CN101261888A - High-conductivity and high-tenacity compound line and its making method - Google Patents
High-conductivity and high-tenacity compound line and its making method Download PDFInfo
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Abstract
The invention relates to a high-conductivity and high-tenacity composite wire which includes a core material and a surface metal layer. The alloy composition of the core material is (weight percentage): 59.0 to 65.0 percent of copper and 0.005 to 0.1 percent of other elements, the other elements include titanium, iron, silicon, tin, phosphorus, two elements in the rare earth metal, the content of unavoidable impurity is less than 0.3 percent and the rest is zinc, wherein, the content of lead, bismuth and antimony in the unavoidable impurity is less than 0.05 percent; the alloy composition of the metal surface layer is (weight percentage): 48.0 to 52.0 percent of copper, 0 to 0.4 percent of rare earth, 0 to 0.2 percent of silver, the content of unavoidable impurity elements is less than 0.3 percent and the rest is zinc. The mechanical property of the composite wire is improved, which is helpful to cut materials with high hardness and the cut materials have good surface smoothness; the washing effect during discharging is improved and the cutting speed and the surface quality of cutting workpieces are improved.
Description
Technical field
The present invention relates to a kind of high-conductivity and high-tenacity compound line, the present invention also relates to a kind of manufacture method of high-conductivity and high-tenacity compound line simultaneously.
Background technology
The machining industrial expansion be unable to do without the development of high-accuracy Machining Technology, the developing into and using of a kind of new manufacturing process, be unable to do without the synchronous raising of efficient and quality, the thread feed electric spark of being careful processing is as one type of machining, in recent years along with advancing that the development of Machining Technology has also obtained advancing by leaps and bounds.The be careful development of silk thread cutting technique, be unable to do without the synchronized development of wire electrode technology, the design concept of now popular be careful an in the world lathe is that the performance according to wire electrode designs, and the breakthrough of wire electrode technology tends to drive the innovation of wire cutting machine design.Cut to present recombination line from the anaerobic copper cash of initial use and cut, the development of the silk cutting of being careful has been experienced from inefficient, low quality to high efficiency, high-quality, automation, a specialized very long course of producing.The line cutting technology development of China is to grow up on the basis of progressively introducing the absorption advanced foreign technology, from the earliest fast cabling, cabling be worked into now gradually in the silk processing of generally using of being careful, experienced a development course from low to high.From the seventies and eighties in last century zinc-plated wire electrode invention to today, various wire electrodes have appearred on the market, such as basis brass wire electrode, zinc-plated wire electrode, velocity profile coating electrode silk, velocity profile coating electrode silk etc., but they also exist following problem to hinder their development.
The basis brass wire electrode:
Constituent is a copper zinc bianry alloy, because be subjected to the restriction of zinc content in the brass, its cutting speed has been subjected to restriction, and along with zinc content in the brass increases, its cutting speed also has little lifting, but its hoisting velocity is limited.Copper zinc bianry alloy belongs to basis brass, and because of being subjected to the restriction of alloy itself, during for the instructions for use tensile property is had relatively high expectations, the cutting accuracy rate request is higher split requirement, the basis brass wire electrode just is restricted.
Zinc-plated wire electrode:
Core is a basis brass, outside plating one deck zinc, because the gasification of zinc in cutting process, the discharge meeting of kind electrode silk is more stable, and the cutting surface can be more sliding than basis brass mercerising.Owing to be to have plated one deck simple substance zinc on the surface of basis brass, because of the conductance of zinc lower much than copper, therefore cause the conductance of kind electrode silk can be lower, and final cutting speed is restricted, electroplate because of zinc in addition, also occur the phenomenon that electrodeposited coating comes off easily, and cause final cutting effect.
Velocity profile coating electrode silk:
Core is a basis brass, and coating is ormolu, and thickness is thicker than the coating of common zinc-plated wire electrode.The speed of this coating electrode silk is faster than the cutting speed of common zinc-plated wire electrode, is suitable for high efficiency processing.But because the coating of kind electrode silk is ormolu, conductance is restricted equally, also can be influential to the raising of cutting speed.
