CN101282621A - Technique for processing PCB gold finger - Google Patents
Technique for processing PCB gold finger Download PDFInfo
- Publication number
- CN101282621A CN101282621A CNA2008100282981A CN200810028298A CN101282621A CN 101282621 A CN101282621 A CN 101282621A CN A2008100282981 A CNA2008100282981 A CN A2008100282981A CN 200810028298 A CN200810028298 A CN 200810028298A CN 101282621 A CN101282621 A CN 101282621A
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- copper material
- golden finger
- connecting finger
- copper
- finger
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Abstract
A PCB connecting finger comprises processes: sequentially performing procedures of cleaning, micro-etching, spraying sand, water rinsing, drying, pattern plating, connecting finger plating to the copper material, wherein the procedure of micro-etching uses 10% dilute sulphuric acid for the neutralizing and removing the oxide in the surface of the copper, which costs time about 1 to 3 minutes; the procedure of spraying sand is for removing grease, dust, oxidized layer on the surface of the copper material and forming a rough surface on the surface of the copper material. A frosted frosting surface is formed from the surface of PCD connecting finger produced by this invention. No matter in the production test or in use, such a connecting finger is able to effectively reduce the scratching rate of connecting finger surface, in particular reducing the appearance scrap ratio at a large scale in the delivery test.
Description
Technical field
The present invention relates to a kind of PCB golden finger treatment process.
Background technology
The processing method on the last golden finger of PCB surface has brushing method and electroless plating method, along with market is more and more stricter to product quality and appearance requirement, the golden finger surface does not allow to occur any defective, basically be perfect state, the appearance of the golden finger of brushing method and electroless plating method all is a wet look, and any slight scuffing is all very obvious in production and testing process.
Summary of the invention
The technical problem to be solved in the present invention provides PCB golden finger treatment process a kind of difficult scuffing, that qualification rate is high.
For solving the problems of the technologies described above, the present invention by the following technical solutions:
A kind of PCB golden finger treatment process, described technological process is: to copper material clean successively, microetch, sandblast, washing, oven dry, graphic plating, gold finger galvanizing,
Wherein,
Microetch is to utilize 10% dilute sulfuric acid neutralization, and copper surface oxide is removed, and the time is about 1～3 minute.The sandblast operation is used to remove the grease, dust, oxide layer on copper material surface and forms frosting on the copper material surface.
Form frosting by the PCB golden finger surface that the present invention produced, the golden finger of this form disorderly still in use can both effectively not reduce the scuffing rate on golden finger surface in production test, particularly in the detection of dispatching from the factory, can reduce its outward appearance scrappage significantly.
Description of drawings
Accompanying drawing 1 is an embodiment of the invention process chart; The golden finger cross-sectional structure schematic diagram of accompanying drawing 2 for adopting present embodiment technology to be produced.
Embodiment
For the ease of those skilled in the art's understanding, structural principle of the present invention is described in further detail below in conjunction with specific embodiment and accompanying drawing:
As shown in Figure 1, the PCB golden finger treatment process that present embodiment disclosed, its flow process is: to copper material clean successively, microetch, sandblast, washing, oven dry, graphic plating, gold finger galvanizing, wherein, microetch is to utilize 10% dilute sulfuric acid neutralization, copper surface oxide is removed, and the time is about 1～3 minute.Wherein, sandblast operation is used to remove the grease, dust, oxide layer on copper material surface and forms frosting on the copper material surface.
As shown in Figure 2, the golden finger surface of adopting the described technology of present embodiment to be produced becomes the frosting 4 of frosted, inwardly is followed successively by heavy copper layer 3, base material Copper Foil 2 and base material 1 from frosting 4.The golden finger of this form disorderly still in use can both effectively not reduce the scuffing rate on golden finger surface in production test, particularly in the detection of dispatching from the factory, can reduce its outward appearance scrappage significantly.
Sandblast in the present embodiment, washing, oven dry, graphic plating and gold finger galvanizing all can be consistent with existing treatment process, do not give unnecessary details at this.
Below be golden finger that golden finger that the present embodiment PROCESS FOR TREATMENT is gone out and former PROCESS FOR TREATMENT the go out test comparison that experimentizes:
| 3 | Salt mist test | Test objective: checking golden finger corrosion resistance.Experiment condition: 1, temperature: 35+/-2 ℃; 2, pH value: 6.5-7.2; 3, brine strength: 5%Nacl solution PCB quantity: 30PCS; Experiment number: 2 times; Experimental technique: (gold is thick: 0.3um) do experiment with the salt air corrosion case respectively, contrast both results with golden finger | Corrosion class: 10 grades, do not have hot spot fully | Corrosion class: 7 grades | The golden finger of present embodiment PROCESS FOR TREATMENT and the contrast of former technology golden finger, the golden finger corrosion resistance is obviously good than former technology golden finger. |
From contrast as can be seen, though slight dew nickel phenomenon has appearred in the golden finger through the production of present embodiment treatment process when resistance to wear is tested, but still satisfy the performance requirement of product, and other aspects are all good than the golden finger of existing explained hereafter, its creativeness this shows.
