CN101253823A - Hardware protection for preventing sensitive electronic data component from being operated by external - Google Patents

Hardware protection for preventing sensitive electronic data component from being operated by external Download PDF

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Publication number
CN101253823A
CN101253823A CNA2005800514536A CN200580051453A CN101253823A CN 101253823 A CN101253823 A CN 101253823A CN A2005800514536 A CNA2005800514536 A CN A2005800514536A CN 200580051453 A CN200580051453 A CN 200580051453A CN 101253823 A CN101253823 A CN 101253823A
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CN
China
Prior art keywords
pcb
circuit board
printed circuit
inner space
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005800514536A
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Chinese (zh)
Inventor
A·威默
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to CNA2005800514536A priority Critical patent/CN101253823A/en
Publication of CN101253823A publication Critical patent/CN101253823A/en
Pending legal-status Critical Current

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Abstract

A hardware protection system is integrated into a circuit carrier. As a result, a sensor system, which is integrated into the circuit carrier in the form of printed circuit boards, which can be produced by means of the traditional high-tech' printed circuit board technology and can be equipped with and processed on traditional insertion lines of electronic module installations, is obtained.

Description

Prevent that sensitive electronic data component is subjected to the hardware protection of external control
Technical field
The electronic building brick that is used for extremely sensitive data processing and data protection; for example at the tachometer that is used for commercial motor vehicle and at financial institution, ATM, aircraft and this electronic building brick that uses Anywhere of handling sensitive data; should prevent outside manipulation at hardware aspect; as the attack (for example machinery, laser, fire etc.) of chemistry or physics, thereby data are not handled.
Background technology
Have a solution at present, wherein the electronic building brick that will protect encapsulates fully by so-called anti-boring film.Anti-boring film is so for example provided as final products by Gore company, is perhaps led the film of slurry printing (Silberleitpastendruck) and provides as having silver by Freudenberg company.This film inwardly is connected with electrical component.After electronic building brick has been packed three-dimensionally, then this electronic building brick is sealed in the container with synthetic resin.When attempting opening this packing, conducting wire on the local film of attacking or resistance circuit are forced to damage and interruption, and this can cause the data of being stored directly deleted in electronic building brick.Thus can't manipulation data, therefore outside attack can be identified by the control corresponding body.
Two problems in the prior art known method, have been produced.The one, the use of film does not have to be fit to accordingly the installation method of electronic product.Another is that film has just damaged when being everlasting packing, thereby very high percent defective occurs.
Summary of the invention
Be to provide hardware protection at electronic building brick, this hardware protection can be integrated in the manufacturing that is fit to electronic product based on this technical problem to be solved in the present invention.
This technical problem solves by the invention that provides in the independent claims.Preferred implementation is provided by dependent claims.
Therefore; hardware protection exists with the form of circuit carrier; this circuit carrier surrounds the inner space of the element that is used for circuit to be protected; this hardware protection has the conductor structure that surrounds this inner space; be used to detect the unauthorized external control to this circuit, this conductor structure for example exists with the structure of network type or the form of cage.Be used for detecting the circuit carrier that therefore conductor structure of the visit of circuit directly is integrated in circuit.
The conductor structure that surrounds the inner space for example can be used as conducting plane and/or exists with grid, latticed form as the formation thing of narrow structuresization, have indentation and/or have fan-shaped, this indentation and/or fan-shaped in conductor structure distribute according to different geometry.Conductor structure should equal traditional HDI (High Density Interconnection, high density interconnect) structure according to the insulation distance (machine-wide) between two distributions of circuit form at this.Similarly also be applicable to the width of the distribution of conductor structure.When just visiting this circuit without permission, this conductor structure is impaired, thereby closed or interruption contact detects the visit to this circuit thus.
