CN101257728A - Earphone and method for manufacturing same - Google Patents
Earphone and method for manufacturing same Download PDFInfo
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- CN101257728A CN101257728A CNA2008100094041A CN200810009404A CN101257728A CN 101257728 A CN101257728 A CN 101257728A CN A2008100094041 A CNA2008100094041 A CN A2008100094041A CN 200810009404 A CN200810009404 A CN 200810009404A CN 101257728 A CN101257728 A CN 101257728A
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Abstract
The invention provides an earphone and the manufacturing method thereof. In the method, when an earphone unit is fixed, uneven stress can not be applied to a vibration plate, thus avoiding high-frequency vibration sound. The earphone comprises an earphone unit and a sound insolation board (100) provided with the earphone unit, the earhone unit includes components forming a magnetic loop, a sound coil (10) arranged the gap formed by the components forming a magnetic loop, a vibration plate (8) provided with a sound coil (10) and an unit frame (4) for fixing the edges of the vibration plate (8), the components forming a magnetic loop are fixed on the sound isolation board (100). The sound isolation board (100) is provided with a sunken part (101) in the center, the components forming a magnetic loop are fixed on the bottom surface of the sunken part (101) by an adhensive (16).
Description
Technical field
The present invention relates to earphone and manufacture method thereof, particularly being characterised in that not can be in the structure of the circumference stress application of oscillating plate and the manufacture method that is used to realize this structure.
Background technology
The structure of earphone generally is that headphone unit is installed on sound panel.Headphone unit may also be referred to as loudspeaker unit, has oscillating plate, is fixed on the voice coil loudspeaker voice coil on this oscillating plate and forms the magnetic loop in magnetic field around this voice coil loudspeaker voice coil.Described magnetic loop is made up of magnetic loop component parts such as permanent magnet, yokes.Usually use screw that headphone unit is installed on the sound panel, the example that uses fixed claw is perhaps also arranged.
Fig. 4 represents with screw headphone unit to be installed in the example of the existing earphone on the sound panel.The formation of headphone unit at first is described.In Fig. 4, label 4 expression unit frameworks.The shape of seeing from the front of frame unit 4 is annulars, and the circumference in heart hole forms side-prominent cylindrical portion 41 downwards therein, the outer peripheral edges portion of unit framework 4 form oriented side-prominent outstanding dyke 46.In addition, on unit framework 4, forming the outstanding dyke 48 lower than outstanding dyke 46 position in the inner part than outstanding dyke 46.In the above-mentioned cylindrical portion 41 of unit framework 4, embedded the yoke 5 that round-ended cylinder shape is arranged, yoke 5 is fixed on the unit framework 4, and to make the upper surface of yoke 5 and the upper surface of unit framework 4 be same plane.On the inner bottom surface of yoke 5, be fixed with discoid and diameter less than the permanent magnet 6 of the inner peripheral surface of yoke 5, on permanent magnet 6, fixing discoideus magnetic pole plate 7.The upper surface of the upper surface of magnetic pole plate 7 and unit framework 4 forms same plane, and, between the inner peripheral surface of the outer peripheral face of magnetic pole plate 7 and yoke 5, be formed with the gap of drum.Constitute magnetic loop by permanent magnet 6, magnetic pole plate 7 and yoke 5, so in above-mentioned gap cylindraceous, be formed with magnetic field.Therefore, above-mentioned gap is a magnetic gap.
Upload the smooth edge portion that is equipped with oscillating plate 8 in the outstanding dyke 48 of said units framework 4; the further mounting smooth edge portion 93 that protective device 9 in the edge portion of this oscillating plate 8, the edge portion of described oscillating plate 8 and protective device 9 is by being adhesively fixed on the unit framework 4.Oscillating plate 8 have vibration section, arch center and around this vibration section, center and with cross section that the vibration section, center forms continuously be the periphery of partial arc shape, fixing an end of voice coil loudspeaker voice coil 10 with cantilevered fashion along the border of vibration section, center and periphery.Voice coil loudspeaker voice coil 10 not and magnetic pole plate 7 and yoke 5 be configured in contiguously in the gap between the inner peripheral surface of the outer peripheral face of above-mentioned magnetic pole plate 7 and yoke 5.
