CN101299111B

CN101299111B - Lighting device and liquid crystal screen having such a lighting device

Info

Publication number: CN101299111B
Application number: CN2007101397723A
Authority: CN
Inventors: G·迪亚曼蒂迪斯
Original assignee: Noctron S A R L
Current assignee: Noctron S A R L; Noctron Holding SA
Priority date: 2007-05-04
Filing date: 2007-07-31
Publication date: 2012-07-18
Anticipated expiration: 2027-07-31
Also published as: CN101299111A; DE102007026795A1

Abstract

The device (10) has a light guiding unit (12), which is limited by parallel main surfaces (14), where one of the main surfaces is arranged at a distance to the other surface. Illuminants (28) are arranged in such a manner that light emitted from the illuminants are coupled into the guiding unit. A reflection device (53) is provided on a side of the former main surface, and reflects the light in the direction to the interior of the guiding unit, where the reflection device has a reflector substrate (48) arranged on the side of the former surface, and a coupling layer and a reflection particle.

Description

Lighting device and LCDs with this lighting device

Technical field

The present invention relates to a kind of like claim 1 lighting device as described in the preamble and like claim 21 LCDs as described in the preamble.

Background technology

LCDs is also referred to as LCD display usually, because its flat structure more and more receives an acclaim.

This LCD display comprises a liquid crystal panel by the lighting device lighting of above-mentioned form.For this known lighting device as using neon tube/flurorescent tube light-emitting structure.Said neon tube needs more energy on the one hand, the parts that also need add on the other hand, and like hole reverberator (Lochreflektor), Fresnel lens and in most cases a plurality of scatter filter, they are arranged between liquid crystal display and the neon tube.

But because this structure, the contrast and the brightness of the image that can discern on usually can the visual side to LCD display have a negative impact.Because making the intensity of the light that is sent by lighting device arrive liquid crystal panel at said light, scatter filter weakened about 10% in the past.The effect of hole shadow mask (Lochmaske) is also stronger.Because the hole shadow mask is absorbed about 25% to 30% light that sends from lighting device, therefore has only corresponding less light component to arrive and want liquid crystal panel to be illuminated.In addition because the hole reverberator also disadvantageous interference effect can occur.

In order to compensate this interference effect and, to be provided with Fresnel lens in order to improve the possible contrast of discernible image on the visual side of LCD display.But this lens also play a part to reduce to this angle, can observe display screen with this angle, can discern the image that is produced by display screen well.

Therefore there is the expectation that obtains such lighting device; In this lighting device; Can abandon using above-mentioned correcting unit basically; But this lighting device still is suitable as the bias light in the LCDs, has good luminosity (Leuchtkraft) and has very flat structure.

In addition, also require to have characteristic recited above more and more at the lighting device of the lamp form that is used for indoor or ambient lighting, because can realize respective performances good optical device through flat design.But desired flat structure often can not make the luminosity coordinating and unifying mutually with required lighting device.

Summary of the invention

Therefore the objective of the invention is, realize a kind of lighting device of above-mentioned form, this lighting device has been considered above-mentioned imagination.

This purpose is achieved through the lighting device with claim 1 characteristic.

Through using the semiconductor light emitting chip, need not be used to proofread and correct the parts of light capable of using basically, so lighting device can design to such an extent that have more flat structure than the lighting device of traditional above-mentioned form generally as ray structure.

Provide favourable improvement project in the dependent claims.

Measure through claim 2 can realize that the thickness of lighting device can not receive the influence of the layout of semiconductor light emitting chip.

Here, if relate in the optically-coupled tablet shape photocon, the semiconductor light emitting chip then is favourable when according to claim 3 or claim 4 layout.

Being input to the ratio in the plate shape light-conductor component in order to improve the optically-coupled that the semiconductor light emitting chip sends, is favourable according to the measure of claim 5.