Preferably, the circuit carrier of the whole assembly of hardware protection with one or more printed circuit board (PCB) forms.This printed circuit board (PCB) can be at it on the face of inner space and/or inner some elements with circuit to be protected.This printed circuit board (PCB) can also be at it dorsad on the face of inner space and/or innerly have a conductor structure that a part is surrounded this inner space in addition.
Preferably, described printed circuit board (PCB) is multilayer board or multi-layer ceramics substrate, have the conductor structure layer that surrounds the inner space and be used to be connected circuit to be protected some elements layer.
The layer that is used to connect some elements of circuit to be protected especially is arranged on printed circuit board (PCB) on the face of inner space and/or inner.Perforation in printed circuit contact (Durchkontaktierung) may be embodied as the perforation contact of burying and/or the lightly conducting hole (Micro vias) of different process (plasma etching, light can be determined (photodefinable)).
Replace or replenish, in order to connect some elements of circuit to be protected, the assembled layers that produce in printed circuit board (PCB) (Aufbaulagen) is embodied as the assembled layers that order adds layer, especially has the different lightly conducting hole of technology as connecting contact.
Preferably; the hardware protection assembly has another multilayer board and/or multi-layer ceramics substrate; this another multilayer board and/or multi-layer ceramics substrate and first printed circuit board (PCB) are opposed; at it dorsad on the face of inner space and/or innerly carried the conductor structure that another part surrounds the inner space, especially at it on the face of inner space and/or inner other element with circuit to be protected.
Preferably, between printed circuit board (PCB) and described another printed circuit board (PCB), the shaped as frame printed circuit board (PCB) is set, this shaped as frame printed circuit board (PCB) and preceding two printed circuit board (PCB)s have certain intervals, form described inner space thus between this shaped as frame printed circuit board (PCB) and two printed circuit board (PCB)s.The shaped as frame printed circuit board (PCB) especially with multilayer board technology or the assembling of multi-layer ceramics substrate, for example is formed by stacking up and down by the layer with dielectric layer and conduction layer by layer.
Described inner space can be a hollow space, also can not be.If for example element is cast in the inner space, then fill up this inner space with the thermoplastic synthetic resin.
Circuit carrier especially has the joint that is used for the joint detection apparatus, and this detector means is used to detect the damage of conductor structure.
Preferably, the entire circuit carrier is used multilayer board technology and/or multi-layer ceramics process implementing at least basically.
Whole assembly with circuit carrier is in particular for tachometer, running data recording device and/or track or non-track restrained motor vehicle.Whole assembly for example can also be used for ATM, the device that is used for financial institution and aircraft.Especially (RSA, in the time of DES), the whole assembly with sort circuit carrier is advantageous particularly always when adopting the encryption key that will protect.
In the method for the circuit carrier of the inner space that is used for making the element that surrounds circuit to be protected, make circuit carrier with the conductor structure that surrounds this inner space, this conductor structure is used to detect the visit to circuit.The preferred implementation of this method is provided by the preferred implementation of circuit carrier, and vice versa.
Device with circuit carrier of the above-mentioned type preferably includes detector means, is used to detect visit by without permission and/or the unwarranted manipulation damage to conductor structure.In order also to allow detector means itself be protected, this detector means may be embodied as network component to be protected.
Description of drawings
Bright other feature and advantage of this law from following by providing the description of accompanying drawing to embodiment.
Fig. 1 illustrates the schematic diagram of the integrated hardware protection of electronic building brick;
Fig. 2 illustrates the part schematic diagram according to the hardware protection of Fig. 1;
Fig. 3 illustrates the sectional view according to the printed circuit board arrangement of the hardware protection of Fig. 1;
Fig. 4 illustrates the shaped as frame printed circuit board (PCB) according to the hardware protection of Fig. 1.
Embodiment
First sub-component of circuit carrier 1 with printed circuit board (PCB) 2 forms as can be seen in Fig. 1, this printed circuit board (PCB) 2 has some elements 3 of circuit to be protected.Printed circuit board (PCB) 2 has the conductor structure 4 of protective layer form, as a part that is used to detect to the multilayer interconnection of the visit of this circuit to be protected.Printed circuit board (PCB) 2 also has and guides the signal conductor of circuit to be protected and voltage source into outside the circuit carrier lead-in wire 5 in addition.This lead-in wire 5 passes the conductor structure that surrounds the inner space, and is inserting the end of 6 places, installation site.
