CN101262241A - Sending/receiving circuit module - Google Patents
Sending/receiving circuit module Download PDFInfo
- Publication number
- CN101262241A CN101262241A CNA2008100834101A CN200810083410A CN101262241A CN 101262241 A CN101262241 A CN 101262241A CN A2008100834101 A CNA2008100834101 A CN A2008100834101A CN 200810083410 A CN200810083410 A CN 200810083410A CN 101262241 A CN101262241 A CN 101262241A
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- receiving circuit
- sending
- circuit board
- high frequency
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
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Abstract
The invention provides a sending/receiving circuit module which can reliably prevent isolation degree from falling to process sending/receiving with high property, and can realize module miniaturization. The sending/receiving circuit module is equipped with an insulation circuit board (2), a high-frequency sending circuit unit (3) and a high-frequency receiving circuit unit (4) mounted on the insulation circuit board (2), a metal housing (29) covered the high-frequency sending circuit unit (3) and the high-frequency receiving circuit unit (4), and an earthing pattern mounted on the insulation circuit board (2). The metal housing (29) is provided with a plurality of installing feet, the insulation circuit board (2) is provided with a plurality of fixing patterns (31) connected with each installing foot (30) of the metal housing (29) respectively, a nearest fixing pattern (31a) in the fixing patterns (31) to an antennal terminal of the high-frequency receiving circuit unit (4) does not connects with the earthing pattern in the insulation circuit board (2) directly.
Description
Technical field
The present invention relates to a kind of sending/receiving circuit module, relate in particular to the sending/receiving circuit module that is suitable for use in small-sized transmitter-receiver.
Background technology
Generally speaking, transmitter-receiver is, when sending received signal connect sending/receiving circuit module on the shared antenna, connect on its back segment then that various circuit groups form.
In this sending/receiving circuit module, for electromagnetic shielding transmitter/receiver circuit electromagnetism, for example, when in a metal housing, transmitter/receiver circuit being fitted together, the transmission high-frequency signal of transmitter side circuit just might disturb receiver side circuit (that is, isolation reduces).
Therefore, in the middle of technology in the past, position by separating transtation mission circuit and receiving circuit or between are provided with barricade and prevent to disturb.
But to the miniaturization demand of transmitter-receivers such as mobile phone, the size decreases of sending/receiving circuit module prevented that isolation from reducing the difficulty that just more and more becomes along with in recent years.Specifically, when metal housing diminishes,, prevent that effects of jamming is also very low in metal housing even barricade is set so.In addition, barricade has become to hinder the factor of sending/receiving circuit module miniaturization.Particularly, because low,,, the current potential of grounding pattern also can become the reason of noise thereby causing minor variations so be easy to be subjected to the interference of other circuit by the level of the received signal before low noise amplifier (LNA) amplification of receiving circuit side.
Summary of the invention
The present invention be directed to above-mentioned problem and propose, its purpose is to provide a kind of and can prevents from the isolation reduction reliably and carry out high performance transmission to receive, and also can realize the sending/receiving circuit module of module miniaturization.
For achieving the above object, involved in the present invention to sending/receiving circuit module be characterised in that to possess insulating circuit board; High frequency transtation mission circuit portion is arranged on the above-mentioned insulating circuit board; High frequency receiving circuit portion is arranged on the above-mentioned insulating circuit board; Metal housing covers above-mentioned high frequency transtation mission circuit portion and above-mentioned high frequency receiving circuit portion; And grounding pattern, be arranged on the above-mentioned insulating circuit board; And, above-mentioned metal housing has a plurality of installation feet, above-mentioned insulating circuit board has a plurality of fixed patterns that are connected with each installation foot of above-mentioned metal housing respectively, not will among the said fixing pattern, from the nearest said fixing pattern of the antenna terminal of high frequency receiving circuit portion directly and the grounding pattern in the insulating circuit board be connected.