Diffusion annealing type wire electrode:
Discover that the surface has the wire electrode of even craterlet can improve the discharge developing result of wire electrode, arises at the historic moment, and has just produced the wire electrode of this porous surface structure.Diffusion annealing type wire electrode core is oxygen-free copper or basis brass, and by diffusion annealing at skin bag layer of copper kirsite, wherein the ratio of copper and zinc is 1: 1, because core is oxygen-free copper or basis brass, the top layer is the loose structure that adopts diffusion annealing to form, so the developing result of kind electrode silk is better than the wire electrode of routine.But because core is oxygen-free copper or basis brass, its toughness and tensile strength can be restricted, and copper that top layer diffusion annealing is got on and zinc are also because the restriction of conductance is influential to special processing meeting.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, a kind of high-conductivity and high-tenacity compound line is provided, this recombination line mechanical performance is improved, help the high materials and parts of cutting hardness, the materials and parts surface smoothness that cuts out is improved, developing result when helping to improve wire electrode discharge, thereby the surface quality of raising cutting speed and cut workpiece.
Another object of the present invention is to provide a kind of manufacture method of high-conductivity and high-tenacity compound line.
A kind of high-conductivity and high-tenacity compound line of the present invention, comprise core and top layer metal level, it is characterized in that: the alloy composition of described core is: copper: 59.0～65.0wt%, other element: 0.005～0.1wt%, described other element comprises that at least two kinds of elements in titanium, iron, silicon, tin, phosphorus, the rare earth metal, unavoidable impurities content are less than 0.3wt%, all the other are zinc, wherein in the unavoidable impurities content of lead, bismuth, antimony less than 0.05wt%; The alloy composition of described top layer metal level is: copper: 48.0～52.0wt%, rare earth: 0～0.4wt%, silver: 0～0.2wt%, unavoidable impurities constituent content are zinc less than 0.3wt%, surplus.
At least two kinds of effects that element adds in titanium in described other element, iron, silicon, tin, phosphorus, the rare earth metal, the one, deoxidation, crystal grain thinning, the intensity of raising material; The 2nd, form metallic compound with elements such as lead in the impurity, bismuths, strengthen crystal boundary, when the constituent content that adds surpasses 0.1wt%, the intensity of alloy has obtained corresponding raising, but can form other more hard crisp phase, also can reduce the conductance of alloy simultaneously, not satisfy the cold forming capability and the discharge effect in back step, also increased simultaneously cost, effect is promoted the use of in influence.
The mechanism that the top layer metal of high-conductivity and high-tenacity compound line of the present invention adds silver is; silver is a kind of at normal temperatures than the better metal of copper conductance; and chemical property torpescence; be not easy with airborne oxygen chemically reactive; in the course of processing of material, also be difficult for simultaneously with other medium chemically reactive; therefore the purpose that adds silver mainly is that the conductance that guarantees alloy surface does not reduce, and can protect the alloy surface metal to be difficult for oxidation effectively simultaneously.
The mechanism that the top layer metal of high-conductivity and high-tenacity compound line of the present invention adds rare earth is, rare earth metal mainly has been to stop grain growth, control β to change the effect of quantity mutually when the intermediate annealing of material, can improve softening point, strengthen intensity, improve cold and hot processability.Adding is the mishmetal better effects if of base with the lanthanum, can increase the anti-dezincify ability in the course of processing of conductance and reinforcing material, and the toughness of material also has raising simultaneously.
As one of preferred high-conductivity and high-tenacity compound line of the present invention, the alloy composition of described core is: copper: 59.0～62.5wt%, other element: 0.005～0.1wt%, described other element comprises that at least two kinds of elements in titanium, iron, silicon, tin, phosphorus, the rare earth metal, unavoidable impurities content are less than 0.3wt%, all the other are zinc, wherein in the unavoidable impurities content of lead, bismuth, antimony less than 0.05wt%; The alloy composition of described top layer metal level is: copper: 48.0～52.0wt%, rare earth: 0～0.4wt%, silver: 0～0.2wt%, unavoidable impurities constituent content are zinc less than 0.3wt%, surplus.