Formed headphone unit by above-mentioned formation.When behind voice coil loudspeaker voice coil 10 input audio signals, under the electric current that flows through in voice coil loudspeaker voice coil 10 and the effect of above-mentioned magnetic flux, voice coil loudspeaker voice coil 10 axle line direction therein is driven, so thereby oscillating plate 8 sound along with voice signal vibration.
In above-mentioned headphone unit, the peripheral part of its unit framework 4 is by being installed on the sound panel 3 by sound panel 3 and pressing plate 2 clampings.Sound panel 3 is annular elements, the part of inner peripheral surface on whole circumference by towards the radial direction lateral resection, thereby form recess 31, above recess 31, on whole circumference, be formed with jaw portion 32.Above-mentioned pressing plate 2 also forms annular, is configured in the lower face side of sound panel 3, and pressing plate 2 is fixed on the sound panel 3 by the screw 13 of right quantity.Pressing plate 2 when being fixed on the sound panel 3 by screw 13, jaw portion 32 butts of the peripheral part upper surface of unit framework 4 and sound panel 3, the peripheral part lower surface of unit framework 4 and pressing plate 2 butts, the peripheral part of unit framework 4 is by sound panel 3 and pressing plate 2 clampings.Like this, headphone unit just is installed on the sound panel 3.
Rear side (lower face side among Fig. 4) at sound panel 3 is being fixed the flat open end that the main body cover 1 of round-ended cylinder shape is arranged, and the downside of sound panel 3 is covered by main body cover 1.One distolateral being attached on the main body cover 1 of headband (headband), another of headband is distolateral to be attached on other main body cover that headphone unit is installed, thereby can constitute stereophone.Front surface side at above-mentioned sound panel 3 is installed with the headrest 12.The cover 11 of the covering protection device 9 that is made of sponge is installed in interior all sides of the headrest 12.
As mentioned above, in headphone unit, the peripheral part of its unit framework 4 is by by screw 13 fastening sound panel 3 and pressing plate 2 clampings, thereby is installed on the sound panel 3.Bonding part is carried out near the edge portion to oscillating plate 8 in this installation site.Therefore, the fastening stress of screw 13 passes to oscillating plate 8 easily, if particularly in the edge portion of oscillating plate 8, apply uneven stress because of the fastening of screw 13, then oscillating plate 8 produces microdeformation, oscillating plate 8 produces unusual resonance with specific frequency, thereby sends the abnormal sound that is called as dither sound.The sound of dither mainly is because oscillating plate 8 can not carry out such parallel the moving of piston, causes but produce fluctuating or partial vibration etc., if with the sine wave drive below the 1kHz, just can detect by audition.
As mentioned above, as the structure that headphone unit is fixed on the sound panel, the employing that has fixed claw.The invention of the patent documentation 1 relevant with the applicant's application belongs to above-mentioned technology, its structure is, one side side at sound panel forms the outstanding fixed claw with fastener, end the outer peripheral edges portion of driver element (being also referred to as headphone unit) with the fastener card of fixed claw, thereby driver element is fixed on the sound panel.
[patent documentation 1] Japan opens flat 5-80090 communique in fact.
According to the invention of patent documentation 1 record, has the advantage that easily headphone unit is fixed on the sound panel.
But the invention of patent documentation 1 record also can end headphone unit and applied stress on headphone unit owing to the fastener card with fixed claw, if this unbalanced stress is even, then oscillating plate might produce so-called dither sound.
Because the sound panel of headphone unit is designed to circular tabular, so the mechanical strength of its circumference is with a little less than the part that magnetic loop is installed is compared very.And if headphone unit mechanically is not securely fixed on the sound panel, then headphone unit itself can be with respect to sound panel vibration, thus the tonequality of impairing.In addition, under the low situation of the intensity of unit framework, if with the magnetic loop partial fixing and to the headphone unit input signal, then might framework along with vibration is cut apart in the vibration of oscillating plate, the circumference of oscillating plate carries out the abnormal vibrations different with the signal of being imported.Because of this abnormal vibrations produces abnormal sound.Therefore, though the situation of strengthening the material of unit framework by combined fiberglass is also arranged, even so also cause insufficient strength easily.
