storage device, and storage device |
| CN109652838A (en) * | 2018-12-27 | 2019-04-19 | 浙江工业大学 | A kind of method of titanium-niobium alloy surface anodization coloring |
| CN110042448A (en) * | 2019-04-30 | 2019-07-23 | 铜仁学院 | A kind of preparation method of porous anodic alumina template |
| CN110997988A (en) * | 2017-07-18 | 2020-04-10 | Imec 非营利协会 | The valve metal layer is transformed into a template comprising a plurality of spaced (nano) channels and forming therein a spacer structure |
| CN113466505A (en) * | 2020-03-30 | 2021-10-01 | 普因特工程有限公司 | Anodic oxide film structure |
-
2007
- 2007-05-07 JP JP2007122537A patent/JP2008272912A/en not_active Withdrawn
-
2008
- 2008-05-07 CN CNA2008100887895A patent/CN101302639A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103460395A (en) * | 2011-04-05 | 2013-12-18 | 富士胶片株式会社 | Metal substrate having insulating layer, method for manufacturing same, and semiconductor device |
| CN103460395B (en) * | 2011-04-05 | 2016-09-07 | 富士胶片株式会社 | With the metal substrate of insulating barrier and manufacture method thereof and semiconductor device |
| CN105492659A (en) * | 2013-08-30 | 2016-04-13 | 富士胶片株式会社 | Method for manufacturing metal-filled microstructure |
| CN105934540A (en) * | 2014-01-31 | 2016-09-07 | 富士胶片株式会社 | Method for manufacturing aluminum plate, aluminum plate, collector for storage device, and storage device |
| CN110997988A (en) * | 2017-07-18 | 2020-04-10 | Imec 非营利协会 | The valve metal layer is transformed into a template comprising a plurality of spaced (nano) channels and forming therein a spacer structure |
| US20210174982A1 (en) * | 2017-07-18 | 2021-06-10 | Imec Vzw | Porous Solid Materials and Methods for Fabrication |
| CN110997986B (en) * | 2017-07-18 | 2022-11-15 | Imec 非营利协会 | Porous solid material and preparation method |
| US11618966B2 (en) * | 2017-07-18 | 2023-04-04 | Imec Vzw | Porous solid materials and methods for fabrication |
| US11827992B2 (en) | 2017-07-18 | 2023-11-28 | Imec Vzw | Transforming a valve metal layer into a template comprising a plurality of spaced (nano)channels and forming spaced structures therein |
| CN109652838A (en) * | 2018-12-27 | 2019-04-19 | 浙江工业大学 | A kind of method of titanium-niobium alloy surface anodization coloring |
| CN109652838B (en) * | 2018-12-27 | 2021-05-18 | 浙江工业大学 | Titanium-niobium alloy surface anodic oxidation coloring method |
| CN110042448A (en) * | 2019-04-30 | 2019-07-23 | 铜仁学院 | A kind of preparation method of porous anodic alumina template |
| CN113466505A (en) * | 2020-03-30 | 2021-10-01 | 普因特工程有限公司 | Anodic oxide film structure |
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