The alloy of this kind core composition is low because of copper content, relative low price, and the mechanical performance of core is general; The rare earth metal that the top layer metal level adds, silver are all at the lower limit of composition, and mechanical performance, conductance have lifting to a certain degree, but the degree that promotes is little, and opposite cost advantage is apparent in view.Such recombination line is suitable for the special processing of special dimension, as processes the carbon steel work-piece of easy discharge, the ordinary carbon steel class workpiece that cutting is easier to cut etc.
High-conductivity and high-tenacity compound line of the present invention as preferred two, the alloy composition of described core is: copper: 63.5～65.0wt%, other element: 0.005～0.1wt%, described other element comprises that at least two kinds of elements in titanium, iron, silicon, tin, phosphorus, the rare earth metal, unavoidable impurities content are less than 0.3wt%, all the other are zinc, wherein in the unavoidable impurities content of lead, bismuth, antimony less than 0.05wt%; The alloy composition of described top layer metal level is: copper: 48.0～52.0wt%, rare earth: 0～0.4wt%, silver: 0～0.2wt%, unavoidable impurities constituent content are zinc less than 0.3wt%, surplus.
The alloying component of this type because copper content in the upper limit, its mechanical performance is more excellent, but because copper content height, price is with respect to scheme one, three costlinesses, the rare earth metal that adds, silver are all in the upper limit of composition, conductance, mechanical performance promote very big, are suitable for the general processing and the special processing in most of fields.
High-conductivity and high-tenacity compound line of the present invention as preferred three, the alloy composition of described core is: copper: 62.5～63.5wt%, other element: 0.005～0.1wt%, described other element comprises that at least two kinds of elements in titanium, iron, silicon, tin, phosphorus, the rare earth metal, unavoidable impurities content are less than 0.3wt%, all the other are zinc, wherein in the unavoidable impurities content of lead, bismuth, antimony less than 0.05wt%; The alloy composition of described top layer metal level is: copper: 48.0～52.0wt%, rare earth: 0～0.4wt%, silver: 0～0.2wt%, unavoidable impurities constituent content are zinc less than 0.3wt%, surplus.
The alloy of this kind core composition because copper content in median, the mechanical performance of material can not reduce, cost is suitable, the rare earth metal that adds, silver are all in the middle limit of composition, conductance, mechanical performance promote very big, the addition of rare earth, silver within the specific limits, the amplitude that cost rises is little, so be suitable for the general processing and the special processing in most of fields.Superiority of effectiveness is obvious.
The manufacture method of a kind of high-conductivity and high-tenacity compound line of the present invention is characterized in that step comprises: raw material enter factory and select--by prescription alloying batching--on draw founding and produce ejector rod that----spraying--process annealing--is annealed into final finished in line drawing to the pressure processing of different passages; Be specially:
1.1 from the market Cai Gou raw material advance factory through picking, chemical analysis qualified after, begin the batching.
1.2 the alloying prescription is carried out in the requirement according to institute's production alloying component, simultaneously qualified batching is transported to the founding scene, prepares founding.
1.3 founding is the master operation that generates the wire electrode core, its used alloy element that is added is all finished in this operation, simultaneously by can guarantee normally carrying out of back road pressure processing to the founding parameter control.
1.4 the pressure processing of different passages: this operation mainly is that the base bar that casting is come out is processed into the preceding specification of spraying, simultaneously require to guarantee that according to spraying, stress relief annealed operation material has the mechanical performance of suitable downward processing, so that normally the carrying out of later process.
1.5 spraying: according to the requirement of wire electrode top layer composition, metal powder is carried out suitable proportioning (will consider the loss difference of different metal) to spray, should guarantee the thickness of sprayed coating simultaneously.
1.6 process annealing: guarantee that spraying metal powder later can be attached to the surface of core equably, and material is not oxidized when guaranteeing annealing.
1.7 anneal in line drawing: this operation mainly is that the blank of above-mentioned making (masterbatch) is carried out finished product processing, to be worked into the specification that client finally needs, have the surface of conductance of meeting the requirements of and material not oxidized when annealing when guaranteeing online annealing simultaneously, the stretch process thickness of the top layer metal of material later is 0.5-2.0um.
