CN101262747A - Electronic device with waterproof structure and its making method - Google Patents
Electronic device with waterproof structure and its making method Download PDFInfo
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- CN101262747A CN101262747A CNA2007100858987A CN200710085898A CN101262747A CN 101262747 A CN101262747 A CN 101262747A CN A2007100858987 A CNA2007100858987 A CN A2007100858987A CN 200710085898 A CN200710085898 A CN 200710085898A CN 101262747 A CN101262747 A CN 101262747A
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- circuit board
- electronic installation
- waterproof construction
- board assemblies
- power supply
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Abstract
The invention relates to an electronic device with a waterproof structure. The electronic device at least comprises a shell structure, a circuit board subassembly and a protection layer. The shell structure comprises an accommodation space, a first vent and a second vent; the circuit board subassembly is provided with a plurality of electronic components and lines; the protection layer is formed on at least partial surfaces of the electronic components and lines of the circuit board subassembly, so as to protect the circuit board subassembly and shield against water.
Description
Technical field
The present invention relates to a kind of electronic installation and method for making thereof with waterproof construction.
Background technology
Along with the productive setization of integrated circuit, the volume of electronic installation such as power supply changeover device or power supply unit also dwindles thereupon, and shape is serious but the heat dissipation problem that the electronic installation volume-diminished is derived is then healed.With the power supply changeover device is example, power supply changeover device electronic building brick on its internal printed circuit board when operation can produce high heat, and traditional power supply changeover device system is made up by the last lower house of plastic material, so has the problem that heat is difficult for dissipation and accumulates on the power supply changeover device enclosure interior and derive.As can't effectively solving heat dissipation problem, the electronic building brick that makes power supply changeover device inside is easy to damage, the useful life that not only can reduce power supply changeover device like this, and also can reduce the power supply conversion efficiency of power supply changeover device.
Have the power supply changeover device of the tool radiator structure that designs for the solution heat dissipation problem at present on the market.See also Fig. 1, it is the structural representation of power supply changeover device commonly used.Power supply changeover device 1 is made up of upper shell 11, lower house 12, circuit board assemblies 13, power input (not shown) and power output end 14.Wherein, upper shell 11 can make up mutually with lower house 12, and when combination definable one accommodation space with ccontaining circuit board assemblies 13.Circuit board assemblies 13 is provided with various electronic building bricks 131 and circuit (not shown), can constitute power-switching circuit to change required power supply by these electronic building bricks 131 and circuit.In addition, for the heat dissipation effectively that these electronic building bricks 131 are produced, so several radiators 132 are set, and electronic building brick 131 and radiator 132 interconnect with screw, anchor clamps or riveted way and help electronic building brick 131 heat that leaves on circuit board assemblies 13.
Power supply changeover device 1 commonly used mainly is to utilize heat transferred that heat conducting mode produced electronic building brick 131 to radiator 132, utilize the surface area of radiator 132 will be received in the heat of electronic building brick 131 again, with the mode dissipation of thermal convection and radiation inner space at power supply changeover device 1, and the air with the inner space is that media is passed to upper shell 11 and lower house 12, carries out heat exchange to reach the purpose of passive heat radiation by upper shell 11 and lower house 12 with outside.Yet power supply changeover device 1 now has towards the demand of miniaturization and high power development, so the raising of power supply changeover device 1 aspect power made traditional passive heat radiation mode not meet the heat radiation requirement.
For solving the problem that the passive heat radiation mode can't satisfy the power supply changeover device radiating requirements, so active radiating mode is provided.Yet, power supply changeover device is for the ease of being used in various system equipments, the for example network equipment, communication apparatus, information equipment and electronic game station, various modes of operation and environment must can be adapted to, if utilize active radiating mode then the housing of power supply changeover device need set up ventilation hole, power supply changeover device inside is communicated, to reach the purpose of heat radiation with outside air.But when running into accident or not having the water of expection or liquid when invading, the electronic building brick of power supply changeover device internal circuit board component cause short circuit and damage with circuit is possible because of contacting with water or liquid.And, if dust or foreign matter, polypide for example, enter power supply changeover device inside via ventilation hole, then also may cause electronic building brick and the line short and the damage of power supply changeover device internal circuit board component, even cause the system equipment misoperation maybe can't move, can't guarantee the quality and stability of system equipment electricity consumption.