According to sending/receiving circuit module of the present invention, flow in the metal housing and the high-power transmission high-frequency signal that flows in high frequency transtation mission circuit portion, the installation foot part by connecting on the fixed pattern not, said fixing pattern are meant from the antenna terminal of the high frequency receiving circuit portion of metal housing recently and not directly and the fixed pattern that is connected of the grounding pattern in the insulating circuit board; Above-mentioned high-power transmission high-frequency signal is the installation foot part that is connected by on other fixed patterns that are connected with grounding pattern, flows to outside by above-mentioned other fixed patterns and grounding pattern afterwards.Therefore, can prevent that fluid stopping disturbs high frequency receiving circuit portion at the high-power transmission high-frequency signal of high frequency transtation mission circuit portion.
And, involved in the present invention to sending/receiving circuit module be characterised in that above-mentioned high frequency transtation mission circuit portion has power amplifier near antenna terminal, and above-mentioned high frequency receiving circuit portion has low noise amplifier near antenna terminal.
According to sending/receiving circuit module of the present invention, even it is very big to have passed through the signal level of the transmission high-frequency signal behind the power amplifier of high frequency transtation mission circuit portion, the installation foot part that this transmission high-frequency signal is not connected by fixed pattern, the said fixing pattern is meant from the antenna terminal of the high frequency receiving circuit portion of metal housing nearest, and therefore the fixed pattern that the grounding pattern in direct and the insulating circuit board is connected can prevent that the low noise amplifier of high frequency receiving circuit portion is subjected to the interference of high-power transmission high-frequency signal mobile on high frequency transtation mission circuit portion power amplifier part.
And, involved in the present invention to sending/receiving circuit module be characterised in that, on the upper surface of above-mentioned insulating circuit board, carry electronic component, be used for the outside terminal for connecting that is connected with motherboard and on the lower surface of above-mentioned insulating circuit board, be provided with.
According to sending/receiving circuit module of the present invention, can on the same surface of insulating circuit board, transmitter/receiver circuit be set jointly, and can be connected with motherboard by the outside terminal for connecting by lower surface, thereby can realize the multifunction and the miniaturization of sending/receiving circuit module.
And, involved in the present invention to sending/receiving circuit module be characterised in that, will be from the fixed pattern beyond the nearest fixed pattern of the antenna terminal of above-mentioned high frequency receiving circuit portion, be connected with grounding pattern in the above-mentioned insulating circuit board.
According to sending/receiving circuit module of the present invention, because a plurality of fixed patterns beyond the nearest fixed pattern of the antenna terminal of above-mentioned high frequency receiving circuit portion are connected on the grounding pattern, so metal housing is many places ground connection, thereby raising shield effectiveness (blocking the electromagnetic wave that passes to outside electromagnetic wave and pass to inside from the outside of sending/receiving circuit module from the inside of sending/receiving circuit module).
As mentioned above, according to the sending/receiving circuit module that arrives involved in the present invention, can prevent from the isolation reduction reliably and carry out high performance transmission to receive, and can also realize module miniaturization etc.
Description of drawings
Fig. 1 is the circuit diagram of the main portion of expression transmitter-receiver, and this transmitter-receiver has adopted 1 execution mode of sending/receiving circuit module of the present invention.
Fig. 2 is the stereogram of 1 execution mode of expression sending/receiving circuit module of the present invention.
The stereogram of Fig. 3 for seeing from bottom surface one side of Fig. 2.
The stereogram of Fig. 4 for the metal housing of Fig. 2 is represented with chain-dotted line.
Fig. 5 is the vertical view of Fig. 4.
Fig. 6 is the amplification profile along the 6-6 line of Fig. 5.
Fig. 7 is the amplification profile along the 7-7 line of Fig. 5.
Description of reference numerals:
1 sending/receiving circuit module, 2 insulating circuit boards, 3 high frequency transtation mission circuit portions, 4 high frequency receiving circuit portions, 13 power amplifiers, 16 reception antenna terminals, 20 low noise amplifiers, 26 outside terminal for connecting, 28 grounding patterns, 29 metal housings, 30 installation feet, 31 fixed patterns
Embodiment
Below, the execution mode of the sending/receiving circuit module that arrives involved in the present invention is described with reference to Fig. 1 to Fig. 7.
Fig. 1 is the circuit diagram of the main portion of expression transmitter-receiver, and this transmitter-receiver has adopted 1 execution mode of sending/receiving circuit module of the present invention.
