CN101278395A - Method of manufacturing laminated lead frame and laminated lead frame produced by the method - Google Patents
Method of manufacturing laminated lead frame and laminated lead frame produced by the method Download PDFInfo
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- CN101278395A CN101278395A CN 200680031007 CN200680031007A CN101278395A CN 101278395 A CN101278395 A CN 101278395A CN 200680031007 CN200680031007 CN 200680031007 CN 200680031007 A CN200680031007 A CN 200680031007A CN 101278395 A CN101278395 A CN 101278395A
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- H01—ELECTRIC ELEMENTS
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Abstract
A method for manufacturing a laminated lead frame in which each lead frame unit plate to be laminated can be bonded surely with a relatively small load. A laminated lead frame is also provided. In the method for manufacturing a lead frame by laminating and bonding a plurality of lead frame unit plates (10, 11) subjected to predetermined shaping, a plurality of protrusions (12) are formed on one of the opposing surfaces of a pair of upper and lower lead frame unit plates (10, 11) and the opposing lead frame unit plates (11, 12) are bonded together through the protrusions (12).
Description
Background technology
The present invention relates to a kind of stacked lead frame (laminated leadframe) that is used for semiconductor device such as IC, more particularly, relate to a kind of stacked lead frame and manufacture method thereof that forms by stacked a plurality of thin plates.
In the field of QFN (square flat non-pin (Quad Flat Non-leaded)) semiconductor device, reduce to have proposed to reduce the SON of lead spacing (lead) (little outline no-lead (Small Outline Non-leaded)) semiconductor device etc. in order to realize thickness.There is the trend that further reduces lead frame thickness.But when the thickness of lead frame was reduced, in the process of carrying operation or subsequent assembly, lead frame was easy to distortion, therefore causes fault, and this causes reducing of productivity ratio again.
In the SON of the QFN of correlation technique semiconductor device or correlation technique semiconductor device, only expose outside contact jaw in the sealing resin outside partly of encapsulation, and other zones of this device cover with sealing resin.Finally, the resin thickness in only should the zone increases, and hinders reducing of package thickness thus.Therefore, known a kind of stacked lead frame, wherein difform two lead frames are stacked, to attempt to reduce the gauge of IC encapsulation, keep the intensity of lead frame simultaneously, form single stacked lead frame (for example, referring to patent documentation 1) thus.In addition, using its thickness is known corresponding to package thickness and encapsulation (for example, referring to patent documentation 2) with lead frame of L-tee section so far.
These stacked lead frames are by a plurality of lead frame veneers (refer to will be bonded single lead frame material) being bonded together and creating, causing the fine pitch of lead frame thus and allow the lead frame of three-dimensional profile to specialize.Diffusion interlinked method is mainly used in the lead frame veneer is bonded together, and wherein applies suitable load and heat to stacked lead frame veneer from its thickness direction.
Under diffusion interlinked method, owing to apply the material (lead frame veneer) of loading and keeping with stacked state, moving in the face of the interface is mutual mutually of this material is close.When heating under this state during this material, the migration (diffusion) that begins atom between the material that adjoins mutually at interface is inserted in activations that become of the atomic energy in the material thus betwixt.When the diffusion of atom was carried out, the atom of two kinds of materials was mixed in together to the existence at the interface uncertain this degree that becomes, and this material is bonded on together thus.
According to this diffusion interlinked method, the interface that applies realization by load is near (deformation), and becoming usually more may at high temperature produce, and is convenient to diffusion progress thus and increases bonding performance.
But, when adopting diffusion interlinked method in the manufacturing at stacked lead frame, arrive the following heavy load of one of percentage (promptly by the plastic deformation (thickness reduces) that applies restriction lead frame veneer, when the bonding load increases, corrugated or the irregular quilt that exists in this interface mechanically pushes, allow to reduce the distance between the atom of upper and lower lead frame veneer thus), realize diffusion interlinked, because diffusion interlinked hope (is used to assemble the temperature of IC in alap temperature, for example, 260 ℃ or following) carry out down.