At present also promising on the market further solution waterproof problem and the power supply changeover device that designs with waterproof construction.See also Fig. 2, it is to show that tradition has the power supply changeover device structural representation of waterproof construction.As shown in Figure 2, the power supply changeover device 2 of tradition with waterproof construction comprises: shell structure 21, fan 22, first ventilation hole 23, second ventilation hole 24, spacer structures 25 and circuit board assemblies 26.Wherein, shell structure 21 is to be combined by upper shell 211 and lower house 212.First ventilation hole 23 and second ventilation hole 24 are to be arranged on the shell structure 21.Spacer structures 25 is to be arranged on shell structure 21 inside, and shell structure 21 inner area is divided into the gas channel 27 and accommodation space 28 of mutual isolation.Spacer structures 25 is made up of metallic plate substantially.Gas channel 27 is to be formed between the internal face and spacer structures 25 of shell structure 21, and interlinks with first ventilation hole 23 and second ventilation hole 24.The inside of gas channel 27 is provided with fan 22, therefore utilize the driving of fan 22, air-flow is flowed by first ventilation hole 23 and second ventilation hole 24 to be passed in and out, remove by active radiating mode with the heat that the circuit board assemblies 26 in the accommodation space 28 is produced when moving, and can make water or other liquid can't invade circuit board assemblies 26 in the accommodation space 28 by the isolation of spacer structures 25, to reach the purpose of heat radiation and waterproof.
Though yet this traditional structure has waterproof and heat sinking function, its cost is higher, and complex structure and assembling are difficult for.In addition, 261 of the electronic building bricks of spacer structures 25 and circuit board assemblies 26 or and 262 in the radiator of circuit board assemblies 26 have air because air be the bad conductive medium of heat, therefore limited to the raising help of integral heat sink usefulness.
Therefore, how to develop a kind of above-mentioned known technology defective of improving, and the heat dissipation that electronic installation inside can be produced, and can avoid water, other liquid or foreign matter to invade the electronic installation with waterproof construction of electronic installation internal circuit board component, be the problem that needs solution at present.
Summary of the invention
Main purpose of the present invention is to provide a kind of electronic installation and method for making thereof with waterproof construction; the protective layer of a plurality of electronic building bricks by being formed at circuit board assemblies and the part surface at least of circuit; can reach anti-sealing, liquid or foreign matter and invade electronic installation internal circuit board component, to solve the problem that traditional electronic devices is unsuitable for operation under various states and the environment.
Another object of the present invention is to provide a kind of electronic installation and method for making thereof with waterproof construction, it is simple in structure, making is simple and easy and cost is lower, and can utilize active radiating mode to increase the heat dissipation of electronic installation.
Another object of the present invention is to provide a kind of electronic installation with waterproof construction; the protective layer of a plurality of electronic building bricks by being formed at circuit board assemblies and the part surface at least of circuit reaches the electronic building brick or the circuit heat radiation of auxiliary circuit board component and makes electronic building brick can have functions such as compensator or trimmer pressure, damping vibration and impact.
For achieving the above object, the execution mode than broad sense of the present invention provides a kind of electronic installation with waterproof construction, comprises at least: shell structure has accommodation space, first ventilating opening and second ventilating opening; Circuit board assemblies has a plurality of electronic building bricks and circuit; And protective layer, be formed at these a plurality of electronic building bricks of this circuit board assemblies and the part surface at least of circuit, to be used to protecting this circuit board assemblies, in order to waterproof.
For achieving the above object, of the present invention another provides a kind of method for making with electronic installation of waterproof construction than the broad sense execution mode, comprises step at least: circuit board assemblies is provided, and this circuit board assemblies has a plurality of electronic building bricks and circuit; Form protective layer at these a plurality of electronic building bricks of circuit board assemblies and the part surface at least of this circuit; And this circuit board assemblies is arranged on the accommodation space of shell structure, and assemble this shell structure, finish the assembling that this has the electronic installation of waterproof construction.
