CN101269547B - Transverse dipping method for preliminary dip material - Google Patents

Transverse dipping method for preliminary dip material Download PDF

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Publication number
CN101269547B
CN101269547B CN2008100275386A CN200810027538A CN101269547B CN 101269547 B CN101269547 B CN 101269547B CN 2008100275386 A CN2008100275386 A CN 2008100275386A CN 200810027538 A CN200810027538 A CN 200810027538A CN 101269547 B CN101269547 B CN 101269547B
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prepreg
preg
preg material
deflector roll
glue
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CN2008100275386A
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CN101269547A (en
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贺育方
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ITEQ (Dongguan) Corp
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ITEQ ELECTRONIC CO Ltd
ITEQ (Dongguan) Corp
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Abstract

The invention relates to a pre-preg material horizontal infiltration method, which is applied to the pre-preg field of the production using the pre-preg in a copper clad laminate, the method is that the pre-preg material is vertically sent to the downside in a glue applying groove containing resin glue, and is horizontally staggered and wound on a guide roller in the glue applying groove; under the drive of the guide roller, the pre-preg material is infiltrated horizontally from the downside to the upside in the glue applying groove through the guide roller, and then passes through an extrusion roller to enter into a glue applying furnace; because the pre-preg material horizontality causes the stay time of the pre-preg material in the resin glue in the glue applying groove to be greatly increased, the time that the resin glue replaces the bubbles in the pre-preg material is prolonged, and the pre-preg material is fully infiltrated, thereby ensuring the resin glue in the glue applying groove to be able to be better infiltrated into the pre-preg material so as to reduce the solvent or bubble residue quantity in the pre-preg material in the pre-preg, and increasing the reliability of the pressing quality, and the metal-resistance ion migration, etc. of the copper clad laminate. The operation of the method is convenient, in particular the device investment cost is not added, and the industrialization application is easy to be realized.