The surface of lead frame veneer is electroplate with Ag or Au to about 3 to 5 microns thickness, and as inserting material, this Ag or Au have low melting point, and demonstrates high diffusion with respect to the material (Cu or Fe-Ni) of lead frame veneer.As a result, reduce the trial of bonding temperature and load.
In addition, the stacked lead frame (for example, referring to patent documentation 3) that forms by stacked down lead frame and last lead frame has been proposed.By this stacked lead frame, the number of outside lead increases, even the width increase of the plastic encapsulant in the semiconductor device can be avoided as much as possible.
In addition, also proposed to use the semiconductor device (for example referring to patent documentation 4) of stacked lead frame.
[patent documentation 1] JP-UM-B-7-13227
[patent documentation 2] JP-A-2003-7955
[patent documentation 3] JP-A-2001-035987
[patent documentation 4] JP-A-2001-274310
According to the technology of describing in the patent documentation 1, in order to achieve success under the alap temperature and under the alap load lead frame veneer being bonded together, the surface roughness and the flatness that are bonded on lead frame veneer plane together must be increased, so that in the early stage the stage, two kinds of materials can contact with each other.
For example, as shown in figure 14, when the terminal lead 60 of last lead frame veneer and the lead 61 of following lead frame veneer must be bonded on a time-out, present, whole lead-in wire 60 and 61 contacts with each other and is bonded together.According to this method, lead-in wire 60 and 61 zones that are bonded on together are wide, meet difficulty in the surface flatness that keeps lead-in wire 60 and 61 thus.In Figure 14, reference number 62 expression bonding parts.
Especially, two kinds of elements all are used as the variation of thickness of the thickness of the Ag-coating that inserts material or Au-coating in about 1 to 2 micron scope, and have in the end of lead-in wire, and this element is deposited as the characteristic of big thickness.Therefore, as shown in figure 15,, produce gap 63 in the center of lead-in wire 60,61 when the lead frame veneer is laminated in a time-out.Thus,, be left not bonding part, in the desirable bonding that guarantees whole surface, cause difficulty when lead-in wire under this state is bonded on a time-out.For described interface being contacted with each other, and in this interface of bonding, achieve success, need the load that more strengthens by reducing this gap.Therefore, plastic deformation (thickness that reduces) causes taking place the shape fault of lead frame, and the big press machine that need be used to produce heavy load.
In the method for in patent documentation 3, describing, when when making that at least two lead frame veneers are overlapped to form single stacked lead frame on another, at least two lead frame veneers be treated in advance reservation shape (corresponding to be applied or stacked together before single lead frame material), the aligning of upper and lower lead frame veneer is quite hard.Usually form location hole in the both sides of the bar bar that is used for making the lead frame veneer.
With respect to the bonding of upper and lower lead frame veneer, upper and lower lead frame veneer is placed in the bonding mould, and places this veneer by formed location hole (pilot hole) and dowel pins (pilot pin).After upper and lower lead frame veneer was placed, heating and this plate that pressurizes in the bonding mould were finished upper and lower lead frame veneer thus and are bonded on together stacked lead frame.
As mentioned above, this bonding mould need be used to place the dowel pins of each lead frame veneer, and must prepare a plurality of bonding moulds according to the type of lead frame veneer.In the manufacture process of lead frame veneer, the small mis-alignment by the lead frame veneer etc. subtract the location hole that obtains after the narrow bonding, and produce in pin and sting weldering (galling), and this causes difficulty again in the removal of stacked lead frame.These cause the deformation or the defective of stacked lead frame.
Sometimes, also produce because restriction, the specification that is provided with by the client needs the position to form to cause situation of difficult in the location hole, as by utilizing for example suction pads, transport the difficulty in the stacked lead frame on the curb girder of stacked lead frame.
In addition, when when utilizing location hole alignment lead frame veneer and the stacked lead frame finished, need with the position of dowel pins, spacing between the dowel pins of adjacent legs frame (or unit lead frame), the relevant accuracy such as external shape of lead frame veneer, this causes the required quality of anchor clamps or accuracy increase etc., and the cost of following increases.
Summary of the invention
The present invention is conceived overcomes background technology, and aims to provide a kind of method that is used to make stacked lead frame, and it allows under relatively little load reliable bond with each stacked lead frame veneer, and a kind of stacked lead frame is provided.