In the structure of existing earphone, even strengthened the intensity of unit framework, if headphone unit mechanically is securely fixed on the sound panel, also can be on oscillating plate stress application, though the difference on the degree is arranged, still can cause producing so-called dither sound.
In addition, under the state that headphone unit is fixed on the sound panel,, then can produce the fricative of air by this space owing to air if between sound panel and headphone unit, have the space.
Summary of the invention
The purpose of this invention is to provide a kind of earphone and preparation method thereof, it has solved existing technical problem in the above-mentioned existing earphone, when the fixed earphone unit, can not apply uneven stress on oscillating plate, thereby can not produce so-called dither sound.
Another purpose of the present invention provides a kind of earphone and preparation method thereof, and it is eliminated in the gap between sound panel and the headphone unit under the state that headphone unit is fixed on the sound panel, thereby prevents to produce the grating of air.
Earphone of the present invention comprises headphone unit and is fixed with the sound panel of headphone unit, described headphone unit comprises: the magnetic loop component parts, be configured in the voice coil loudspeaker voice coil in the gap that is formed by described magnetic loop component parts, the unit framework that is fixed with the oscillating plate of described voice coil loudspeaker voice coil and is fixing the circumference of described oscillating plate, its topmost being characterised in that, described magnetic loop component parts is fixed on the sound panel.
The manufacture method of earphone of the present invention is characterised in that and comprises following operation: in the magnetic loop component parts of headphone unit and the described sound panel operation of adhesive-applying at least one side of opposed mutually; Make the magnetic loop component parts of described headphone unit mutually opposed across sound panel, the operation of utilizing the magnetic attraction between described magnetic loop component parts and the permanent magnet that described magnetic loop component parts and sound panel are close to permanent magnet; With the operation that makes adhesive hardens under the state of being close at described magnetic loop component parts and sound panel.
According to earphone of the present invention and by earphone that manufacture method of the present invention obtained, because mechanical strength is fixed on the sound panel with regard to high magnetic loop component parts originally, even so the magnetic loop component parts is fixed firmly on the sound panel, also be not easy the oscillating plate stress application, produce above-mentioned problems such as dither sound thereby can eliminate because of stress application on oscillating plate.
By making magnetic loop component parts and sound panel with in the face of putting, and with this opposed faces of adhesive securement, can not produce stress, thereby can more effectively prevent to produce described dither sound because of fixing between magnetic loop component parts and sound panel.
By the gap that is produced between the outer peripheral face with the inner peripheral surface of the depressed part of encapsulant sound insulation by filling plate and unit framework, air can not pass through above-mentioned gap, can not produce the friction sound of air yet.
Description of drawings
Fig. 1 is the longitudinal section of the embodiment of expression earphone of the present invention;
Fig. 2 is the longitudinal section of an operation of embodiment of the manufacture method of expression earphone of the present invention;
Fig. 3 is the longitudinal section of the operation after the above-mentioned operation of expression;
Fig. 4 is the longitudinal section of the example of the existing earphone of expression;
Label declaration
1 main body cover; 4 unit frameworks; 5 yokes; 6 permanent magnets; 7 magnetic pole plate;
8 oscillating plates; 12 headrests; 16 bonding agents; 17 encapsulants; 100 sound panels;
101 depressed parts; 102 inner bottom surfaces; 105 inner peripheral surfaces; 110 gaps.
Embodiment
Following reference Fig. 1～Fig. 3 the embodiment of earphone of the present invention and manufacture method thereof is described.In addition, to the component part mark identical label identical with the formation of existing example shown in Figure 4.