Description

The method of prepreg transverse dipping
Technical field
The present invention relates to use in the copper-clad plate preimpregnation field of the production of prepreg, refer in particular to a kind of method and device thereof of prepreg transverse dipping, to reach the wellability that strengthens prepreg.
Background technology
Copper-clad plate is the stock of PCB, and it generally is to be composited by epoxyn, glass fabric (all-glass paper etc.), Copper Foil.Because the quality of copper-clad plate can directly have influence on the performance of PCB, and copper-clad plate depends mainly on prepreg (prepreg), and it is particularly important wherein soaking between prepreg (glass fabric, fibrous paper or fabric) and the epoxyn in this prepreg process.
As Fig. 1, show known prepreg infiltration apparatus; On in gluing groove 1, be arranged with complex root deflector roll 2, prepreg 3 vertically passes resin glue and is around on this deflector roll 2, wherein prepreg 3 is to adopt successively along gluing groove 1 from the bottom to top, vertical drive method from top to bottom (can along gluing groove 1 from left to right or from right to left) soaks into again, soak into after send in the gluing stove 5 behind the compression roller 4 and toast processing, wherein owing to can exist infiltrating time shorter in the impregnation process, soak into also abundant inadequately problem, and easy residual bubble between prepreg, thereby cause the subsequent production copper-clad plate to bring correlated quality hidden danger, be unfavorable for market competition; Above-mentioned known techniques for example has Japan Patent JP2000061939 case.So, a series of new schemes have constantly been proposed in the industry, those schemes all need increase other treatment facility and handle, make infiltration method and device comparatively complicated, simultaneously can consult relevant Chinese patent application publication number CN1734003A, CN1872760A etc., therefore, the applicant thinks that improving the prepreg wellability belongs to necessary in fact.
Summary of the invention
The present invention is directed to the existing disappearance of above-mentioned known techniques, main purpose is to provide a kind of method of prepreg transverse dipping, by prolonging the infiltrating time of prepreg in the gluing groove, soaks into insufficient problem to solve prepreg.
For realizing above-mentioned purpose, the present invention takes following skill scheme:
A kind of method of prepreg transverse dipping, prepreg vertically sent into the below in the gluing groove that is loaded with resin glue, and laterally staggered again being around on the interior deflector roll of gluing groove, drive down through this deflector roll, the prepreg that immerses in the gluing groove is laterally sent toward the top circulation of gluing groove from the below of gluing groove.
Described prepreg comprises glass fabric or fabric.
Deflector roll quantity in the gluing groove is 3~8; Further, all deflector rolls are scattered in the longitudinal row of two vertical gluing bottom lands.
The present invention's advantage is that prepreg enters the gluing stove through compression roller again after deflector roll is laterally soaked into by the below in the gluing groove to top, because prepreg makes that laterally the time of staying increases greatly in the resin glue of prepreg in the gluing groove, prolong the time of the bubble in the resin glue displacement prepreg, prepreg is soaked into be able to fully, guaranteed that the resin glue in the gluing groove can soak in the prepreg well, with solvent or the bubble residual quantity in the prepreg in the minimizing prepreg, thus the reliability of reliabilities such as the pressing quality of raising copper-clad plate and anti-metal ion transport.The present invention is easy to operate, does not especially increase equipment investment cost and realizes industrial applications easily.
Description of drawings
Fig. 1 is a known techniques prepreg infiltration method schematic diagram;
Fig. 2 is a prepreg transverse dipping method schematic diagram of the present invention;
Fig. 3 (a) adopts the prepared semi-solid preparation of known techniques method shown in Figure 1 at crystalline phase microscopically observation schematic diagram backlight down for equal conditions;
Fig. 3 (b) adopts the prepared semi-solid preparation of the technology of the present invention method shown in Figure 2 at crystalline phase microscopically observation schematic diagram backlight down for equal conditions;
Fig. 4 is another enforcement schematic diagram of prepreg transverse dipping method of the present invention.
The drawing reference numeral explanation:
1, gluing groove 2, deflector roll 3, prepreg 4, compression roller 5, gluing stove
10, gluing groove 20, first deflector roll 21, second deflector roll 22, the 3rd deflector roll 30, prepreg 40, compression roller 50, gluing stove
10 ', gluing groove 20 ', deflector roll 30 ', prepreg 40 ', compression roller 50 ', gluing stove
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the present invention is further described.
As shown in Figure 2, present embodiment system describes the transverse dipping method by applied prepreg infiltration apparatus, and above-mentioned prepreg can be selected glass fabric or fibrous paper or fabric for use; Wherein, totally 3 of the deflector roll numbers in the present embodiment in the gluing groove, i.e. first deflector roll 20, second deflector roll 21 and the 3rd deflector roll 22; Prepreg 30 vertically sent into the below in the gluing groove 10 that is loaded with resin glue, be around in successively then on first deflector roll 20, second deflector roll 21, the 3rd deflector roll 22, and first deflector roll 20, the 3rd deflector roll 21 are positioned on the longitudinal row A, second deflector roll 21 is positioned on another longitudinal row B, the bottom of longitudinal row A, the vertical gluing groove 10 of longitudinal row B; And the canoe of prepreg 30 system forms laterally staggered being around on each deflector roll, prepreg 30 is under the drive of each deflector roll, the prepregs 30 that immerse in the gluing groove 10 are laterally sent toward the tops circulation of gluing groove 10 from the belows of gluing groove 10, and the prepreg 30 after sending is sent in the gluing stove 50 through the resin glue that compression roller 40 scrapes off unnecessary infiltration usefulness again.
Through experiment showed, that repeatedly adopting the inventive method to soak under the same terms such as size, deflector roll transmission machine speed, prepreg kind, deflector roll number, deflector roll size and resin glue viscosity at the gluing groove all is better than known techniques.For example, size at the gluing groove is bottom width 60cm, groove wide 120cm suitable for reading, the high 70cm of groove, resin glue liquid level 60cm in the groove, deflector roll diameter 10cm, 3 of deflector roll quantity, prepreg model 7628, machine speed 12m/min, resin glue viscosity (test of 3# viscosity cup) 22s is beneficial to above-mentioned the same terms and carries out different experiments, wherein experimental results show that, known techniques is soaked into the prepreg that obtains in the employing earlier figures 1, and shown in Fig. 3 (a), it is in the observation backlight of crystalline phase microscopically, there is a large amount of bubbles as can be known, shows that resin does not soak between the organdy fully.And the resulting prepreg of previous embodiment transverse dipping method of employing Fig. 2 of the present invention, see shown in Fig. 3 (b), it is also in the observation backlight of crystalline phase microscopically, wellability improves greatly as can be known, and almost do not have bubble in the organdy of prepreg, guaranteed that the resin glue in the gluing groove can soak in the prepreg well.So from Fig. 3 (a) and Fig. 3 (b) both relatively down, Fig. 3 (b) obviously is the prepreg that is better than Fig. 3 (a).
See also again shown in Figure 4, its be prepreg transverse dipping method of the present invention another implement schematic diagram.Wherein, present embodiment is compared with the embodiment of earlier figures 2, only difference is that the total quantity of deflector roll 20 ' is 6 in the present embodiment, and same system forms two longitudinal row A ', B ', prepreg 30 ' is laterally staggered on each deflector roll 20 ', drive down through deflector roll 20 ', prepreg 30 ' enters in the gluing stove 50 ' through compression roller 40 ' after laterally being soaked into by below to the top of gluing groove 10 ', it can make better that equally the time of staying increases greatly in the resin glue of prepreg 30 ' in gluing groove 10 ', prolong the time of the bubble in the resin glue displacement prepreg 30 ', prepreg is soaked into be able to fully, promptly do not add to give at this and give unnecessary details.
Design focal point of the present invention is laterally to be soaked into by the below in the gluing groove to top by prepreg, prolong the infiltrating time of prepreg in the gluing groove effectively, prepreg is soaked into be able to fully, guaranteed that the resin glue in the gluing groove can soak in the prepreg well, with solvent or the bubble residual quantity in the prepreg in the minimizing prepreg, thus the reliability of reliabilities such as the pressing quality of raising copper-clad plate and anti-metal ion transport.
The above, only be the method and the device preferred embodiment thereof of a kind of prepreg transverse dipping of the present invention, be not that technical scope of the present invention is imposed any restrictions, for example the quantity of the every row deflector roll in apparatus of the present invention can be adjusted according to demand, it for example can also be 4 to 8 etc., so every foundation technical spirit of the present invention is to any trickle modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.