Description of drawings
Fig. 1: be the structural representation of power supply changeover device commonly used.
Fig. 2: show that tradition has the structural representation of the power supply changeover device of waterproof construction.
Fig. 3: be the section of structure of the electronic installation with waterproof construction of preferred embodiment of the present invention.
Fig. 4 a: the structural representation of another preferred embodiment that has the electronic installation of waterproof construction for the present invention.
Fig. 4 b: show and use another kind of fan to have the structural representation of the electronic installation of waterproof construction in the present invention.
Fig. 5: the flow chart that shows the electronic installation of making preferred embodiment of the present invention with waterproof construction.
The primary clustering symbol description
Power supply changeover device: 1 upper shell: 11,211
Lower house: 12,212 circuit board assemblies: 13
Power output end: 14
Electronic building brick: 131,261,361 radiators: 132,262,362
Power supply changeover device with waterproof construction: 2
Electronic installation with waterproof construction: 3
Shell structure: 21,31 fans: 22,32
First ventilation hole: 23,33 second ventilation holes: 24,34
Spacer structures: 25 circuit board assemblies: 26,36
Gas channel: 27,313 accommodation spaces: 28,38
Power supply input module: 35 power supply output precisions: 37
First housing: 311 second housings: 312
Protective layer: 39
S11～S13: the present invention has the making flow process of the electronic installation of waterproof construction
Embodiment
Some exemplary embodiments that embody feature of the present invention and advantage will be described in detail in the explanation of back segment.Be understood that the present invention can have various variations on different modes, it does not all depart from the scope of the present invention, and explanation wherein and to be shown in be as illustrative purposes in essence, but not in order to restriction the present invention.
See also Fig. 3, it is the section of structure of the electronic installation with waterproof construction of preferred embodiment of the present invention.As shown in Figure 3, the electronic installation 3 with waterproof construction of the present invention can be for example power supply changeover device or power supply unit, and is not limited thereto.Electronic installation 3 with waterproof construction of the present invention comprises: shell structure 31, first ventilation hole 33, second ventilation hole 34, power supply input module 35, circuit board assemblies 36 and power supply output precision 37.Wherein, shell structure 31 is to be made up of for example first housing 311 and second housing 312.First ventilation hole 33 and second ventilation hole 34 are to be arranged on the shell structure 31.Circuit board assemblies 36 is to be arranged in the accommodation space 38 of shell structure 31 inside.Circuit board assemblies 36 has a plurality of electronic building bricks 361, circuit (not shown) and radiator 362, to constitute power-switching circuit, the electric power after the conversion offered used by the system equipment of electricity.In this embodiment; circuit board assemblies 36 directly forms protective layer 39 at the part surface at least of a plurality of electronic building bricks 361 and circuit; this protective layer 39 is to be made by for example surface applied material (conformal coating material), and can be for example transparent material.This protective layer 39 can utilize modes such as for example impregnation, coating, sprinkling directly to be formed on the electronic building brick 361 and circuit surface of circuit board assemblies 36.In addition, power supply input module 35 can be for example socket, and power supply output precision 37 can be for example electric power connection line, but is not limited thereto.In this embodiment; though shell structure 31 utilizes first ventilation hole 33 and second ventilation hole 34 to assist heat radiation; but protection because of circuit board assemblies 36 matcoveredns 39; make electronic building brick 361 and line short or damage so can prevent sealing, liquid or foreign matter directly to invade circuit board assemblies 36, make this electronic installation go for various environment.In addition, protective layer 39 also can make electronic building brick 361, has functions such as compensator or trimmer pressure, damping vibration and impact.
See also Fig. 4 a, it is to show that the present invention has the structural representation of another preferred embodiment of the electronic installation of waterproof construction.In this embodiment; electronic installation 3 with waterproof construction also comprises at least one fan 32; air blast (blower) for example; this fan 32 is to be arranged on housing 31 inside; and contiguous first ventilation hole 33 or second ventilation hole 34; therefore utilize the driving of fan 32; air-flow is flowed by first ventilation hole 33 and second ventilation hole 34 to be passed in and out; form gas channel 313; remove by active radiating mode with the heat that the circuit board assemblies 36 in the accommodation space 38 of electronic installation 3 is produced when moving; and can be by the protection and the isolation of the protective layer 39 on the circuit board assemblies 36; make water; liquid or other foreign matter can't be invaded the circuit board assemblies 36 of shell structure 31 inside, to reach the purpose of heat radiation and waterproof.
