CN101263972B - Ceramic pan for electromagnetic stove and manufacturing method thereof - Google Patents
Ceramic pan for electromagnetic stove and manufacturing method thereof Download PDFInfo
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- CN101263972B CN101263972B CN2008100644179A CN200810064417A CN101263972B CN 101263972 B CN101263972 B CN 101263972B CN 2008100644179 A CN2008100644179 A CN 2008100644179A CN 200810064417 A CN200810064417 A CN 200810064417A CN 101263972 B CN101263972 B CN 101263972B
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Abstract
The invention relates to a ceramic pot and a making method of the ceramic pot, which are used for the induction cooker. The invention solves the problem of prior ceramic kitchenware used on the induction cooker that while used on the induction cooker, the heat conduction efficiency is low and the electric energy is wasted. The ceramic pot: nickel layers is plated on the bottom surface and the periphery of the ceramic pot body; a copper wire mesh is attached under the nickel layer; an annular solder is arranged on the bottom surface of the second-level groove; and a stainless steel tablet is attached under the copper wire mesh and the annular solder. The making method: the bottom surfaces and the peripheries of the first-level groove and the second-level groove are operated by defatting, chemical coarsing, sensitization, activation, reduction and chemical nickel plating, and then the nickel is dried with a blower; the copper wire mesh is tightly attached under the nickel layer; the soft flux is laid on the annular solder, and the assembled pot body is put in the resistance furnace for welding. The invention has the advantages of achieving the brazing connection of the stainless steel tablet and the bottom surface of the ceramic pot body, firm and reliable joint, high heat conduction efficiency, and energy-saving.
Description
Technical field
The present invention relates to a kind of pottery pot and preparation method thereof.
Background technology
Along with the raising of people's living standard, the use of electromagnetic oven also more and more widely.Because electromagnetic oven adopts the heating principle of magnetic field induction eddy current, when the bottom that contains irony pan (iron pan, stainless-steel pan, enamel pan etc.) is placed on the electromagnetism boiler face, pan promptly cuts the alternation magnetic line of force and partly produces the electric current (being eddy current) of alternation in the pan bottom metal, eddy current makes the random motion of pan iron molecule high speed, molecule runs foul of each other, rubs and produces heat energy, make utensil heating at a high speed voluntarily itself, be used for heating and cooking food, thereby reach the purpose of cooking.The pot and the container of copper, aluminium, pottery, glass material because their molecule is not the molecule that can be magnetized, can not produce collision under the effect in magnetic field.Like the characteristics of cooking at people, in electromagnetic oven, uses the easily sticking shortcoming of stewing and burning in order to overcome the stainless steel cooker simultaneously, proposed marmite that the metal/ceramic composite component makes and be used for requirement on the electromagnetic oven with ceramic marmite Baoshang.The cooker that has occurred at present pottery and glass can use on electromagnetic oven.Mainly contain following two kinds, a kind of is to carry out can using after secondary is fired after the electromagnetic oven bottom is stained with one deck magnetic conduction substrate or iron plate, connects owing to make to stick with glue, and has the thermal conductivity problem, and the thermal efficiency during use is low, and waste of energy is big.In addition, the magnetic conduction substrate is easy to wearing and tearing.Another kind is to carry out can using after secondary is fired after electromagnetic oven bottom bag iron plate of embedding or magnetic conduction substrate, thermal expansion when it uses is easy to burst a pot body, thus lack service life, and also iron plate or magnetic conduction substrate can not closely contact with pottery, heat transfer efficiency is low, and waste of energy is big.
Summary of the invention
The objective of the invention is for solving existing pottery that can use and kitchen glassware on electromagnetic oven, heat transfer efficiency is low when using on electromagnetic oven, and the problem that waste of energy is big provides a kind of pottery pot and preparation method thereof that is used on the electromagnetic oven.
Pottery pot of the present invention comprises pottery pot body, nickel dam, copper mesh, stainless steel substrates and annular solder, the bottom surface of pottery pot body is provided with ground floor groove and second layer groove, the bottom surface and the periphery of ground floor groove and second layer groove are coated with nickel dam, copper mesh be fitted in nickel dam below, the annular solder is arranged on the bottom surface of second layer groove, and between nickel dam and copper mesh, stainless steel substrates be fitted in copper mesh and annular solder below.