The present invention also provides a kind of method that is used to make stacked lead frame, it is convenient to the stacked of at least two lead frame veneers, and allow to cut down production cost and make stacked lead frame, in the curb girder (side rail) of the lead frame of finishing, do not form location hole, and the stacked lead frame of making by this method is provided.
Be used for above-mentioned purpose according to the method that is used to make stacked lead frame of first invention corresponding to by a plurality of lead frame plies are stacked the method for making stacked lead frame, each lead frame is treated to reservation shape, this method comprises:
In at least one the mutual apparent surface who forms a pair of upper and lower lead frame veneer, form a plurality of projections; And
This mutual relative lead frame ply is stacked, have the projection of inserting betwixt (protuberance).
Corresponding to by a plurality of lead frame veneers are stacked and be bonded together and make the method for stacked lead frame, each lead frame is treated to reservation shape according to the method that is used to make stacked lead frame of second invention, and this method comprises:
In at least one the mutual apparent surface who forms a pair of upper and lower lead frame veneer, form a plurality of projections; And
This mutual relative lead frame veneer is bonded together, has the projection of inserting therebetween.
According to the method that is used to make stacked lead frame of the 3rd invention, in the method that is used for making stacked lead frame of second invention, by etch partially, punching press (coining) and thick plating any one form this projection.
The method that is used to make stacked lead frame according to the 4th invention, the method that is used for making stacked lead frame in second invention, will with pairing (counterpart) the lead frame veneer of described projection bonding in, the surface of described projection and contact with this projection regionally at least be electroplate with rare metal.
Here, the plating of rare metal means the deposit of Au, Ag, Pt, Pd etc.For the deposit of rare metal, primary coat is covered and can be carried out naturally.
The method that is used to make stacked lead frame according to the 5th invention, the method that is used for making stacked lead frame in the 4th invention, carry out the bonding of lead frame veneer by exerting pressure, this allows to flatten the end of (collapse) projection, heats the lead frame veneer down at 180 ℃ to 300 ℃ simultaneously.As a result, can with basically perfectly mode carry out the diffusion and the bonding of projection, and, can carry out uniform bonding by flattening the end of this projection with relatively little load, though when the height of this projection mutually not simultaneously.
Make the stacked lead frame of the 6th invention by any one that utilizes second to the 5th method.Thus, the firmer stacked lead frame that provides a kind of each lead frame veneer to be bonded together reliably.
The method that is used to make stacked lead frame according to the 7th invention comprises:
Form the first step of the group of a plurality of depressions and projection at least in the corresponding position of two lead frame veneers, this depression and projection form and form pairing by half-etched or half-die separation;
This projection is assembled to second step in this depression, thus that the lead frame veneer is overlapped in top of each other; And
Come the third step of this overlapping lead frame veneer of bonding by heating and pressurization.
According to the method that is used to make stacked lead frame of the 8th invention, in the method that is used for making stacked lead frame of the 7th invention, in second step, the lead frame veneer is compressed (caulk) and be coupled by this depression and projection.
The method that is used to make stacked lead frame according to the 9th invention, in the method that is used for making stacked lead frame of the 7th invention, be used as the object of reference that is used for superimposed lead frame veneer with a plurality of groups of depressions that form and one group depression in the projection and projection; And in the depression and projection of another group, this depression becomes the elongated hole in the direction of maximum elongation of lead frame veneer.
According to the method that is used to make stacked lead frame of the tenth invention,, use the surface of the bonding face at least of rare metal electroplate lead wire frame veneer in the method that is used for making stacked lead frame of second invention.
The method that is used to make stacked lead frame according to the 11 invention, the method that is used for making stacked lead frame in the 7th invention, the location hole of register lock pin (registration pilot pin) will be assembled in corresponding position on each lead frame veneer, formation.
The method that is used to make stacked lead frame according to the 12 invention, in the method that is used for making stacked lead frame of the 11 invention, on will becoming the lead frame veneer of object of reference in the overlapping lead frame veneer diameter of formed location hole greater than the diameter of formed location hole in will becoming the lead frame veneer of object of reference.