In Fig. 1, label 4 expression unit frameworks.The shape of seeing from positive (being upper surface among Fig. 1) of frame unit 4 is annulars, and the circumference in heart hole forms side-prominent cylindrical portion 41 downwards therein, the outer peripheral edges portion of unit framework 4 form oriented side-prominent outstanding dyke 46.In addition, on unit framework 4, form than outstanding dyke 46 position in the inner part than outstanding dyke 46 low, side-prominent outstanding dyke 48 makes progress.In the above-mentioned cylindrical portion 41 of unit framework 4, embedded the yoke 5 that round-ended cylinder shape is arranged, yoke 5 is fixed on the unit framework 4, and to make the upper surface of yoke 5 and the upper surface of unit framework 4 be same plane.On the inner bottom surface of yoke 5, be fixed with discoid and diameter less than the permanent magnet 6 of the inner peripheral surface of yoke 5, on permanent magnet 6, fixing discoideus magnetic pole plate 7.The upper surface of the upper surface of magnetic pole plate 7 and unit framework 4 forms same plane.And the external diameter of magnetic pole plate 7 is littler than the internal diameter of yoke 5, and bigger than the external diameter of permanent magnet 6, is formed with the gap of drum between the inner peripheral surface of the outer peripheral face of magnetic pole plate 7 and yoke 5.Permanent magnet 6, magnetic pole plate 7 and yoke 5 become the magnetic loop component parts, constitute magnetic loop by these parts, so be formed with magnetic field in the gap of above-mentioned drum.Therefore, the gap of above-mentioned drum is a magnetic gap.
Upload the smooth edge portion (outer peripheral edges portion) that is equipped with oscillating plate 8 in the outstanding dyke 48 of said units framework 4; further mounting has the smooth edge portion 93 of protective device 9 in the edge portion of this oscillating plate 8, and above-mentioned oscillating plate 8 and protective device 9 are by being adhesively fixed on the unit framework 4.Oscillating plate 8 have the vibration section, center of arcuation and around this vibration section, center and with cross section that the vibration section, center forms continuously be the periphery of partial arc shape.Protective device 9 is used to protect oscillating plate 8, this protective device 9 be configured and oscillating plate 8 between keep proper spacing so that can be from outside contact vibration plate 8.Vibration section, center and cross section that protective device 9 copies the shape of oscillating plate 8 to have arch are the periphery of partial arc shape, and are formed with a plurality of holes 91 that the sound that sends from oscillating plate 8 is passed.One end of voice coil loudspeaker voice coil 10 is fixed on the downside of the oscillating plate 8 among Fig. 1 along the border of the vibration section, above-mentioned center of oscillating plate 8 and periphery with cantilevered fashion.Voice coil loudspeaker voice coil 10 not and magnetic pole plate 7 and yoke 5 be configured in contiguously in the gap between the inner peripheral surface of the outer peripheral face of above-mentioned magnetic pole plate 7 and yoke 5.
Formed headphone unit by above-mentioned formation.When behind voice coil loudspeaker voice coil 10 input audio signals, under the electric current that flows through in voice coil loudspeaker voice coil 10 and the effect of above-mentioned magnetic flux, voice coil loudspeaker voice coil 10 is driven, so oscillating plate 8 along with thereby voice signal is sounded in central axial direction vibration.
In above-mentioned headphone unit, its magnetic loop component parts is installed on the sound panel 100.Sound panel 100 is not the such endless member of the sound panel 3 in the existing example shown in Figure 4, but front shape is circular plate type and the shape that is formed with depressed part 101 at central part.Specify the shape of this depressed part 101, depressed part 101 has the inner bottom surface 102 that is formed by tabular surface, and have from the at right angles continuous inner peripheral surface 103 of this inner bottom surface 102, from this inner peripheral surface 103 to the at right angles continuous stage portion 104 in the radial direction outside and from these stage portion 104 rectangular continuous expansion inner peripheral surfaces 105.Bottom surface as the yoke 5 of one of magnetic loop component parts is a flat surfaces, and opposed with the smooth inner bottom surface 102 of depressed part 101.Bonding agent 16 will comprise that by bonding agent 16 the magnetic loop component parts of yoke 5 is fixed on the sound panel 100 between the inner bottom surface 102 of the bottom surface of this yoke 5 and depressed part 101.The axis direction length of the cylindrical portion 41 of unit framework 4 is shorter slightly than axis direction (being above-below direction among Fig. 1) length of yoke 5, also hardening in the gap that is produced between the bottom surface that the bonding agent 16 that is crimped on the outer circumferential side that is expressed into yoke 5 on the inner bottom surface 102 of depressed part 101 owing to the bottom surface with yoke 5 is filled above-mentioned depressed part 101 and the lower surface of above-mentioned cylindrical portion 41, thereby has strengthened the bonding of magnetic loop component parts and sound panel 10.Like this, headphone unit is installed on the sound panel 100.