Preparation method of the present invention realizes by following steps: one, with adhesive plaster the side of pottery pot body is wrapped earlier; Two, with the bottom surface and the peripheral oil removing of ground floor groove and second layer groove, ceramic bottom of pot body is put into acetone soln soaked 15-25 minute, put into absolute alcohol solution again and soaked 5-15 minute, clean after the oil removing with distilled water flushing; Three, bottom surface and the periphery with ground floor groove and second layer groove carries out chemical roughen, ceramic bottom of pot body is put into roughening solution to be soaked 20-30 minute, roughening solution is to add 18-22ml hydrofluoric acid and 34-38ml nitric acid in a small amount of distilled water, rise solution with distilled water diluting to 1-1.5 again, clean after the alligatoring with distilled water flushing; Four, bottom surface and the periphery with ground floor groove and second layer groove carries out sensitization, ceramic bottom of pot body is put into sensitized solution to be soaked 10-15 minute, during the preparation sensitized solution, earlier stannous chloride 10-15g is dissolved in the 30-50ml hydrochloric acid, slowly is diluted to 1-1.5 with distilled water again and rises solution, if slight white precipitate is arranged, can use, if a large amount of white precipitates need reconfigure, wash with distilled water after the sensitization; Five, bottom surface and the periphery of ground floor groove 22 with second layer groove activated, ceramic bottom of pot body is put into activated solution to be soaked 15-20 minute, activated solution is that the 0.25-0.5g palladium bichloride is put into 5-15ml hydrochloric acid, rise solution with distilled water diluting to 1-1.5 again, the activation back is washed with distilled water; Six, bottom surface and the periphery with ground floor groove and second layer groove reduces, ceramic bottom of pot body is put into reducing solution to be soaked 3-5 minute, reducing solution is to rise in the distilled water at 1-1.5 that to add the 5-10g inferior sodium phosphate formulated, and the reduction back is washed with distilled water; Seven, bottom surface and the periphery with ground floor groove and second layer groove carries out chemical nickel plating, ceramic bottom of pot body is put into chemical plating fluid, chemical plating fluid is that nickelous sulfate 24-36g, inferior sodium phosphate 20-35g, boric acid 12-16g, lactic acid 12-16ml, anhydrous sodium acetate 30-40g, sodium fluoride 0.8-1.2g and ammonium molybdate 8-12mg are dissolved in the distilled water, is made into 1-1.5 with distilled water and rises solution; The glass container of pottery pot body and chemical plating fluid of packing into is put into 75-85 ℃ water bath with thermostatic control environment, and chemical Ni-plating layer forms gradually, and the chemical plating time is 1-1.5 hour, washes with distilled water after the chemical plating; Eight, tear the adhesive plaster of pot body side surface off, use the distilled water wash clean, will plate the ground floor groove of nickel dam with hair-dryer again and the bottom surface and the periphery of second layer groove dries up; Nine, copper mesh is fitted tightly below nickel dam; Ten, oxide-film is removed with sand papering in annular solder surface, oil removing is cleaned with acetone in the stainless steel substrates surface, remove surface film oxide with sand papering again, after the polishing annular solder and stainless steel substrates are cleaned up with absolute alcohol, select for use soldering flux to be coated on the nickel dam and stainless steel substrates of annular solder and second layer groove floor and side; 11, annular solder is placed on the bottom surface of second layer groove, again stainless steel substrates be fitted in copper mesh and annular solder below; 12, the above-mentioned pot body that assembles is put into resistance furnace to be welded, make the temperature in the resistance furnace be raised to 350 ℃～400 ℃ with per second 18-22 ℃ programming rate from room temperature, make annular solder fusing, the wetting second layer groove floor of annular solder liquid after the fusing and the nickel dam and the stainless steel substrates of side, be incubated 10-20 minute then, make resistance furnace temperature drop to 45-55 ℃ with per second 8-12 ℃ cooling rate again, at this moment, the annular solder liquid of fusing solidifies, simultaneously that the nickel dam of stainless steel substrates and second layer groove floor and side is welded together, encapsulation has been finished in whole cooker body bottom surface, from resistance furnace, take out the pottery pot body after encapsulating, with the brazing flux of distilled water flush away pottery pot surface.