Wherein, the smelting temperature that draws founding on described is 980～1150 ℃; It is Φ 0.8mm～Φ 1.5mm that the pressure processing of described different passages processes the core specification, and the mechanical performance scope is 420～650Mpa; Its sprayed coating thickness of described spraying is 7-13um; Described process annealing temperature is 250～380 ℃.
As preferably, its smelting temperature that draws founding on described of the manufacture method of high-conductivity and high-tenacity compound line of the present invention is 1000～1100 ℃; It is Φ 0.8mm～Φ 1.5mm that the pressure processing of described different passages processes the core specification, and the mechanical performance scope is 450～550Mpa; Its sprayed coating thickness of described spraying is 9～11um; Described process annealing temperature is 310～350 ℃.
Stretch process through spraying and stress relief annealed recombination line bus process later process multi-pass, its core constantly attenuate elongated, and the top layer metal composites is pressed into (or being squeezed into) core metal surface, thereby form the metal group zoarium, and form uniform craterlet on the surface of material in the fashionable meeting of top layer metal crimp, the rare earth, the silver element that add when containing spraying in this assembly, this metal composites is combined together through final annealing and the core metal later that stretch, thereby form the top layer metal.Core and top layer metal pair recombination line are used as wire electrode and have following effect;
1. the core of alloying is because added alloying element, and mechanical performance is improved, and helps the high materials and parts of cutting hardness;
2. the zinc content in the metal of top layer is about 50%, thereby makes when discharge spark even, and the materials and parts surface smoothness that cuts out is improved;
In the metal of top layer because of containing rare earth metal, because of the interaction of rare earth metal with the body metal, the mechanical performance of this assembly is not lowered (because of containing 50% left and right sides zinc in the coating metal is the mechanical performance that can reduce material, and this reduction of material is just seldom after adding rare earth).
4. the silver in the coating can promote the conductivity of wire electrode, and final cutting speed is promoted, and it is oxidized that the adding of silver simultaneously makes among the present invention high-conductivity and high-tenacity compound line be not easy, and increased the storage time.
5. the developing result when the even craterlet that forms after sprayed coating is pressed into helps to improve wire electrode discharge, thereby the surface quality of raising cutting speed and cut workpiece.
Embodiment
Mode with embodiment further specifies the present invention below, but is not limited thereto.
Embodiment
1.1 from the market Cai Gou raw material advance factory through picking, chemical analysis qualified after, begin the batching.
1.2 the alloying prescription is carried out in the requirement according to alloying component shown in the table 1, simultaneously qualified batching is transported to the founding scene, prepares founding.
1.3 founding is the master operation that generates the wire electrode core, its used alloy element that is added is all finished in this operation, and by can guarantee normally carrying out of road, back pressure processing to the founding parameter control, smelting temperature is 980～1150 ℃ simultaneously.
1.4 the pressure processing of different passages: this operation mainly is that the base bar that casting is come out is processed into the preceding specification of spraying, simultaneously require to guarantee that according to spraying, stress relief annealed operation material has the mechanical performance of suitable downward processing, so that normally the carrying out of later process.It is Φ 0.8mm～Φ 1.5mm that the pressure processing of different passages processes the core specification, and the mechanical performance scope is 420～650Mpa.
1.5 spraying: according to the requirement of the top layer of wire electrode shown in the table 1 composition, metal powder is carried out suitable proportioning to spray, the thickness that should guarantee sprayed coating simultaneously is 9～11um.
1.6 process annealing: guarantee that spraying metal powder later can be attached to the surface of core equably, and material is not oxidized when guaranteeing annealing, described process annealing temperature is 250～380 ℃.
1.7 anneal in line drawing: this operation mainly is that the blank of above-mentioned making (masterbatch) is carried out finished product processing, to be worked into the specification that client finally needs, have the surface of conductance of meeting the requirements of and material not oxidized when annealing when guaranteeing online annealing simultaneously, the stretch process thickness of the top layer metal of material later is 0.5-2.0um.