Claims (4)

1. the method for a prepreg transverse dipping, it is characterized in that: prepreg is vertically sent into the below in the gluing groove that is loaded with resin glue, and laterally staggered again being around on each deflector roll of gluing groove, drive down through this deflector roll, the prepreg that immerses in the gluing groove is laterally sent toward the top circulation of gluing groove from the below of gluing groove.
2. the method for prepreg transverse dipping according to claim 1 is characterized in that: described prepreg comprises glass fabric or fibrous paper or fabric.
3. the method for prepreg transverse dipping according to claim 2 is characterized in that: the deflector roll quantity in the described gluing groove is 3~8.
4. the method for prepreg transverse dipping according to claim 3 is characterized in that: all deflector rolls are scattered in the longitudinal row of two vertical gluing bottom lands.
CN2008100275386A 2008-04-21 2008-04-21 Transverse dipping method for preliminary dip material Active CN101269547B (en)

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104109954A (en) * 2014-07-31 2014-10-22 开平太平洋绝缘材料有限公司 Production device for prepregs of PCB
CN104275271B (en) * 2014-09-16 2017-02-08 东莞联茂电子科技有限公司 Device for improving impregnation property of prepreg
CN104941867A (en) * 2015-06-30 2015-09-30 开平太平洋绝缘材料有限公司 Improved prepreg glue presoaking device used for PCB production
CN111941685B (en) * 2020-08-14 2022-07-19 苏州生益科技有限公司 Infiltration unit and infiltration method of prepreg
CN113327724B (en) * 2021-05-26 2023-03-07 上杭鑫昌龙实业有限公司 Filling process and processing system for security and protection cable waterproof glue and security and protection cable waterproof structure
CN114267499A (en) * 2021-12-15 2022-04-01 四川耀强科技有限公司 Waterproof communication cable and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5205898A (en) * 1990-11-15 1993-04-27 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Continuous fiber thermoplastic prepreg
JP2000061939A (en) * 1998-08-20 2000-02-29 Hitachi Chem Co Ltd Resin varnish impregnation method, manufacture of prepreg and resin impregnation device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5205898A (en) * 1990-11-15 1993-04-27 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Continuous fiber thermoplastic prepreg
JP2000061939A (en) * 1998-08-20 2000-02-29 Hitachi Chem Co Ltd Resin varnish impregnation method, manufacture of prepreg and resin impregnation device

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Effective date of registration: 20180102

Address after: Dongguan City, Guangdong Province, Humen, North Gate Village

Patentee after: Iteq (Dongguan) Corp.

Address before: 168 No. 523900 Guangdong city of Dongguan province Nan Fang Industrial Zone of Humen Town Dong Fang Road

Co-patentee before: Iteq Electronic Co., Ltd.

Patentee before: Iteq (Dongguan) Corp.