Advantage of the present invention is: one, the present invention has realized ceramic pot body bottom surface metallization, and stainless steel substrates is connected with the soldering of pottery pot body bottom surface, and joint is solid and reliable, combination is tight, and the heat transfer efficiency height has been saved the energy.Two, adopt pottery to do a pot body, because pottery is an Inorganic Non-metallic Materials, harmful substances such as the not leaded and cadmium of pottery, pottery is gone back acid and alkali-resistance, not perishable, so the present invention can make the nutrition in the food not be decomposed, has kept the genuineness in the food.Three, the present invention has energy-saving and environmental protection, safe and reliable advantage concurrently.Three, the present invention not only can be placed on the electromagnetic oven and use, and can be placed on the micro-wave oven and use, long service life, and the efficient height, and also production method is simple, and cost is low.
Description of drawings
Fig. 1 is the overall structure cutaway view of the present invention's pottery pot.
The specific embodiment
The specific embodiment one: present embodiment is described in conjunction with Fig. 1, present embodiment comprises pottery pot body 2, nickel dam 4, copper mesh 5, stainless steel substrates 6 and annular solder 7, the bottom surface of pottery pot body 2 is provided with ground floor groove 22 and second layer groove 23, ground floor groove 22 is coated with nickel dam 4 with the bottom surface and the periphery of second layer groove 23, copper mesh 5 be fitted in nickel dam 4 below, annular solder 7 is arranged on the bottom surface of second layer groove 23, and between nickel dam 4 and copper mesh 5, stainless steel substrates 6 be fitted in copper mesh 5 and annular solder 7 below.The bottom surface of pottery pot body 2 is the plane, and two layers of groove that pottery pot body 2 bottom surfaces are provided with can make the copper mesh 5 in the ground floor groove 22 can fit tightly with stainless steel substrates 6 in the second layer groove 23, to alleviate welding stress, have strengthened heat transfer efficiency simultaneously.The present invention also contains pot cover 1, and pot cover 1 is arranged on the upper port of pottery pot body 2, and pot cover 1 is a glass cover, and pot cover 1 is provided with pore 11, and the periphery of pot cover 1 is embedded with bound edge 12.Pore 11 can reduce the pressure in the pottery pot body 2, is packed with bound edge 12 at the periphery of pot cover 1 and can prevents pot cover 1 distortion.During cooking, food and water are placed in the pottery pot body 2, then pottery pot body 2 is placed on the electromagnetic oven, utilize the magnetic field induction eddy current heating principle of electromagnetic oven, when running into the stainless steel substrates 6 of ceramic pot bottom, produce countless little eddy current and make stainless steel substrates 6 heating at a high speed, heat is passed to nickel coating 4 and copper mesh 5, and then make the heating of whole bottom of pot body, just can come by all good food of cooking excellent aroma very soon.
The specific embodiment two: in conjunction with Fig. 1 present embodiment is described, the inner chamber base angle of the pottery pot body 2 of present embodiment is a round-corner transition 8.This design goes out the food that is bonded at pottery pot body 2 base angles easily clearly.
The specific embodiment three: present embodiment is described in conjunction with Fig. 1, the stainless steel substrates 6 of present embodiment is a plate-like, and annular solder 7 is the paper tinsel shape, and annular solder 7 is selected tin silver solder, tin copper solder or SAC solder for use, wherein Yin content is 2%～5%, and the content of copper is 0.7%～5%.Design makes annular solder 7 little with stainless steel substrates 6 welding stress when welding like this, the intensity height.Before the welding annular solder 7 surface finish are removed oxide-film, before the welding oil removing is cleaned with acetone earlier in stainless steel substrates 6 surfaces, surface film oxide is removed in polishing again.
