CN101294983A - Multi-layer electric probe structure and production method thereof - Google Patents

Multi-layer electric probe structure and production method thereof Download PDF

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Publication number
CN101294983A
CN101294983A CNA200710102133XA CN200710102133A CN101294983A CN 101294983 A CN101294983 A CN 101294983A CN A200710102133X A CNA200710102133X A CN A200710102133XA CN 200710102133 A CN200710102133 A CN 200710102133A CN 101294983 A CN101294983 A CN 101294983A
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China
Prior art keywords
layer
article
electric probe
physical strength
probe
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CNA200710102133XA
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Chinese (zh)
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黄萌祺
周敏杰
张复瑜
吴景平
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Industrial Technology Research Institute ITRI
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Industrial Technology Research Institute ITRI
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Abstract

The invention discloses a multilayer type electric probe and manufacturing method thereof. The multilayer type electric probe is applicable to detecting elements to be detected, comprising a first strip layer and a second strip layer, wherein, the first strip layer is provided with first conductivity and first mechanical strength, and the second strip layer is provided with second conductivity and second mechanical strength; the first strip layer and the second strip layer are contacted tightly so as to form a structural body and achieve one of the needed mechanical strength and current resistance; besides, the multilayer type electric probe can also comprise a third strip layer so as to achieve the needed capacity of current resistance and the needed mechanical strength.

Description

The structure of multi-layer electric probe and manufacture method
Technical field
The present invention relates to a kind of detector probe, and particularly relate to a kind of electric probe that can be used for detecting element.
Background technology
Probe has been widely used in the manufacturing and test of integrated circuit, and it utilizes probe that the bare chip before encapsulating is carried out functional test, uses filtering out defective products, to repair or to scrap, to promote the yield rate of product.
The probe of existing general use for example is to be derived from United States Patent (USP) 4,027, and the basic design that No. 935 file proposed is machined into tiny cylindrical rod material, forms crooked probe (cobra probe).Fig. 1 illustrates the structure of the probe of conventional bending.Consult Fig. 1, crooked probe consists essentially of test side 102, is erected on the operation panel 100, and it comprises rotatable pivot (pivot).The body 104 of probe is connected in the pivot of test side 102.Body 104 generally is crooked shape, needed elasticity and deflection so that test to be provided.Be set up in the contact jaw 108 on another operation panel 106 in addition, can contact with the element under test (not shown).Body 104 stress applications by probe are given element under test.For example also can apply curtage to element under test in addition by probe.
For the probe of this structure, many probes all need to process one by one, and are consuming time relatively in the making.Again, along with the evolution of integrated circuit technology, relevant live width and gap day by day dwindle, and this can make probe face the restriction of reduced.
At the conventional art of other probe, also utilize the chemical etching mode to make probe, it has the diversified advantage of geometric shape, however it is subjected to the restriction of material, for example is the alloy of BeCu, can only utilize single metal to make.Though it can have anti-higher electric current, its intensity is relatively poor, and the life-span is also short, and expensive.
The general probe of forming by single component, for example Ni, NiCo alloy, NiMn alloy etc., it generally has not enough situation on the problem of anti-high electric current.In addition, it is easy to generate hot stack and shortens the life-span, can be restricted on high-frequency IC test.
Summary of the invention
The invention provides a kind of multi-layer electric probe, can reach the ability of required anti-high electric current and intensity, be suitable for to detect a described element under test.
The invention provides a kind of method of making multi-layer electric probe, the multi-layer electric probe that produces can reach the ability of required anti-high electric current and intensity.
The present invention proposes a kind of structure of multi-layer electric probe.Multi-layer electric probe comprises article one layer and second layer.Article one, layer has first conductance and first physical strength.The second layer has second conductance and second physical strength.Described article one layer becomes structure with fastening contact of described second layer, to produce desired conductance and desired physical strength.Again, multi-layer electric probe more can comprise at least the three layer again, to reach desired conductance and desired physical strength.