Fig. 4 b system shows that the another kind of fan of use has the structural representation of the electronic installation of waterproof construction in the present invention.In this embodiment, the fan 32 that the present invention has the electronic installation 3 of waterproof construction can be for example tube-axial fan, and it is provided with the position being adjacent to first ventilation hole 33 or second ventilation hole 34 for good, but is not limited thereto.The flow direction that fan 32 drives air-flow can flow to second ventilation hole 34 by first ventilation hole 33 equally, also can flow to first ventilation hole 33 (shown in the direction of arrow) by second ventilation hole 34, form gas channel 313 thus, remove by active radiating mode with the heat that circuit board assemblies 36 is produced when moving.In addition, the opposite flank that first ventilation hole 33 and second ventilation hole 34 are arranged on shell structure 31 is preferable, but is not limited thereto.
In certain embodiments; circuit board assemblies 36 also can form protective layer 39 on whole surface substantially; this protective layer 39 is with homogeneous thickness attaching and the surface that covers these a plurality of electronic building bricks 361, circuit and radiator 362 haply; thus; be formed at the power-switching circuit that protective layer 39 on the circuit board assemblies 36 can protective circuit board component 36; make water, liquid or other foreign matter can't invade the circuit board assemblies 36 of shell structure 31 inside, to reach the purpose of heat radiation and waterproof.In addition and since protective layer 39 attach with in abutting connection with electronic building brick 361, so the heat that electronic building brick 361 is produced can directly be passed in the accommodation space 38, and the radiating airflow that is directly driven by fan 32 takes away, and can improve heat dissipation thus.
See also Fig. 5, it is the flow chart that shows the electronic installation with waterproof construction of making preferred embodiment of the present invention.As shown in Figure 5, at first, shown in step S11, provide circuit board assemblies 36, this circuit board assemblies 36 has a plurality of electronic building bricks 361 and circuit (not shown), to form power-switching circuit, the electric power after the conversion is offered power receiving equipment use.Then, shown in step S12, at a plurality of electronic building bricks 361 of circuit board assemblies 36 and the formation of the part surface at least protective layer 39 of circuit.Then, shown in step S13, circuit board assemblies 36 is arranged on the accommodation space 38 and the assemble case structure 31 of shell structure 31, finishes the assembling of electronic installation 3 with waterproof construction.In certain embodiments; the mode that forms protective layer 39 can be modes such as for example impregnation, sprinkling and coating; with surface applied material (conformal coating); for example polyurethane (polyurethane), Parylene (Poly-para-xylylene; be called for short Parylene) etc. the macromolecule insulating material, be formed on the circuit board assemblies 36.Wherein, these surface applied materials (conformalcoating) can be supplied in a variety of forms, for example fluid or hydrojet, and can at room temperature solidify or heat the back and solidify.Therefore, in certain embodiments, when forming protective layer 39, can further utilize the program of baking, make protective layer 39 structure quick shaping.Certainly, also can not use the baking program or change, answer apparent surface coating material characteristic and decide with ultraviolet irradiation heating.Certainly, the thickness and the color of protective layer 39 are not also limited, and protective layer 39 partly or complete coating circuit board component 39 optionally, the zone that needs protection with protection.And first housing 311 and second housing 312 that also can utilize these surface applied materials (conformalcoating) to be coated on shell structure 31 in the formed gap, are strengthened the water proofing property of shell structure 31 when combination.In certain embodiments, the electronic installation 3 that the present invention has waterproof construction can be portable electronic devices, but is not limited thereto.