The specific embodiment four: in conjunction with Fig. 1 present embodiment is described, the difference of the present embodiment and the specific embodiment one is that it also contains base 3, is provided with base groove 31 above the base 3, and pottery pot body 2 is arranged in the base groove 31 on the base 3.Base 3 is used to carry pottery pot body 2.Pottery pot body 2 after the cooked food is placed in the base 3, promptly can prevent to scorch desktop, can continue insulation again, plays multi-efficiency.Other composition and annexation are identical with the specific embodiment one.
The specific embodiment five: in conjunction with Fig. 1 present embodiment is described, the preparation method of present embodiment realizes by following steps: one, with adhesive plaster the side of pottery pot body is wrapped earlier; Two, with bottom surface and the peripheral oil removing of ground floor groove 22 with second layer groove 23, ceramic bottom of pot body is put into acetone soln soaked 15-25 minute, put into absolute alcohol solution again and soaked 5-15 minute, clean after the oil removing with distilled water flushing; Three, bottom surface and the periphery with ground floor groove 22 and second layer groove 23 carries out chemical roughen, ceramic bottom of pot body is put into roughening solution to be soaked 20-30 minute, roughening solution is to add 18-22ml hydrofluoric acid and 34-38ml nitric acid in a small amount of distilled water, rise solution with distilled water diluting to 1-1.5 again, clean after the alligatoring with distilled water flushing; Four, bottom surface and the periphery with ground floor groove 22 and second layer groove 23 carries out sensitization, ceramic bottom of pot body is put into sensitized solution to be soaked 10-15 minute, during the preparation sensitized solution, earlier stannous chloride 10-15g is dissolved in the 30-50ml hydrochloric acid, slowly is diluted to 1-1.5 with distilled water again and rises solution, if slight white precipitate is arranged, can use, if a large amount of white precipitates need reconfigure, wash with distilled water after the sensitization; Five, bottom surface and the periphery of ground floor groove 22 with second layer groove 23 activated, ceramic bottom of pot body is put into activated solution to be soaked 15-20 minute, activated solution is that the 0.25-0.5g palladium bichloride is put into 5-15ml hydrochloric acid, rise solution with distilled water diluting to 1-1.5 again, the activation back is washed with distilled water; Six, bottom surface and the periphery of the-layer groove 22 with second layer groove 23 reduced, ceramic bottom of pot body is put into reducing solution to be soaked 3-5 minute, reducing solution is to rise in the distilled water at 1-1.5 that to add the 5-10g inferior sodium phosphate formulated, and the reduction back is washed with distilled water; Seven, bottom surface and the periphery with ground floor groove 22 and second layer groove 23 carries out chemical nickel plating, ceramic bottom of pot body is put into chemical plating fluid, chemical plating fluid is that nickelous sulfate 24-36g, inferior sodium phosphate 20-35g, boric acid 12-16g, lactic acid 12-16ml, anhydrous sodium acetate 30-40g, sodium fluoride 0.8-1.2g and ammonium molybdate 8-12mg are dissolved in the distilled water, is made into 1-1.5 with distilled water and rises solution; The glass container of pottery pot body and chemical plating fluid of packing into is put into 75-85 ℃ water bath with thermostatic control environment, chemical Ni-plating layer forms gradually, the chemical plating time is 1-1.5 hour, because there is the adhesive plaster protection side of pottery pot body, chemical deposit only forms in pot body bottom surface deposition, make ceramic bottom surface form certain thickness nickel dam 4, wash with distilled water after the chemical plating; Eight, tear the adhesive plaster of pot body side surface off, use the distilled water wash clean, the ground floor groove 22 that will plate nickel dam 4 with hair-dryer dries up with the bottom surface and the periphery of second layer groove 23 again; Nine, copper mesh 5 is fitted tightly below nickel dam 4; Ten, oxide-film is removed with sand papering in annular solder 7 surfaces, oil removing is cleaned with acetone in stainless steel substrates 6 surfaces, remove surface film oxide with sand papering again, after the polishing annular solder 7 and stainless steel substrates 6 usefulness absolute alcohols are cleaned up, select for use soldering flux to be coated on the nickel dam 4 and stainless steel substrates 6 of annular solder 7 and second layer groove 23 bottom surfaces