CN101274989B - Semi-conductor polyimide film - Google Patents
Semi-conductor polyimide film Download PDFInfo
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- CN101274989B CN101274989B CN 200710089720 CN200710089720A CN101274989B CN 101274989 B CN101274989 B CN 101274989B CN 200710089720 CN200710089720 CN 200710089720 CN 200710089720 A CN200710089720 A CN 200710089720A CN 101274989 B CN101274989 B CN 101274989B
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Abstract
The invention provides a semiconductor polyimide film which has a surface resistivity common logarithm of 9 to 15 log omega/square at temperature of 25 DEG C and with 60 percent of RH; the common logarithm of volume resistivity is 8 to 15log omega.cm; according to JIS K7118, when the repeating times of fatigue tests are 107, the fatigue stress is 160MPa or more; and according to JIS P8115, times of testing bendability in MIT tests are 2000 or more and intermediate transfer belts and conveyer belts are also provided which use the semiconductor polyimide film.
Description
Technical field
The present invention relates to the excellent semi-conductor polyimide film of a kind of wearing quality, particularly can be used for intermediate transfer belt and conveying belt in the device of electrophotographic method formation and document image.
Background of invention
Because the improvement of picture quality, speed and compactedness recently; With the device of the formation of electrophotographic method and document image for example the intermediate transfer belt in duplicating machine, laser printer, video printer, facsimile recorder and the multi-function printer (MFP), conveying belt etc. compare with conventional conditions, working conditions is harsh more.Particularly; Because the miniaturized of device, the roll roller that is used for intermediate transfer belt and conveying belt is littler, thereby is applied to the pressure increase of bending part; And because speed is high; The tension force that is applied to band increases, thereby causes increasing with the factor of elongation and fracture, thereby has increased the demand to the excellent seamless band of wearing quality.
As the semiconductor tape that is used for intermediate transfer belt, the known up to now semiconductor tape (for example referring to document 1-3) that has the film processed by elastomeric material, fluorine-based material (vinylidene fluoride), polycarbonate resin material, polyimide resin material, polyamide-imide resin material etc. to form.
Yet this traditional band has because the improvement of speed, compactedness and picture quality recently, in operational process, be applied to on load increase, thereby have the change of distortion in the life-time service, transferred image, problem such as break.
[reference 1] JP-A-5-200904
[reference 2] JP-A-6-228335
[reference 3] JP-A-10-63115
Summary of the invention
An object of the present invention is to provide the excellent semi-conductor polyimide film of a kind of wearing quality; And under the situation of this semi-conductor polyimide film as intermediate transfer belt in the electrophotographic recording device or conveying belt; Adding under the state of stress to this band application along the small dia roller; On this is with during applied load, this band is hardly or from indeformable or break during the long-term operation, and do not have toner image to change with transfer printing to spread.
Contriver of the present invention broad research in the hope of realizing above-mentioned purpose; And the semi-conductor polyimide film of finding to use fatigue resistence and flex resistance excellence is as intermediate transfer belt; Significantly reduce to take existing distortion in the long-term operation out of and break, thereby obtain the present invention.
Semi-conductor polyimide film of the present invention has: 25 ℃ of surface resistivity denary logarithm with 60%RH be 9 to 15log Ω/square; The denary logarithm of volume specific resistance is 8 to 15log Ω cm; Carrying out the fatigue test multiplicity according to JISK7118 is 107 o'clock, and fatigue stress is 160MPa or bigger; Carrying out MIT according to JISP8115, to test anti-number of bends be 2,000 times or more.With method surface measurements resistivity, volume specific resistance, fatigue stress and the anti-number of bends described among the embodiment.
Semi-conductor polyimide film with above-mentioned characteristic has the balance between favorable rigidity and the property, and fatigue resistence and flex resistance excellence.Therefore, when this semi-conductor polyimide film is used as intermediate transfer belt and conveying belt for a long time, suppress because the stress in bending of band is possible with the crack that fatigue produces with breaking.
Preferably from the acid solution of the polymeric amide that comprises at least a following material, obtain semi-conductor polyimide film of the present invention: the multipolymer that comprises following repeating unit: component A, wherein by imide bond be connected to the tetracarboxylic acid residue complete fragrant skeleton and for the diamines residue to the phenylene skeleton; And B component, wherein be connected to the complete fragrant skeleton of tetracarboxylic acid residue and be the diphenyl ether skeleton of diamines residue by imide bond; With following blend: comprise the polymkeric substance of component A as repeating unit; With comprise the polymkeric substance of B component as repeating unit, wherein the constitutive molar ratio rate (A/B) of component A and B component is 7/3 to 3/7.