Measure through according to claim 6 and 7 can realize from the semiconductor light emitting chip to the good light transmission of plate shape light-conductor component.Silicon materials for example can be silicone oil.Also can use the flexible silicon material.For example at first can use liquid silicone oil to surround the semiconductor light emitting chip, said silicone oil is added with rigidizer for this reason, and silicone oil becomes viscoelastic material at the certain hour after coagulation thus.

If optical wavelength of being emitted by the semiconductor light emitting chip and desired wavelength are inconsistent, then can adjust said wavelength through the measure of claim 8.The phosphorus particle absorbs the light that arrives on it and also emits beam with another wavelength at least.That is, when suitably selecting phosphorus particle or phosphorus granulate mixture, can make the light that sends by the semiconductor light emitting chip convert light to another spectrum.

Measure according to claim 9 guarantees the favourable even distribution of phosphorus particle.

In order to improve the luminous quantity (Lichtausbeute) of the light that sends through its first interarea by lighting device, be favourable according to the measure of claim 10.It is favourable forming according to each described reflection unit in the claim 11 to 14 at this.Especially the measure through claim 12 can realize strong reflecting effect.Measure through claim 13 advantageously further improves reflecting effect.

For the cardboard according to claim 14, verified as surface density that in claim 15, provide is favourable.

In order to keep by reflection unit along the light of the direction of second interarea of plate shape photocon reflection because originally to reflect the loss that causes on one's body at second interarea of said plate shape photocon as far as possible little, second interarea that as in claim 16, providing, constitutes tabular light-conductor component is favourable.

Said plate shape light-conductor component is preferably by processing at one of material described in the claim 17.

In order to obtain high illuminating device luminous degree, lighting device constitutes according to claim 18.Can be used for the light that sends from lighting device is carried out white balance in this measure according to claim 19 and 20.Can abandon surrounding the phosphorus particle of semiconductor light emitting chip in this case in case of necessity.

The object of the invention is still realized a kind of LCDs of above-mentioned form, and this LCDs has been considered the relevant therewith difficulty that proposes.

Said purpose realizes through the LCDs with claim 21 characteristic.

Measure through claim 22 realizes good light transmission between lighting device and liquid crystal panel.

Description of drawings

Describe embodiments of the invention in detail by means of accompanying drawing below.In the accompanying drawing:

Fig. 1 illustrates first embodiment of lighting device with the vertical view of partly cut-away,

The online II-II of lighting device that Fig. 2 illustrates among Fig. 1 goes up cut-open view,

Fig. 3 illustrates second embodiment of lighting device with vertical view,

Fig. 4 illustrates the cut-open view on the online IV-IV of lighting device among Fig. 3,

Fig. 5 illustrates the 3rd embodiment of lighting device with the sectional view corresponding to Fig. 4,

Fig. 6 illustrates the liquid crystal display of LCDs with the vertical view of partly cut-away, has the lighting device according to Fig. 1 that is arranged on below it,

Fig. 7 illustrates liquid crystal display and the cut-open view on the online VII-VII of lighting device among Fig. 6.

Embodiment

At lighting device 10 shown in Fig. 1 and 2, it comprises the LGP 12 by transparent propene acids glass one-tenth.This LGP 12 also can be processed by the material of other even printing opacity, for example by glass or epoxy resin.This LGP 12 is preferably limpid.

Said LGP 12 has first interarea 14, irradiates the using light that is produced by lighting device 10 through said first interarea.Have second interarea 16 (referring to Fig. 2) at the above LGP 12 of a relative side, it has the surfaceness of representing with sawtooth, below said roughness, also will describe in detail.

On two relative outward

flanges

18 and 20, said LGP 12 support respectively one have a

U-shaped cross-section housing

22 and 24 and do not have to specify specially the end wall of Reference numeral here.One side of said

housing

22 and 24 respective openings has LGP 12 on the direction of correspondingly adjacent outward

flange

18 and 20.

Be that example specifies

housing

22 and 24 only below with housing 22.Explanation to it is equally applicable to housing 24.