According to another embodiment of the present invention, in described multi-layer electric probe, described article one layer and described second layer are strip of sheet and contact with face and to become described structure.According to another embodiment, in described multi-layer electric probe, wherein said article one layer has first thickness again, and described second layer has second thickness, adjusts desired intensity and withstanding current capability.
According to another embodiment of the present invention, in described multi-layer electric probe, comprise at least the three layer, have the 3rd conductance and the 3rd physical strength, constitute described structure with described article one layer and described second layer.
According to another embodiment of the present invention, in described multi-layer electric probe, the cross-sectional structure of described article one layer and described second layer is the lamination of concave shape.
According to another embodiment of the present invention, in described multi-layer electric probe, described second layer is to be covered at least a portion surface of described article one layer or all surfaces in fact.
According to another embodiment of the present invention, in described multi-layer electric probe, the xsect of described article one layer is a geometric configuration, more for example is circle, triangle or polygon.
According to another embodiment of the present invention, in described multi-layer electric probe, described article one layer and described second layer, it is crooked having a part at least.
According to another embodiment of the present invention, in described multi-layer electric probe, be to contact between described article one layer and the described second layer so that the electroforming mode is fastening.
According to another embodiment of the present invention, in described multi-layer electric probe, be to contact between described article one layer and the described second layer so that plating mode is fastening.
The present invention provides a kind of multi-layer electric probe again, is suitable for to detect described element under test, comprises measurement portion and body.Described body and described measurement portion mechanical connection, wherein an end of body is in order to contact described element under test, to apply at least one detected parameters.Described body comprises article one layer at least, has first conductance and first physical strength; And the second layer, have second conductance and second physical strength.Article one, layer becomes a structure with fastening contact of second layer, to reach the one at least with desired physical strength and anti-electric current.
The present invention provides a kind of method of making multi-layer electric probe again, and described method comprises formation article one layer, and wherein said article one layer has first conductance and first physical strength.Form the second layer in the surface of described second layer, become structure with fastening contact, wherein said second layer has second conductance and second physical strength, with described first conductance and the combination of described first physical strength, to reach the ability of being wanted with anti-electric current and physical strength.
According to another embodiment of the present invention, in the method for described manufacturing multi-layer electric probe, be to form between the wherein said second layer, or form with plating mode in the electroforming mode.
Multi-layer electric probe of the present invention is because of adopting sandwich construction, the ability that can mix desired physical strength and have anti-high electric current etc.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 illustrates the structure of the probe of conventional bending.
Fig. 2 A illustrates according to one embodiment of the invention, the structural profile synoptic diagram of multi-layer electric probe.
Fig. 2 B illustrates the schematic cross section of the multi-layer electric probe of Fig. 2 A.
Fig. 3 A-3D illustrates according to the embodiment of the invention, makes the method flow synoptic diagram of multi-layer electric probe 200.
Fig. 4 A-4D illustrates according to another embodiment of the present invention, makes the method flow synoptic diagram of multi-layer electric probe.
Fig. 5 A-5D illustrates other embodiment according to the present invention, makes the method and the structural representation of multi-layer electric probe.
The simple symbol explanation
200: multi-layer electric probe 200a: measuring end
200b: main part 202,204: bar layer
300,400: substrate 302,404: metal level
304: photoresist layer 306: opening
406: article one layer 408: the second layer
500: ground floor 502: isolation layer
504: second layer 506: the second layer
700: article one layer 702: the second layer
Embodiment
The present invention proposes a kind of design of multi-layer electric probe, can reach the ability of required anti-high electric current and intensity etc.Fig. 2 A illustrates according to one embodiment of the invention, the structural profile synoptic diagram of multi-layer electric probe.Fig. 2 B illustrates the schematic cross section of the multi-layer electric probe of Fig. 2 A.Consult Fig. 2 A and Fig. 2 B, the multi-layer electric probe 200 of the embodiment of the invention, applicable to detect described element under test.Multi-layer electric probe 200 for example comprises article one layer 202 and second layer 204.Here, multi-layer electric probe 200 is that two-layer structure is that example is done explanation, yet according to principle of identity described below, two-layer above structure can be arranged.With regard to according to lifted two-layer with regard to, article one layer 202 has first conductance and first physical strength.Second layer 204 has second conductance and second physical strength.Article one, be that fastening the contact becomes a structure between layer 202 and the second layer 204, in order to produce desired withstanding current capability and desired physical strength.