The inventor finds; The Kapton that production fatigue resistence and flex resistance are excellent can comprise the polyamic acid solution of multipolymer or blend through use, and wherein multipolymer or blend comprise the composition and the composition that forms flexible back bone (B component) of the formation rigid backbone (component A) of predetermined proportion.The Kapton of above-mentioned composition has favorable durability during as intermediate transfer belt etc. continuously long-time.
Intermediate transfer belt of the present invention and conveying belt comprise above-mentioned semi-conductor polyimide film.The fatigue resistence of this semi-conductor polyimide film and flex resistance are excellent.Therefore; Under the situation of this semi-conductor polyimide film as the intermediate transfer belt of electrophotographic recording device or conveying belt; Distortion still less will take place and break in said band; And transfer printing preferable image on can long-time inherent recording paper, can not cause that toner image changes with transfer printing spreads.
According to the present invention, can obtain the excellent semi-conductor polyimide film of fatigue resistence and flex resistance.Through using this film to be used for intermediate conveyor system and delivery system through electrophotographic method formation and document image device; High image quality, high speed and compact system can be provided, wherein use the device of electrophotographic method formation and document image for example to be duplicating machine, laser printer, video printer, facsimile recorder and multi-function printer (MFP).
Detailed description of the invention
Hereinafter, will specify the embodiment of the invention.
Semi-conductor polyimide film of the present invention 25 ℃ with 60%RH under the surface resistivity denary logarithm be 9 to 15 (log Ω/square), and can be preferably 10 to 12 (log Ω/square).For example, when being used for intermediate transfer belt, when surface resistivity is lower than 9 and occurs when (log Ω/square) hickie, the transfer printing diffusion appears greater than 15 when (log Ω/square) in surface resistivity.
The volume specific resistance denary logarithm of semi-conductor polyimide film is 8 to 15 (log Ω cm), can be preferably 9.5 to 12 (log Ω cm).Hickie appears when volume specific resistance is lower than 8 (log Ω cm), when the transfer printing diffusion appears during greater than 15 (log Ω cm) in volume specific resistance.
According to the fatigue test of JIS K7118, multiplicity is 10
7The time measure semi-conductor polyimide film of the present invention fatigue stress be 160MPa or bigger, can be preferably 170MPa or bigger.When fatigue stress is lower than 160MPa, continuously in the life-time service when stress concentration with bending cause fracture etc.The fatigue stress of here using is meant in the fatigue test, repeats up to 10
7The band stress higher limit of bearing that does not have fracture when inferior.
According to the MIT measurements determination of JIS P8115, the anti-number of bends of Kapton of the present invention is 2,000 times or more, and can be preferably 5,000 times or more.When anti-number of bends is lower than 2,000 times, continuously between the usage period during stress concentration band possibly rupture.
As for polyimide resin; The preferred use comprises following polyamic acid solution: the multipolymer that comprises component A and B component repeating unit; Among the component A by imide bond be connected to the tetracarboxylic acid residue complete fragrant skeleton and for the diamines residue to the phenylene skeleton, be connected to the complete fragrant skeleton of tetracarboxylic acid residue and be the diphenyl ether skeleton of diamines residue by imide bond in the B component; And/or comprise component A as the polymkeric substance of repeating unit with comprise the blend of B component as the polymkeric substance of repeating unit.
The constitutive molar ratio rate (A/B) of component A and B component can be preferably 7/3 to 3/7, is more preferably 6/4 to 4/6.When the component A with rigid backbone surpassed aforementioned proportion, because flexible low, although elasticity increases, flex resistance reduced.When the B component with flexible back bone surpassed aforementioned proportion, although flexible and tensile property increase, flex resistance became and is lower than the flex resistance of multipolymer and blend.
The tetracarboxylic dianhydride is preferred for producing complete fragrant skeleton, and the example comprises pyromellitic acid dianhydride (PMDA), 3,3 ＇, 4,4 ＇-phenylbenzene tetracarboxylic dianhydride (BPDA), 2; 3,6,7-naphthalene tetracarboxylic acid dianhydride, 1,2,5; 6-naphthalene tetracarboxylic acid dianhydride, 1,4,5,8-naphthalene tetracarboxylic acid dianhydride etc.Wherein, BPDA is a particularly suitable.