Circuit carrier 1 also has another printed circuit board (PCB) 7, and this another printed circuit board (PCB) has other element 8 of circuit to be protected.
Other element 8 of another printed circuit board (PCB) 7 is arranged on this another printed circuit board (PCB) on the face of the face of the some elements 3 that are provided with circuit to be protected of printed circuit board (PCB) 2.All elements of circuit to be protected are thus in the inner space 9 that is being formed between printed circuit board (PCB) 2 and another printed circuit board (PCB) 7 between these two printed circuit board (PCB)s.
Printed circuit board (PCB) 2 and another printed circuit board (PCB) 7 are by shaped as frame printed circuit board (PCB) 10 each intervals, and this shaped as frame printed circuit board (PCB) 10 is arranged between these two printed circuit board (PCB)s and with printed circuit board (PCB) 2 and another printed circuit board (PCB) 7 and surrounds inner space 9.Printed circuit board (PCB) 2, another printed circuit board (PCB) 7 and shaped as frame printed circuit board (PCB) 10 are embodied as respectively, make circuit connection lines to be protected (Verdrahtung) and element 3,8 be arranged on that 9 the face towards the inner space of printed circuit board (PCB) 2, another printed circuit board (PCB) 7 and shaped as frame printed circuit board (PCB) 10 and/or zone are gone up and/or inner.These connect and element 3,8 and whole circuit to be protected are printed the structure encirclement that the conductor structure 12 of the conductor structure 11 of conductor structure 4, another printed circuit board (PCB) 7 of circuit board 2 and shaped as frame printed circuit board (PCB) 10 forms fully, and these conductor structures are electrically connected to each other.Conductor structure 11,12,4 being connected to each other between different printed circuit board (PCB)s undertaken by joint 14.Joint 14 is provided with brokenly.Conductor structure and the detector means coupling that is embodied as the damage special electronic circuit, that be used to detect conductor structure.Conductor structure can think to belong to this detector means.Externally around connection box 13 is coupled with the special electronic electrical component, thereby forms the additional protection function.
Around connection box 13 and being used to connect have between the joint 14 of different printed circuit board (PCB)s around conductor structure 35,37, this conductor structure and detector means electric coupling.
Fig. 3 illustrates the structure of printed circuit board (PCB) 2.This printed circuit board (PCB) 2 comprises ground plane 21, at least one the hardware protection network layer 22 at conductor structure 4, at least one hardware protection conversion articulamentum (Hardwareschutz-Umverdrahtungslage) 23, at least one power source layer 24, at least one ground plane 25, a plurality of signals layer 26,27,28.The arrangement of these layers will be selected like this, makes protective layer be arranged on outer and in signals layer and bus plane be arranged on.
The printed circuit board arrangement of shaped as frame printed circuit board (PCB) 10 as can be seen in Fig. 4.Shaped as frame printed circuit board (PCB) 10 is made up of multilayer board or multi-layer ceramics substrate, and this multilayer board or multi-layer ceramics substrate are made up of the conductor layer of the n with conductor structure 15, and wherein the spacing between two conductor layers is less than 500 μ m.For each layer being contacted with each other and printed circuit board (PCB) 2 being contacted with another printed circuit board (PCB) 7, shaped as frame printed circuit board (PCB) 10 comprises the through hole 16 of plated-through-hole (PlatedThrough Holes) form, and this through hole is distributed to another printed circuit board (PCB) perpendicular to each layer ground from printed circuit board (PCB) 2.
Therefore the pilot protection of example, in hardware directly is integrated in the electronic building brick, promptly is integrated in the printed circuit board (PCB) 2,7 that is used for this assembly.Utilize to detect the conductor structure of the visit that the circuit to the inner space 9 that is arranged in circuit carrier 1 carries out thus, for the electronic building brick of circuit carrier 1 form provides integrated hardware protection.
The execution mode of this assembly is for this reason, and this assembly has two sub-components, and wherein these two sub-components have only been installed the parts of element 3,8 forms of circuit to be protected in one side.
The printed circuit board (PCB) 2,7 that is used for this sub-component constitutes like this, be that printed circuit board (PCB) 2,7 is embodied as multilayer board, wherein Connection Element 3,8 needed internal layers and skin are towards installed surface (Bestueckseite), and at the printed circuit board (PCB) back side, be the opposite of installed surface, the electricity of outwards not drawing connects contact.