and side; 11, annular solder 7 is placed on the bottom surface of second layer groove 23, again stainless steel substrates 6 be fitted in copper mesh 5 and annular solder 7 below; 12, the above-mentioned pot body that assembles is put into resistance furnace to be welded, make the temperature in the resistance furnace be raised to 350 ℃～400 ℃ with per second 18-22 ℃ programming rate from room temperature, make annular solder 7 fusings, annular solder liquid wetting second layer groove 23 bottom surfaces after the fusing and the nickel dam 4 and the stainless steel substrates 6 of side, be incubated 10-20 minute then, make resistance furnace temperature drop to 45-55 ℃ with per second 8-12 ℃ cooling rate again, at this moment, the annular solder liquid of fusing solidifies, simultaneously that the nickel dam 4 of stainless steel substrates 6 and second layer groove 23 bottom surfaces and side is welded together, encapsulation has been finished in whole cooker body bottom surface, from resistance furnace, take out the pottery pot body 2 after encapsulating, with the brazing flux on distilled water flush away pottery pot body 2 surfaces.Above-mentioned steps 5 surface actives are steps the most key in the pretreatment procedure, and its quality is directly connected to the power of the adhesion of the uniformity of coating, coating and pottery pot body 2, is vital link in the chemical deposit technology.In whole nickel process, all use glass container.The model of the soldering flux in the above-mentioned steps 10 is RJ4, removes the effect of oxide-film, increase wetability when soldering flux can play high temperature.
The specific embodiment six: the difference of the present embodiment and the specific embodiment five is that the roughening solution prescription in the step 3 is: hydrofluoric acid 20ml and nitric acid 36ml rise solution with distilled water preparation 1-1.5.The roughening solution of this ratio content can make the alligatoring best results.
The specific embodiment seven: the difference of the present embodiment and the specific embodiment five is that the sensitized solution prescription in the step 4 is: stannous chloride 13g and hydrochloric acid 40ml rise solution with distilled water preparation 1-1.5.The sensitized solution of this ratio content can make the sensitization best results.
The specific embodiment eight: the difference of the present embodiment and the specific embodiment five is that the activated solution prescription in the step 5 is: palladium bichloride 0.35g and hydrochloric acid 10ml rise solution with distilled water preparation 1-1.5.The activated solution of this ratio content can make activation effect the best.
The specific embodiment nine: the difference of the present embodiment and the specific embodiment five is that the reducing solution prescription in the step 6 is: inferior sodium phosphate 8g rises solution with distilled water preparation 1-1.5.The reducing solution of this ratio content can make reduction effect the best.
The specific embodiment ten: the difference of the present embodiment and the specific embodiment five is the chemical nickel-plating solution prescription in the step 7: nickelous sulfate 30g, inferior sodium phosphate 30g, boric acid 14g, lactic acid 14ml, anhydrous sodium acetate 35g, sodium fluoride 1g and ammonium molybdate 10mg prepare 1 liter of solution with distilled water.The chemical nickel-plating solution of this ratio content can make the chemical nickel plating best results.
Claims (9)
1. pottery pot that is used on the electromagnetic oven, it comprises pottery pot body (2), nickel dam (4), copper mesh (5), stainless steel substrates (6) and annular solder (7), the bottom surface that it is characterized in that pottery pot body (2) is provided with ground floor groove (22) and second layer groove (23), ground floor groove (22) is coated with nickel dam (4) with the bottom surface and the periphery of second layer groove (23), copper mesh (5) be fitted in nickel dam (4) below, annular solder (7) is arranged on the bottom surface of second layer groove (23), and be positioned between nickel dam (4) and the copper mesh (5), stainless steel substrates (6) be fitted in copper mesh (5) and annular solder (7) below.
2. the pottery pot that is used on the electromagnetic oven according to claim 1 is characterized in that the inner chamber base angle of pottery pot body (2) is arc transition (8).
3. the pottery pot that is used on the electromagnetic oven according to claim 2 is characterized in that it also contains base (3), is provided with base groove (31) above the base (3), and pottery pot body (2) is arranged in the base groove (31) on the base (3).