Equally, Ursol D (PDA) is preferably used as the diamine components of generation to the phenylene skeleton.Be used to produce the diphenyl ether skeleton, preferred 4,4 ＇-diamino-diphenyl ether, 3,3 ＇-diamino-diphenyl ether etc. are as diamine components, wherein preferred 4,4 ＇-diamino-diphenyl ether (DDE).
In order to prepare semi-conductor polyimide film of the present invention, begin from the preparation polyamic acid solution.
Adopt currently known methods to prepare polyamic acid, the reagent that for example will conduct electricity is dispersed into solution, and catalyzer is added to this solution, and in the dispersion solvent that obtains like this, with the dissolving of pre-mixed ratio and polymerization tetracarboxylic dianhydride and diamines; Through in solvent, dissolving and polymerization tetracarboxylic dianhydride and diamines with the pre-mixed ratio, this solution of the reagent that will conduct electricity then adding obtains the method for polyamic acid solution etc.
Consider solvability etc., be used for preferably polar solvent of solvent of the present invention, the example comprises N; The N-dialkyl amide, N for example, dinethylformamide, N; N-N,N-DIMETHYLACETAMIDE, N; N-DEF and N, N-diethyl acetamide, N, N-dimethyl-methoxy yl acetamide, DMSO 99.8MIN., hexamethylphosphorictriamide, N-N-methyl-2-2-pyrrolidone N-(NMP), pyridine, METHYL SULFONYL METHANE. (dimethylsulfon), dimethylsulfolane etc.
Be used for conduction example agents of the present invention and comprise carbon black; For example ketjen is black and acetylene black, and metal is al and ni for example, the conduction and the semiconductor powder of White tin oxide and quasi-metal oxides compound; Potassium titanate etc.; Conductive polymers is polyaniline and polyacetylene etc. for example, and these materials can use separately or two kinds or more kinds of combination use, and is unqualified to type.Among the present invention, consider the electroconductibility effect of giving, uniformly dispersed etc., preferably use carbon black separately or be used in combination with other conducting material.
Can select to conduct electricity the content of reagent according to the type of conduction reagent,, can be preferably about 5, be more preferably 10 to 25wt% to 30wt% based on the amount of resin.When content was lower than 5wt%, the resistance homogeneity reduced, and causes the remarkable reduction of surface resistivity between the usage period sometimes.When this content surpasses 30wt%, be difficult to obtain required resistance, and the moulding material that the obtains undesirable fragility that becomes.
Can adopt known dispersing method as the dispersed electro-conductive compositions and methods, and can adopt ball mill, sand mill, planetary-type mixer, three-roller type shredder, ultrasonic dispersing etc. to spread the work.In addition, in order to obtain homodisperse, can use dispersion agent, for example tensio-active agent.This dispersion agent is not special to be limited, as long as it satisfies the object of the invention, the example comprises dispersion stabilizer, for example polymeric dispersant, tensio-active agent and inorganic salt, wherein preferred surfactant.
The instance of polymeric dispersant comprises and gathers (N-vinyl-2-Pyrrolidone), gathers (N; N ＇-diethylammonium acryl trinitride), gather (N-vinyl formamide), gather (N-vinyl acetamide), gather (N-vinyl phthalic diamide), gather (N-vinylamide succinate), gather (N-vinyl urea), gather (N-vinyl piperidone), gather (N-caprolactam), gather (N-Yi Xi oxazolin) etc., can add one or more polymeric dispersants.
The instance of tensio-active agent comprises carboxylic acid type, sulfuric acid ester type and sulfonic acid type AS, quaternary ammonium type, fatty amine type and imidazoline type cats product, amine oxide type, glycine type and betaine type amphoteric ionic surface active agent and ether type, ester type, amino ethers type, Etheric ester type and alkylolamide type non-ionics.
For physical strength and the wearing quality that improves semi-conductor polyimide film, can preferably catalyzer be added to the polyimide acid solution.
The instance of catalyzer comprises tertiary amine for example Trimethylamine 99, triethylamine, triethylenediamine, Tributylamine, xylidine, pyridine, 9-picoline, 6-picoline, γ-picoline, isoquinoline 99.9 and lutidine; And organic bases, for example 1,5-diazabicylo [4.3.0] nonane-5; 1; 4-diazabicylo [2.2.2] octane and 1,8-diazabicylo [5.4.0] undecylene-7 is wherein considered stability and control imidization easily; Preferred tertiary amine, preferred especially isoquinoline 99.9.
The catalytic amount that adds can be preferably 0.04 to 0.3 molar equivalent, is more preferably 0.1 to 0.2 molar equivalent, with respect to the polyamic acid of 1 molar equivalent in the polyamic acid solution.