As shown in Figure 1, the sending/receiving circuit module 1 of present embodiment is, high frequency transtation mission circuit portion 3 and high frequency receiving circuit portion 4 are set on the upper surface of insulating circuit board 2 and form.
By sending the high frequency transtation mission circuit portion 3 that IC5 and filter 6 form a side.Sending signal (modulation signal) is input in the frequency mixer MOD9 that sends IC5 with baseband I C7 by the transmission of transmission signal input terminal 8 from sending/receiving circuit module 1 leading portion.In the frequency mixer 10 of this frequency mixer MOD9 and hypomere,, send high-frequency signal and generate by the transmission oscillator signal (carrier signal) of above-mentioned transmission signal modulation by synthesizer 11 vibrations.In the transmission high-frequency signal that is generated, have only to send the Filtering Processing that the high-frequency signal composition obtains filter 6, and obtain amplifying by low noise amplifier 12 and power amplifier 13 successively, send by 14 outputs of transmitting antenna terminal and from antenna 15 then.
By receiving the high frequency receiving circuit portion 4 of IC17 and 2 filter 18,19 formation opposite sides.The reception high-frequency signal that receives by antenna 14 by reception antenna terminal 16 input, and have only and receive the Filtering Processing that the high-frequency signal composition obtains filter 18, and after obtaining amplifying by low noise amplifier 20, obtain the Filtering Processing of filter 19 once more.Then, receive high-frequency signal on frequency mixer DEM21 with the oscillator signal mixing that transmits from synthesizer 22, and output to receive from received signal lead-out terminal 23 and use baseband I C24.
The sending/receiving circuit module 1 that possesses the foregoing circuit structure is, to carry each structure division and form on insulating circuit board 2 to shown in Figure 7 as Fig. 2.
To shown in Figure 5, insulating circuit board 2 forms rectangular shape, and as Figure 6 and Figure 7, stacked in the present embodiment many veneer 2a, 2a are to form this insulating circuit board 2 as Fig. 3.As Fig. 4 and shown in Figure 5, on the upper surface of this insulating circuit board 2, carry transmission IC4 and filter 6 that forms high frequency transtation mission circuit portion 3 and reception IC17 and 2 filters 18,19 that form high frequency receiving circuit portion 4, and be configured to the Region Segmentation of insulating circuit board 2 is become two parts.Also have, on the upper surface of insulating circuit board 2, carried needed coil, capacitor and resistance on the circuit structure as chip 25.These IC5,17 and filter 6,18,19 and chip 25 electrically connect by the circuit that does not have expression among the figure.As shown in Figure 3, majority is formed with and is used for the outside terminal for connecting 26 that is connected with motherboard (among the figure not expression) on the peripheral part of insulating circuit board 2 lower surfaces, as Figure 6 and Figure 7, by via 27 and the upper surface of insulating circuit board 2 or the electric connections such as circuit that on veneer 2a, form.And, on the middle body of insulating circuit board 2 lower surfaces, be provided with two big grounding patterns 28, and electrically connect by via 27 and necessary part.
Moreover,, bring into play metal housing 29 shield effectiveness, thin rectangular shape case shape and be covered with the IC5 that on insulating circuit board 2 upper surfaces, carries, 17 and filter 6,18,19 and chip 25 to shown in Figure 7 as Fig. 2.On 4 corners of this metal housing 29, be formed with installation foot 30a, 30b, 30c, the 30d that sheet material is curved the L font, and as Figure 6 and Figure 7, respectively with the upper surface that is arranged on insulating circuit board 2 on 4 fixed pattern 31a, 31b, 31c, 31d welding and be connected.Not with among 4 fixed pattern 31a, 31b, 31c, the 31d, in abutting connection with from the nearest filter 18 of the antenna terminal of high frequency receiving circuit portion 4 and the fixed pattern 31a of configuration directly is connected with grounding pattern 28 on being arranged on insulating circuit board 2.Other 3 fixed pattern 31b, 31c, 31d will be successively in abutting connection with the filter 6 that receives IC17, high frequency transtation mission circuit portion 3 with send IC5 and dispose, and electrically connect by via 27 and grounding pattern 28 respectively.