Claims (2)
1. PCB golden finger treatment process is characterized in that described technological process is: to copper material clean successively, microetch, sandblast, washing, oven dry, graphic plating, gold finger galvanizing,
Wherein,
Microetch is to utilize 10% dilute sulfuric acid neutralization, and copper surface oxide is removed, and the time is about 1～3 minute.
2. PCB golden finger treatment process according to claim 1 is characterized in that: the sandblast operation is used to remove grease, dust, the oxide layer on copper material surface, and forms frosting on the copper material surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100282981A CN101282621A (en) | 2008-05-21 | 2008-05-21 | Technique for processing PCB gold finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100282981A CN101282621A (en) | 2008-05-21 | 2008-05-21 | Technique for processing PCB gold finger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101282621A true CN101282621A (en) | 2008-10-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100282981A Pending CN101282621A (en) | 2008-05-21 | 2008-05-21 | Technique for processing PCB gold finger |
Country Status (1)
| Country | Link |
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| CN (1) | CN101282621A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102014587A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Gold-plating process method of long and short golden fingers |
| CN101699940B (en) * | 2009-11-10 | 2011-07-13 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
| CN102560580A (en) * | 2012-03-08 | 2012-07-11 | 深圳市中兴新宇软电路有限公司 | Manufacture technology of nickel-free electroplating gold |
| CN103233250A (en) * | 2013-04-28 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | Method for electroplating goldfinger with thick gold layer |
| WO2015003369A1 (en) * | 2013-07-11 | 2015-01-15 | 深圳崇达多层线路板有限公司 | Printed circuit board preparation method and printed circuit board |
| CN106610199A (en) * | 2016-11-30 | 2017-05-03 | 保定威奕汽车有限公司 | Multilayer reverse-flow type drying device, material sandblasting water washing drying processing line and material sandblasting water washing drying processing technology |
| CN113362288A (en) * | 2021-05-24 | 2021-09-07 | 深圳明锐理想科技有限公司 | Golden finger scratch detection method and device and electronic equipment |
| CN114645280A (en) * | 2022-03-28 | 2022-06-21 | 深圳市铨天科技有限公司 | BGA substrate bonding wire golden finger cleaning agent and cleaning method |
-
2008
- 2008-05-21 CN CNA2008100282981A patent/CN101282621A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699940B (en) * | 2009-11-10 | 2011-07-13 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
| CN102014587B (en) * | 2010-11-24 | 2012-07-18 | 深南电路有限公司 | Gold-plating process method of long and short golden fingers |
| CN102014587A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Gold-plating process method of long and short golden fingers |
| CN102560580A (en) * | 2012-03-08 | 2012-07-11 | 深圳市中兴新宇软电路有限公司 | Manufacture technology of nickel-free electroplating gold |
| CN102560580B (en) * | 2012-03-08 | 2014-10-08 | 深圳市新宇腾跃电子有限公司 | Manufacture technology of nickel-free electroplating gold |
| CN103233250B (en) * | 2013-04-28 | 2015-10-21 | 胜宏科技（惠州）股份有限公司 | A kind of thick layer gold gold finger galvanizing method |
| CN103233250A (en) * | 2013-04-28 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | Method for electroplating goldfinger with thick gold layer |
| WO2015003369A1 (en) * | 2013-07-11 | 2015-01-15 | 深圳崇达多层线路板有限公司 | Printed circuit board preparation method and printed circuit board |
| CN106610199A (en) * | 2016-11-30 | 2017-05-03 | 保定威奕汽车有限公司 | Multilayer reverse-flow type drying device, material sandblasting water washing drying processing line and material sandblasting water washing drying processing technology |
| CN106610199B (en) * | 2016-11-30 | 2019-05-07 | 保定威奕汽车有限公司 | Material sandblasting washing drying processing line and its technique |
| CN113362288A (en) * | 2021-05-24 | 2021-09-07 | 深圳明锐理想科技有限公司 | Golden finger scratch detection method and device and electronic equipment |
| CN113362288B (en) * | 2021-05-24 | 2024-03-08 | 深圳明锐理想科技股份有限公司 | Golden finger scratch detection method and device and electronic equipment |
| CN114645280A (en) * | 2022-03-28 | 2022-06-21 | 深圳市铨天科技有限公司 | BGA substrate bonding wire golden finger cleaning agent and cleaning method |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20081008 |