Monomer concentration in the polyamic acid solution (tetracarboxylic dianhydride and diamines (ex.PDA+DDE) in the solvent) can be preferably 5% to 30%, can change although depend on this concentration of different condition.In addition, temperature of reaction can preferably be set to 80 ℃ or littler between dissolving and polymerization period, is more preferably 5 ℃ to 50 ℃, and the reaction times can be 5 to 10 hours usually.
Can remove the solvent of polyamic acid solution through heat drying, remove dewatering cycle sealing water, and accomplish the imide conversion reaction, and obtain Kapton of the present invention.When polyamic acid solution is the solution form, consider moldedly easily, preferably carry out molded to polyamic acid solution.
As for seamless band method of moulding; Can adopt suitable method according to ordinary method, for example polyamic acid solution is coated on the method on cylindrical mold internal circumference or the exterior periphery through immersion, centrifugal mo(u)lding, coating, cylinder square extrusion molding (cylindrical dice extrusion) etc.; Wherein for example fill casting die and obtain endless shaper article with polyamic acid solution with suitable method; Through drying these annular goods are formed banded section bar; The goods that add thermosetting to be realizing the imide conversion of polyamic acid, and from (JP-A-61-95361, the JP-A-64-22514 such as method of mold releasability moulded product; JP-A-3-180309, etc.).In the molded seamless band, can carry out proper process for example releasing agent processing and defoaming treatment.
Embodiment
With reference now to embodiment and comparative example, illustrate the present invention in more detail, but be to be understood that the present invention is not limited by it.Measure among the embodiment scoring item etc. according to the method that is described below.
Embodiment 1
Through with 39.4g carbon black (Special Black4; The product of Degussa) and nonionogenic tenside (alkyl di-alcohol amine oxide; 0.5wt% is with respect to carbon black) be added to the nmp solution that 944.7g N-N-methyl-2-2-pyrrolidone N-(NMP) obtains carbon blacks, use ball mill to stir subsequently 12 hours.After 4.3g isoquinoline 99.9 being added to the nmp solution (0.2mol is with respect to the 1mol polyamic acid) of carbon blacks, add 146.8g BPDA, 37.8g PDA and 30.0g DDE (component A/ B component=7/3), polymerization under nitrogen atmosphere subsequently.After the polyreaction multiviscosisty, under 65 ℃, stirred the mixture 7 hours, obtain the polyamic acid solution (regulating carbon black) of dispersed carbon to 24wt%, with respect to the polyimide resin component.
The polyamic acid solution that uses circle side's grain so to obtain is uniformly coated on the internal surface of cylindrical mold; Subsequently 130 ℃ of heating 20 minutes; In 30 minutes, temperature is risen to 360 ℃ then; To remove residual solvent, remove dewatering cycle sealing water and imidization, be cooled to room temperature subsequently.Then, from the mold releasability moulded product, obtain the seamless band of diameter 100mm, thickness 80 μ m, length 500mm.
The band that so obtains is cut into width 250mm, and estimates through continuous durability test.Behind the continuous operation 240 hours, neither exist the crack also not break in the band, explain that this band wearing quality is excellent.Measure surface resistivity, volume specific resistance, tensile strength, tensile elasticity, fatigue stress and the anti-number of bends of this band.The result lists in table 1.
Embodiment 2
Through with 39.4g carbon black (Special Black4; The product of Degussa) and nonionogenic tenside (alkyl di-alcohol amine oxide; 0.5wt% is with respect to carbon black) be added to the nmp solution that 944.7g N-N-methyl-2-2-pyrrolidone N-(NMP) obtains carbon blacks, use ball mill to stir subsequently 12 hours.After 4.5g isoquinoline 99.9 being added to the nmp solution (0.2mol is with respect to the 1mol polyamic acid) of carbon blacks, add 146.8g BPDA, 27.0g PDA and 50.1g DDE (component A/ B component=5/5), polymerization under nitrogen atmosphere subsequently.After the polyreaction multiviscosisty, stirred the mixture 7 hours at 65 ℃, obtain the polyamic acid solution (regulating carbon black) of 110Pas dispersed carbon to 23wt%, with respect to the polyimide resin component.Except above-mentioned condition, with embodiment in identical method obtain seamless band.