4. preparation method that is used for the pottery pot on the electromagnetic oven is characterized in that the pottery pot that is used on the electromagnetic oven realizes by following steps: one, with adhesive plaster the side of pottery pot body is wrapped earlier; Two, with bottom surface and the peripheral oil removing of ground floor groove (22) with second layer groove (23), ceramic bottom of pot body is put into acetone soln soaked 15-25 minute, put into absolute alcohol solution again and soaked 5-15 minute, clean after the oil removing with distilled water flushing; Three, bottom surface and the periphery with ground floor groove (22) and second layer groove (23) carries out chemical roughen, ceramic bottom of pot body is put into roughening solution to be soaked 20-30 minute, roughening solution is to add 18-22ml hydrofluoric acid and 34-38ml nitric acid in a small amount of distilled water, rise solution with distilled water diluting to 1-1.5 again, clean after the alligatoring with distilled water flushing; Four, bottom surface and the periphery with ground floor groove (22) and second layer groove (23) carries out sensitization, ceramic bottom of pot body is put into sensitized solution to be soaked 10-15 minute, during the preparation sensitized solution, earlier stannous chloride 10-15g is dissolved in the 30-50ml hydrochloric acid, slowly is diluted to 1-1.5 with distilled water again and rises solution, if slight white precipitate is arranged, can use, if a large amount of white precipitates need reconfigure, wash with distilled water after the sensitization; Five, bottom surface and the periphery of ground floor groove (22) with second layer groove (23) activated, ceramic bottom of pot body is put into activated solution to be soaked 15-20 minute, activated solution is that the 0.25-0.5g palladium bichloride is put into 5-15ml hydrochloric acid, rise solution with distilled water diluting to 1-1.5 again, the activation back is washed with distilled water; Six, bottom surface and the periphery of ground floor groove (22) with second layer groove (23) reduced, ceramic bottom of pot body is put into reducing solution to be soaked 3-5 minute, reducing solution is to rise in the distilled water at 1-1.5 that to add the 5-10g inferior sodium phosphate formulated, and the reduction back is washed with distilled water; Seven, bottom surface and the periphery with ground floor groove (22) and second layer groove (23) carries out chemical nickel plating, ceramic bottom of pot body is put into chemical plating fluid, chemical plating fluid is that nickelous sulfate 24-36g, inferior sodium phosphate 20-35g, boric acid 12-16g, lactic acid 12-16ml, anhydrous sodium acetate 30-40g, sodium fluoride 0.8-1.2g and ammonium molybdate 8-12mg are dissolved in the distilled water, is made into 1-1.5 with distilled water and rises solution; The glass container of pottery pot body and chemical plating fluid of packing into is put into 75-85 ℃ water bath with thermostatic control environment, and chemical Ni-plating layer forms gradually, and the chemical plating time is 1-1.5 hour, washes with distilled water after the chemical plating; Eight, tear the adhesive plaster of pot body side surface off, use the distilled water wash clean, the ground floor groove (22) that will plate nickel dam (4) with hair-dryer dries up with the bottom surface and the periphery of second layer groove (23) again; Nine, copper mesh (5) is fitted tightly below nickel dam (4); Ten, oxide-film is removed with sand papering in annular solder (7) surface, oil removing is cleaned with acetone in stainless steel substrates (6) surface, remove surface film oxide with sand papering again, after the polishing annular solder (7) and stainless steel substrates (6) are cleaned up with absolute alcohol, select for use soldering flux to be coated on the nickel dam (4) and stainless steel substrates (6) of annular solder (7) and second layer groove (23) bottom surface and side; 11, annular solder (7) is placed on the bottom surface of second layer groove (23), again stainless steel substrates (6) be fitted in copper mesh (5) and annular solder (7) below; 12, the above-mentioned pot body that assembles is put into resistance furnace to be welded, make the temperature in the resistance furnace be raised to 350 ℃～400 ℃ with per second 18-22 ℃ programming rate from room temperature, make annular solder (7) fusing, annular solder liquid wetting second layer groove (23) bottom surface after the fusing and the nickel dam (4) and the stainless steel substrates (6) of side, be incubated 10-20 minute then, make resistance furnace temperature drop to 45-55 ℃ with per second 8-12 ℃ cooling rate again, at this moment, the annular solder liquid of fusing solidifies, simultaneously that the nickel dam (4) of stainless steel substrates (6) and second layer groove (23) bottom surface and side is welded together, encapsulation has been finished in whole cooker body bottom surface, from resistance furnace, take out the pottery pot body (2) after encapsulating, with the brazing flux on distilled water flush away pottery pot body (2) surface.