According to action need, multi-layer electric probe 200 for example can have the body of being divided into 200a and the 200b of measurement portion.Body 200a for example can be designed to crooked part, and the one end can contact with element under test.The 200b of measurement portion of multi-layer electric probe 200 links with the control module of outside, applies the electrical signals of detection and by the stress that body produced, for example the stress that elastic deformation produced is given element under test.In other words, the multi-layer electric probe shown in Fig. 2 A 200 only is single structure.In practical application, may be to combine by many, controlled by the control module of outside.This should be those skilled in the art can understand, and will not describe in detail at this.
Article one layer 202 of multi-layer electric probe 200 for example is NiCo alloy and Cu with the material of second layer 204, and its preset thickness is arranged respectively.So, the physical strength of multi-layer electric probe 200 can be adjusted.Again, by the conductance of article one layer 202, can be combined into desired conductance, and then cooperate the thickness of article one layer 202 and second layer 204, can reach the ability of anti-high electric current with second layer 204.Because multi-layer electric probe 200 is made of multilayer, therefore adjust desired physical strength and desired anti-high current capacity easily.Below, describe and how to make multi-layer electric probe 200 for an embodiment.Certainly, multi-layer electric probe 200 is not subject to the method for being lifted and makes.As long as it is can produce the method for the multi-layer electric probe 200 of sandwich construction, all applicable.
Fig. 3 A-3D illustrates according to the embodiment of the invention, makes the method flow synoptic diagram of multi-layer electric probe 200.Consult Fig. 3 A, in substrate 300, form metal level 302.The technology of conjunction with semiconductors, substrate 300 for example are silicon base, and metal level 302 for example is deposition (Deposition) formed nickel metal layer.At Fig. 3 B, utilize photoetching process on metal level 302, to form photoresist layer 304, and have opening 306 to expose the part of metal level 302.The pattern of opening 306 can need and form in direction longitudinally according to actual design.
At Fig. 3 C, 202 on article one layer for example is formed on the metal level 302 in the opening 306 in electroforming (Electroform) mode.Electrode when metal level 302 mainly provides electroforming, the selection of its material are the materials that cooperates article one layer 202, make the follow-up material that can separate with article one layer 202 easily.Article one, layer 202 has preset thickness.
At Fig. 3 D, then continue to form second layer 204 on article one layer 202 in the electroforming mode, and the fastening structure that makes contact to.Second layer 204 for example fills up opening 306.And for example aforementioned, if there are more layers to form, then also be to utilize the electroforming mode, continue to form according to desired thickness, be not limited to two-layer structure.Take out follow-up these many layers can separation, promptly is an embodiment of multi-layer electric probe 200.Body 200a and the 200b of measurement portion for example can form in the lump simultaneously.Article one, layer 202 for example can be selected from NiCo alloy, NiMn alloy, Cu, Ni, Au, Ag, Co, W, W alloy and Ni alloy with second layer 204 ground material.
In addition, Fig. 4 A-4D illustrates according to another embodiment of the present invention, makes the method flow synoptic diagram of multi-layer electric probe.Consult Fig. 4 A, utilize photoetching and etch process, for example in substrate 400, for example on silicon base, be formed with the groove (Trench) of predetermined pattern.The pattern of groove for example is the shape shown in the 2A, and it for example can have crooked main part.