The 7th the invention be used to make under the method for stacked lead frame, make the 13 the invention stacked lead frame.
Stacked lead frame according to the 14 invention, in stacked lead frame according to the 13 invention, compress (half-blanking caulking) by partly covering and form this depression and projection, and in third step, do not expose this depression and projection from the preceding and rear surface of the stacked lead frame of bonding.
According to the stacked lead frame that is used to make the method for stacked lead frame and make thus, the both belongs to the present invention, and by utilizing projection, overlapped lead frame veneer is bonded on together.Thus, because the minimizing of bonding area can reduce the needed load of bonding.Because this reduces, by reducing capacity of equipment, the size of equipment can be made less.
By restriction bonding scope, be convenient to the contact of bonding surface.In addition, owing to can easily obtain flatness, therefore can reduce the chance of bonding fault (not bonding region takes place).
When because the varied in thickness of lead frame veneer and coating, in the height of projection, exist when inhomogeneous, by increasing load, this projection is slightly flattened, and absorbs the variation in the height change thus.Therefore, can prevent the not appearance of bonding region.
According to the stacked lead frame that is used to make the method for stacked lead frame and make thus, the both belongs to the present invention, before standing heating and pressurization, by this depression and projection, stacked lead frame veneer is coupling in together.Therefore, be convenient to subsequent treatment.For example, even when by making pressurization of overlapping lead frame veneer experience and heating, and when this overlapping lead frame veneer was fixed together, flat board can be used as heating plate.Therefore, accurately the use necessary or accurately bonding mould of alignment is avoided.In addition, by utilizing anchor clamps (jig) as employed anchor clamps in the roll-welding, upper and lower lead frame veneer also can heat and pressurize.
Especially, when by etching partially when forming depression and projection, eliminated scrambling from the preceding and rear surface of stacked lead frame, the subsequent delivery processing of suction pads easy to use (suction pad) etc.
Description of drawings
Fig. 1 is the perspective view of using according to first embodiment of the invention of stacked lead frame of method that is used to make stacked lead frame;
Fig. 2 is the descriptive view of this method;
Fig. 3 shows the descriptive view of the method that is used to create projection;
Fig. 4 shows the descriptive view of the method that is used to create projection;
Fig. 5 shows the descriptive view of the method that is used to create projection;
Fig. 6 A and 6B are the descriptive views of this method;
Fig. 7 is the perspective view that is used to describe according to the method for the stacked lead frame of manufacturing of second embodiment of the invention;
Fig. 8 is the part-detailed descriptive view of this method;
Fig. 9 is the part-detailed descriptive view of this method;
Figure 10 is the part-detailed descriptive view of this method;
Figure 11 is the part-detailed descriptive view of this method;
Figure 12 is the part-detailed descriptive view of this method;
Figure 13 is the perspective view that is used to describe according to the method for the stacked lead frame of manufacturing of third embodiment of the invention;
Figure 14 is the description view of method that is used to make the stacked lead frame of correlation technique example; And
Figure 15 shows the description view of shortcoming of the method for the stacked lead frame that is used to make the correlation technique example.
10,11: lead-in wire, 12: projection, 13,14: silver-coating (coating of rare metal), 15: projection, 16; Lead-in wire, 16a: silver-coating, 17: lead-in wire, 18: diel, 19: projection, 20 to 22: lead-in wire, 23 to 25: lead-in wire, 26 to 28: projection
Embodiment
In order to understand the present invention, next by the first embodiment of the present invention is described with reference to the drawings.
Fig. 1 is the perspective view of stacked lead frame of using the stacked lead frame manufacture method of first embodiment of the invention; Fig. 2 is the descriptive view of this method; Fig. 3 to 5 shows the descriptive view of the method that is used to create projection; And Fig. 6 A and 6B are the descriptive views of this method.
Fig. 1 and 2 shows the method that is used to make stacked lead frame according to first embodiment of the invention.The lead-in wire 11 formation parts that the lead-in wire 10 of last lead frame veneer forms part and following lead frame veneer are bonded on together.On 11 each upper surface of going between down, create jut 12.