Table 1 embodiment of the invention recombination line alloy composition
With the uniform specification is external diameter 0.25mm, and cutting material is a medium carbon steel, and cutting material thickness is that 30mm contrasts various wire electrode material, and is as shown in table 2:
The performance comparison of the different wire electrode materials of table 2
To sum up, recombination line mechanical performance of the present invention is improved, and helps the high materials and parts of cutting hardness, and the materials and parts surface smoothness that cuts out is improved, developing result when helping to improve wire electrode discharge, thereby the surface quality of raising cutting speed and cut workpiece.
The foregoing description is used for the present invention that explains, rather than limits the invention, and in the protection range of spirit of the present invention and claim, any modification and change to the present invention makes all fall into protection scope of the present invention.
Claims (6)
1, a kind of high-conductivity and high-tenacity compound line, comprise core and top layer metal level, it is characterized in that: the alloy composition of described core is: copper: 59.0～65.0wt%, other element: 0.005～0.1wt%, described other element comprises that at least two kinds of elements in titanium, iron, silicon, tin, phosphorus, the rare earth metal, unavoidable impurities content are less than 0.3wt%, all the other are zinc, wherein in the unavoidable impurities content of lead, bismuth, antimony less than 0.05wt%; The alloy composition of described top layer metal level is: copper: 48.0～52.0wt%, rare earth: 0～0.4wt%, silver: 0～0.2wt%, unavoidable impurities constituent content are zinc less than 0.3wt%, surplus.
2, high-conductivity and high-tenacity compound line according to claim 1, it is characterized in that: the alloy composition of described core is: copper: 59.0～62.5wt%, other element: 0.005～0.1wt%, described other element comprises that at least two kinds of elements in titanium, iron, silicon, tin, phosphorus, the rare earth metal, unavoidable impurities content are less than 0.3wt%, all the other are zinc, wherein in the unavoidable impurities content of lead, bismuth, antimony less than 0.05wt%; The alloy composition of described top layer metal level is: copper: 48.0～52.0wt%, rare earth: 0～0.4wt%, silver: 0～0.2wt%, unavoidable impurities constituent content are zinc less than 0.3wt%, surplus.
3, high-conductivity and high-tenacity compound line according to claim 1, it is characterized in that: the alloy composition of described core is: copper: 63.5～65.0wt%, other element: 0.005～0.1wt%, described other element comprises that at least two kinds of elements in titanium, iron, silicon, tin, phosphorus, the rare earth metal, unavoidable impurities content are less than 0.3wt%, all the other are zinc, wherein in the unavoidable impurities content of lead, bismuth, antimony less than 0.05wt%; The alloy composition of described top layer metal level is: copper: 48.0～52.0wt%, rare earth: 0～0.4wt%, silver: 0～0.2wt%, unavoidable impurities constituent content are zinc less than 0.3wt%, surplus.
4, high-conductivity and high-tenacity compound line according to claim 1, it is characterized in that: the alloy composition of described core is: copper: 62.5～63.5wt%, other element: 0.005～0.1wt%, described other element comprises that at least two kinds of elements in titanium, iron, silicon, tin, phosphorus, the rare earth metal, unavoidable impurities content are less than 0.3wt%, all the other are zinc, wherein in the unavoidable impurities content of lead, bismuth, antimony less than 0.05wt%; The alloy composition of described top layer metal level is: copper: 48.0～52.0wt%, rare earth: 0～0.4wt%, silver: 0～0.2wt%, unavoidable impurities constituent content are zinc less than 0.3wt%, surplus.
5, a kind of manufacture method of high-conductivity and high-tenacity compound line is characterized in that step comprises: raw material enter factory and select--by prescription alloying batching--on draw founding and produce ejector rod that----spraying--process annealing--is annealed into final finished in line drawing to the pressure processing of different passages; Wherein, the smelting temperature that draws founding on described is 980～1150 ℃; It is Φ 0.8mm～Φ 1.5mm that the pressure processing of described different passages processes the core specification, and the mechanical performance scope is 420～650Mpa; Its sprayed coating thickness of described spraying is 7-13um; Described process annealing temperature is 250～380 ℃.