Consult Fig. 4 B, metal level 302, one metal levels 404 of similar Fig. 3 A are deposited earlier and are formed in the substrate 400.Consult Fig. 4 C, then utilize electroforming mode or depositional mode, form the first metal layer 406, its material and thickness are to cooperate desired parameter and set.The first metal layer 406 for example is the one that is selected from NiCo alloy, NiMn alloy, Cu, Ni, Au, Ag, Co, W, W alloy and Ni alloy.The first metal layer 406 also has desired thickness.Then, consult Fig. 4 D, form second metal level 408 in the same manner, its material is different from the first metal layer 406, so constitutes sandwich construction.Certainly if desired, can continue to form another layer again.Then, metal level 406 and metal level 408 are suitably removed, for example only get its part at trench region and constitute multi-layer electric probe, it for example is the structure that depression is arranged on xsect.Though the cross-sectional structure of this embodiment is different from aforementioned structure as Fig. 2 B, still has the effect of multilayer.
In other words, the structure of multilayer of the present invention can have different the variation, can reach effect proposed by the invention.Fig. 5 A-5D illustrates other embodiment according to the present invention, makes the method and the structural representation of multi-layer electric probe.This embodiment utilizes plating mode to make.
Consult Fig. 5 A, be made into ground floor 500 earlier, it wants crooked or straight long shape to some extent, and the cross-sectional area of the size of subscribing is arranged, and it for example is the cross-sectional area of circle, triangle, polygon etc.Then, electroplate as electrode with ground floor 500.According to actual demand, be plated in the second layer 504 on the surface of ground floor 500, may not need to cover whole surfaces, therefore for example can coat isolation layer 502 earlier, surface coverage with a part, therefore when carrying out electrodeposit, second layer 504 can not cover ground floor 500 surfaces of the part that is covered by isolation layer 502.
Consult Fig. 5 B, then isolation layer 502 is removed, as left figure, and article one layer 500 surface of remaining second layer 504 cover part.As right figure, its xsect is circular geometric figure.Again at Fig. 5 C, second layer 506 can cover the surface of ground floor 500 basically, and for example second layer 506 covers the side surface of whole ground floor 500.Consult Fig. 5 D, article one layer 700 is triangles with the xsect of second layer 702.Can understand ground, xsect can be other geometric figure, more for example generally is polygon.
Again, also being not restricted on article one layer only is that the second layer is arranged.According to actual needs, above article one layer, can have other the 3rd layer at least, cover on second layer and article one layer.This also is the embodiment of possible variation.
Foregoing description only be the structure of multi-layer electric probe itself.Those skilled in the art can understand, and can have a plurality of multi-layer electric probes to be arranged on the loading end in the practical operation, accept moving and apply and detecting required signal and stress to element under test of external control unit.At this, the description of its whole details is omitted.
The present invention proposes multi-layer electric probe especially owing to have a sandwich construction, its at least the characteristic of intensity and anti-electric current etc. can effectively be raised.Again.Because this multi-layer electric probe for example conjunction with semiconductors technology is made, and can dwindle the cross-sectional sizes of probe, therefore can be used in the detection of the integrated circuit of high integration.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; those skilled in the art can do a little change and retouching without departing from the spirit and scope of the present invention, thus protection scope of the present invention should with accompanying Claim the person of being defined be as the criterion.

Claims (19)

1, a kind of multi-layer electric probe comprises:
Article one, layer has first conductance and first physical strength; And
The second layer has second conductance and second physical strength, and wherein said article one layer becomes structure with fastening contact of described second layer, as the part of multi-layer electric probe.
2, multi-layer electric probe as claimed in claim 1, wherein said article one layer and described second layer are strip of sheet and contact with face and to become described structure.
3, multi-layer electric probe as claimed in claim 1, wherein said article one layer has first thickness, and described second layer has second thickness.