The needed perforation contact of the assembly work of circuit to be protected is embodied as the perforation contact (via of burying) of burying for this reason; perhaps sub-component connect needed assembled layers be embodied as have plasma etching, the SBU structure (adding layer, Sequential Build Up in proper order) of lithoprinting or lightly conducting hole-perforations contact of producing by laser drill.On existing nuclear, sequentially lay assembled layers for this reason, and have the lightly conducting hole.
On installed surface, the sub-component printed circuit board (PCB) has the contact pad of array format outside the installation region, the sub-component that this contact pad is used for after a while two single faces being installed is electrically connected to each other by the form of shaped as frame printed circuit board (PCB) 10 with multilayer circuit " face-to-face ".
The printed circuit board (PCB) 2,7 of sub-component is on the opposite of installed surface, promptly also have a plurality of conductive layers on the face of inner space dorsad.These conductive layers for example are embodied as the multiple layer of copper layer with conductor structure 4,11, these copper layers are embodied as the circuit of very fine ground structureization respectively, by this enforcement structure of circuit, the disposable little lattice of these circuits ground covers whole layer plane, but also extends between different layers.
The conductor width of one deck covers circuit under the part of insulation spacing and layer following and that separate by dielectric.
This circuit inwardly is conducting to assembly by the via or the lightly conducting hole of burying equally again.
This implements structure; be one deck for example on the x direction, have this curved structure that forms by thin copper wire and below or above layer on the y direction, have a this structure that separates by dielectric layer; the hardware protection that prevents that assembly is mechanically operated by is provided; circuit 4,11 inwardly is connected with this assembly, and damaged by external reference the time by extremely meticulous structuring thus thus.The interruption and/or the short circuit of conductor structure 4,11 take place thus, and this interruption and/or short circuit will be recorded in circuit or the assembly.
The enforcement of meticulous conductor can also be in resistance slurry printing (integrated resistor) with resistance value of qualification carry out in all rare earth structures as conductor paste (ceramic thick-layer technology) or ink printing (integrated resistor) with carbon ink with resistance value of qualification, this rare earth structure produces the formation thing of little lattice by one deck at least in large area, and inwardly is electrically connected to assembly.
At least one printed circuit board (PCB) 2,7 of sub-component can also be embodied as flexibility-printed circuit board, or can be provided for transmitting the flexible wire of data on printed circuit board.
In the printed circuit board (PCB) of sub-component, the dielectric spacing between the hardware protection layer is chosen as, though make also can damage when hole on the front in the front with the front under protective layer, trigger protection mechanism thus.For example can implement shaped as frame printed circuit board (PCB) 10 rigidly, two printed circuit board (PCB)s 2,7 of sub-component also may be embodied as flexible circuit.
For the sub-component that two " face-to-face " is provided with couples together, be similar to top enforcement equally and construct printed circuit board (PCB).This printed circuit board construction is a shaped as frame printed circuit board (PCB) 10, and is embodied as multilayer, after this multilayer prevents by its make from the whole assembly of frontal attack.General this can make spacing between each layer less than 500 μ m.Electricity connects the cloth intra-office that contact 16 is positioned at protective circuit, and this connects contact 16 and under mounted state two sub-electrical component is connected.Be used for the layout areas of defencive function at the conductor structure 12 that comprises forms such as circuit or printed resistor, for each layer of protective circuit distributing the perforation contact brokenly hidden.Two kinds connect contact type be embodied as connection pads (Anschlusspad) on the surface of the multilayer board of the shaped as frame of shaped as frame printed circuit board (PCB) 10 and bottom surfaces, after this connection pads is used for each sub-component are contacted with each other.
Sub-component and shaped as frame printed circuit board (PCB) be electrically connected and mechanical connection can and then weld the slit with adhesive closure by welding, add by stacked, undertaken by bonding contact or the like.
Form by the way with the printed circuit board (PCB) form and be integrated in sensing system in the circuit carrier, this sensing system is with traditional " high-tech " printed circuit board technology manufacturing, and can be on the conventional mounting line that electronic building brick is made assembling and handling.Provide following advantage in addition: directly provide in electronic building brick with integrated safer, cheap and the not pending safety system of more expenses is installed, this safety system detection hardware is reliably attacked.