In the illustrated embodiment, magnetic loop component parts and sound panel 100 are fixing by bonding agent 16, because the particularly described yoke 5 of magnetic loop component parts is exactly to be formed by the big parts of mechanical strength originally, even so fixedly be secured on the sound panel 100 by screw thread, its stress can not feed through to oscillating plate 8 yet.Therefore, in the application's earphone, also it doesn't matter even adopt screw thread fixedly to carry out magnetic loop component parts and sound panel 100 fixing.
As described above, sound panel 100 is different with the sound panel in the conventional example, and sound panel 100 has big area, is pedestal assembling earphone with this sound panel 100.Therefore, sound panel 100 is also used as the substrate parts of earphone.Be fixed with the open end of the flat main body cover that the round-ended cylinder shape is arranged 1 in the rear side (lower face side among Fig. 1) of sound panel 100, the downside of sound panel 100 is covered by main body cover 1.One distolateral being attached on the main body cover 1 of headband, another of headband is distolateral to be attached on other main body cover that headphone unit is installed, thereby can constitute stereophone.Front surface side at above-mentioned sound panel 100 is equipped with the headrest 12.The sponge cover 11 of covering protection device 9 is installed in interior all sides of the headrest 12.
The peripheral part of unit framework 4 is located to extend towards enlarging inner peripheral surface 105 above the stage portion 104 of sound panel 100, and between the expansion inner peripheral surface 105 of the outer peripheral face of unit framework 4 and sound panel 100, produce gap 110, between the stage portion 104 of the peripheral part lower face side of unit framework 4 and sound panel 100, also produce and continuous gap, above-mentioned gap.Underfill sealants 17 in these gaps, so above-mentioned gap is filled by encapsulant 17.As encapsulant 17, for example can use single-component RTV (the room-temperature vulcanized of Shin-Etsu Chemial Co., Ltd's system; Room temperature vulcanizing) rubber KE347.The characteristic of constancy of volumeization when RTV rubber has sclerosis, thus the advantage that can avoid because of the circumference stress application that is hardened in headphone unit had.
As mentioned above, because the gap 110 that is produced between the outer peripheral face of the inner peripheral surface 105 of the depressed part 101 of sound panel 100 and unit framework 4 is by encapsulant 17 fillings, so air can not flow in the gap 110, thereby can prevent to produce fricative because of air flows.
Earphone according to the embodiment of the invention of above explanation, because mechanical strength is fixed on the sound panel 100 with regard to high magnetic loop component parts originally, even so the magnetic loop component parts is securely fixed on the sound panel 100 by fixing grade of screw thread, also be not easy the oscillating plate stress application, produce problems such as so-called dither sound thereby can eliminate because of stress application on oscillating plate 8.
Make magnetic loop component parts and sound panel 100 with in the face of putting, and fix this opposed faces, thereby can not produce stress, can more effectively prevent to produce above-mentioned dither sound because of fixedly magnetic loop component parts and sound panel 100 with bonding agent 16.
In addition, because the gap that is produced between the outer peripheral face with the inner peripheral surface 105 of the depressed part 101 of encapsulant 17 sound insulation by filling plates 100 and unit framework 4 so air can not pass through above-mentioned gap, also can not produce the fricative of air.
Then the embodiment to the manufacture method of earphone of the present invention describes.The formation of the earphone of manufacturing is identical with the formation of earphone shown in Figure 1, owing to be characterised in that headphone unit is fixed on operation on the sound panel 100, is fixed on the operation on the sound panel 100 so stress the headphone unit that will assemble.