Housing 22 limits an inner space 26 with the outward flange 18 of fixed head 12, and a plurality of semiconductor light emitting chips 28 are set therein, wherein in Fig. 1, has only a semiconductor light emitting chip to be furnished with Reference numeral.

Said semiconductor light emitting chip 28 for example can comprise a n type conductive layer and the p type conductive layer of being made up of III-V semiconductor material such as p type GaN be made up of n type GaN or n type InGaN, as known that kind.Between this n type conductive layer and this p type conductive layer, mqw layer can be set.MQW is the abbreviation of " Multiple Quantum Well (MQW) ".The MQW material constitutes a kind of superlattice

, and it has the electronic band structure/band structure that changes according to superlattice structure, and correspondingly in the bright dipping that issues of other wavelength.Through selecting mqw layer, can on purpose influence the spectrum of the light that sends by p-n semiconductor light emitting chip.

The inner space 26 of housing 22 is filled with the photoconduction liquid of liquid silicone oil 30 forms, and this silicone oil is represented with circle in the drawings, and will be guided to the outward flange 34 of LGP 12 by the light that semiconductor light emitting chip 28 sends.In addition, can outwards distribute through silicone oil 30, especially the wall to housing 28 distributes the heat that is produced by semiconductor light emitting chip 28.

The semiconductor light emitting chip of being made up of p-GaN/n-InGaN 28 sends ultraviolet light and sends blue light with the wavelength coverage from 420nm to 480nm when applying voltage.In order to produce white light through semiconductor light emitting chip 28, in silicone oil 30, be distributed with phosphorus particle 32 equably, said phosphorus particle is processed by the transparent solid material with look center.Said phosphorus particle 32 uses than representes the circular little circle of silicone oil 30 to represent in the drawings.Phosphorus particle 32 also can be the potpourri of multiple different phosphate particle.That is, through suitably selecting phosphorus particle or phosphorus granulate mixture that the light that sends from semiconductor light emitting chip 28 is converted to have the light with the spectrum of the Spectral matching of hoping.Be appreciated that lighting device 10 sends blue light if economize dephosphorization particle 32.

Said semiconductor light emitting chip 28 be parallel connection and through two

supply lines

34 and 36 on-load voltages.For this reason,

supply line

34 and 36 end at can be approaching from the

outside joint

38 or 40 in.For the sake of clarity, said

supply line

34 and 36 does not illustrate in Fig. 2.Said semiconductor light emitting chip 28 also can be connected.

The inwall of said housing 22 is furnished with reflection horizon 42, will be reflexed on LGP or its outward flange 18 along the light that sends that leaves LGP 12 directions by semiconductor light emitting chip 28 thus.

Particularly as shown in Figure 2, said LGP 12 is bearing on the wall that does not mark Reference numeral specially of another housing 44 here and is similar to the lid that forms housing with its second interarea 16.The second surface 16 of this housing 44 and LGP 12 limits an inner space 46 thus.On second interarea 16 of LGP 12, apply one have layer 50 the white of processing with silicon materials cardboard 48, said silicon materials are represented with circle equally.

The silicone oil that for example adopts thickness is as said silicon materials.For this reason, the cardboard 48 of white with the viscous silicone dipping of layer 50, was pressed onto it on second interarea 16 of optical plate 12 with roller before being applied on the optical plate 12 then under pressure.Here have to be noted that through roller pressure can with might be present in the silicone oil of layer 50 and the bubble extrusion between cardboard 48 and the optical plate 12.The cardboard 72 of white is fixed on second interarea 16 of optical plate 12 through the adhesive attraction of the silicone oil of layer 50

The silicone oil that replaces thickness, layer 50 also available one viscoelastic silicon matter are processed.For this reason, cardboard 48 can be with thin silicone oil dipping before being applied on the optical plate 12, and this silicone oil is mixing with rigidizer in advance.Thus, after being applied to cardboard 48 on the optical plate 12, silicone oil can harden into flexible silicon matter, and here, the light transmission of silicon materials can be therefore not undermined.