Secondly, will the effect of present embodiment be described.
In the sending/receiving circuit module 1 of present embodiment, not with among 4 fixed pattern 31a, 31b, 31c, the 31d, in abutting connection with from the nearest filter 18 of the antenna terminal of high frequency receiving circuit portion 4 and the fixed pattern 31a of configuration directly is connected with grounding pattern 28 on being arranged on insulating circuit board 2.
Therefore, sending/receiving circuit module 1 according to present embodiment, flow in the metal housing 29 and the high-power transmission high-frequency signal that flows in high frequency transtation mission circuit portion 3, installation foot 30a part not, and installation foot 30b, 30c, 30d part by being connected with other fixed patterns 31b, 31c, 31d by being connected with fixed pattern 31a.This fixed pattern 31a from the antenna terminal 16 of the high frequency receiving circuit portion 4 of metal housing 29 recently and not with insulating circuit board 2 in grounding pattern 28 directly be connected, and other fixed patterns 31b, 31c, 31d are connected with grounding pattern 28.Because flow to the outside, disturb high frequency receiving circuit portion 4 so can prevent the high-power transmission high-frequency signal of fluid stopping in high frequency transtation mission circuit portion 3 by this other fixed pattern 31b, 31c, 31d and grounding pattern 28.
Secondly, verification msg is described.
Again with 4 fixed pattern 31a, 31b, 31c, 31d all with grounding pattern 28 direct-connected states under, with stream in the transmission signal sets of high frequency transtation mission circuit portion 3 be-26.85dBm/Freq (=2010MHz), and close high frequency receiving circuit portion 4, arrive to receive and use the transmission signal leakage amount of baseband I C24 to be-8.66dBm.Secondly, when cut off successively 4 fixed pattern 31a, 31b, 31c, 31d and grounding pattern 28 be connected and during transmission signal that mensuration is leaked, its concrete leakage rate is: during cut-out fixed pattern 31a, for-12.40dBm (the improvement amount is-3.74dB); When cutting off fixed pattern 31b, for-8.97dBm (the improvement amount is-0.31dB); When cutting off fixed pattern 31c, for-8.69dBm (the improvement amount is-0.03dB); And when cutting off fixed pattern 31d, for-9.31dBm (the improvement amount is-0.65dB).Therefore, when experimental result had also proved the connection of cutting off between fixed pattern 31a and the grounding pattern 28, the leakage rate that sends signal was minimum, and has also improved isolation the biglyyest.
Also have, sending/receiving circuit module 1 according to present embodiment, even the signal level of the transmission high-frequency signal behind the power amplifier 13 of high frequency transtation mission circuit portion 3 is very big, this transmission high-frequency signal is the installation foot part 30a by being connected with fixed pattern 31a not also, and this fixed pattern 31a be with from the antenna terminal 16 of the high frequency receiving circuit portion 4 of metal housing 29 recently and not with insulating circuit board 2 in grounding pattern 28 directly be connected, so the noise amplifier 20 of the low receiving circuit portion 4 of high frequency will can not be subjected to the interference of the high-power transmission high-frequency signal that power amplifier 13 parts in high frequency transtation mission circuit portion 3 flow.
Also have, sending/receiving circuit module 1 according to present embodiment, on the upper surface of insulating circuit board 2 as electro part carrying IC5,17 and filter 6,18,19 and chip 25, and on its lower surface, be provided with and be used for the outside terminal for connecting 26 that is connected with motherboard, therefore transmitter/ receiver circuit 3,4 can be set jointly on the same surface of insulating circuit board 2, and can be connected with motherboard by the outside terminal for connecting 26 by its lower surface, thereby can realize the multifunction and the miniaturization of sending/receiving circuit module 1.
Also have, sending/receiving circuit module 1 according to present embodiment, most fixed pattern 31b, 31c, 31d beyond the nearest fixed pattern 31a of the antenna terminal 16 of high frequency receiving circuit portion 4, be connected on the grounding pattern 28, therefore metal housing 29 is many places ground connection, thereby can improve shield effectiveness (block and pass to outside electromagnetic wave from the inside of sending/receiving circuit module 1 and pass to inner electromagnetic wave from the outside of sending/receiving circuit module 1).