The basal surface (supposition even shape) of last lead-in wire 10 scribbles Ag-coating 13, and this Ag-coating 13 is examples of rare metal coating, and plays the upper surface of the jut 12 on the lead-in wire 11 to scribble Ag-coating 14, and this Ag-coating 14 is examples of rare metal coating.In addition, the whole surface of upper and lower lead-in wire 10,11 scribbles Ag-coating.
By with reference to figure 3 to 5, use description to create the method for projection 12.Under method shown in Figure 3, create jut 12 by etching partially, wherein only the zone on the end of jut 12 is electroplate with Ag (rare metal) 14, the not etched dose corrosion of this Ag, therefore the zone of electroplating contacts with etching agent.The degree that projection is etched partially (that is the degree of depth of etching) preferably initially go between 11 thickness about 1/4th to about in the of 4/5ths.This reason is that when the degree of depth that etches partially increased, the height of jut 12 was reduced; Because the degree of depth that etches partially further increases, the area of section of the lead-in wire that electric current flows is reduced; And the variation by etching, lead-in wire is ruptured or breach.When by etching partially when creating jut 12, the surface of lead-in wire 11 and the surface of jut 12 also can be electroplate with rare metal.
In method shown in Figure 4, form jut 15 by multilayer coating (thickness coating).
In the case, only final layer is electroplate with rare metal; But, can be the situation that all layers all are electroplate with rare metal.The height of projection 15 can be about 1/5th to 2/3rds (parts of lead frame veneer) of lead-in wire 16 thickness.When the height of jut 15 hour, the deformation of lead-in wire 16 can not be solved.On the contrary, when the height of jut 15 is big, need a large amount of electroplating operations, this has increased cost.Reference number 16a represents Ag-coating.
In method shown in Figure 5,, therefore cause the plastic deformation of lead-in wire 17 and create jut 19 by the initial lead-in wire 17 of diel 18 compactings.In the case, when the trial of the height that increases jut 19,17 heavy loads that must go between, and go between and 17 become at it and transversely undesirably expand and be out of shape.
Therefore, enough height of jut 19 be the lead-in wire 17 thickness sixth to half (more preferably, sixth to three/one).The reason of these situations is, because that the surface of the lead-in wire 17 except that jut 19 is made into by diel 18 is smooth, the tip position of the end of jut 19 can remain on given level.When forming jut 19 by punching press, the surface electrical of jut 19 is coated with rare metal.
Although above-mentioned jut 12,15 and 19 is circular when inspecting from the top, they can be square, ellipse, rectangle etc.Jut 12,15 and 19 width (for example, diameter) 1/10th to 3/10ths of 11,16 and 17 the width that preferably goes between.When the width of jut too hour, may produce the situation that the conduction resistance between the circuitous resistance of this lead-in wire and semiconductor device increases, cause problem thus.
Fig. 6 A and 6B show the lead-in wire 20 to 22 of lead frame discrete component and the lead-in wire 23 to 25 of following lead frame discrete component stands the bonding that pressurizes, and are heated to 180 ℃ to 300 ℃ simultaneously.
As shown in Figure 6A, instantly the jut 27 of central tap 24 is lower than other lead-in wire juts 26 of 23 and 25 and at 28 o'clock, and when putting on the thrust of lead-in wire on 20 to 22 hour, the jut 27 and the last central tap 21 of following central tap 24 can not be bonded on together.In the case, shown in Fig. 6 B, when putting on lead-in wire 20 to 22 thrust and increase, jut 26 and 28 end are crushed, and allow jut 27 and lead-in wire 21 bondings thus.Therefore, consider under the go between height change of the jut 26 to 28 that 23 to 25 (that is, following lead frame veneer) go up to form, put on and go between 20 to 22 (promptly, last lead frame veneer) the thrust Be Controlled on is so that jut 26 to 28 is crushed corresponding to the quantity of this variation.In the case, that the last width of preferred jut 26 to 28 is made is less (therefore supposition, for example, taper shape), thus jut 26 to 28 from their end by flattening (under the situation of punching press, being possible) inevitably.
The present invention is not limited to the foregoing description, and under the condition that does not break away from main idea of the present invention, can be applied to being changed or improved method.Especially, in order to understand the present invention easily, present embodiment has been described by utilizing specific markers.But the present invention is not limited to by this mark restricted portion and zone.