In a modification, said layer 50 can for example be processed by epoxy resin or vibrin by processing at the resin of hardening state printing opacity, and said resin is represented with circle equally.

For example, can on second interarea 16 of optical plate 48, apply the layer of processing by the liquid resin that is provided with rigidizer 50.Lay cardboard 48 before layer 50 sclerosis that resin is processed, after this, these scraps of paper are fixed later at hardening of resin.

In order to improve reflecting effect, the reflection grain 51 of in the layer of processing by silicone oil or resin 50, distribute equably scandium oxide for example or zinc sulphide form.Reflection grain 51 is represented by the inner point of the circle of expression silicon layer or resin bed 50.

If layer 50 is processed by the resin that wherein is distributed with reflection grain 51, then compare with adopting the layer of processing by silicone oil 74, improved reflecting effect, and the ratio of on first interarea 14 of LGP 12, leaving the light capable of using of LGP 12 increases.

The surface density of said white cardboard 48 is 50g/m ²To 200g/m ², preferred 80g/m ²To 170g/m ², preferred 100g/m ²To 150g/m ², especially be preferably 120g/m ²

On the side of cardboard 48, be provided with additional reflection horizon 52 away from silicone oil 50, can with for example from the mirror film of pasting or or even the form of white plastic film said reflection horizon is set.

The sandwich structure that this layer of being processed by reflection horizon 52, cardboard 48 and silicone oil or resin 50 is formed is covered by housing 44, and the bottom 54 of its middle shell abuts on the reflection horizon 52.Housing 54, cardboard 48, layer 50 and reflection horizon 52 are formed on LGP second outside 16, leaving the reflection of light device of LGP 12 jointly.

Another embodiment at lighting device 10 ' shown in Fig. 3 and 4.In Fig. 3 and 4, the parts that combined Fig. 1 and 2 to describe have same Reference numeral.

Particularly as shown in Figure 4; Said lighting device 10 ' is with difference according to the lighting device 10 of Fig. 1 and 2; Said semiconductor light emitting chip 28 is not that side direction externally is arranged on the outward flange 18 of

LGP

12 or 20 next door, and is arranged on from the inside of the recessed groove 56 of first interarea 14 of LGP 12.Internal semiconductor luminescence chip 28 at groove 56 is surrounded by silicon materials 30 and equally distributed therein phosphorus particle 32 equally.If silicon materials are mobile bigger silicone oil 30, be arranged on the covering part 58 that dots among Fig. 4 then can for groove 56.If silicon materials 30 are to have enough viscoelastic material, then can save said covering part 58.

In a unshowned modification of lighting device 10 ', said groove 56 is positioned on second outside 16 of LGP 12.

At lighting device shown in Fig. 5 10 " another embodiment of form.In Fig. 5, the parts that combined Fig. 1 to 4 to describe have same Reference numeral.

Different with lighting device 10 and 10 '; At lighting device 10 " in be provided with two LGP 12a and 12b, said two LGPs are being arranged to be parallel to each other under the situation of the certain distance between the outward flange 20b of outward flange 20a that remains on LGP 12a and LGP 12b and in a plane.

Said semiconductor light emitting chip 28 is provided with such reservation in the intermediate space that, and is surrounded by the silicone oil that is mixed with phosphorus particle 32 30.

As shown in Figure 5, here at LGP 12a, also be distributed with phosphorus particle 32 in the silicone oil 50 between 12b and the cardboard 48.

Three described

lighting devices

10,10 ', 10 in the above " in; semiconductor light emitting chip 28 is arranged to respectively, and said semiconductor light emitting chip is arranged on by between the plane of first interarea, 14 regulations of LGP and the plane of being stipulated by second interarea 16 of LGP with respect to LGP 12.