4, multi-layer electric probe as claimed in claim 1 comprises at least the three layer, has the 3rd conductance and the 3rd physical strength, constitutes described structure with described article one layer and described second layer.
5, multi-layer electric probe as claimed in claim 1, the cross-sectional structure of wherein said article one layer and described second layer is the lamination of concave shape.
6, multi-layer electric probe as claimed in claim 1, wherein said second layer are at least a portion surfaces that is covered in described article one layer.
7, multi-layer electric probe as claimed in claim 6, wherein said second layer are all surfaces basically that is covered in described article one layer.
8, multi-layer electric probe as claimed in claim 1, the xsect of wherein said article one layer are circle, triangle or polygon.
9, multi-layer electric probe as claimed in claim 1, the xsect of wherein said article one layer is a geometric configuration.
10, multi-layer electric probe as claimed in claim 1, the material of wherein said article one layer and described second layer are to be selected from NiCo alloy, NiMn alloy, Cu, Ni, Au, Ag, Co, W, W alloy and Ni alloy.
11, multi-layer electric probe as claimed in claim 1, wherein said desired physical strength is to be used for producing test required elasticity or deflection.
12, multi-layer electric probe as claimed in claim 1, wherein said desired conductance is to be used for producing the required electric current of test.
13, multi-layer electric probe as claimed in claim 1, wherein said article one layer and described second layer, it is crooked having a part at least.
14, between the multi-layer electric probe as claimed in claim 1, wherein said article one layer and described second layer is to contact so that the electroforming mode is fastening.
15, between the multi-layer electric probe as claimed in claim 1, wherein said article one layer and described second layer is to contact so that plating mode is fastening.
16, a kind of multi-layer electric probe is suitable for to detect described element under test, comprising:
Measurement portion; And
Body, with described measurement portion mechanical connection, wherein an end of body is in order to contacting described element under test, applying at least one detected parameters,
Wherein said body comprises at least:
Article one, layer has first conductance and first physical strength; And
The second layer has second conductance and second physical strength, and wherein said article one layer becomes structure with fastening contact of described second layer, to reach the one at least with desired physical strength and anti-electric current.
17, a kind of method of making multi-layer electric probe, electric probe is suitable for to detect described element under test, and described method comprises:
Form article one layer, described article one layer has first conductance and first physical strength; And
Form the second layer in the surface of described second layer, become structure with fastening contact,
Wherein said second layer has second conductance and second physical strength, with described first conductance and the combination of described first physical strength, to reach the one at least with desired physical strength and anti-electric current.
18, the method for manufacturing multi-layer electric probe as claimed in claim 17, wherein said article one layer and second layer are to form in the electroforming mode.
19, the method for manufacturing multi-layer electric probe as claimed in claim 17, wherein said article one layer and second layer are to form with plating mode.
CNA200710102133XA 2007-04-29 2007-04-29 Multi-layer electric probe structure and production method thereof Pending CN101294983A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9444479B2 (en) 2009-01-26 2016-09-13 Socionext Inc. Analogue-to-digital conversion circuitry
CN109425765A (en) * 2017-08-23 2019-03-05 李诺工业股份有限公司 MEMS probe makes its method and the test device using it
CN111812366A (en) * 2020-08-05 2020-10-23 苏州韬盛电子科技有限公司 Method for manufacturing wafer test micro probe based on micro electro mechanical system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9444479B2 (en) 2009-01-26 2016-09-13 Socionext Inc. Analogue-to-digital conversion circuitry
CN109425765A (en) * 2017-08-23 2019-03-05 李诺工业股份有限公司 MEMS probe makes its method and the test device using it
US11408914B2 (en) * 2017-08-23 2022-08-09 Leeno Industrial Inc. MEMS probe and test device using the same
CN111812366A (en) * 2020-08-05 2020-10-23 苏州韬盛电子科技有限公司 Method for manufacturing wafer test micro probe based on micro electro mechanical system

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Open date: 20081029