In addition, in the present embodiment, on the lead-in wire (that is lead frame veneer) jut is being set down.But, also can on last lead-in wire (that is lead frame veneer), jut be set.
Second embodiment of the present invention will be described now.
Fig. 7 is the perspective view of describing according to second embodiment of the invention of method that is used to make stacked lead frame, and Fig. 8 to 13 is part-detailed description property views of this method.
Shown in Fig. 7 to 13, according to second embodiment of the invention be used to make under the method for stacked lead frame, preparation has stood the lead frame veneer 10 and 11 of predetermined etching.
In the case, lead frame veneer 10 arrives upper/lower positions, and lead frame veneer 11 arrives upward position.Shown in Fig. 8 and 9, by etching partially, in each end of following lead frame veneer 10, form sunk part 12 and 13, and, create jut 14 and 15 in each end of last lead frame veneer 11 by etching partially.Lower and upper lead frame veneer 10 and 11 are set in the corresponding position, overlap so that between the alignment position of the following lead frame figure of the alignment position of lead frame figure on the following lead frame veneer 10 and last lead frame veneer 11, exist, so as sunk part 12 and 13 and jut 14 and 15 mutually in pairs, each supposes circular cross-section.
In lead frame veneer 10 and 11 shown in Figure 7, two groups cave in and projection, promptly one group is made of sunk part 12 and jut 14, and another group is made of sunk part 13 and jut 15, longitudinally curb girder 16 and 17 does not form, but being formed on the centre position of horizontal curb girder 16 and 17 at each longitudinal end place of lead frame veneer 10 and 11, each has three unit lead frames.
Figure 11 shows the details (this situation also is applied to sunk part 13 and jut 15) of sunk part 12 and jut 14.Because these parts form by etching, the entrance side 18 of sunk part 12 is broadened, and the end 19 of jut 14 becomes less.As a result, be convenient to jut 14 is assembled in the sunk part 12.
The diameter of the main cross section of jut 14 and sunk part 12 changes according to the size of stacked lead frame, and this stacked lead frame is a product, but in the common scope about 0.2 to 2mm.In the nominal diameter scope of the diameter of the jut 14 except that its end greater than the sunk part except that intake section 12 (for example amount of 1/50th of this diameter to 5 percent (one-five-hundredth)).When jut 14 fully was assembled in the sunk part 12, jut 14 was not easy to be removed.
The degree of depth of the height of jut 14 and sunk part 12 is for example in their 1/3rd to 2/3rds scope of thickness separately, and the height of jut 14 is less than the degree of depth of sunk part 12.
In the present embodiment, form sunk part 12 and jut 14 (this situation also is applied to sunk part 13 and jut 15) by etching.As shown in figure 10, also can form this part by partly cover (half-blanking) that utilizes press machine.In the case, on the rear surface of each lead frame veneer 10 and 11, form jut 20, and in the front surface of each lead frame veneer 10 and 11, form sunk part 21.Thus, when below will being disposed in the bottom of lead frame veneer 10 on when existing jut 20 to have problems, in lead frame veneer 10 down, also can form reach through hole, replace half through hole (half blank).In addition, when forming sunk part 21 and jut 20 by pressure processing, the diameter of the entrance side of sunk part 21 also can be broadened, and the diameter of the end side of projection 20 also can be made less.The degree of depth of sunk part 21 is about 1/3rd to 2/3rds of lead frame veneer thickness.
As shown in Figure 7, in the present embodiment, sunk part 12, jut 14, sunk part 13 and jut 15 are set in each end of lead frame veneer 10 and 11, they each have circular cross-section.Form one group each sunk part 12 and jut 14 (promptly, purpose for reference), so that suppose a circular section shape, and the sunk part 22 that assembles another jut 15 also can be formed and extend blind hole (blind hole), as shown in figure 12.
The result, even when according to the degree of thickness, material, processing etc., reason owing to difference between lower and upper lead frame veneer 10 and 11, distance between the sunk part 12 and 22 be different between jut 14 and 15 apart from the time, the jut 15 (it also can be the square-section) with circular section shape can be mounted in the sunk part 22.Sunk part 22 is set on the direction that the maximum of lead frame veneer 10 extends.