As shown in Figure 2, following operation is at first arranged: at the magnetic loop component parts of headphone unit and sound panel 100 adhesive-applying 16 at least one side of opposed mutually.In illustrated example, in the bottom surface of the yoke 5 that constitutes the magnetic loop component parts adhesive-applying 16 on the inner bottom surface 102 of depressed part 101 of right sound panel 100.
Then, the magnetic loop component parts is pushed against on the inner bottom surface 102 of above-mentioned depressed part 101, the bottom surface of yoke 5 and the inner bottom surface 102 of above-mentioned depressed part 101 are close to, are close to state, make permanent magnet 61 and magnetic loop component parts opposed across sound panel 100 in order to keep this.Permanent magnet 61 is fixed in the yoke 51, and magnetic pole plate 71 is fixed on the upper surface of permanent magnet 61, thus the magnetic loop component parts identical construction of formation and earphone.Magnetic pole plate 71 and above-mentioned magnetic loop component parts are disposed opposed to each other, utilize the magnetic attraction of above-mentioned magnetic loop component parts and permanent magnet 61 that above-mentioned magnetic loop component parts is close on the sound panel 100.Under this state, headphone unit is positioned, make between the expansion inner peripheral surface 105 of the outer peripheral face of unit framework 4 and sound panel 100, to be formed uniformly above-mentioned gap 110, under this state, keep a period of time to make bonding agent 16 sclerosis then.
In above-mentioned bonding process, as previously mentioned, bonding agent 16 is extruded the gap that is produced between the lower surface of the cylindrical portion 41 of bonding agent 16 filler cells frameworks 4 and the inner bottom surface 102 of above-mentioned depressed part 101 along the bottom surface of yoke 5 to the radial direction outside.Thereby bonding agent 16 hardens in hardening process unit framework 4 and sound panel 100 is bonded together.
In the hardening process of bonding agent 16, perhaps as shown in Figure 3, after hardening process finishes and removes permanent magnet 61, underfill sealants 17 in above-mentioned gap 110, thus fill gap 110 and make encapsulant 17 sclerosis with encapsulant 17.
According to the manufacture method of earphone of the present invention, by adopting the magnetic loop component parts is bonded in structure on the sound panel, can utilize magnetic attraction between magnetic loop component parts and the permanent magnet make efficiently not can be on oscillating plate the earphone of stress application.
Claims (10)
1. earphone, comprise headphone unit and the sound panel that is fixed with headphone unit, described headphone unit comprises: the magnetic loop component parts, be configured in the voice coil loudspeaker voice coil in the gap that is formed by described magnetic loop component parts, the unit framework that is fixed with the oscillating plate of described voice coil loudspeaker voice coil and is fixing the circumference of described oscillating plate, it is characterized in that
Described magnetic loop component parts is fixed on the sound panel.
2. earphone as claimed in claim 1 is characterized in that,
Sound panel has depressed part at central part, is fixed with the magnetic loop component parts on the bottom surface of described depressed part.
3. earphone as claimed in claim 2 is characterized in that,
The opposed faces of the bottom surface of the depressed part of sound panel and magnetic loop component parts is fixed by bonding agent.
4. earphone as claimed in claim 3 is characterized in that,
Bonding agent bonding the bottom surface of depressed part of sound panel and the bottom of magnetic loop component parts and unit framework.
5. earphone as claimed in claim 3 is characterized in that,
Bonding agent is the epoxies bonding agent.
6. earphone as claimed in claim 2 is characterized in that,
The gap that is produced between the inner peripheral surface of the depressed part of sound panel and the outer peripheral face of unit framework is filled by encapsulant.
7. earphone as claimed in claim 1 is characterized in that,
Sound panel is also used as the substrate parts of earphone, is fixed with earphone case on sound panel, thereby sound panel is covered by earphone case, on sound panel and the face earphone case opposition side the headrest is installed.