6, the manufacture method of high-conductivity and high-tenacity compound line according to claim 5 is characterized in that: the smelting temperature that draws founding on described is 1000-1100 ℃; It is Φ 0.8mm～Φ 1.5mm that the pressure processing of described different passages processes the core specification, and the mechanical performance scope is 450～550Mpa; Its sprayed coating thickness of described spraying is 9～11um; Described process annealing temperature is 310～350 ℃.
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| CN103447641A (en) * | 2013-08-30 | 2013-12-18 | 广西锦新科技有限公司 | Low-speed wire cut electrical discharge machining metal wire and preparation method thereof |
| CN103752805A (en) * | 2013-04-16 | 2014-04-30 | 云南大学 | Manufacturing method for compound silver-coated-nickel or silver-coated-iron core wire electrode |
| CN104183296A (en) * | 2014-09-06 | 2014-12-03 | 丹阳市明琪金属制品有限公司 | Corrosion-resistant copper-clad aluminum conductor |
| CN104308305A (en) * | 2014-10-29 | 2015-01-28 | 苏州市宝玛数控设备有限公司 | Stable wire conveying mechanism |
| CN104409136A (en) * | 2014-12-22 | 2015-03-11 | 孙华桥 | Compound conducting bar |
| CN104651659A (en) * | 2015-01-29 | 2015-05-27 | 宁波博威麦特莱科技有限公司 | High zinc-silicon-boron-ferro copper alloy |
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| CN103752805A (en) * | 2013-04-16 | 2014-04-30 | 云南大学 | Manufacturing method for compound silver-coated-nickel or silver-coated-iron core wire electrode |
| CN103752805B (en) * | 2013-04-16 | 2015-09-16 | 云南大学 | The manufacture method of the coated nickel of silver or iron core composite electrode wire |
| CN103447641A (en) * | 2013-08-30 | 2013-12-18 | 广西锦新科技有限公司 | Low-speed wire cut electrical discharge machining metal wire and preparation method thereof |
| CN104183296A (en) * | 2014-09-06 | 2014-12-03 | 丹阳市明琪金属制品有限公司 | Corrosion-resistant copper-clad aluminum conductor |
| CN104308305A (en) * | 2014-10-29 | 2015-01-28 | 苏州市宝玛数控设备有限公司 | Stable wire conveying mechanism |
| CN104409136A (en) * | 2014-12-22 | 2015-03-11 | 孙华桥 | Compound conducting bar |
| CN104409136B (en) * | 2014-12-22 | 2016-09-07 | 孙华桥 | A kind of preparation method of compound conductive bar |
| CN104651659A (en) * | 2015-01-29 | 2015-05-27 | 宁波博威麦特莱科技有限公司 | High zinc-silicon-boron-ferro copper alloy |
| CN105312698A (en) * | 2015-09-28 | 2016-02-10 | 宁波博威麦特莱科技有限公司 | Low-silver-oxygen electrode wire used for one-way wiring and manufacturing method of electrode wire |
| CN105328287A (en) * | 2015-11-13 | 2016-02-17 | 芜湖楚江合金铜材有限公司 | Low-speed wire cut electrical discharge machining electrode wire and preparation method thereof |
| CN105478938A (en) * | 2015-11-23 | 2016-04-13 | 芜湖楚江合金铜材有限公司 | Soft silver layer plated high-precision copper alloy wire and manufacturing method thereof |
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Address after: After 315137 Yinzhou District Yunlong Town in Zhejiang province Ningbo city Chen Cun Co-patentee after: Bowei Group Co., Ltd., Ningbo Patentee after: Ningbo bode Hi Tech Co., Ltd. Address before: After 315137 Yinzhou District Yunlong Town in Zhejiang province Ningbo city Chen Cun Co-patentee before: Bowei Group Co., Ltd., Ningbo Patentee before: Ningbo Powerway Materialise Co., Ltd. |
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Effective date of registration: 20170919 Address after: After 315137 Yinzhou District Yunlong Town in Zhejiang province Ningbo city Chen Cun Patentee after: Ningbo bode high tech Limited by Share Ltd Address before: After 315137 Yinzhou District Yunlong Town in Zhejiang province Ningbo city Chen Cun Co-patentee before: Bowei Group Co., Ltd., Ningbo Patentee before: Ningbo bode Hi Tech Co., Ltd. |