Claims (13)

1. circuit carrier; this circuit carrier surrounds the element (3 that is used for circuit to be protected; 8) inner space (9); and has a conductor structure (4 that surrounds this inner space; 11; 12) be used to detect manipulation to this circuit; it is characterized in that; described element (3; 8) and line be printed the conductor structure (4) of circuit board (2) fully; the conductor structure (11) of another printed circuit board (PCB) (7) and the conductor structure (12) of shaped as frame printed circuit board (PCB) (10) surround; wherein these printed circuit board (PCB)s (2,7,10) respectively by around connection box (13) be connected to each other.
2. circuit carrier according to claim 1; it is characterized in that; this circuit carrier has printed circuit board (PCB) (2); this printed circuit board (PCB) at it on the face of inner space (9) and/or inner at least some elements (3), and at it dorsad on the face of inner space (9) and/or innerly have a conductor structure (4) that a part is surrounded this inner space with circuit to be protected.
3. circuit carrier according to claim 2; it is characterized in that; described printed circuit board (PCB) (2) is multilayer board or multi-layer ceramics substrate, have at the layer of the conductor structure (4) that surrounds the inner space and be used to be connected circuit to be protected more described elements (3) layer.
4. according to claim 2 or 3 described circuit carriers, it is characterized in that the layer that is used to connect some elements (3) of circuit to be protected is arranged on described printed circuit board (PCB) on the face of inner space (9) and/or inner.
5. according to each described circuit carrier in the claim 2 to 4, it is characterized in that the perforation contact of circuit to be protected is embodied as the perforation contact of burying in described printed circuit (2).
6. according to each described circuit carrier in the claim 3 to 5, it is characterized in that,, the assembled layers that will produce is embodied as the assembled layers that order adds layer in printed circuit board (PCB) (2) in order to connect some elements (3) of circuit to be protected.
7. according to each described circuit carrier in the claim 3 to 6; it is characterized in that; this circuit carrier (1) has another printed circuit board (PCB) (7); this another printed circuit board (PCB) and described printed circuit board (PCB) (2) are opposed; at this another printed circuit board (PCB) dorsad on the face of inner space (9) and/or innerly carried the conductor structure (11) of a part of encirclement inner space, and especially at this another printed circuit board (PCB) on the face of inner space (9) and/or inner other element (8) with circuit to be protected.
8. circuit carrier according to claim 7 is characterized in that, between described printed circuit board (PCB) (2) and described another printed circuit board (PCB) (7) shaped as frame printed circuit board (PCB) (10) is set.
9. circuit carrier according to claim 8 is characterized in that, described shaped as frame printed circuit board (PCB) (10) is assembled with printed circuit board technology.
10. according to one of aforesaid right requirement described circuit carrier, it is characterized in that this circuit carrier (1) is assembled with printed circuit board technology.
11. according to one of aforesaid right requirement described circuit carrier, it is characterized in that this circuit carrier (1) has joint irregular alignment, that be used for the joint detection apparatus (14), this detector means is used to detect the damage of conductor structure (4,11,12).
12. have tachometer, automobile, aircraft, data logger and/or ATM according to each described circuit carrier in the claim 1 to 11.
13. method that is used for making according to each described circuit carrier of claim 1 to 11.
CNA2005800514536A 2005-06-30 2005-06-30 Hardware protection for preventing sensitive electronic data component from being operated by external Pending CN101253823A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2005800514536A CN101253823A (en) 2005-06-30 2005-06-30 Hardware protection for preventing sensitive electronic data component from being operated by external

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Application Number Priority Date Filing Date Title
CNA2005800514536A CN101253823A (en) 2005-06-30 2005-06-30 Hardware protection for preventing sensitive electronic data component from being operated by external

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103582299A (en) * 2012-07-27 2014-02-12 德昌电机(深圳)有限公司 Security wrap
CN106879160A (en) * 2011-09-06 2017-06-20 松下电器产业株式会社 Terminal device with security feature
CN108235832A (en) * 2017-03-09 2018-06-29 华为技术有限公司 The mainboard and terminal of a kind of consumption electronic product

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106879160A (en) * 2011-09-06 2017-06-20 松下电器产业株式会社 Terminal device with security feature
CN106879160B (en) * 2011-09-06 2018-06-26 松下电器产业株式会社 Terminal device with security feature
CN103582299A (en) * 2012-07-27 2014-02-12 德昌电机(深圳)有限公司 Security wrap
CN103582299B (en) * 2012-07-27 2018-08-21 德昌电机(深圳)有限公司 Protective device
CN108235832A (en) * 2017-03-09 2018-06-29 华为技术有限公司 The mainboard and terminal of a kind of consumption electronic product
CN108235832B (en) * 2017-03-09 2021-01-05 华为技术有限公司 Mainboard and terminal of consumer electronics product

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Application publication date: 20080827