CN101290664A - RFID paper base note reclaiming and reusing method - Google Patents

Abstract

The invention provides a method for recovering and reutilizing RFID paper based bills. The method has the advantages of simple making process and the realization of the resource reutilization. The technical proposal comprises the following steps that: a radio circuit of a RFID bill is cut out, and the RFID bill is punched and packaged in the PVC card base. The finished card can be applied to all items of using RFID labels.

Description

The method of a kind of RFID paper base note recycling

Technical field

The invention belongs to the method field of RDID bill recycling, the method that especially a kind of RFID paper base note is recycled.

Background technology

At present, China is more and more with the case of RFID technology introducing railway passenger tickets and the ticketing service of performance class.This method RFID technology introducing bill is false proof at the height of having realized bill, when having improved work efficiency, has also realized sharing of data resource.The disposable characteristics of this ticketing service have caused the waste of resource but simultaneously.

Summary of the invention

The purpose of this invention is to provide the method that a kind of process is simple, can realize the RFID paper base note recycling that the resource secondary utilizes.The bill radio circuit part not damaged that reclaims is taken off, be packaged in the card base of PVC material, be used in the middle of the application item of all kinds of better simply RFID labels.

The technical solution adopted for the present invention to solve the technical problems is: the method for RFID paper base note recycling is characterized in that comprising the following steps:

---from used RFI D paper base note intercepting RFID chip and aerial coil;

---punch on aerial coil physical centre place paper substrate is placed on the RFID chip of intercepting and aerial coil then and carries out the punching press encapsulation in the PVC card base, and maybe RFID chip and the direct clamp of aerial coil with intercepting encapsulates in the circuit film trap of mould substrate.

When intercepting RFID chip and aerial coil, RFID chip and aerial coil are together intercepted together with the outside paper substrate of aerial coil along the aerial coil outer.

The invention has the beneficial effects as follows: realized the secondary utilization of resource, only need in the card encapsulation process carrying out punching press after the punching on the circuit wafer, or directly with the circuit wafer clamp among the circuit film trap of special PVC card base, process is simple, the relative position Stability Analysis of Structures of circuit and card base.Beat some via holes in the middle of the circuit wafer, by heat lamination processing to the pvc material, be about two substrates go out to connect together at via hole, make the texture ratio of whole card more firm.

Description of drawings

The present invention is further described below in conjunction with drawings and Examples.

Fig. 1 is the structural representation of the electronic bill that the present invention relates to;

Fig. 2 is the STRUCTURE DECOMPOSITION synoptic diagram that heat lamination method of the present invention generates product;

Fig. 3 is a heat lamination method processing synoptic diagram of the present invention;

Fig. 4 is the STRUCTURE DECOMPOSITION synoptic diagram that die type method of the present invention generates product;

Fig. 5 is the shell floor map of die type substrate of the present invention.

Embodiment

Embodiment 1: the thermosphere pressure type.The method of RFID paper base note recycling, comprise the following steps: from used RFID paper base note intercepting RFID chip and aerial coil, on aerial coil physical centre place paper substrate, punch, the RFID chip of intercepting and aerial coil are placed on carry out the punching press encapsulation in the PVC card base then.

As shown in Figure 1, structural representation for the electronic bill that relates among the present invention, be packaged with radio circuit 2 in the paper substrate 12, the punch process process that the present invention need finish is: along radio circuit antenna outer this radio circuit is together intercepted together with its outside paper substrate.

As shown in Figure 2, the radio-frequency card that is transformed into that adopts heat lamination method of the present invention to generate comprises, last substrate 1 of PVC and subtegulum 3, and the radio circuit 2 between two substrates is equipped with some holes 6 promptly by the part that intercepts on the bill on radio circuit 2.

Fig. 3 is the radio circuit sheet of intercepting, and original aerial coil 5 of holding circuit, the architectural feature of chip 7 are constant.On paper substrate, beat some via holes 6.

Embodiment 2: die type.The method of RFID paper base note recycling, it is characterized in that comprising the following steps: RFID chip and the direct clamp of aerial coil that intercepts being encapsulated in the circuit film trap of mould substrate from used RFID paper base note intercepting RFID chip and aerial coil.

As shown in Figure 4, radio-frequency card comprises that radio circuit 11 between PVC mold substrate 8, PVC bed die substrate 9 and two the mould substrate shells is promptly by the part that intercepts on the bill.

As shown in Figure 5, be the front schematic view of PVC mould substrate shell 8 of the present invention or 9, substrate physical centre position is used for the radio circuit sheet is loaded on wherein for being about 1 millimeter foundation trench 10 with the equal size of radio circuit, the degree of depth.

Claims (2)

1, the method for a kind of RFID paper base note recycling is characterized in that comprising the following steps:

---from used RFID paper base note intercepting RFID chip and aerial coil;

---punch on aerial coil physical centre place paper substrate is placed on the RFID chip of intercepting and aerial coil then and carries out the punching press encapsulation in the PVC card base, and maybe RFID chip and the direct clamp of aerial coil with intercepting encapsulates in the circuit film trap of mould substrate.

2, the method for RFID paper base note according to claim 1 recycling when it is characterized in that intercepting RFID chip and aerial coil, together intercepts RFID chip and aerial coil get off together with the outside paper substrate of aerial coil along the aerial coil outer.

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