As stated, make second interarea, 16 roughenings of LGP 12.This surfaceness is positioned at the order of magnitude that is reflexed to this lip-deep light wavelength by

reflection unit

44,48,50,52.Said roughness is preferably in the order of magnitude of 100 μ m to 500 μ m, preferably from 200 μ m to 400 μ m, preferably from 300 μ m to 500 μ m's.

Second interarea, 16 such roughness through LGP 12 realize the antireflection effect; Thus; By

reflection unit

44,48,50,52 once more the light of the reflection of the direction on the optical plate 12 can be partly once more by crossing LGP 12 reflection itself, and can not be utilized again thus.The total light yield that like this, finally leaves the light of LGP 12 through first interarea 30 is improved.

At

lighting device

10,10 ', 10 " all embodiment in, the silicone oil 30 that surrounds semiconductor light emitting chip 28 directly contacts with the respective

outer edges

18 or 20 of LGP 12.Guarantee that thus the light that is sent by semiconductor light emitting chip 28 is coupled reliably and is input in the LGP 12.Do not have 30 of silicone oil to have such danger, that is, the part that the light that sends from semiconductor light emitting chip 28 is bigger is reflected by the respective outer edges 18 of

LGP

12 or 20 and is not capable of using.

Adjusting is from

lighting device

10,10 ', 10 " the another kind of possibility of the light that sends is, uses different types of semiconductor light emitting chip 28.The for example main semiconductor light emitting chip 28 that sends blue light of installing.But additionally can also use the semiconductor light emitting chip 28 that sends ruddiness and green glow.Through correspondingly luminous power separately being coordinated to realize white balance.

Also can use the semiconductor light emitting chip 28 that sends UV light.But on first interarea 14, apply the UV filter house.

Above-mentioned

lighting device

10,10 ' and 10 " can be used as independently ray structure use, for example be used for room lighting.But in addition, through

lighting device

10,10 ' and 10 " also good background illumination is provided for LCDs.This point illustrates to example lighting device 10 by means of Fig. 6 and 7 explanations in said accompanying drawing.

Particularly as shown in the cut-open view shown in Fig. 7, in the front of first interarea 14 of the LGP 12 of lighting device 10 liquid crystal panel 60 is installed, it has the visual side 62 on plane and the side 64 relative with it.Liquid crystal panel 60 itself is known, therefore no longer it is further explained at this.

Lighting device 10 is arranged on the side 64 of liquid crystal panel 60 like this, that is, make first interarea 14 of LGP 12 be parallel to liquid crystal panel 60 extensions.Between the side 64 of first interarea 14 of LGP 12 and liquid crystal panel 60, be provided with the layer of processing by the silicone oil or the flexible silicon matter of thickness 66.These silicon materials are here also represented with circle.Can be through add the layer 66 that the rigidizer acquisition is processed by the flexible silicon material to thin silicone oil.This layer 66 directly contacts with first interarea 14 of LGP 12 and with the surface of liquid crystal display 60 on side 62.

In a kind of modification, also can by resin, for example by epoxy resin or vibrin process the layer 66.In this case, can obtain layer 66, add rigidizer to said resin for this reason, as itself is known through the hardening of resin that applies liquidly.

On first interarea 14 of LGP 12, send high-intensity uniform light through lighting device 10, through the layer of processing by the silicon matter of silicone oil or viscosity 66 said light is delivered to

liquid crystal panel

60, and 64 pairs of liquid crystal displays throw light on from its side.

At the known background lighting installation that is used for liquid crystal display; Use additional parts; Like hole reverberator mask, Fresnel lens and scattering wave filter; Said

lighting device

10,10 ' and 10 " compare with this known background lighting installation and to have good luminosity, guarantee that simultaneously liquid crystal panel 60 has bigger angle of visibility, in said angle of visibility, still can discern the image that produces by liquid crystal panel well.

In addition, said semiconductor light emitting chip 28 and other light source, as start described neon tube and compare and more save the energy.