The band that obtains like this is cut into width 250mm, and estimates through continuous durability test.Behind the continuous operation 240 hours, neither exist the crack also not break in the band, explain that this band wearing quality is excellent.Measure surface resistivity, volume specific resistance, tensile strength, tensile elasticity, fatigue stress and the anti-number of bends of this band.The result lists in table 1.
Embodiment 3
Through with 39.4g carbon black (Special Black4; The product of Degussa) and nonionogenic tenside (alkyl di-alcohol amine oxide; 0.5wt% is with respect to carbon black) be added to the nmp solution that 944.7g N-N-methyl-2-2-pyrrolidone N-(NMP) obtains carbon blacks, use ball mill to stir subsequently 12 hours.After 4.7g isoquinoline 99.9 being added to the nmp solution (0.2mol is with respect to the 1mol polyamic acid) of carbon blacks, add 146.8g BPDA, 16.2g PDA and 70.1g DDE (component A/ B component=3/7), polymerization under nitrogen atmosphere subsequently.After the polyreaction multiviscosisty, stirred the mixture 7 hours at 65 ℃, with the polyamic acid solution (regulating carbon black) that obtains the 110Pas dispersed carbon to 19wt%, with respect to the polyimide resin component.Except above-mentioned condition, with embodiment in identical method obtain seamless band.
The band that obtains like this is cut into width 250mm, and estimates through continuous durability test.Behind the continuous operation 240 hours, neither exist the crack also not break in the band, explain that this band wearing quality is excellent.Measure surface resistivity, volume specific resistance, tensile strength, tensile elasticity, fatigue stress and the anti-number of bends of this band.The result lists in table 1.
Comparative Examples 1
Through with 39.4g carbon black (Special Black4; The product of Degussa) and nonionogenic tenside (alkyl di-alcohol amine oxide; 0.5wt% is with respect to carbon black) be added to the nmp solution that 944.7g N-N-methyl-2-2-pyrrolidone N-(NMP) obtains carbon blacks, use ball mill to stir subsequently 12 hours.After 4.0g isoquinoline 99.9 being added to the nmp solution (0.2mol is with respect to the 1mol polyamic acid) of carbon blacks, add 146.8g BPDA and 54.0g PDA (component A/ B component=10/0), polymerization under nitrogen atmosphere subsequently.After the polyreaction multiviscosisty, stirred the mixture 7 hours at 65 ℃, obtain the polyamic acid solution (regulating carbon black) of dispersed carbon to 23wt%, with respect to the polyimide resin component.Except above-mentioned condition, with embodiment in identical method obtain seamless band.
The band that obtains like this is cut into width 250mm, and estimates through continuous durability test.Process is desmorrhexis after about 30 hours.Measure surface resistivity, volume specific resistance, tensile strength, tensile elasticity, fatigue stress and the anti-number of bends of this band.The result lists in table 1.
Comparative Examples 2
Through with 39.4g carbon black (Special Black4; The product of Degussa) and nonionogenic tenside (alkyl di-alcohol amine oxide; 0.5wt% is with respect to carbon black) be added to the nmp solution that 944.7g N-N-methyl-2-2-pyrrolidone N-(NMP) obtains carbon blacks, use ball mill to stir subsequently 12 hours.After 4.0g isoquinoline 99.9 being added to the nmp solution (0.2mol is with respect to the 1mol polyamic acid) of carbon blacks, add 146.8g BPDA and 100.1g DDE (component A/ B component=0/10), polymerization under nitrogen atmosphere subsequently.After the polyreaction multiviscosisty, stirred the mixture 7 hours at 65 ℃, with the polyamic acid solution (regulating carbon black) that obtains dispersed carbon to 19wt%, with respect to the polyimide resin component.Except above-mentioned condition, with embodiment in identical method obtain seamless band.
The band that obtains like this is cut into width 250mm, and estimates through continuous durability test.Process is desmorrhexis after about 70 hours.Measure surface resistivity, volume specific resistance, tensile strength, tensile elasticity, fatigue stress and the anti-number of bends of this band.The result lists in table 1.
Appraisal procedure
1. surface measurements resistivity and volume specific resistance
Use the HIRESTA UP HCP-HT450 (product of Mitsubishi Chemical Corporation; Probe: UR); Under impressed voltage 100V and 10 seconds condition of voltage application time, measure 25 ℃ with 60%RH under surface resistivity and volume specific resistance.