5. the preparation method that is used for the pottery pot on the electromagnetic oven according to claim 4, it is characterized in that the roughening solution prescription in the step 3 is: hydrofluoric acid 20ml and nitric acid 36ml prepare 1 liter of solution with distilled water.
6. the preparation method that is used for the pottery pot on the electromagnetic oven according to claim 4, it is characterized in that the sensitized solution prescription in the step 4 is: stannous chloride 13g and hydrochloric acid 40ml prepare 1 liter of solution with distilled water.
7. the preparation method that is used for the pottery pot on the electromagnetic oven according to claim 4, it is characterized in that the activated solution prescription in the step 5 is: palladium bichloride 0.35g and hydrochloric acid 10ml prepare 1 liter of solution with distilled water.
8. the preparation method that is used for the pottery pot on the electromagnetic oven according to claim 4, it is characterized in that the reducing solution prescription in the step 6 is: inferior sodium phosphate 8g prepares 1 liter of solution with distilled water.
9. the preparation method that is used for the pottery pot on the electromagnetic oven according to claim 4, it is characterized in that the chemical nickel-plating solution prescription in the step 7: nickelous sulfate 30g, inferior sodium phosphate 30g, boric acid 14g, lactic acid 14ml, anhydrous sodium acetate 35g, sodium fluoride 1g and ammonium molybdate 10mg prepare 1 liter of solution with distilled water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100644179A CN101263972B (en) | 2008-04-30 | 2008-04-30 | Ceramic pan for electromagnetic stove and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100644179A CN101263972B (en) | 2008-04-30 | 2008-04-30 | Ceramic pan for electromagnetic stove and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN101263972A CN101263972A (en) | 2008-09-17 |
| CN101263972B true CN101263972B (en) | 2010-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008100644179A Expired - Fee Related CN101263972B (en) | 2008-04-30 | 2008-04-30 | Ceramic pan for electromagnetic stove and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| FI127475B (en) | 2015-10-30 | 2018-06-29 | Fiskars Home Oy Ab | A cooking vessel and manufacturing method |
| CN108720555A (en) * | 2018-07-02 | 2018-11-02 | 陈广 | A kind of electromagnetic heating marmite |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2160078Y (en) * | 1992-12-31 | 1994-03-30 | 赵建和 | Energy-saving power frequency induction electromagnetic oven |
| CN2328298Y (en) * | 1998-06-26 | 1999-07-14 | 新兴县银丰贸易有限公司 | Cooker |
| CN201175255Y (en) * | 2008-04-25 | 2009-01-07 | 哈尔滨工业大学 | Ceramics pan for electromagnetic oven |
-
2008
- 2008-04-30 CN CN2008100644179A patent/CN101263972B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2160078Y (en) * | 1992-12-31 | 1994-03-30 | 赵建和 | Energy-saving power frequency induction electromagnetic oven |
| CN2328298Y (en) * | 1998-06-26 | 1999-07-14 | 新兴县银丰贸易有限公司 | Cooker |
| CN201175255Y (en) * | 2008-04-25 | 2009-01-07 | 哈尔滨工业大学 | Ceramics pan for electromagnetic oven |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2004-8462A 2004.01.15 |
| JP特开平8-215054A 1996.08.27 |
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Assignee: Guangdong Aouder Technology Stock Co., Ltd. Assignor: Harbin Institute of Technology Contract record no.: 2011440000334 Denomination of invention: Ceramic pan for electromagnetic stove and manufacturing method thereof Granted publication date: 20100602 License type: Exclusive License Open date: 20080917 Record date: 20110414 |
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