When the seamed edge length of the outward flange 18 of

LGP

12 or 20 during near 50cm, along corresponding

outward flange

18 or 20 or just enough usually at four semiconductor light emitting chips 28 of groove 56 set inside.

Consider the quantity of its size and semi-conductor chip 28, said

lighting device

10,10 ' and 10 " can process by multiple various structure.

Said

lighting device

10,10 ' and 10 " for example can process with the seamed edge length of LGP 12

outward flanges

18,20 of seven interconnective semiconductor light emitting chips 28, about 100cm and LGP 12 width of about 20cm.The seamed edge length of the

outward flange

18,20 of said LGP 12 for example can change between 10cm to 200cm, and the width of LGP 12 for example can change between 1cm to 20cm.

Owing to adopt semiconductor light emitting chip 28, said

lighting device

10,10 ' and 10 " power input (Aufnahmeleistung) less.

Claims

1. lighting device has

A) light-conductor component of a plate shape (12), this light-conductor component limits first interarea (14) with second interarea (16) that the first main surface parallel ground is provided with at interval;

B) ray structure (28), said ray structure are arranged so that the optically-coupled of sending from ray structure (28) is input to the light-conductor component (12) of plate shape,

Said ray structure (28) comprises the semiconductor light emitting chip (28) that at least one is luminous when on-load voltage,

Wherein, On this side of second interarea (16) of plate shape light-conductor component (12), be provided with reflection unit (44,48,50,52), said reflection unit is along the light of being launched by second interarea (16) of tabular light-conductor component (12) towards the inner direction reflection of plate shape light-conductor component (12)

It is characterized in that,

Said reflection unit (44,48,50,52) comprises the layer (50) that perhaps is formed from a resin by silicon materials, and said layer is second interarea (16) of contact plate shape light-conductor component (12) directly,

Said reflection unit (44,48,50,52) comprises reflection horizon (52),

Said reflection unit (44,48,50,52) comprises and is arranged on reflection horizon (52) and by the cardboard (48) of silicon materials or the white of layer between (50) that is formed from a resin.

2. lighting device as claimed in claim 1 is characterized in that said lighting device is used for the background illumination of liquid crystal panel (60).

3. lighting device as claimed in claim 1 is characterized in that, said silicon materials are silicone oil or flexible silicon matters of thickness.

4. lighting device as claimed in claim 1 is characterized in that, said resin is epoxy resin or vibrin.

5. lighting device as claimed in claim 1 is characterized in that, said semiconductor light emitting chip (28) is arranged between the plane and the plane by second interarea (16) regulation by first interarea (14) regulation with respect to the light-conductor component (12) of plate shape.

6. lighting device as claimed in claim 5 is characterized in that, outward flange (18, the 20) next door of the laterally disposed light-conductor component plate shape of said semiconductor light emitting chip (28) (12).

7. lighting device as claimed in claim 5 is characterized in that, said semiconductor light emitting chip (28) is arranged in the groove (56) among in the interarea (14,16) of plate shape light-conductor component (12).

8. lighting device as claimed in claim 1; It is characterized in that; One reflection horizon (42) is relative at least partly with at least one side of said semiconductor light emitting chip (28), and said reflection horizon is along the light that is sent by semiconductor light emitting chip (28) towards the inner direction reflection of plate shape light-conductor component (12).

9. lighting device as claimed in claim 1 is characterized in that, said semiconductor light emitting chip (28) is surrounded by optical material (30), and said optical material directly contacts the light-conductor component (12) of said plate shape.

10. lighting device as claimed in claim 9 is characterized in that, said optical material (30) is silicon materials.

11. lighting device as claimed in claim 10 is characterized in that, said silicon materials are silicone oil or flexible silicon matter.

12. lighting device as claimed in claim 1; It is characterized in that; At least partly by equally distributed phosphorus particle (32) encirclement basically, said phosphorus particle absorbs the light that is sent by semiconductor light emitting chip (28) to said semiconductor light emitting chip (28), and itself sends the light of another wavelength.