8. the manufacture method of an earphone, described earphone comprises headphone unit and is fixed with the sound panel of headphone unit, described headphone unit comprises: the magnetic loop component parts, be configured in the voice coil loudspeaker voice coil in the gap that is formed by described magnetic loop component parts, the unit framework that is fixed with the oscillating plate of described voice coil loudspeaker voice coil and is fixing the circumference of described oscillating plate, described magnetic loop component parts is fixed on the sound panel, it is characterized in that
Described manufacture method comprises following operation:
In the magnetic loop component parts of described headphone unit and the described sound panel operation of adhesive-applying at least one side of opposed mutually;
Make the magnetic loop component parts of described headphone unit mutually opposed across described sound panel, the operation of utilizing the magnetic attraction between described magnetic loop component parts and the permanent magnet that described magnetic loop component parts and sound panel are close to permanent magnet; With
Under the state that described magnetic loop component parts and sound panel are close to, make the operation of adhesive hardens.
9. the manufacture method of earphone as claimed in claim 8 is characterized in that,
The operation that also has underfill sealants in the gap that between the outer peripheral face of the inner peripheral surface of the depressed part of sound panel and unit framework, is produced.
10. the manufacture method of earphone as claimed in claim 9 is characterized in that,
Encapsulant is made of RTV rubber.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007046659A JP5013902B2 (en) | 2007-02-27 | 2007-02-27 | headphone |
| JP2007046659 | 2007-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101257728A true CN101257728A (en) | 2008-09-03 |
Family
ID=39787474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100094041A Pending CN101257728A (en) | 2007-02-27 | 2008-02-01 | Earphone and method for manufacturing same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5013902B2 (en) |
| CN (1) | CN101257728A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107948783A (en) * | 2016-10-12 | 2018-04-20 | 铁三角有限公司 | Headphone |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5253075B2 (en) * | 2008-10-07 | 2013-07-31 | 株式会社オーディオテクニカ | Headphone unit and headphones |
| KR101192397B1 (en) * | 2010-01-06 | 2012-10-17 | 주식회사 비에스이 | Multi-function micro-speaker |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240726U (en) * | 1975-09-17 | 1977-03-23 | ||
| JPS6386997A (en) * | 1986-09-30 | 1988-04-18 | Sanwa Denko Kk | Headphone |
| JPH0319186U (en) * | 1989-07-07 | 1991-02-25 | ||
| JPH08140189A (en) * | 1994-11-10 | 1996-05-31 | Tohoku Pioneer Kk | Speaker unit |
| JPH09326851A (en) * | 1996-06-07 | 1997-12-16 | Oki Electric Ind Co Ltd | Receiver mounting structure |
| JP3237525B2 (en) * | 1996-07-02 | 2001-12-10 | 三菱電機株式会社 | Solid-state laser excitation module |
| JP2002231839A (en) * | 2001-02-01 | 2002-08-16 | Matsushita Electric Ind Co Ltd | Manufacturing method of electronic part and manufacturing device using the same |
| JP4154728B2 (en) * | 2002-05-24 | 2008-09-24 | コニカミノルタホールディングス株式会社 | Mold production method |
| JP2006174432A (en) * | 2004-11-22 | 2006-06-29 | G Force:Kk | Bone conduction speaker, headphone, headrest, and pillow using the same |
| JP2006252786A (en) * | 2005-03-08 | 2006-09-21 | Canon Inc | Manufacturing method for image forming device |
| JP2006262195A (en) * | 2005-03-17 | 2006-09-28 | Pioneer Electronic Corp | Speaker device |
-
2007
- 2007-02-27 JP JP2007046659A patent/JP5013902B2/en not_active Expired - Fee Related
-
2008
- 2008-02-01 CN CNA2008100094041A patent/CN101257728A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107948783A (en) * | 2016-10-12 | 2018-04-20 | 铁三角有限公司 | Headphone |
| US10687133B2 (en) | 2016-10-12 | 2020-06-16 | Audio-Technica Corporation | Headphone |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5013902B2 (en) | 2012-08-29 |
| JP2008211548A (en) | 2008-09-11 |
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Open date: 20080903 |