2. fatigue test
The sample of dumbbell shape (dumbbel) No.3 (JIS K6771 (the K6301)) form that obtains through punching according to JIS K-7118, and use the pneumatic strength testing machine (product of Shimadzu Corporation; SERVO PULSER EHF-F01,4880 type gear), in 22 ℃ to 25 ℃, ultimate load stress 300MPa, minimum load stress 30MPa, frequency 15Hz (sinusoidal waveform) and multiplicity 10
7Under the inferior condition, measure fatigue stress (up to 10
7The inferior stress higher limit of not breaking and bearing).
3.MIT test
Use the specimen of width 15mm according to JIS P-8115, and use MIT tester (Tester Sangyo Co., the product of Ltd.), under 270 degree bending angle (left side and right), 175 times/minute the condition of rate of bending and 9.8N load, measure.Begin to test the back and be determined as anti-number of bends until the specimen number of times that bears that breaks.
4. measure tensile strength and tensile elasticity
According to JIS K6771 (K6301), use the tape test sample of the dumbbell shape No.3 form that obtains through punching to measure.
5. continuous durability test
The semi-conductor polyimide band that obtains is cut into width 250mm, and is fixed on the slewing of roller diameter 10mm, roller speed is 10 meters/minute, and band tension force is 2kg/250mm.Carry out 240 hours of continuous run, to estimate the breakage of band.
As shown in table 1, each band among component A and the embodiment 1 to 3 of B component constitutive molar ratio rate in pre-determined range does not have the crack and breaks at continuous operation after 240 hours, explains that its wearing quality is excellent.On the contrary, wherein each band of exceeding in the Comparative Examples 1 and 2 of pre-determined range of component A and B component constitutive molar ratio rate breaks after tens of hours at continuous operation.
Though describe in detail with reference to its embodiment, multiple change and the improvement that under the situation that does not break away from its spirit and scope, can make are conspicuous for those of ordinary skills.
The Japanese patent application No.2005-281865 that the application submitted to based on September 28th, 2005, wherein full content is incorporated herein by reference here.
Claims (3)
1. semi-conductor polyimide film has:
25 ℃ of denary logarithm with 60%RH lower surface resistivity be 9 to 15log Ω/square;
The denary logarithm of volume specific resistance is 8 to 15log Ω cm;
Carrying out the fatigue test multiplicity according to JIS K7118 is 10
7The time, fatigue stress is more than the 160MPa; With
The anti-number of bends that carries out the MIT test according to JIS P8115 is more than 2,000 times,
Said semi-conductor polyimide film can obtain from the polyamic acid solution that comprises at least a following material:
The multipolymer that comprises following repeating unit:
Component A wherein connects complete fragrant skeleton by imide bond and to the phenylene skeleton, described complete fragrant skeleton is the tetracarboxylic acid residue, and described is the diamines residue to the phenylene skeleton; With
B component wherein connects complete fragrant skeleton and diphenyl ether skeleton by imide bond, and described complete fragrant skeleton is the tetracarboxylic acid residue, and described phenyl ether skeleton is the diamines residue; With
The blend of following material: comprise the polymkeric substance of component A as repeating unit; With comprise the polymkeric substance of B component as repeating unit,
Wherein the constitutive molar ratio of component A and B component (A/B) is 3/7 to＜5/5.
2. an intermediate transfer belt comprises the described semi-conductor polyimide film of claim 1.
3. a conveying belt comprises the described semi-conductor polyimide film of claim 1.
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| CN 200710089720 CN101274989B (en) | 2007-03-27 | 2007-03-27 | Semi-conductor polyimide film |
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| CN 200710089720 CN101274989B (en) | 2007-03-27 | 2007-03-27 | Semi-conductor polyimide film |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5939498A (en) * | 1998-04-07 | 1999-08-17 | E. I. Du Pont De Nemours And Company | High modulus polyimide blend |
| US6281324B1 (en) * | 1998-12-21 | 2001-08-28 | Nitto Denko Corporation | Semiconductive belt |
| US6352750B1 (en) * | 1999-08-12 | 2002-03-05 | Gunze Limited | Seamless tubular electrically-semiconductive aromatic polymide film and process for producing the same |
-
2007
- 2007-03-27 CN CN 200710089720 patent/CN101274989B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5939498A (en) * | 1998-04-07 | 1999-08-17 | E. I. Du Pont De Nemours And Company | High modulus polyimide blend |
| US6281324B1 (en) * | 1998-12-21 | 2001-08-28 | Nitto Denko Corporation | Semiconductive belt |
| US6352750B1 (en) * | 1999-08-12 | 2002-03-05 | Gunze Limited | Seamless tubular electrically-semiconductive aromatic polymide film and process for producing the same |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2006-323081A 2006.11.30 |
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