In addition, the invention is not restricted to above-mentioned execution mode, can carry out all changes as required.
Claims (4)
1. sending/receiving circuit module is characterized in that possessing:
Insulating circuit board;
High frequency transtation mission circuit portion is arranged on the above-mentioned insulating circuit board;
High frequency receiving circuit portion is arranged on the above-mentioned insulating circuit board;
Metal housing covers above-mentioned high frequency transtation mission circuit portion and above-mentioned high frequency receiving circuit portion; And
Grounding pattern is arranged on the above-mentioned insulating circuit board; And,
Above-mentioned metal housing has a plurality of installation feet, above-mentioned insulating circuit board has a plurality of fixed patterns that are connected with each installation foot of above-mentioned metal housing respectively, not will among the said fixing pattern, from the nearest said fixing pattern of the antenna terminal of above-mentioned high frequency receiving circuit portion directly and the grounding pattern in the insulating circuit board be connected.
2. sending/receiving circuit module according to claim 1 is characterized in that, above-mentioned high frequency transtation mission circuit portion has power amplifier near antenna terminal, and above-mentioned high frequency receiving circuit portion has low noise amplifier near antenna terminal.
3. sending/receiving circuit module according to claim 2 is characterized in that above-mentioned insulating circuit board carries electronic component on upper surface, is used for the outside terminal for connecting that is connected with motherboard and be provided with on lower surface.
4. according to claim 1 each described sending/receiving circuit module to the claim 3, it is characterized in that, will be from the said fixing pattern beyond the nearest said fixing pattern of the antenna terminal of above-mentioned high frequency receiving circuit portion, be connected with grounding pattern in the above-mentioned insulating circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007053698A JP2008219453A (en) | 2007-03-05 | 2007-03-05 | Transmitting and receiving circuit module |
| JP053698/2007 | 2007-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101262241A true CN101262241A (en) | 2008-09-10 |
Family
ID=39838963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100834101A Pending CN101262241A (en) | 2007-03-05 | 2008-03-05 | Sending/receiving circuit module |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2008219453A (en) |
| CN (1) | CN101262241A (en) |
| TW (1) | TW200845605A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103997352B (en) * | 2014-05-14 | 2016-02-24 | 电信科学技术研究院 | Active antenna relevant device, system and transmitting-receiving calibration steps |
| CN110710118B (en) | 2017-06-02 | 2021-08-20 | 株式会社村田制作所 | High-frequency module and communication device |
| WO2019146549A1 (en) | 2018-01-23 | 2019-08-01 | 株式会社村田製作所 | Power amplification circuit |
| WO2019146550A1 (en) * | 2018-01-23 | 2019-08-01 | 株式会社村田製作所 | Power amplification circuit |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5780867A (en) * | 1980-11-08 | 1982-05-20 | Mitsubishi Electric Corp | Facsimile device |
| JP3664869B2 (en) * | 1998-03-20 | 2005-06-29 | シャープ株式会社 | Transceiver circuit module |
| JP2004260744A (en) * | 2003-02-27 | 2004-09-16 | Ngk Spark Plug Co Ltd | High frequency switch module and wireless phone communication apparatus employing the same |
| JP4112484B2 (en) * | 2003-12-17 | 2008-07-02 | 株式会社東芝 | Wireless device and semiconductor device |
| JP2006319512A (en) * | 2005-05-11 | 2006-11-24 | Murata Mfg Co Ltd | Multilayer wiring board device |
-
2007
- 2007-03-05 JP JP2007053698A patent/JP2008219453A/en not_active Ceased
-
2008
- 2008-01-28 TW TW097103108A patent/TW200845605A/en unknown
- 2008-03-05 CN CNA2008100834101A patent/CN101262241A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008219453A (en) | 2008-09-18 |
| TW200845605A (en) | 2008-11-16 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20080910 |
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| C20 | Patent right or utility model deemed to be abandoned or is abandoned |