13. like each described lighting device in the claim 9 to 11; It is characterized in that; Said semiconductor light emitting chip (28) is at least partly by equally distributed phosphorus particle (32) encirclement basically; Said phosphorus particle absorbs the light that is sent by semiconductor light emitting chip (28), and itself sends the light of another wavelength, and said phosphorus particle (32) is distributed in the said optical material (30).

14. lighting device as claimed in claim 1 is characterized in that, said reflection horizon (52) are mirror films.

15. lighting device as claimed in claim 14 is characterized in that, said mirror film is the white mirror facial mask.

16. lighting device as claimed in claim 1 is characterized in that, in the said layer (50) that perhaps is formed from a resin by silicon materials, is distributed with reflecting material (51) basically equably.

17. lighting device as claimed in claim 16 is characterized in that, said reflecting material (51) is scandium oxide or zinc sulphide.

18. lighting device as claimed in claim 1 is characterized in that, the surface density of said cardboard (48) is 50g/m ²To 200g/m ²

19. lighting device as claimed in claim 18 is characterized in that, the surface density of said cardboard (48) is 80g/m ²To 170g/m ²

20. lighting device as claimed in claim 19 is characterized in that, the surface density of said cardboard (48) is 100g/m ²To 150g/m ²

21. lighting device as claimed in claim 20 is characterized in that, the surface density of said cardboard (48) is 120g/m ²

22. lighting device as claimed in claim 1 is characterized in that, second interarea (16) of said plate shape light-conductor component (12) is local at least to have the order of magnitude and is the surfaceness from 100 μ m to 500 μ m.

23. lighting device as claimed in claim 22 is characterized in that, second interarea (16) of said plate shape light-conductor component (12) is local at least to have the order of magnitude and is the surfaceness from 200 μ m to 500 μ m.

24. lighting device as claimed in claim 23 is characterized in that, second interarea (16) of said plate shape light-conductor component (12) is local at least to have the order of magnitude and is the surfaceness from 300 μ m to 500 μ m.

25. lighting device as claimed in claim 24; It is characterized in that second interarea (16) of said plate shape light-conductor component (12) part at least has by reflection unit (44,48; 50,52) reflex to the surfaceness of the order of magnitude of the light wavelength on second interarea.

26. lighting device as claimed in claim 1 is characterized in that, said plate shape light-conductor component (12) is processed by glass or epoxy resin.

27. lighting device as claimed in claim 26 is characterized in that, said glass is acrylic compounds glass.

28. lighting device as claimed in claim 1 is characterized in that, said ray structure (28) comprises a plurality of semiconductor light emitting chips (28).

29. lighting device as claimed in claim 28 is characterized in that, at least two semiconductor light emitting chips (28) send different spectrum.

30. lighting device as claimed in claim 29; It is characterized in that; At least one semiconductor light emitting chip (28) sends blue light, at least one semiconductor light emitting chip (28) sends ruddiness and sends green glow with at least one semiconductor light emitting chip (28), produces the mixed light of white basically thus.

31. a LCDs, it comprises

A) one have the visual side in plane (62) liquid crystal panel (60),

B) lighting device (10,10 ', 10 ") is used up the side (64) that liquid crystal panel (60) is deviated from visual side (62) through said lighting device and is loaded,

It is characterized in that,

C) like the said lighting device of each said design in the claim 1 to 30 (10,10 ', 10 ").

32. LCDs as claimed in claim 31 is characterized in that, between first interarea (14) of LGP (12) and liquid crystal panel (60), is provided with by silicon materials or the layer (66) that is formed from a resin.

33. LCDs as claimed in claim 32 is characterized in that, said silicon materials are silicone oil or the flexible silicon matters that glue.

34. LCDs as claimed in claim 32 is characterized in that, said resin is epoxy resin or vibrin.