For the shape difference between the lead-in wire of the lead-in wire that absorbs lead frame veneer 10 and lead frame veneer 11, at lead frame veneer 10, in the centre position of 11 cross side, vertically be provided for locating the sunk part and the jut of purpose along it, and the sunk part and the sunk part in the middle of the jut that are provided with on the both sides of depression of arranging in the center and jut also can form the longitudinal extension hole.
Lead frame veneer 10 and 11 stands diffusion interlinked under intensification pressure, and jut 14 and 15 modes with intimate contact (for example, compressing mode) are assembled in respective recesses part 12 and 13.Therefore, electroplate lead wire frame veneer 10 and 11 surface-copper product, Cu alloy material and ferroalloy materials are separated ground etching or punch process in advance with noble metal such as Au, Ag etc.After overlapped lead frame veneer 10 and 11 (therefore to produce stacked lead frame), this stacked lead frame stands various processing operations, as the installation of semiconductor element, lead-in wire bonding, molded, mark, cutting forming separates etc., and be embedded in the semiconductor device at last.
To describe now according to the difference between the method for the stacked lead frame of manufacturing of the method for the stacked lead frame of manufacturing of third embodiment of the invention shown in Figure 13 and first embodiment.
In this method that is used for making stacked lead frame, location hole 29 and 30 is set at the curb girder 26 of lead frame veneer 24 and 25 and the position of 27 inside, and between unit lead frame 28.By this location hole, in the manufacture process of lead frame veneer 24 and 25, the lead frame veneer can easily be positioned its materials behavior (judgement of for example, exposing the location of carrying out in the position of mask or the punch process operating process in the etching operation process).
When utilizing dowel pins to locate lower and upper lead frame veneer 24 and 25, use its diameter fully less than the pin of location hole 29 and 30.As a result, between dowel pins and location hole, produce vibration (rattle), and the assembling of sunk part 12,13 and jut 14,15 is carried out glibly.The diameter of the location hole of the lead frame veneer that preferably, will place on the top is made into the diameter greater than the location hole of the lead frame veneer that will be used for reference substance.
The present invention is not limited to previously described embodiment, and under the condition that does not break away from main idea scope of the present invention, can stand to improve.Especially, when not when utilizing location hole to locate lead frame veneer 10 and 11, also can make the image processing operations of lead frame veneer 10 and 11 and external shape identical from one another, and also can be by along lead frame or center on the support component (with the form of integrated component or separating component) that lead frame is provided with and locate lead frame veneer 10 and 11, so that around lead frame veneer 10 and 11.
In addition, although in the present embodiment, be two with the number of stacked lead frame veneer, also can stacked three or more lead frame veneer.For example, when the present invention's lead frame veneer that is applied to being perpendicular to one another contiguous, it is three or more situations that the present invention is applied to lead frame veneer number naturally.
[industrial applicibility]
Method and this stacked lead frame according to for the manufacture of stacked lead frame both belong to this Bright, overlapped lead frame veneer utilizes jut and is bonded on together. Therefore, owing to subtract The zone that the young pathbreaker is bonded, the needed load of bonding can be reduced. As a result, can reduce processing Ability and can make device miniaturization, industrial applicibility of the present invention is quite high thus.
The application based on and require the rights and interests of priority of the Japanese patent application No. 2005-331937 of the Japanese patent application No. 2005-327631 of on November 11st, 2005 application and application on November 16th, 2005, all introduce its content for reference at this.
Claims (14)
1. one kind is used for making the method for stacked lead frame by a plurality of lead frame plies are stacked, and each described lead frame veneer is treated to reservation shape, and this method comprises:
In at least one the mutual apparent surface who forms a pair of upper and lower lead frame veneer, form a plurality of projections; And
This mutual relative lead frame ply is stacked, have the projection of inserting betwixt.
2. one kind is used for making the method for stacked lead frame by a plurality of lead frame veneers are stacked and be bonded together, and each described lead frame veneer is treated to reservation shape, and this method comprises:
In at least one the mutual apparent surface who forms a pair of upper and lower lead frame veneer, form a plurality of projections; And
This mutual relative lead frame veneer is bonded together, has the projection of inserting betwixt.