In sum; the invention provides a kind of electronic installation and method for making thereof with waterproof construction; the protective layer of a plurality of electronic building bricks by being formed at circuit board assemblies and the part surface at least of circuit; can reach anti-sealing, liquid or foreign matter and invade electronic installation internal circuit board component, to solve the problem that traditional electronic devices is unsuitable for operation under various states and the environment.In addition, the present invention has that the electronic installation of waterproof construction is not only simple in structure, making is simple and easy, cost is lower, and can utilize active radiating mode to increase the heat dissipation of electronic installation.And protective layer can make electronic building brick have functions such as compensator or trimmer pressure, damping vibration and impact.
The present invention can and carry out multiple modification by any enforcement of those of ordinary skill in the art, but does not all break away from the scope of claims.
Claims (10)
1. the electronic installation with waterproof construction is characterized in that, comprises at least:
Shell structure has accommodation space, first ventilating opening and second ventilating opening;
Circuit board assemblies has a plurality of electronic building bricks and circuit; And
Protective layer is formed at these a plurality of electronic building bricks of this circuit board assemblies and the part surface at least of circuit, to be used to protecting this circuit board assemblies, in order to waterproof.
2. the electronic installation with waterproof construction as claimed in claim 1 is characterized in that, wherein this electronic installation with waterproof construction is to be selected from one of power supply changeover device and power supply unit.
3. the electronic installation with waterproof construction as claimed in claim 1, it is characterized in that, also comprise at least one fan, be arranged on the inside of this shell structure, wherein this fan is for being selected from one of air blast and tube-axial fan, and this fan is adjacent to one of this first ventilation hole and this second ventilation hole.
4. the electronic installation with waterproof construction as claimed in claim 1 is characterized in that, also comprises power supply input module and power supply output precision, and this shell structure is formed by first housing and second shell combination.
5. the electronic installation with waterproof construction as claimed in claim 1; it is characterized in that; wherein these protection series of strata are made of the surface applied material, and this surface applied material system is to be formed at this circuit board assemblies one of in the group that is selected from impregnation, coating and spray pattern and is formed.
6. the electronic installation with waterproof construction as claimed in claim 1 is characterized in that, wherein this electronic installation with waterproof construction is a portable electronic devices.
7. the method for making with electronic installation of waterproof construction is characterized in that, comprises step at least:
(a) provide circuit board assemblies, this circuit board assemblies has a plurality of electronic building bricks and circuit;
(b) on the part surface at least of this a plurality of electronic building bricks of this circuit board assemblies and this circuit, form protective layer; And
(c) this circuit board assemblies is arranged on the accommodation space of shell structure, and assembles this shell structure, finish the assembling that this has the electronic installation of waterproof construction.
8. the method for making with electronic installation of waterproof construction as claimed in claim 7 is characterized in that, wherein this step (b) also comprises heating steps.
9. the method for making with electronic installation of waterproof construction as claimed in claim 7, it is characterized in that, wherein this step (c) also comprises step: at least one fan is set in this accommodation space of this shell structure, and power supply input module and power supply output precision are set.
10. the method for making with electronic installation of waterproof construction as claimed in claim 7; it is characterized in that; wherein these protection series of strata of this step (b) are made of a surface applied material, and this surface applied material system is to be formed at this circuit board assemblies one of in the group that is selected from impregnation, coating and spray pattern and is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100858987A CN101262747A (en) | 2007-03-09 | 2007-03-09 | Electronic device with waterproof structure and its making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100858987A CN101262747A (en) | 2007-03-09 | 2007-03-09 | Electronic device with waterproof structure and its making method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101262747A true CN101262747A (en) | 2008-09-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100858987A Pending CN101262747A (en) | 2007-03-09 | 2007-03-09 | Electronic device with waterproof structure and its making method |
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| CN (1) | CN101262747A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990354A (en) * | 2018-04-30 | 2018-12-11 | 中山广毅自动化设备有限公司 | A kind of driving power equipped with locking mechanism |
-
2007
- 2007-03-09 CN CNA2007100858987A patent/CN101262747A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990354A (en) * | 2018-04-30 | 2018-12-11 | 中山广毅自动化设备有限公司 | A kind of driving power equipped with locking mechanism |
| CN108990354B (en) * | 2018-04-30 | 2020-11-20 | 中山广毅自动化设备有限公司 | Driving power supply with locking mechanism |
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Open date: 20080910 |