3. the method that is used to make stacked lead frame according to claim 2, wherein by etch partially, punching press and thick plating any one form described projection.
4. according to each described method that is used to make stacked lead frame in claim 2 and 3, wherein will with described projection mutually in the pairing lead frame veneer of bonding, the surface of described projection and be electroplate with rare metal with the contacted zone of this projection at least.
5. the method that is used to make stacked lead frame according to claim 4 is wherein carried out the bonding of lead frame veneer by exerting pressure, this allows the flattening of the end of projection, simultaneously at 180 ℃ to 300 ℃ described lead frame veneers of heating down.
6. stacked lead frame of making by the method for the stacked lead frame of manufacturing that each limited in the claim 2 to 5.
7. method that is used to make stacked lead frame comprises:
Form a plurality of groups first step of depression and projection at least in the corresponding position of two lead frame veneers, this depression and projection form and form pairing by half-etched or half-die separation;
Described projection is assembled to second step in the described depression, makes the lead frame veneer overlapped thus in top of each other; And
Come the third step of the overlapping lead frame veneer of bonding by heating and pressurization.
8. the method that is used to make stacked lead frame according to claim 7 wherein in second step, by described depression and projection, compresses the lead frame veneer and is coupled.
9. according to each described method that is used to make stacked lead frame in claim 7 and 8, wherein depression of a group in depression that forms with many groups and projection and projection are used as the object of reference that is used for superimposed lead frame veneer; And in another group depression and projection, the elongated hole in the maximum elongation direction that becomes the lead frame veneer that caves in.
10. according to each described method that is used to make stacked lead frame in the claim 7 to 9, the surface of wherein electroplating the bonding face at least of this lead frame veneer with rare metal.
11. according to each described method that is used to make stacked lead frame in the claim 7 to 10, the corresponding position on each lead frame veneer wherein, formation will be assembled the location hole of register lock pin.
12. the method that is used to make stacked lead frame according to claim 11, the wherein location hole that forms in greater than the lead frame veneer that is becoming object of reference at the diameter that becomes formed location hole in the overlapping lead frame veneer on the lead frame veneer of object of reference.
13. stacked lead frame of making by the method for the stacked lead frame of manufacturing that each limited in the claim 7 to 12.
14. stacked lead frame according to claim 13 wherein forms described depression and projection by partly covering to compress, and in third step, does not expose described depression and projection from the preceding and rear surface of the stacked lead frame of bonding.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005327631A JP2007134584A (en) | 2005-11-11 | 2005-11-11 | Method for manufacturing laminated lead frame, and laminated lead frame manufactured thereby |
| JP327631/2005 | 2005-11-11 | ||
| JP331937/2005 | 2005-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101278395A true CN101278395A (en) | 2008-10-01 |
Family
ID=38155982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200680031007 Pending CN101278395A (en) | 2005-11-11 | 2006-11-07 | Method of manufacturing laminated lead frame and laminated lead frame produced by the method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007134584A (en) |
| CN (1) | CN101278395A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630339A (en) * | 2009-11-25 | 2012-08-08 | 意法半导体(图尔)公司 | Mounting electronic components assembled by means of a clip in a package |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9136209B2 (en) * | 2011-01-07 | 2015-09-15 | Fuji Electric Co., Ltd. | Semiconductor device with specific lead frame for a power semiconductor module |
| JP5762078B2 (en) * | 2011-03-28 | 2015-08-12 | 新光電気工業株式会社 | Lead frame |
| JP2016004887A (en) * | 2014-06-17 | 2016-01-12 | Ｓｈマテリアル株式会社 | Lead frame, and method of manufacturing lead frame |
-
2005
- 2005-11-11 JP JP2005327631A patent/JP2007134584A/en active Pending
-
2006
- 2006-11-07 CN CN 200680031007 patent/CN101278395A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630339A (en) * | 2009-11-25 | 2012-08-08 | 意法半导体(图尔)公司 | Mounting electronic components assembled by means of a clip in a package |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007134584A (en) | 2007-05-31 |
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